JP2932772B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device having an active element, a passive element and the like mounted on a wiring board.

[0002]

2. Description of the Related Art Conventionally, a hybrid integrated circuit device of this kind is shown in FIG.
As shown in FIG. 6 and FIG.
Then, the through-hole electrode 2 is provided on the end face of the substrate, and the active element, the passive element 8 and the like are mounted with a conductive or insulating adhesive 7 and then mechanically fixed by heating and curing.

Next, the electrodes of the active element and the passive element 8 are electrically connected to the wiring pattern 6 of the wiring board 1 by wire bonding using a thin metal wire 9, and finally the active element and the passive element 8 are electrically connected. And exterior resin 5 for mechanical protection
It is structured to cover with.

[0004]

In this conventional hybrid integrated circuit device, the thermal conductivity is about 0.0004 c because the wiring board 1 is made of an organic material such as glass epoxy.
al / sec · cm · ° C
There was a disadvantage that the active element, the passive element 8 and the like could not be used due to the restriction of thermal conductivity.

Further, the thermal expansion coefficient is about 15-20 × 10 ^-6.
After mounting the active element, the passive element 8 and the like on the 1 / ° C. wiring board 1, the exterior resin 5 having a coefficient of thermal expansion of about 25 to 30 × 10 ⁻⁶ is used for the purpose of electrical and mechanical protection. There is a drawback that mechanical distortion occurs due to a difference in thermal expansion coefficient and a contraction force when the exterior resin 5 is cured, and the wiring substrate 1 warps, so that surface mounting cannot be performed.

When the size of the wiring board 1 is increased, the warpage is further increased. In addition, when the active element and the passive element 8 are used in an environment where there is a lot of electric disturbance noise only by being protected electrically and mechanically by the exterior resin 5, a noise countermeasure is provided by the metallic shield plate 4. There was a problem that had to be done.

[0007]

According to the hybrid integrated circuit device of the present invention, a metal plate 10 is mounted on a die pad portion of the wiring board 1 on which one or more active elements, passive elements 8 and the like are mounted. The structure includes a structure in which the metal shield plate 4 is fixed using a concave portion that reaches to the metal plate 10 and a structure in which a metallic shield plate 4 is provided on the surface of the exterior resin 5 on the active element and passive element 8 side in the extension of the suspension pin 3 integrated with the metal plate 10.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. 1, 2 and 3 are a plan view and a sectional view of a hybrid integrated circuit device according to one embodiment of the present invention. For example, the thermal conductivity of the 42 alloy Cu alloy or the like is about 0.04 to
A metal plate 10 of 0.4 cal / sec · cm · ° C. is provided on the inner layer by a multilayer printed board manufacturing technique, and the through-hole electrode 2 and the wiring pattern 6 are formed to a thickness of about 30 to 35 μm (Cu foil) using an electroplating method of a printed board. C (including underground)
u plating, and about 5 to 8
Ni plating of about μm and Au plating of about 0.3 to 0.5 μm are applied.

Next, a concave portion is provided in a mounting portion of the active element, the passive element 8 and the like, so that the metal plate 10 is exposed and
The active element, the passive element 8 and the like are mounted using the adhesive 7, and are heated and cured at about 150 to 200 ° C. and joined.

Next, after the active element passive element 8 and the like and the wiring pattern 6 are electrically connected by a wire bonding method with a thin metal wire 9 having a diameter of about 25 to 30 μm, the exterior resin 5 is formed by a podding or transfer molding method. The external disturbance noise is reduced by about 10 to 50% by covering the surface of the exterior resin 5 such as the active element and the passive element 8 with the metallic shield plate 4 on the extension of the suspension pin 3 integrated with the metal plate 10.
In addition to being able to shield to a certain extent, unnecessary radiation noise from the active element, the passive element 8 and the like does not affect the surrounding electronic circuits and devices. Therefore, the noise margin of the hybrid integrated circuit device can be significantly improved.

FIG. 4 is a sectional view showing a second embodiment.
According to the present invention, the heat radiation fins 11 are joined to the metal shield plate 4 to further improve the heat radiation effect, and the active element, the passive element 8 and the like which consume large power can be mounted.

[0012]

As described above, the present invention has a structure in which the active element, the passive element 8 and the like are directly joined to the metal plate 3, so that the thermal conductivity is reduced from the conventional value of about 0.0004 to about 0. Since the power consumption can be greatly reduced to 0.04 to 0.41 / ° C., there is an effect that an active element and a passive element 8 having large power consumption can be mounted.

Further, since the wiring board 1 withstands a heat shrinkage force due to a difference in thermal expansion coefficient of the exterior resin 5 and the like, the warpage of the wiring board 1 can be greatly reduced. Further, by including the wiring board 1, the active element, the passive element 8 and the like in the metal shield plate 4, the electric noise margin can be remarkably improved and the heat radiation effect can be remarkably improved.

Further, in solder mounting by infrared reflow or the like, by providing the metal shield plate 4 on the surface of the exterior resin 5, infrared rays are reflected and heat is not transmitted directly to the interior of the exterior resin 5. Can be greatly reduced. Therefore, cracks and the like of the wiring board 1 and the exterior resin 5 can be prevented.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a sectional view taken along line BB of FIG. 1;

FIG. 4 is a sectional view showing another embodiment of the present invention.

FIG. 5 is a plan view showing a conventional example.

FIG. 6 is a sectional view taken along line CC of FIG. 5;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 2 Through-hole electrode 3 Hanging pin 4 Metallic shield plate 5 Outer resin 6 Wiring pattern 7 Adhesive 8 Active element, passive element 9 Fine metal wire 10 Metal plate

──────────────────────────────────────────────────の Continued on front page (51) Int.Cl. ⁶ Identification code FI H01L 25/18

Claims (1)

(57) [Claims] 1. A wiring board having a metal plate, a recess provided in the wiring board exposing the metal plate, an active element and a passive element provided on the metal plate, and a resin filling the recess. And a metal shield plate provided on the resin, and a suspension pin connected to the metal plate, wherein an extension of the suspension pin is provided along a top surface from a side surface of the wiring board and is provided on the metal shield plate. A hybrid integrated circuit device which is connected.