JPH04336299A - Non-contact signal processing device - Google Patents

Abstract

PURPOSE:To obtain a highly durable non-contact signal processing device capable of maintaining an adequate breakdown strength against a static electricity applied from outside by holding a semiconductor circuit part from the upper and lower surfaces using a metal sheet or a metal film conductor. CONSTITUTION:A non-contact IC card, for example, consists of an IC chip 3 mounted on one surface of a printed circuit board 6 and coils for receiving and sending a signal with an external device, and required connects made using bonding wire 8 between such component parts through a circuit pattern. In addition, the other surface of the circuit board 6 is connected to GND level entirely over the IC. In addition, the periphery of a wire connected part including the IC chip 3 and the bonding wire 8 is formed in a resin mold or in an IC module 2 structured with a sealing frame 10 encircling the periphery of the IC chip 3. In the latter case, a conductor surface 11 is chemically plated after potting the sealing frame 10 or a conductive sheet is attached forcibly to the land part of a through hole 12 to form the conductor surface 11 on both sides of the IC module 2.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact signal processing device typified by a non-contact IC card, and more particularly to improving its electrostatic resistance.

0002

[Prior Art] In conventional devices of this kind, the semiconductor and external coupling circuits are all covered with an insulator, and the electrostatic resistance against electrostatic damage from the outside depends on the volume resistance of the insulator and the structural dimensions. depended on it.

0003

Therefore, in the above-mentioned prior art, there are restrictions on the material and structural dimensions of the insulator.

The present invention solves the drawback that the static electricity resistance of the above-mentioned conventional products depends on the material and structural dimensions of the insulator, thereby providing a non-contact signal processing device with excellent durability. The purpose is to

[0005]

[Means for Solving the Problems] The above object is to provide a semiconductor memory, a data processing circuit that performs input/output to the semiconductor memory, an analog circuit that performs contactless signal transmission and reception with an external device, and a In a non-contact signal processing device equipped with a coupling circuit, this is achieved by sandwiching the semiconductor circuit section between conductors of metal plates or metal films from the upper and lower surfaces.

[0006]

[Operation] For example, the semiconductor circuit part of a contactless signal processing circuit composed of a contactless IC card is wrapped with a conductor such as a metal plate or a metal film, and further connected to the GND level of the semiconductor, and By forming a potential surface, the semiconductor itself can be protected from static electricity from the outside.

[0007]

Embodiments Hereinafter, embodiments of the present invention will be explained based on the drawings. FIG. 1 is a perspective front view of a contactless card according to an embodiment;
2 is an external front view of the same, and FIG. 3 is a sectional view taken along the line A-A in FIG. 2.

In FIG. 1, 1 is a non-contact IC card body, 2 is an IC module, 3 is an IC chip, and 4 is a coil. Further, in FIG. 2, 5 is a magnetic stripe.

In FIG. 3, an IC chip 3 is mounted on one side of a printed circuit board 6 made of a material with excellent strength (eg, glass epoxy, glass BT resin, polyimide, etc.), and there is no connection between the IC chip and the outside. Necessary wiring is made by bonding wires 8 via a circuit pattern between the transmission and reception coils that are not connected to each other. Further, the other surface of the printed circuit board 6 is connected to the GND level of the entire IC.

Furthermore, the periphery of the wiring section including the IC chip 3 and bonding wires 8 is molded with a molding resin to form a resin mold section 9 shown in FIG. 4, and the IC module 2 is formed as a whole. Alternatively, as shown in FIG. 2, the IC module 2 may have a structure having a sealing frame 10 surrounding the IC chip 3 of the printed circuit board 6.

In the case of FIG. 3, after potting the sealing frame 10, the conductive surfaces 11 are chemically plated or a conductive sheet is crimped onto the lands of the through-holes 12 to form conductive surfaces on both sides of the IC module 2. 11 is formed.

Furthermore, as shown in FIG.
The printed circuit board itself may be made flexible as shown in FIG. The flexible printed circuit board 14 may be formed by molding in the same manner.

On the other hand, the card base material includes a first oversheet 16 of about 0.1 mm thick and a second oversheet 17 of about 0.1 mm thick on both sides of a core sheet 15 of about 0.6 mm thick.
It is constructed by laminating and press laminating. This card base material is ABS resin, polyester,
It is made of synthetic resin such as polypropylene, styrene resin, vinyl chloride, acrylic, polycarbonate, and vinyl chloride/vinyl acetate copolymer.

Next, a specific method of manufacturing an IC card will be explained. First, the core sheet 15 is cut into the same shape as the printed circuit board 6 protruding from the IC module 2, and a hole is provided through which the entire IC module 2 passes. The first and second oversheets 16 and 17 are also provided with holes in which the IC module 2 is accommodated. Next, IC module 2
The core sheet 15 and the oversheet 16 are sandwiched together.
, 17 are overlapped and heat pressed to create a card base material. Finally, the card base material is formed into a predetermined shape and size using an engraving machine or the like.

[0015]

[Effects of the Invention] As explained above, in the present invention, since the semiconductor is wrapped in a conductor and further connected to the GND level of the semiconductor, it is effective to maintain sufficient withstand voltage even when static electricity is applied from the outside. be.

[Brief explanation of drawings]

FIG. 1 is a perspective front view of a contactless card according to an embodiment of the present invention.

FIG. 2 is an external front view thereof.

FIG. 3 is a sectional view taken along line AA in FIG. 2;

FIG. 4 is a sectional view showing an example of an IC module.

FIG. 5 is a sectional view showing another example of the IC module.

[Explanation of symbols]

1. Contactless IC card body 2 IC module 3 IC chip 4 Coil 5 Magnetic stripe 6 Printed circuit board 8 Bonding wire 9 Resin mold part 10 Sealing frame 11 Conductor surface 12 Through hole 13 Metal plate 14 Flexible printed circuit board 15 Core sheet 16 1st oversheet 17 2nd oversheet

Claims (2)

[Claims] 1. A contactless device comprising a semiconductor memory, a data processing circuit that performs input/output to the semiconductor memory, an analog circuit that performs contactless signal transmission and reception with an external device, and a coupling circuit with the external device. 1. A non-contact signal processing device characterized in that a semiconductor circuit section is sandwiched between upper and lower surfaces of a conductor made of a metal plate or a metal film. [Claim 2] The non-contact type IC according to claim 1,
A contactless signal processing device comprising a card.