JPS62248692A - Card-shaped semiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to card-shaped semiconductor device technology, and particularly to technology that can prevent cracks from occurring in semiconductor pellets when they are bent during use.

[Conventional technology]

One type of semiconductor package is a so-called COB (chip on board) in which a semiconductor element such as a semiconductor chip is directly mounted on a wiring board such as a flexible printed circuit board. This product is used in small and thin products such as watches and calculators, and is also built into and attached to various cards such as IC cards and game cards.

Note that in the present invention, the card-shaped semiconductor device is a COB
In addition to IC cards, cards called chip cards, memory cards, microcomputer cards, electronic cards, etc., which are equipped with or have built-in semiconductor elements such as IC chips or IC modules such as memory or microcomputers,
D card Cl11! separate card), credit card,
It also includes bank cards (cash cards), and furthermore,
It may be understood that the term also includes game cards used in Family Combiators and the like.

When using (including holding) such a C0BI package or IC card, undesirable bending stress may be applied thereto. For example, when carrying an IC card in a pocket, bending stress may be applied for some reason. In that case, the semiconductor chip may be warped due to the warpage of the wiring board on which it is bonded (mounted), and as a result cracks may occur.The same thing can happen with COB packages. The occurrence of these so-called chip cracks may destroy the functionality of the semiconductor element.

In addition, as an example of literature and patents that describe COB type pancage-'PIC cards, Kogyo Chosenkai Co., Ltd.19
Published January 15, 1980, “IC Mounting Technology jp144-1
47 and p285-321 and JP-A-51-184
No. 33 and Japanese Unexamined Patent Publication No. 52-83132.

[Problem that the invention seeks to solve]

An object of the present invention is to provide a card-shaped semiconductor device that is resistant to bending.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Failure to solve the problem]

A summary of representative inventions among the inventions disclosed in this wA is as follows.

That is, in the present invention, the arrangement angle of the semiconductor element with respect to the card is changed.

[Effect]

In this way, by changing the arrangement angle of the semiconductor element, it is possible to prevent cracking of the semiconductor element and the direction of the bending direction from not matching the bending direction of the wiring board, thereby preventing chip cracks.

〔Example〕

Next, the present invention will be explained based on embodiments shown in the drawings.

Figure 1 is! Figures 1 and 2 are enlarged explanatory views of the main parts of the game card shown in Figure 2, in which Figures 1 and 2 are plan views of the game card incorporating the COB type package shown in Figure 1, and Figure wc3 is l! FIG. 2 shows a cross-sectional view of the main parts along the line l-l111.

Game cards must be bent and folded during use.
The B-type package is also bent accordingly, causing warps (X) and (Y), for example, as shown in FIGS. 9(a) and 9(b).

In these figures, 1 is a semiconductor element (chip) and 2 is a wiring board.
A semiconductor chip 1 is bonded (fixed), and the element 1
The resin is coated (molded) by botting etc.
has been done.

The wiring board 2 is constituted by a printed circuit board such as a glass epoxy board, for example, and has conductor patterns 3 formed in multiple layers on one or both sides thereof.

A semiconductor element (chip) 1 is made of, for example, a silicon single crystal substrate, and a large number of circuit elements are formed within this chip using well-known techniques to provide one circuit function. A concrete example of a circuit element is, for example, a transistor (MOS), and these circuit elements form, for example, a logic circuit and a memory circuit function.

A bonding pad (not shown) of the semiconductor element 1 and a conductor pattern 3 of the wiring board 2 are wire-bonded using a connector wire 4.

These are the so-called T A B (Tape Auto
It may also be based on a wireless 7-lip chip bonding method.

As mentioned above, the resin solder portion 5 is formed of resin such as epoxy resin.

As shown in FIG. 3, the conductor pattern 3 of the wiring board 2 and the external terminal 6 on the back surface thereof are electrically connected by a conductor layer formed by through-hole technology, such as a through-hole plating layer 7. The assembly (module) 8 is buried in a recess provided in the card body 9 in a face-down manner,
It constitutes a game card with a main structure equipped with a COB type package (Mosier).

In the present invention, when a semiconductor chip is mounted on such a wiring board 2, the arrangement angle thereof is changed.

Semiconductor chips made of silicon single crystal or the like are generally easy to break in the direction in which the valve opens, but are generally difficult to break in directions other than the direction in which the valve opens. Based on this, the present invention displaces the arrangement angle of the chip with respect to the wiring board by K so that the bending direction of the wiring board 2 does not coincide with the opening plane of the crystal valve of the chip.

Next, K such as crystal planes, interfold planes, extensibility, etc. in semiconductors will be explained with reference to drawings as appropriate.

FIG. 5 shows typical crystal planes (crystal axes) for a cubic lattice crystal indicated by Miller indices.

x, y, and z in the same figure (A) are the crystal 100 fundamental axes, the same figure (D) is the crystal plane shown by the Miller index (100) plane, and the same figure (C) is the crystal plane shown by the (110) plane. The crystal plane shown is 5'''.

As is well known, the crystal structure of silicon (Si) is a body-centered, face-centered cubic lattice.

S, an integrated circuit (IC) manufactured using a planar process
The i-wafer is then scribed into chips using the stretchability of the silicon single crystal.

When a single crystal is subjected to an undesired stress from the outside, it is easily 'l? can be opened.

Next, FIG. 6 shows a Si wafer. This wafer IIK
Usually, the facets are placed in the (011) direction. In the (100) plane, as shown in Figure 6, (01
There are two vectors perpendicular to each other, (011) and (01).
1) The surface is the interfold surface 12.

The inter-fold planes are also perpendicular to each other and also perpendicular to the (100) wafer surface 13.

In the present invention, when the arrangement angle of the semiconductor element is changed, for example, when the semiconductor element is bent in the state shown in FIG. The element 1 is arranged tilted as shown in the figure. FIG. 4(B) shows a conventional example, and when it is bent in the state shown in the same figure and exhibits warpage (Y), the semiconductor element 1 is shown in the same figure in the direction of bending. It was arranged like this. An, warp direction of wiring board 2 and semiconductor element 1
The upper and lower sides (interfold planes) of the folds were in agreement. In other words,
Long sleeve of rectangular wiring board 2 and square semiconductor element 1
The horizontal axes of the wiring board 2 and the vertical axes of the semiconductor element 1 were in the same direction.

In contrast, in the present invention, as shown in FIG. 1, the arrangement angle of the semiconductor element 1 is shifted by K so that the warp direction of the wiring board 2 and the crystal valve opening plane of the semiconductor element 1 do not coincide.

For example, the semiconductor element 1 whose main axis is the (100) plane and its vicinity is arranged at an angle of 45° with respect to the warping direction of the wiring board 20.

As described above, according to the present invention, by making the valve opening direction of the semiconductor element 1 intersect with the bending direction of the wiring board 2, the strength of the semiconductor element 10 against bending is improved, and occurrence of chip crank can be prevented.

Figure 7 is a plan view of the IC card, Figure 8 is Figure 7 II-X
In the line cross-sectional view, the recess 1 of the card base 14 of the IC card is shown.
5, fixing the semiconductor element 17 to the wiring board 16;
An IC module 22 is embedded in which electrical conduction is established between the element 17 and the conductor pattern 19 of the wiring board 16 through the conductor portion 18, and electrical continuity between the conductor pattern 2o on the back side of the board 16 and the through hole #21. . In the figure, 23 is a pattern, 24 is an oversheet, and 25 is a magnetic stripe layer.

The present invention also provides such an IC card 26 by similarly displacing the arrangement angle of the semiconductor element 17 with respect to the wiring board 16, so that even if the IC card 26 is bent and the wiring board 16 is warped, the element (Chip) 17 can be prevented from cracking.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the above Examples, and it is understood that changes can be made without departing from the gist of the invention. Needless to say.

In the above explanation, the present invention has been mainly explained based on game cards and IC cards, but it goes without saying that the present invention can also be applied to other card-shaped semiconductor devices, and can also be applied to COB type packages themselves. do not have.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

That is, according to the present invention, by changing the arrangement angle of the semiconductor element with respect to the card, it is possible to prevent the direction in which the semiconductor element is likely to break and the bending direction (warp direction) of the card from coinciding with each other, thereby preventing chip cracks. Therefore, it is possible to provide a highly reliable semiconductor device.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram of the main parts showing an embodiment of the present invention, Fig. 2 is a plan view showing an embodiment of the invention, Fig. 3 is a sectional view taken along the line I-I in Fig. 2, and Fig. 4 (A) is an explanatory diagram of the main part showing the embodiment of the present invention, FIG. 4 (B) is an explanatory diagram of the main part showing the conventional example, and FIGS. An explanatory diagram of the crystal, Figure 6 is an explanatory diagram of the expanded plane of the semiconductor Ueno, and Figure 7 is an explanatory diagram of the I
FIG. 8 is a plan view of an example of the C card, and FIG. 8 is a sectional view taken along the line 1t-X in FIG. 7. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 2... Wiring board, 3... Conductor pattern, 4... Connector wire, 5... Resin mold part, 6... External terminal, 7... Through-hole plating layer, 8... module, 9... card body, 10
...Semiconductor crystal, 11...Si wafer, 12...
expansion surface, 13... wafer surface, 14... card base,
DESCRIPTION OF SYMBOLS 15... Recessed part, 16... Wiring board, 17... Semiconductor element, 18... Conductor part, 19... Conductor pattern,
20... Conductor pattern, 21... Through hole, 2
2...IC module, 23...Picture, 24...
Oversheet, 25... Magnetic stripe layer, 26.
・IC card. Agent Patent Attorney Katsuo Ogawa Figure 6/Z Figure 7 Figure 2 Figure 8/Lj', s7

Claims (2)

[Claims] 1. In a card-shaped semiconductor device in which a semiconductor element is directly mounted on a mounting card, when the card is bent during use, etc., the bending direction of the card and the crystal cleavage plane of the semiconductor element should not coincide. A card-shaped semiconductor device comprising the element mounted on the card. 2. The card-shaped semiconductor device according to claim 1, wherein the semiconductor element is made of a silicon single crystal substrate having a (100) plane as a crystal plane.