JPS6430848U - - Google Patents
Info
- Publication number
- JPS6430848U JPS6430848U JP12571887U JP12571887U JPS6430848U JP S6430848 U JPS6430848 U JP S6430848U JP 12571887 U JP12571887 U JP 12571887U JP 12571887 U JP12571887 U JP 12571887U JP S6430848 U JPS6430848 U JP S6430848U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- circuit board
- printed circuit
- semiconductor element
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 238000009429 electrical wiring Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示す半導体装置の断
面図、第２図は第１図に示される半導体装置の基
板の製造工程図、第３図は第１図に示されれる半
導体装置の入出力端子部の拡大断面図、第４図は
従来の半導体装置の断面図、第５図は第４図に示
される半導体装置の基板の拡大部分上面図、第６
図はその基板の拡大部分断面図、第７図は本考案
の他の実施例を示す半導体装置の断面図である。
２……半導体素子、３……金属細線、４……封
止枠、５……封止樹脂、６……ピン入出力端子、
７……蓋、１０，２０……プリント基板、１１…
…コア材、１２，１５，２２……金属層（銅箔）
、１３……エポキシ接着材（プリプレグ）、１４
……上面基板、２１……挟持形入出力端子。
FIG. 1 is a cross-sectional view of a semiconductor device showing an embodiment of the present invention, FIG. 2 is a manufacturing process diagram of the substrate of the semiconductor device shown in FIG. 1, and FIG. 3 is a cross-sectional view of the semiconductor device shown in FIG. 1. FIG. 4 is an enlarged cross-sectional view of the input/output terminal portion, FIG. 4 is a cross-sectional view of a conventional semiconductor device, FIG. 5 is an enlarged partial top view of the substrate of the semiconductor device shown in FIG. 4, and FIG.
The figure is an enlarged partial sectional view of the substrate, and FIG. 7 is a sectional view of a semiconductor device showing another embodiment of the present invention. 2...Semiconductor element, 3...Metal thin wire, 4...Sealing frame, 5...Sealing resin, 6...Pin input/output terminal,
7... Lid, 10, 20... Printed circuit board, 11...
... Core material, 12, 15, 22 ... Metal layer (copper foil)
, 13...Epoxy adhesive (prepreg), 14
...Top board, 21...Pinch type input/output terminal.
Claims (1)
該プリント基板上に固着され、かつ、前記リード
と接続された半導体素子と、該半導体素子及び該
半導体素子と前記リードの接続部を封止する樹脂
部を具備する半導体装置において、 前記プリント基板内部に電気的配線と接続され
ることのない金属層を設けるようにしたことを特
徴とする半導体装置。[Claims for Utility Model Registration] A printed circuit board on which leads are formed,
In the semiconductor device, the semiconductor device includes a semiconductor element fixed on the printed circuit board and connected to the lead, and a resin part that seals the semiconductor element and the connecting portion between the semiconductor element and the lead, comprising: an interior of the printed circuit board; 1. A semiconductor device characterized in that a metal layer that is not connected to electrical wiring is provided on the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12571887U JPS6430848U (en) | 1987-08-20 | 1987-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12571887U JPS6430848U (en) | 1987-08-20 | 1987-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430848U true JPS6430848U (en) | 1989-02-27 |
Family
ID=31376570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12571887U Pending JPS6430848U (en) | 1987-08-20 | 1987-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430848U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7400964B2 (en) | 2003-12-05 | 2008-07-15 | Toyota Jidosha Kabushiki Kaisha | Deceleration control apparatus and method for a vehicle |
| US7427254B2 (en) | 2003-12-05 | 2008-09-23 | Toyota Jidosha Kabushiki Kaisha | Deceleration control apparatus and method for a vehicle |
| US7469178B2 (en) | 2004-02-10 | 2008-12-23 | Toyota Jidosha Kabushiki Kaisha | Deceleration control apparatus and method for a vehicle |
-
1987
- 1987-08-20 JP JP12571887U patent/JPS6430848U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7400964B2 (en) | 2003-12-05 | 2008-07-15 | Toyota Jidosha Kabushiki Kaisha | Deceleration control apparatus and method for a vehicle |
| US7427254B2 (en) | 2003-12-05 | 2008-09-23 | Toyota Jidosha Kabushiki Kaisha | Deceleration control apparatus and method for a vehicle |
| US7469178B2 (en) | 2004-02-10 | 2008-12-23 | Toyota Jidosha Kabushiki Kaisha | Deceleration control apparatus and method for a vehicle |
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