JPS6295295A - Integrated circuit card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a card-sized IC card on which semiconductor elements such as RE, LSI, etc. are arranged.

2. Description of the Related Art In recent years, IC cards or memory cards in which semiconductor elements such as ICs and LSIs are embedded have been put into practical use. FIG. 2 shows a conventional structure, and these C cards and memory cards consist of a module body on which a semiconductor element is mounted and a plastic card base material. A module body 40 shown in FIG. 2 is mounted on a card base material 1o made of hard vinyl chloride, glass epoxy, ABS resin, or the like.

A recess 11 for embedding is provided, into which the module body 40 is fitted.

The module body 40 is constructed by providing recesses in the through-hole printed circuit board 13 on both sides, installing the semiconductor element 12 thereon, and attaching ultrafine wires 16 of Au or A/ by the wire bonding method.
．． At 16', the electrode of the semiconductor element 12 and the wiring 16.15 of the printed circuit board 13 are connected. The wiring 15115 of the printed circuit board 13 is electrically connected to the external lead-out electrode terminals 14+14' formed on the opposite surface of the printed circuit board 13 through a through hole. The entire body is molded with resin 17 in the state shown in FIG. 2, and this is embedded in the recess 11 of the card base material 1o.Furthermore, a film 18 is laminated on the surface of the card base material 10 to improve the appearance of the module. It is something to do. The thickness of the card base material is generally about 0.8 mm, and the heights of the resin 17 and the ultrafine wires 16 and 16' of the module body 40 are adjusted according to this thickness.

Problems to be Solved by the Invention These conventional cards have the following problems. If stress such as bending is applied to the card itself, the module body, which is simply fitted into a recess in the flexible card base material, will easily pop out of the recess, failing to perform its original function and causing serious damage. It was causing a lot of trouble. Also,
Since the semiconductor elements are mounted on the printed circuit board, the thickness of the module body increases, making it extremely difficult to embed it in a card with a thickness of only O. It is in the range of being thicker than the wood, which hinders its practical application.

The external lead-out electrode terminal that contacts the external terminal is made of Au-plated copper foil formed on the printed circuit board, so if the external terminal comes into contact with strong force, this external lead-out electrode terminal will be worn out or damaged. Not only can it not withstand permanent use, but since the card base material is made of a resinous material, it is sensitive to heat and deforms when even a small amount of bending stress is applied, making it extremely impractical. Furthermore, the surface of the card base material had numerous scratches due to long-term use, and the appearance lacked beauty.

Furthermore, each time a plurality of semiconductor elements are mounted or other passive elements or active elements are added, the recessed portion of the card base must be made thicker. As a result, the card itself was damaged due to the bending stress of the card itself, making it extremely impractical.

Means for Solving the Problems The present invention aims to eliminate the above problems by using ceramics as the base material of the card.

Not only is the working ceramic itself hard and resistant to bending stress, but the electrode terminal for external lead-out can be printed and fired, so a highly reliable electrode terminal that does not wear out can be constructed. Furthermore, since the wiring pattern necessary to mount a semiconductor element can be formed directly on the ceramic itself, the printed wiring board that was previously required is no longer necessary, and the semiconductor element can protrude from the card base material and become unusable. No accidents will occur.

Embodiment An embodiment of the present invention will be explained with reference to FIG. A card base material having a card size of 0.8 mm in thickness is made of ceramics and has a recess 3 for mounting a semiconductor element 1 thereon. The external lead-out electrode terminals 4.4', which serve as electrical contacts for exchanging signals with the outside, are made of Au.

It is made of a conductive material such as Cu, Pd, Aged, etc., and is provided on the surface of the card base material 2 by a screen printing method and fired. Further, the semiconductor element 1 is electrically connected by a connecting wire 9 to an internal wiring 6,6' provided around the recess 3, which is also printed by the screen method and fired. The semiconductor element 1 is fixed to the bottom surface of the recess 3 with a conductive adhesive 1 or an ordinary adhesive or an alloy of Au and Si, and the connecting wires 9 are connected to the wires 25 to 25 by wire bonding.
Although it is also possible to use an ultra-thin wire of 36 μmφ A/mm U, the film lead can be installed using the film carrier method. It may be connected to e'. Alternatively, metal protrusions may be formed on the electrodes of the semiconductor element, and connections may be made to internal wiring via the metal protrusions.

Further, the internal wirings 6, 6' are electrically connected to at least the external lead-out electrode terminals 4, 4' by through-hole wirings 5.5'. Further, the surface of the semiconductor element 1 is filled with a protective resin 7 up to the upper surface of the recess. Alternatively, as shown in FIG. 3, a thin film 8 with a decorative design may be attached to the surface of the card base material 2.

In any case, the external lead-out electrode terminals 4, 4', internal wiring 6, 6', and through-hole wiring 5, 5' are provided at the stage of forming the ceramic base material.・It is made by stacking a plurality of 2-inch thick sheet-like sheets on top of each other. Wiring is formed on each sheet by the above-mentioned screen printing method, and finally it is fired at a relatively high temperature. Further, the recess provided in the card base material may be a through hole.

Furthermore, referring to other embodiments, FIG.
' is formed and is integrated with the ceramic base material. For example, if a semiconductor element is made into a card, the semiconductor element may be damaged by static electricity. To prevent this, a varistor, a resistor, etc. must be directly connected to the conductor element. For this reason, conventionally,
It is necessary to make the recess on the card thicker.
When the recesses become sharper, the bending stress of the card itself becomes weaker.
There was a risk of damaging the card.

However, if ceramics are used for the card base material as in the present invention, these passive elements,
The active elements can be baked together and there will be no change in appearance. The passive element or active element 30.30'
The wiring 31+31' connected to the semiconductor element 1 and the external lead-out electrode terminals 4, 4' are also integrally formed and connected.

With the structure of the present invention, compared to the conventional resin card,
It has much higher strength, does not undergo extreme bending, and does not cause semiconductor elements to pop out. In addition, since it is heat resistant, it not only ensures stable performance even when stored at relatively high temperatures, but also allows the formation of external lead-out electrode terminals, passive elements, and active elements that are integrated with the card base material. The manufacturing cost is significantly reduced.

Effect of the invention The present invention has the following effects.

(1) The external lead-out electrode terminal that comes into direct contact with the external terminal is printed on the ceramic base material and fired.
There is no wear or damage to this external lead-out electrode terminal.

(2) The card itself is made of ceramic, which is hard and resistant to damage and impact stress, so there is no damage to the card itself, and it is durable because it can self-recover even when mechanical stress is applied. It is possible to create a highly practical card. Up to 1 heat resistance can also be obtained.

(3) Also, unlike the conventional structure, the module body in which the semiconductor element is mounted on the printed circuit board is not buried;
Even if bending stress is applied to the card itself, there will be no accidents such as the semiconductor element itself flying out from the card.

(4) Since the card itself is made of ceramics, the manufacturing cost of the card itself is low.

(5) Passive elements and active elements such as semiconductor elements, resistors, and capacitors can be formed inside the card base material at the manufacturing stage of the card base material, and wiring with external lead-out electrode terminals is also integrated. Therefore, not only can additional functions be easily increased, but also a highly reliable card can be obtained since the number of connection points is significantly reduced.

(6) Since a conventional printed circuit board is not used, not only can the thickness of the card be made thinner, but also the number of component parts can be reduced, making it possible to construct an even cheaper card.

[Brief explanation of drawings]

1, 3, and 4 are cross-sectional views of an IC card according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the structure of a conventional IC card. 1...Semiconductor element, 2...Card base material, 3...River/recess, 4.4'...External lead-out electrode terminal, 7... ·resin. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 14 14' Figure 3 Figure 4

Claims (3)

[Claims] (1) An IC card characterized in that at least the base material is made of ceramics. (2) I according to claim 1, characterized in that the external lead-out electrode terminal is printed on a ceramic base material.
C card. (3) The IC card according to claim 1, characterized in that a passive element and an active element are formed on a ceramic base material.