JPS62236793A - Integrated circuit card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a card having a layered structure in which a plurality of plastic sheets are laminated and incorporating a semiconductor integrated circuit (hereinafter simply referred to as an IC) such as an LSI. Regarding structure.

Conventional technology IC An IC card enclosed in a stack of multiple plastic sheets has electronic circuits such as memory and data processing circuits built into the main body of the IC card 1, as shown in the standard appearance diagram in Figure 4. The IC device embedding section 2 has the same IC element embedding section 2, and circuit information therein is input/outputted through a connection terminal for external connection that is electrically connected to an external device such as a data transfer device.

However, if these connection terminals are exposed, the IC
When carrying the card or using the IC card, for example, there is a risk that the internal circuit function may be destroyed due to high electrostatic input.

Further, the thickness of the IC card is approximately 0.8wn, and
The built-in IC element is extremely thin, approximately 0.15 m thick, and its mechanical rigidity is extremely low, making it susceptible to unnecessary external forces when carried or used.

When the IC card is deformed, a bending moment or the like acts on the built-in IC element, and there is a fear that the IC element itself may be mechanically destroyed.

In order to protect IC elements from destruction of circuit functions due to high electrostatic input, as shown in FIG. After bonding the IC element 3 and curing the bonding resin 16, the electrode part bonding pad 4 of the IC element 3 and the bonding pattern electrode part 8 provided on the circuit board 11 are electrically connected using a gold wire 5. The circuit board 1 is connected to the circuit board 1 in a predetermined hole of a center core 12 having a thickness of approximately 0.5 fi made of hard vinyl chloride or the like.
1, and a coating resin 15 such as epoxy resin is placed in the hole of the center core 12.
The circuit board 11. is filled and cured, and then the circuit board 11. Conductive films 14 are placed on both the upper and lower surfaces of the IC section in which the center core 12 and the like are combined.

A structure was adopted in which this and an oversheet 13 made of hard vinyl chloride or the like and having a thickness of approximately 0.1 mm were laminated together by heating and pressing with a flat press.

Further, the conductive film 14 reduces the adhesion area between the center core 12 and the oversheet 13 and reduces the adhesive force between them, so a reticular conductive net may be used instead of the conductive film. there were.

Problems to be Solved by the Invention In order to protect IC elements from destruction of circuit functions due to high electrostatic input, in structures where the upper and lower surfaces of electronic circuits including IC elements are shielded and protected with conductive films, etc. In addition to the increase in material costs due to the increase in the number of parts used.

Placing a conductive film or the like between the oversheet and the center core or circuit board reduces the contact surface area between the two, which reduces adhesive strength and reduces the yield of IC cards. , furthermore, an electronic circuit including an IC element,
Even if it is coated with epoxy resin etc., its thickness is
Since it is extremely thin, measuring only about 0.5 mm at most, it has the disadvantage that it is easily destroyed by bending when carrying or using an IC card.

Means for Solving the Problems In order to solve the above-mentioned disadvantages, the present invention provides an IC card with a built-in IC, elements, etc. and a layered structure made of a plurality of laminated plastic sheets, in which the IC elements, etc. are made elastic. It has a structure embedded in resin.

Function: Due to the structure in which the IC element is embedded in the elastic resin, the IC
When the card is deformed by an external force, the elastic resin is deformed, and no external mechanical force is applied to the IC element.
Prevents IC elements etc. from mechanical destruction.

Embodiment An embodiment of the IC card of the present invention will be described with reference to FIGS. 1 to 4.

FIG. 1 is a diagram for explaining the structure of an IC card according to an embodiment, and is a cross-sectional view of the IC element embedding part 2 in FIG. 4, which is a schematic diagram of the entire IC card, and FIG. FIG. 2 is a wiring diagram showing electrical circuits of terminals.

The IC element 3 is made of hard vinyl chloride or the like and has a thickness of approximately 0.
A gold wire 5 with a thickness of about 26 μm is bonded to a predetermined surface of a 15 mm circuit board 11 with an elastic and conductive bonding resin 7, and the electrode bonding pad 4 of the IC element 3 is bonded to a predetermined surface of a 15 mm circuit board 11. It is electrically connected to the bonding pattern electrode section 8 of the circuit board 11 through the bonding pattern electrode section 8 , and the bonding pattern electrode section 8 is electrically connected to the connecting terminal 1° via the through hole 9 .

It is made of hard vinyl chloride, etc. and has a thickness of about 0.5'm.
After arranging the IC element 3 in the xC element arrangement hole of the mO center core 12, for example, J
It is filled with a resin 6 which has a hardness of 20 to 40 degrees according to the IS and MU standards, an elasticity of about 150% of the elongation rate, and has semiconductivity. In this way, the IC element 3 is embedded in the resin 6 having both elasticity and semiconductivity.
I made a card.

In such a structure, the data signal from the external device is
The signal is transmitted to the circuit function section within the IC element 3 via the contact terminal 10, through hole 9, bonding pattern electrode section 8, and gold wire 5, while the data signal from the IC element 3 is sent to an external device through the opposite route.

Furthermore, because of this structure, the gold wire 6 that electrically connects the IC element 3 and the connection terminal 10 and the bonding pattern electrode section 8 are embedded in the resin 6 having semiconductivity. As shown in the equivalent circuit diagram of FIG. 2, resistors R1 to R6 are connected between the respective electrode terminals a, b, c, and d.

That is, when the bonding pattern electrode section 8 has four electrode terminals, the electrode 8a and the electrode 8b are connected by the resistor R1, the electrode 8a and the electrode 8C are connected by the resistor R4, and the electrode 8a and the electrode 8b are connected by the resistor R4. Resistor R between 8d
Each electrode is connected with an appropriate resistance, such as a connection with a resistor of 5.

When a high electrostatic input is applied between any two connection terminals for external connection, the connection terminal 1o is electrically connected to the bonding pattern 8 via the through hole 9, so it becomes semiconductive. It becomes possible to prevent local concentration of high electrostatic input to the IC element 3 embedded in the resin 6 (resistors R1 to R6).

The semiconductive resin 6 has a resistance value that does not cause short circuits between the bonding pattern electrode parts 8, between the bonding meso 84 of the IC element 3, and between the gold wires 5. Although the resistance value between the electrode parts of the bonding pattern varies depending on the internal resistance of the embedded IC element 3, the optimum conditions are selected. Experience has shown that each of these resistances is preferably selected to be between several ohms and several ohms between each electrode. In addition, the resin 6 surrounding the IC element 3
Since the IC card 7 has elasticity, as shown in FIG. 3, if the IC card 1 is bent due to inappropriate external force during use such as when being carried or inserted into a card reader, Since the above-mentioned elastic resin deforms and absorbs the external force, external stress is relieved on the built-in IC element 3, and destruction of the RC element 3 can be prevented.

Effects of the Invention According to the IC card of the present invention, by embedding the built-in IC element, etc. in a semiconductive and elastic resin, connection terminals can be semiconductively connected. Therefore, when carrying an IC card, the IC element inside the IC card will not be destroyed by high electrostatic input such as static charge from clothing, etc., and the IC card will not be damaged when carrying and using the IC card. Even if the IC card is deformed due to external force, the elastic resin described above absorbs and disperses the external force.
Prevents damage to the C element.

The IC card of the present invention is an IC card made of conventional epoxy resin or the like.
By simply replacing the protection of the C element with a resin that has both semiconductivity and elasticity, the anti-static properties and the resistance to destruction from deformation due to external force are significantly improved.
There is no need to increase the card manufacturing process.

[Brief explanation of drawings]

FIG. 1 is a structural sectional view of a card incorporating an IC etc. according to the embodiment, FIG. 2 is a wiring diagram showing electrical circuits of external connection terminals of the same embodiment, and FIG. 3 is a diagram. FIG. 4 is an explanatory cross-sectional view of the IC card being deformed by an external force, FIG. 4 is an external view of a standard IC card, and FIG. 6 is a structural cross-sectional view of a conventional IC card. 1...IC card, 3.old...IC element, 6.
...Coating resin, 7...Ponding resin, 8...Ponding pattern, 10
...Song/connection terminal. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 3 Figure 4

Claims (3)

[Claims] (1) An IC card in which a semiconductor integrated circuit element is embedded in elastic resin and sealed in a plastic sheet. (2) The IC card according to claim 1, wherein the elastic resin has semiconductive properties. (3) The IC card according to claim 1 or 2, which has a structure in which a semiconductor integrated circuit element is bonded onto a rigid substrate via an elastic and conductive resin.