JPH0212875U - - Google Patents
Info
- Publication number
- JPH0212875U JPH0212875U JP9032588U JP9032588U JPH0212875U JP H0212875 U JPH0212875 U JP H0212875U JP 9032588 U JP9032588 U JP 9032588U JP 9032588 U JP9032588 U JP 9032588U JP H0212875 U JPH0212875 U JP H0212875U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- card
- module
- reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案によるＩＣモジユールおよびＩ
Ｃカードの第１の実施例を示すＩＣカード側断面
図であり、第２図は本考案の第２の実施例を示す
ＩＣカードの側断面図であり、第３図は本考案の
第２の実施例を示すＩＣモジユールの底面図であ
り、第４図は本考案の第３の実施例を示すＩＣカ
ードの側断面図であり、第５図は本考案の第４の
実施例を示すＩＣカードの側断面図である。
１０……ＩＣカード、１１……ＩＣモジユール
、１２……基板、１３……外部端子、１４……ス
ルーホール、１４ａ……導電メツキ、１５……パ
タン層、１７……ＩＣチツプ、１８……ボンデイ
ングワイヤ、１９……樹脂モールド部、２０……
金属補強板、２１……ダイボンデイング接着剤、
２３……ソルダレジスト層、３０……カード基材
、３４……接着剤、３５……凹部。
Figure 1 shows the IC module and I according to the present invention.
FIG. 2 is a side cross-sectional view of an IC card showing a first embodiment of the C card, FIG. 2 is a side cross-sectional view of an IC card showing a second embodiment of the present invention, and FIG. FIG. 4 is a side sectional view of an IC card showing a third embodiment of the present invention, and FIG. 5 shows a fourth embodiment of the present invention. It is a side sectional view of an IC card. 10...IC card, 11...IC module, 12...board, 13...external terminal, 14...through hole, 14a...conductive plating, 15...pattern layer, 17...IC chip, 18... Bonding wire, 19...Resin mold part, 20...
Metal reinforcing plate, 21...Die bonding adhesive,
23...Solder resist layer, 30...Card base material, 34...Adhesive, 35...Recessed portion.
Claims (1)
の他方の面にＩＣチツプおよびパタン層を設け、
このＩＣチツプならびに配線部の周囲を樹脂モー
ルドしてなるＩＣモジユールにおいて、前記基板
と前記ＩＣチツプとの間にＩＣチツプを補強する
補強板を介在させたことを特徴とするＩＣモジユ
ール。 ２ カード基材の表面に形成された凹部内に請求
項１記載のＩＣモジユールを装着してなるＩＣカ
ード。[Claims for Utility Model Registration] 1. An external terminal is provided on one side of a substrate, an IC chip and a pattern layer are provided on the other side of the substrate,
An IC module formed by resin molding the periphery of the IC chip and the wiring section, characterized in that a reinforcing plate for reinforcing the IC chip is interposed between the substrate and the IC chip. 2. An IC card comprising the IC module according to claim 1 installed in a recess formed on the surface of a card base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9032588U JPH0212875U (en) | 1988-07-07 | 1988-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9032588U JPH0212875U (en) | 1988-07-07 | 1988-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0212875U true JPH0212875U (en) | 1990-01-26 |
Family
ID=31314850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9032588U Pending JPH0212875U (en) | 1988-07-07 | 1988-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0212875U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002123809A (en) * | 2000-10-16 | 2002-04-26 | Dainippon Printing Co Ltd | Ic module and ic card using it |
-
1988
- 1988-07-07 JP JP9032588U patent/JPH0212875U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002123809A (en) * | 2000-10-16 | 2002-04-26 | Dainippon Printing Co Ltd | Ic module and ic card using it |
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