JPS6436185U - - Google Patents
Info
- Publication number
- JPS6436185U JPS6436185U JP13124987U JP13124987U JPS6436185U JP S6436185 U JPS6436185 U JP S6436185U JP 13124987 U JP13124987 U JP 13124987U JP 13124987 U JP13124987 U JP 13124987U JP S6436185 U JPS6436185 U JP S6436185U
- Authority
- JP
- Japan
- Prior art keywords
- card
- base material
- wiring pattern
- internal wiring
- card base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000003779 heat-resistant material Substances 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は、本考案によるＩＣカードの実施例の
要部を示した断面図、第２図は、同実施例カード
を製造工程順に示した図である。第３図は、本考
案によるＩＣカードの他の実施例の要部を示した
断面図である。
１……カード基材、２……外部接続端子、３…
…内部配線パターン、３ａ……補強層、４……接
着剤層、５……封止枠板、６……ＩＣチツプ、７
……ダイボンデイング用接着剤、８……導体、９
……モールド用樹脂、１０……ラベル。
FIG. 1 is a sectional view showing the main parts of an embodiment of an IC card according to the present invention, and FIG. 2 is a diagram showing the same embodiment card in the order of manufacturing steps. FIG. 3 is a sectional view showing the main parts of another embodiment of the IC card according to the present invention. 1...Card base material, 2...External connection terminal, 3...
...Internal wiring pattern, 3a... Reinforcement layer, 4... Adhesive layer, 5... Sealing frame board, 6... IC chip, 7
...Die bonding adhesive, 8...Conductor, 9
...Mold resin, 10...Label.
Claims (1)
テイ部が設けられた耐熱性を有する材質からなる
カード基材と、前記カード基材の前記キヤビテイ
部側に設けられた内部配線パターンと、前記カー
ド基材の前記内部配線パターンと同一または反対
側の面に設けられその内部配線パターンと導通す
る外部接続用端子と、前記カード基板の前記キヤ
ビテイ部に直接実装されたＩＣチツプと、前記カ
ード基材の前記ＩＣチツプの実装部を掛止する掛
止層とから構成したＩＣカード。 (2) 前記カード基材には、前記内部配線パター
ンおよび前記外部接続用端子が設けられた部分を
除いた全面に強度補強層が設けられていることを
特徴とする実用新案登録請求の範囲第１項記載の
ＩＣカード。 (3) 前記カード基材の材質は、ガラスエポキシ
フイルムまたはＢＴレジンフイルムであることを
特徴とする実用新案登録請求の範囲第１項記載の
ＩＣカード。[Claims for Utility Model Registration] (1) A card base material made of a heat-resistant material and provided with a concave cavity portion for mounting an IC chip; an internal wiring pattern, an external connection terminal provided on the same or opposite surface of the card base material as the internal wiring pattern and electrically connected to the internal wiring pattern, and an external connection terminal mounted directly on the cavity portion of the card substrate. An IC card comprising an IC chip and a hooking layer for hooking a mounting portion of the IC chip of the card base material. (2) Utility model registration claim 1, characterized in that the card base material is provided with a strength reinforcing layer on the entire surface except for the portion where the internal wiring pattern and the external connection terminal are provided. IC card described in Section 1. (3) The IC card according to claim 1, wherein the material of the card base material is a glass epoxy film or a BT resin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13124987U JPS6436185U (en) | 1987-08-28 | 1987-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13124987U JPS6436185U (en) | 1987-08-28 | 1987-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6436185U true JPS6436185U (en) | 1989-03-06 |
Family
ID=31387137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13124987U Pending JPS6436185U (en) | 1987-08-28 | 1987-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6436185U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6153096A (en) * | 1984-08-23 | 1986-03-15 | 株式会社東芝 | Identification card |
| JPS6163498A (en) * | 1984-09-05 | 1986-04-01 | 株式会社東芝 | Integrated circuit card |
| JPS6295295A (en) * | 1985-10-23 | 1987-05-01 | 松下電器産業株式会社 | Integrated circuit card |
-
1987
- 1987-08-28 JP JP13124987U patent/JPS6436185U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6153096A (en) * | 1984-08-23 | 1986-03-15 | 株式会社東芝 | Identification card |
| JPS6163498A (en) * | 1984-09-05 | 1986-04-01 | 株式会社東芝 | Integrated circuit card |
| JPS6295295A (en) * | 1985-10-23 | 1987-05-01 | 松下電器産業株式会社 | Integrated circuit card |
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