JP2011205384A - Antenna device and wireless communication device - Google Patents

Antenna device and wireless communication device Download PDF

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JP2011205384A
JP2011205384A JP2010070431A JP2010070431A JP2011205384A JP 2011205384 A JP2011205384 A JP 2011205384A JP 2010070431 A JP2010070431 A JP 2010070431A JP 2010070431 A JP2010070431 A JP 2010070431A JP 2011205384 A JP2011205384 A JP 2011205384A
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conductor
surface side
back
side conductor
loop
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JP5521686B2 (en
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Nobuo Ikemoto
伸郎 池本
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Murata Mfg Co Ltd
株式会社村田製作所
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Abstract

PROBLEM TO BE SOLVED: To obtain an antenna device and a wireless communication device suitable for an RFID system that functions as a radiating element even when a metallic member is adjacent or not.SOLUTION: The antenna device has a dielectric body 20 provided with a loop state radiation conductor 30 and a neutral conductor 35. The wireless communication device is configured by mounting a wireless IC element 50 on the dielectric body 20. The loop state radiation conductor 30 is configured by surface side conductors 31a, 31b provided at a surface side of the dielectric body 20, rear side conductors 33a, 33b provided at a rear side of the dielectric body 20, and inter-layer connection conductors 34a, 34b for connecting the surface side conductors 31a, 31b and the rear side conductors 33a, 33b. The neutral conductor 35 is disposed electrically independent from the loop state radiation conductor 30, and has facing areas 40a, 40b which are facing the surface side conductors 31a, 31b.

Description

  The present invention relates to an antenna device and a wireless communication device, and more particularly to an antenna device and a wireless communication device used in an RFID (Radio Frequency Identification) system.

  In recent years, as an information management system for articles, a reader / writer that generates an induced magnetic field and an RFID tag (also referred to as a wireless communication device) attached to the article are communicated in a non-contact manner using an electromagnetic field, and predetermined information is transmitted. An RFID system for transmission has been put into practical use. The RFID tag includes a wireless IC chip that stores predetermined information and processes predetermined wireless signals, and an antenna (radiator) that transmits and receives high-frequency signals.

  As an RFID tag that can operate even when placed close to a metal plate, a metal-compatible tag described in Patent Document 1 is known. In this metal-compatible tag, a loop antenna conductor is wound around a flat dielectric member, and an RFID chip is mounted in a gap formed in a part of the loop antenna conductor. A gap is also formed on the side of the loop antenna conductor opposite to the chip mounting surface. When this metal-compatible tag is attached to a metal plate, a high-frequency signal current flows through both the loop antenna conductor and the metal plate via capacitive coupling between the conductor on the back surface of the dielectric member and the metal plate.

  However, in the metal-compatible tag, the conductor on the back surface of the dielectric member and the metal plate are capacitively coupled. Therefore, when the capacitance value fluctuates, that is, when the distance between the tag and the metal plate varies, the impedance is reduced. It has the problem of changing. Therefore, it does not operate unless the metal plates are close to each other.

JP 2007-272264 A

  Therefore, an object of the present invention is to provide an antenna device and a wireless communication device suitable for an RFID system that functions as a radiating element even when a metal member is close and when it is not close.

The antenna device according to the first aspect of the present invention is:
A dielectric element body, first and second surface side conductors provided on the surface side of the dielectric element body, a back surface side conductor provided on the back side of the dielectric element body, a first surface side conductor, and A loop-shaped radiation conductor coupled in a loop with a first interlayer connection conductor connecting the back-side conductor and a second interlayer connection conductor connecting the second surface-side conductor and the back-side conductor;
A neutral conductor independent of the loop radiation conductor;
With
The neutral conductor has a first facing region facing the first surface side conductor and a second facing region facing the second surface side conductor;
It is characterized by.

  A wireless communication device according to a second aspect of the present invention includes a wireless IC element that processes a high-frequency signal and the antenna device coupled to the wireless IC element.

  In the antenna device, the high-frequency signal current tends to flow through the loop-shaped radiation conductor. When a metal member is in close proximity, a high-frequency signal current flows through the loop-shaped radiation conductor using this metal member as a signal current path, magnetic field energy is radiated from the metal member to the outside, and magnetic field energy received by the metal member is looped. Flows in a radiating conductor. On the other hand, when the metal member is not close, the first and second surface-side conductors and the neutral conductor are capacitively coupled in the first and second opposing regions, and the high-frequency signal current is neutral with the first and second surface-side conductors. It flows through the conductor as a signal current path and also flows through the loop-shaped radiation conductor. The loop-shaped radiating conductor functions as a dipole radiating element by matching impedance between the first and second surface electrodes and the neutral conductor.

  According to the present invention, even when the metal member is close and not close, it functions as a radiating element, and communication is possible without being affected by the distance to the metal member.

The wireless communication device provided with the antenna device which is 1st Example is shown, (A) is a perspective view, (B) is sectional drawing. It is operation | movement explanatory drawing of the antenna apparatus which is 1st Example, (A) shows the case where a metal plate is adjoining, (B) shows the case where a metal plate is not adjoining. It is a perspective view which shows the radio | wireless IC chip as a radio | wireless IC element. It is a perspective view which shows the state which mounted the said radio | wireless IC chip on the electric power feeding circuit board as a radio | wireless IC element. It is an equivalent circuit diagram showing an example of a power feeding circuit. It is a top view which shows the laminated structure of the said feeder circuit board. It is a perspective view which shows the loop-shaped radiation | emission conductor which comprises the antenna apparatus which is 2nd Example. The wireless communication device provided with the antenna apparatus which is 3rd Example is shown, (A) is sectional drawing, (B) is operation | movement explanatory drawing when a metal plate adjoins, (C) is a metal plate adjoining. It is operation | movement explanatory drawing in case it is not.

  Embodiments of an antenna device and a wireless communication device according to the present invention will be described below with reference to the accompanying drawings. In each figure, common parts and portions are denoted by the same reference numerals, and redundant description is omitted.

(Refer to the first embodiment, FIGS. 1 and 2)
The antenna device 10A according to the first embodiment is used for UHF band communication, and is configured as a wireless communication device including a wireless IC element 50 as shown in FIG. The antenna device 10 </ b> A includes a dielectric body 20 having a rectangular parallelepiped shape, a loop-shaped radiation conductor 30, and a neutral conductor 35. The wireless IC element 50 processes a high-frequency signal, and details thereof will be described in detail below with reference to FIGS. The dielectric body 20 is made of a thermosetting resin such as epoxy, a thermoplastic resin such as polyimide, or a ceramic such as LTCC (may be a magnetic body), and is configured as a single layer substrate or a multilayer substrate. Yes.

  The loop-shaped radiation conductor 30 includes first and second surface-side conductors 31a and 31b provided on the surface of the dielectric body 20, and first and second back-side conductors provided on the back surface of the dielectric body 20. 33a, 33b, a first interlayer connection conductor 34a connecting the first surface side conductor 31a and the first back surface side conductor 33a, and a second interlayer connection conductor connecting the second surface side conductor 31b and the second back surface side conductor 33b. 34b. Feed terminals 32a and 32b are formed on the surfaces of the dielectric body 20 and at the opposing ends of the first and second surface-side conductors 31a and 31b. Further, the first and second interlayer connection conductors 34 a and 34 b are provided on both end faces of the dielectric element body 20.

  The back surface side conductor is divided into a first back surface side conductor 33a and a second back surface side conductor 33b with the neutral conductor 35 disposed therebetween by the first and second slits 36a and 36b. The neutral conductor 35 is formed independently of the loop-shaped radiation conductor 30, and has a first facing region 40a facing the first surface-side conductor 31a and a second facing region 40b facing the second surface-side conductor 31b. is doing.

  The various conductors are formed as a thin film conductor pattern made of a metal foil such as copper or aluminum, or as a thick film conductor pattern made of a conductive paste containing powder such as silver or copper.

  On the surface of the dielectric body 20, a wireless IC element 50 is coupled to the power supply terminals 32a and 32b. This coupling is electromagnetic coupling or direct electrical coupling (DC connection) by solder bumps.

  As shown in FIG. 2 (A), the antenna device 10A having the above structure has a case where it is attached to a metal plate 46 provided on the surface of the substrate 45 via an insulating adhesive 47, and FIG. ), High-frequency signals are transmitted / received by an operation different from that in the case of being attached to the surface of the substrate 45 via the insulating adhesive 47 without using a metal plate.

  That is, when the metal plate 46 is close, when a predetermined high-frequency signal is transmitted from the wireless IC element 50, as shown by a dotted line in FIG. A high-frequency signal current flows along the surface of the metal plate 46 coupled to the. A loop surface, which is a circumferential surface of the loop-shaped radiation conductor 30, is disposed perpendicular to the metal plate 46. Thereby, since a magnetic field is formed on the surface of the metal plate 46, the antenna device 10 </ b> A can function as an antenna even if it is attached to the metal plate 46. The end portions of the first and second back surface side conductors 33 a and 33 b are coupled to the metal plate 46 by a capacity via an adhesive 47. The high-frequency signal current flows through the metal plate 46 as a current path through this capacitive coupling. The loop-shaped radiation conductor 30 acts as a magnetic field antenna, and magnetic field energy is radiated from the metal plate 46 to the outside. This enables communication with the reader / writer via the metal plate 46. The high-frequency signal radiated from the reader / writer of the RFID system and received by the metal plate 46 is supplied to the wireless IC element 50 via the loop-shaped radiation conductor 30, and the wireless IC element 50 operates. On the other hand, the response signal from the wireless IC element 50 is transmitted to the metal plate 46 through the loop-shaped radiation conductor 30 and radiated to the reader / writer.

  The loop-shaped radiation conductor 30 functions as an impedance matching circuit that couples the wireless IC element 50 and the metal plate 46. The loop-shaped radiation conductor 30 can be matched in impedance by adjusting its electrical length and the like.

  When the metal plate 46 is not close, as shown in FIG. 2B, the first and second surface-side conductors 31a and 31b and the neutral conductor 35 are in the first and second opposing regions 40a and 40b (FIG. 1). (See (B)), coupling is performed with relatively large capacitors C1 and C2. In this case, the high-frequency signal current flows through the first and second surface-side conductors 31a and 31b and the neutral conductor 35 via the capacitors C1 and C2, as indicated by a one-dot chain line. Further, as indicated by the dotted line, the high-frequency signal current is supplied from the first and second loop-shaped radiation conductors 30, that is, the first and second surface-side conductors 31 a and 31 b through the first and second interlayer connection conductors 34 a and 34 b. It flows in the back side conductors 33a and 33b. At this time, a part of the high-frequency signal is radiated to the outside as a magnetic field from the loop constituted by the first and second surface-side conductors 31a and 31b and the neutral conductor 35, and the loop-shaped radiation conductor 30 (31a, 31b, 33a, 33b, 34a, 34b) act as a dipole radiating element, and a high-frequency signal is radiated to the outside as an electric field.

  In this case, the first and second surface-side conductors 31a and 31b and the neutral conductor 35 coupled thereto function as an impedance matching circuit. By adjusting the electrical length of the neutral conductor 35 and the distance between the first and second surface-side conductors 31a and 31b and the neutral conductor 35, impedance matching between the wireless IC element 50 and the loop-shaped radiation conductor 30 is achieved. be able to. Then, by matching impedance between the first and second surface-side conductors 31a and 31b and the neutral conductor 35, the loop-shaped radiation conductor 30 functions as a dipole radiation element.

  The loop-shaped radiation conductor 30 has a predetermined resonance frequency corresponding to the electrical length, and the dipole radiating element similarly has a predetermined resonance frequency corresponding to the electrical length.

(Wireless IC element, see FIGS. 3 to 6)
The wireless IC element 50 may be a wireless IC chip 51 that processes a high-frequency signal, as shown in FIG. 3, or, as shown in FIG. 4, a resonant circuit having a predetermined resonance frequency with the wireless IC chip 51. It may be comprised with the electric power feeding circuit board 65 containing.

  The wireless IC chip 51 shown in FIG. 3 includes a clock circuit, a logic circuit, a memory circuit, and the like, and necessary information is stored in the memory. The wireless IC chip 51 is provided with input / output terminal electrodes 52 and 52 and mounting terminal electrodes 53 and 53 on the back surface thereof. The input / output terminal electrodes 52, 52 are electrically connected to the power supply terminals 32a, 32b shown in the first embodiment via metal bumps or the like. In addition, Au, solder, etc. can be used as a material of a metal bump.

  As shown in FIG. 4, when the wireless IC element 50 includes the wireless IC chip 51 and the power supply circuit board 65, various power supply circuits (including resonance circuits / matching circuits) may be provided on the power supply circuit board 65. it can. For example, as shown in FIG. 5 as an equivalent circuit, the feeder circuit 66 includes inductance elements L1 and L2 that have mutually different inductance values and are magnetically coupled in opposite phases to each other (indicated by mutual inductance M). May be. The power feeding circuit 66 has a predetermined resonance frequency, and aims at impedance matching between the impedance of the wireless IC chip 51 and the metal plate 46. Note that the wireless IC chip 51 and the power feeding circuit 66 may be electrically connected (DC connection) or may be coupled via an electromagnetic field.

  The power feeding circuit 66 transmits a high-frequency signal having a predetermined frequency transmitted from the wireless IC chip 51 to the loop-shaped radiation conductor 30, and receives the received high-frequency signal via the loop-shaped radiation conductor 30. To supply. Since the power feeding circuit 66 has a predetermined resonance frequency, impedance matching is easily achieved, and the impedance matching circuit, that is, the electrical lengths of the loop-shaped radiation conductor 30, the first and second surface-side conductors 31a and 31b, and the neutral conductor 35 are obtained. Can be shortened.

  Next, the configuration of the feeder circuit board 65 will be described. As shown in FIGS. 3 and 4, the input / output terminal electrode 52 of the wireless IC chip 51 is provided on the power supply terminal electrodes 142a and 142b formed on the power supply circuit board 65, and the mounting terminal electrode 53 is provided on the mounting terminal electrode 143a. , 143b through metal bumps or the like.

  As shown in FIG. 6, the feeder circuit board 65 is obtained by laminating, pressing and firing ceramic sheets 141a to 141h made of a dielectric or magnetic material. However, the insulating layer constituting the power supply circuit board 65 is not limited to the ceramic sheet, and may be a thermosetting resin such as a liquid crystal polymer or a resin sheet such as a thermoplastic resin. On the uppermost sheet 141a, power supply terminal electrodes 142a and 142b, mounting terminal electrodes 143a and 143b, and via-hole conductors 144a, 144b, 145a, and 145b are formed. On the second to eighth sheets 141b to 141h, wiring electrodes 146a and 146b constituting the inductance elements L1 and L2 are formed, and via-hole conductors 147a, 147b, 148a and 148b are formed as necessary. ing.

  By laminating the above sheets 141a to 141h, the inductance element L1 in which the wiring electrode 146a is spirally connected by the via hole conductor 147a is formed, and the inductance in which the wiring electrode 146b is spirally connected by the via hole conductor 147b. Element L2 is formed. In addition, a capacitance is formed between the wiring electrodes 146a and 146b.

  The end 146a-1 of the wiring electrode 146a on the sheet 141b is connected to the power supply terminal electrode 142a via the via hole conductor 145a, and the end 146a-2 of the wiring electrode 146a on the sheet 141h is connected via the via hole conductors 148a and 145b. Connected to the power supply terminal electrode 142b. The end 146b-1 of the wiring electrode 146b on the sheet 141b is connected to the power supply terminal electrode 142b via the via-hole conductor 144b, and the end 146b-2 of the wiring electrode 146b on the sheet 141h is connected via the via-hole conductors 148b and 144a. Connected to the power supply terminal electrode 142a.

  In the above power feeding circuit 66, the inductance elements L1 and L2 are wound in opposite directions, so that the magnetic fields generated by the inductance elements L1 and L2 are canceled. Since the magnetic field is canceled out, it is necessary to lengthen the wiring electrodes 146a and 146b to some extent in order to obtain a desired inductance value. As a result, the Q value is lowered, so that the steepness of the resonance characteristics is lost, and the bandwidth is increased in the vicinity of the resonance frequency.

  The inductance elements L1 and L2 are formed at different positions on the left and right when the feeder circuit board 65 is viewed in plan. The magnetic fields generated by the inductance elements L1 and L2 are opposite to each other. Thus, when the feeder circuit 66 is coupled to the loop radiation conductor 30, a reverse current is excited in the loop radiation conductor 30, and a current can be generated in the metal plate 46, and a potential difference due to the current is generated. Thus, the metal plate 46 can be operated as a radiating element (antenna).

  By incorporating the resonance / matching circuit in the power supply circuit board 65, characteristic fluctuations due to the influence of external articles can be suppressed, and deterioration in communication quality can be prevented. Further, if the wireless IC chip 51 constituting the wireless IC element 50 is arranged toward the center in the thickness direction of the power supply circuit board 65, the wireless IC chip 51 can be prevented from being broken, and the machine as the wireless IC element 50 can be prevented. Strength can be improved.

(Refer to the second embodiment, FIG. 7)
As shown in FIG. 7, the antenna device 10B according to the second embodiment is a first and second interlayer connection conductors 34a, 34b made of via-hole conductors or through-hole conductors provided in the dielectric body 20. Other configurations are the same as those of the first embodiment. Therefore, the operational effects of the second embodiment are the same as those of the first embodiment. And a via-hole conductor or a through-hole conductor can be easily formed in the same process as manufacturing a normal printed wiring board.

(Refer to the third embodiment, FIG. 8)
As shown in FIG. 8A, the antenna device 10C according to the third embodiment is provided with a neutral conductor 35 in the inner layer of the dielectric body 20, and the other configuration is the same as that of the first embodiment. It is. In the third embodiment, the same function and effect as in the first embodiment are achieved. In particular, in the third embodiment, since the neutral conductor 35 is provided in the inner layer of the dielectric element body 20, the capacitances C1 and C2 can be increased. Conversely, the area of the neutral conductor 35 can be reduced. Further, since the neutral conductor 35 is arranged in a layer different from the back-side conductors 33a and 33b, the size of the neutral conductor 35 can be set relatively freely.

  That is, when the metal plate 46 is close, when a predetermined high-frequency signal is transmitted from the wireless IC element 50, as shown by a dotted line in FIG. 8B, the loop-shaped radiation conductor 30 and the loop-shaped radiation conductor 30 A high-frequency signal current flows along the surface of the metal plate 46 coupled to the. A loop surface, which is a circumferential surface of the loop-shaped radiation conductor 30, is disposed perpendicular to the metal plate 46. The end portions of the first and second back surface side conductors 33 a and 33 b are coupled to the metal plate 46 by a capacitor via an adhesive 47. The high-frequency signal current flows through the metal plate 46 as a current path through this capacitive coupling. The loop-shaped radiation conductor 30 acts as a magnetic field antenna, and magnetic field energy is radiated from the metal plate 46 to the outside. This enables communication with the reader / writer via the metal plate 46. The high-frequency signal radiated from the reader / writer of the RFID system and received by the metal plate 46 is supplied to the wireless IC element 50 via the loop-shaped radiation conductor 30, and the wireless IC element 50 operates. On the other hand, the response signal from the wireless IC element 50 is transmitted to the metal plate 46 through the loop-shaped radiation conductor 30 and radiated to the reader / writer. The loop radiation conductor 30 functions as an impedance matching circuit between the wireless IC element 50 and the metal plate 46 as in the first embodiment.

  When the metal plate 46 is not close, as shown in FIG. 8C, the first and second surface-side conductors 31a and 31b and the neutral conductor 35 are relatively separated by the first and second opposing regions 40a and 40b. Coupling with large capacitors C1 and C2. In this case, the high-frequency signal current flows through the first and second surface-side conductors 31a and 31b and the neutral conductor 35 via the capacitors C1 and C2, as indicated by a one-dot chain line. Further, as indicated by the dotted line, the high-frequency signal current is supplied from the first and second loop-shaped radiation conductors 30, that is, the first and second surface-side conductors 31 a and 31 b through the first and second interlayer connection conductors 34 a and 34 b. It flows in the back side conductors 33a and 33b. At this time, a part of the high-frequency signal is radiated to the outside as a magnetic field from the loop constituted by the first and second surface-side conductors 31a, 31b and the neutral conductor 35, and the loop-shaped radiation conductor 30 (conductors 31a, 31) 31b, 33a, 33b, 34a, 34b) act as a dipole radiating element, and a high frequency signal is radiated to the outside as an electric field. The first and second surface-side conductors 31 a and 31 b and the neutral conductor 35 coupled to the first and second surface-side conductors 31 a and 31 b function as an impedance matching circuit between the wireless IC element 50 and the loop-shaped radiation conductor 30. Functions as a dipole radiating element in the same manner as in the first embodiment.

(Other examples)
The antenna device and the wireless communication device according to the present invention are not limited to the above-described embodiments, and can be variously modified within the scope of the gist.

  In particular, the detailed structure and shape of the loop-shaped radiation conductor are arbitrary. Further, for example, when the antenna device and the metal plate are brought close to each other, the antenna device is attached to the metal plate via the insulating adhesive, but may be attached via the conductive adhesive. In this case, the loop-shaped radiation conductor is directly coupled (DC connection) to the metal plate.

  As described above, the present invention is useful for an antenna device and a wireless communication device, and is particularly excellent in that it functions as a radiating element even when a metal member is close or not close. .

10A, 10B, 10C ... Antenna device 20 ... Dielectric body 30 ... Loop radiation conductor 31a, 31b ... Front side conductor 32a, 32b ... Feed terminal 33a, 33b ... Back side conductor 34a, 34b ... Interlayer connection conductor 35 ... Neutral Conductor 36a, 36b ... Slit portion 40a, 40b ... Opposite area 50 ... Wireless IC element 51 ... Wireless IC chip 65 ... Feed circuit board 66 ... Feed circuit

Claims (7)

  1. A dielectric element body, first and second surface side conductors provided on the surface side of the dielectric element body, a back surface side conductor provided on the back side of the dielectric element body, a first surface side conductor, and A loop-shaped radiation conductor coupled in a loop with a first interlayer connection conductor connecting the back-side conductor and a second interlayer connection conductor connecting the second surface-side conductor and the back-side conductor;
    A neutral conductor independent of the loop radiation conductor;
    With
    The neutral conductor has a first facing region facing the first surface side conductor and a second facing region facing the second surface side conductor;
    An antenna device characterized by the above.
  2. The back side conductor and the neutral conductor are provided on the back side of the dielectric body,
    The back-side conductor is divided into first and second back-side conductors with the neutral conductor interposed between the first and second slits,
    The first back side conductor is connected to the first surface side conductor via the first interlayer connection conductor, and the second back side conductor is connected to the second surface side conductor via the second interlayer connection conductor;
    The antenna device according to claim 1.
  3. The back surface side conductor is provided on the back surface of the dielectric element body and a first back surface side conductor provided on the back surface of the dielectric element body and connected to the first front surface side conductor via a first interlayer connection conductor. And a second back side conductor connected to the second front side conductor via the second interlayer connecting conductor,
    The antenna device according to claim 1, wherein the neutral conductor is provided in an inner layer of the dielectric element body.
  4.   The antenna device according to any one of claims 1 to 3, wherein the first and second interlayer connection conductors are formed of via-hole conductors or through-hole conductors provided in the dielectric body.
  5. A wireless IC element for processing a high-frequency signal, and an antenna device coupled to the wireless IC element,
    The antenna device is
    A dielectric element body, first and second surface side conductors provided on the surface side of the dielectric element body, a back surface side conductor provided on the back side of the dielectric element body, a first surface side conductor, and A loop-shaped radiation conductor coupled in a loop with a first interlayer connection conductor connecting the back-side conductor and a second interlayer connection conductor connecting the second surface-side conductor and the back-side conductor;
    A neutral conductor independent of the loop radiation conductor;
    With
    The neutral conductor has a first facing region facing the first surface side conductor and a second facing region facing the second surface side conductor;
    A wireless communication device.
  6.   The wireless communication device according to claim 5, wherein the wireless IC element is a wireless IC chip that processes a high-frequency signal.
  7.   The wireless communication device according to claim 5, wherein the wireless IC element includes a wireless IC chip that processes a high-frequency signal and a power supply circuit board including a power supply circuit having a predetermined resonance frequency. device.
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