JPH08276688A - Circuit chip bearing device and its manufacture - Google Patents

Abstract

PURPOSE: To provide an improved method of manufacturing high density card device having intricate functions. CONSTITUTION: A plurality of circuit chips 14 are fixed onto a flexible carrying member 16, which is prepared by providing a plurality of electrically conductive leads on a flexible tape. Electrical wiring pattern 40 is formed on the surface 34 of a substrate carrying member 30. By binding the flexible carrying member and the substrate carrying member with each other, at least two circuit chips in a plurality of the circuit chips are electrically connected through the wiring pattern.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a card device which can be used in a data processing system.

[0002]

2. Description of the Prior Art In some prior art data processing systems, such as those shown in U.S. Pat. No. 4,295,041, a portable data carrying device including a microprocessor is provided. However, in such prior art systems, read only memory (ROM) circuits are provided and do not use electrically modifiable program ROM systems. In addition, such prior art systems cannot fit enough circuits into a standard credit card to provide an integrated data processing system.

In another prior art system, such as that shown in US Pat. No. 4,211,919, a microprocessor, a portable data device including the system, is provided. However, in such prior art systems, the tight packing of logic circuits cannot be accomplished within the geometric constraints of a card-like housing. Such prior art systems are unable to provide a substrate carrier layer that is integrated into the electrical logic system.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing a card device which is relatively lightweight and has a small size.

[0005]

According to the present invention, there is provided an improved method of manufacturing a card device. That is, according to the present invention, (a) a plurality of circuits are provided on a flexible carrier having an electrically insulating flexible tape and a plurality of conductive leads formed on the flexible tape. Fix the tip,
(B) forming a predetermined electrical wiring pattern on one surface of a substantially rigid and electrically insulative substrate carrying member, (c)
Combining the flexible carrier member and the substrate carrier member,
At that time, at least two circuit chips of the plurality of circuit chips are electrically coupled to the electrical wiring pattern formed on the substrate carrying member. Provided.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Referring to FIGS. 1-3, the overall geometrical outline of a card member 12 is shown, which is a card device in a practically sealed condition, manufactured by electronic logic circuit mounting technology. The card device is shown.

As shown in FIG. 1, the card device 10 is mounted in the form of a card member 12 or another planar member. As will be understood from the following description, the card device 10 provided by the mounting technology and structure as described here.
Are essentially sealed with respect to the external environment for use in a wide variety of external environments, some of which may be harmful to the logic circuits contained therein.

The card device 10 includes an electronic circuit of a chip,
In effect, multiple chip logic circuits are provided in a thin, compact packaging system that is hermetically sealed. The circuit chip 14 including the IC chip and the like shown in FIG. 2 is well known in this kind of technology, and can be a logic circuit chip, a recording device chip, and / or a combination thereof.
The circuit chip 14 may be a commercially available electrically erasable programmable ROM type having a model number 2816. The circuit chip 14 as a memory chip of this type can operate from a 5.0V power supply in the read mode, and the write / erase mode is achieved by applying a voltage pulse of about 21.0V. Intel model number 28
The electrical erase / write capability of the circuit chip 14 as a 16 memory chip is used in a variety of applications requiring non-volatile erase as well as write modes.

In the embodiment shown in FIGS. 1-3, card device 10 includes a plurality of circuit chips 14 coupled to a mechanism for mounting circuit chips 14 therein. The circuit chip 14 is mounted on the first flexible film carrying member 16 using one of a number of well known techniques.

One technique for attaching the circuit chip 14 to the first flexible film carrying member 16 is US Pat.
689,991 and U.S. Pat. No. 4,380,042. Circuit chip 1
4 is bonded to the first flexible film carrying member 16 by a lead, and the carrying member 16 serves as the card device 10.
There is a unique circuit design in which the circuit chips 14 can be interconnected.

Referring now to FIGS. 6 and 7, the mounting mechanism and structure for the circuit chip 14 is shown.

As can be seen from FIG. 6, which is shown in a partially cutaway perspective view, the first flexible film carrying member 16 is
For convenience of explanation, one circuit chip 14 is shown in a removed state. As shown in FIG. 6, the circuit chip 14 can be aligned with the lower portion of the first flexible film carrying member 16. However, the circuit chip 14 can also be attached to the upper surface, as is known in the art.

The flexible film carrying member 16 has an insulating tape 18 forming an electrically insulating insulating layer.
And a conductive layer 20 forming a thin foil strip or a layered member that is conductive and is held on the insulating tape 18 by laminating adhesion and similar techniques. This laminating adhesive and similar techniques are not important to the overall concept of the invention.

6 and 7 are drawn with an excessively large thickness for the sake of clarity, the total thickness of the combination of the insulating tape 18 and the conductive layer 20 is about 0.005 to 0.01. In the range of inches. In this case, the total thickness of the first flexible film carrying member 16 is preferably about 0.0075 inches. The thickness of the conductive layer 20 is approximately 0.0001 to 0.0.
It will be in the range of 005 inches. In order to give a size to the entire first flexible film carrying member 16, the circuit chip 14 having the shape described here has a size of about 0.01-.
Thicknesses in the 0.04 inch range can be taken. However, a thickness of about 0.02 inch is preferred. The first flexible film carrying member 16 is of the type described in U.S. Pat. Nos. 3,689,991 and 4,380,042. The opening 22 extends through the first flexible film carrying member 16 and is aligned with the circuit chip 14 for insertion therein. As shown in FIG. 6, the conductive layer 20 is partially removed from the flexible film carrying member 16 to provide a plurality of metal or conductive materials for contacting predetermined active or contact areas 26 of the circuit chip 14. Conductive wires or leads 24 are formed. Forming the conductive layer 20 in a predetermined pattern can be accomplished by photolithographic masking and etching, or other well known techniques in the art. The lead 24 is formed by removing a predetermined portion of the conductive layer 20. The lead 24 extends to the inside of the opening 22, and the circuit chip 14 is bonded to the lead 24 by contact bonding.

In the manufacturing process of the first flexible film carrying member 16 to which the plurality of circuit chips 14 are attached, a band in which the conductive layer 20 and the insulating tape 18 are combined is first prepared. The central opening 22 penetrating the insulating tape 18 and the conductive layer 20 positions the inner portion of the lead 24. The lead 24 is formed by etching away a predetermined portion of the conductive layer 20 according to its predetermined geometric structure. As shown in FIG. 6, the inner end portion of the lead 24 extends substantially radially outward from the center portion of the opening 22. The inner end of the lead 24 terminates inside the opening 22, and terminates at a position aligned with the contact area 26 of the circuit chip 14. Next, the circuit chip 1
4 is arranged at a position aligned with the opening 22, and the inner end of the lead 24 is fixed to the contact area 26 of the circuit chip 14.

Before the circuit chip 14, such as a logic or memory chip, is bonded to the lead 24, the first flexible film carrying member 16 is unwound from the reel, as is known in the art, The leads 24 can be formed thereon by any suitable pattern etching technique. The first flexible film carrying member 16 is dipped in a tin plating solution, and the exposed portion of the lead 24 is plated with a solderable metal. In this way, both sides of the exposed portion of the lead 24 in the opening 22 are covered with tin.

Subsequently, the circuit chip 14 of the semiconductor device or the like is bonded to the lead 24 by applying an electric conductor. In this case, the circuit chip 14, such as a logic and / or memory device, may have metal contacts attached to the electrically active areas 26. This contact is connected to the lead 24
In order to perform the bonding, the stroke of a heatable tip bonding device, which is well known in the art, presses the contact portion against the tin-plated lead 24. Then, an electric resistance heating current is applied to the tip to raise the temperature to a sufficiently high temperature to bond the tin-plated lead 24 onto the contact area 26 made of metal such as gold, and the bonding is achieved.

Further, in order to continuously bond the plurality of circuit chips 14 on the first flexible film carrying member 16, as shown in FIGS. 1 and 6, the circuit chips 14 are electrically connected. Metal busbar (busbar) foil member 28
Is provided. In this way, the plurality of circuit chips 14
Can be connected to each other according to special circuit design requirements.

The card device 10 is a device in which a standard printed wiring board, which normally uses a circuit pattern of copper foil which is photo-etched, is replaced with a flexible film carrying member, and the film carrying member is logical and / or Alternatively, the circuit device 14 such as a memory chip is connected to each other to form the card device 10 capable of performing operations such as unique data processing. The plurality of circuit chips 14 respectively attached to the plurality of consecutive frames of the first film carrying member 16 are
The card device 10 forms a repeating system pattern on the first film carrying member 16 so that it can be easily bonded and tested.

The substrate carrying member 30 of the card device 10 is formed as part of the overall logic circuit carrying the parallel buses of each circuit chip 14. Further, the substrate carrying member 30 is
Used to interconnect circuit chips with the specific logic required. Moreover, the substrate carrying member 30 is generally formed of a material of essentially rigid composition and also serves as a mechanical support for the circuit chip 14 associated with the first flexible film carrying member 16. There is. Further, it is also used as a heat dissipation device of the card device 10 during the operation mode period. Therefore, in addition to the purpose of heat dissipation, the substrate carrying member 30 also provides a function as an electrical interconnection device that couples the circuit chip 14 to the form of the card device 10 that performs the overall operation, and also as a concept of electrical design. It is interrelated and part of it. To provide a combination of electrically insulating material composition and heat conducting composition, the substrate carrying member 30 helps dissipate heat from the ceramic, Kovar, or card device 10 during operation, while at the same time being substantially electrically insulating. It can be formed of similar materials that maintain a barrier. It should be noted that such a material gives some strength to the card device 10. This means that although the film carrying member 16 is structurally very flexible, many users of the card device 10 as a whole. This is important because it is understood that it must be strong enough to allow its use in the environment.

As can be seen from FIG. 2, the substrate conductor 32
Is formed on the upper surface 34 of the substrate carrying member 30,
It forms a first predetermined substrate electrical wiring pattern 40. The first substrate electrical trace 40 is not critical to the inventive concepts described herein, but is formed by photoresist etching or similar techniques. The overall pattern of board conductors 32 matches the circuit pattern required to interconnect the addressing data buses of circuit chip 14 as an overall operating system.

As can be seen from FIGS. 2 and 3, the plurality of substrate conducting wires 32 forming the first substrate electrical wiring pattern 40 extend to the end face 38 of the substrate carrying member 30 and are electrically connected there. It terminates as a pin member 36 for connection. Electrically connecting pin member 3 attached to the end face 38
6 has a role of electrically connecting the card device 10 to an external terminal device different from the present invention.

As can be seen from FIG. 3, the tip pin member 4
8 are used to bond predetermined board conductors 32 in the first board electrical wiring pattern 40 and at the same time to individual circuit chips 14. The chip pin member 48 is capable of electrically connecting one end thereof to a predetermined lead 24 and is extended so as to make an electric contact with a predetermined substrate conductive wire 32 when required by a special logic design. It is possible to The chip pin member 48 may be a single chip pin member, or may be an extension of the lead 24 that is brought into contact with a predetermined substrate conducting wire 32 by lowering it through the first flexible film carrying member 16. Is possible. The manner in which the circuit chip 14 is coupled to the first substrate electrical trace 40 is accomplished by a number of techniques using the illustrated chip pins 48.

With further reference to the embodiment of the card device 10, as shown in FIGS. 1-3, a mechanism for substantially separating the substrate carrying member 30 and the first flexible film carrying member 16 from the external environment is provided. It is provided.

Referring to FIGS. 2 and 3, the separating mechanism is substantially coupled to the combination of the substrate carrying member 30 and the first flexible film carrying member 16 on opposite sides thereof. A pair of flat layer members 42 and 4
Four. These flat layer members 42 and 44
Are generally formed from composite plastic materials. These flat layer members 42 and 44 are disposed above and below the combination of the flexible film carrying member 16 and the substrate carrying member 30, and are provided with appropriate heat and heat treatment well known in the art. Adhered to them by pressure technique.

As already mentioned, the substrate carrier 30 can be made of ceramic, glass, composite silicon oxide, or Kovar, which is a steel carrier with a porcelain coating. Due to the other material components of the card device 10, the substrate carrying member 30 is generally designed to be formed of a material that is practically matched to the expansion and contraction temperature coefficients of the normally silicon-based circuit chip 14.

The first board electrical wiring pattern 40 formed by electrically connecting the board conducting wires 32 is
A plurality of attached flexible film carrying members 16 such that a plurality of circuit chips 14 are integrated as a system.
Interconnect each other. Each of these carrier members is interconnected with each other in a unique format, depending on the logic system involved to provide the integrated electronic system. Therefore, as described above, the substrate carrying member 30
The important purpose of is to provide the basis for interconnecting multiple system level carrier members and circuits into an overall operating circuit.

The substrate carrying member 30 mechanically supports the circuit and radiates the heat generated by each of the circuit chips 14 in the operation mode.

In the overall operation of manufacturing the card device 10, a plurality of circuit chips 14 have been incorporated into US Pat.
The first flexible film carrying member 1 according to the method described in No. 9,991 and / or No. 4,380,042.
It is possible to attach to 6. The wiring pattern 40 is
It can be formed on the substrate carrying member 30 by etching with a photoresist in a manner well known in the art. The first flexible film carrying member 16 can be bonded to the substrate carrying member 30 in a state of being aligned by an adhesive method. It should be understood that the adhesive used in such a bonding process has a temperature coefficient of expansion / contraction that substantially matches the constituent material of the circuit chip 14 as well as the particular constituent material of the substrate carrying member 30. In this way, the first flexible film carrying member 16 is firmly adhered and attached to the substrate carrying member 30. The substrate carrying member 30 itself is generally and substantially not electrically conductive, but is thermally conductive due to the dissipation of heat generated by the circuit chip 14 during the operating mode. Heat and pressure are applied to fuse the appropriate pattern supported by the flexible film carrying member 16 to the matrix formed on the substrate carrying member 30, ie, the attachment points of the first substrate electrical wiring pattern 40. . Finally, the plastic layers 42 and 44 are applied above and below the first flexible film carrier 16 and substrate carrier 30 combination, and there by suitable heat and pressure techniques well known in the art. Bonded to.

Next, referring to FIGS. 4 and 5, FIGS.
FIG. 3 shows a card device 10 'which is one embodiment of the card device 10 described above. For clarity, elements of the card device 10 'that are substantially the same as those provided in the card device 10 are numbered the same. The idea of the card device 10 'is to provide a stacking system which adds circuit chips 14 by increasing the number of logic circuits, while maintaining the overall housing structure relatively thin.

As was the case with the card device 10, the embodiment of the card device 10 'also has an upper surface 3 of the substrate carrying member.
4 and has an adjacent first flexible film carrying member 16 located adjacent thereto. As shown in FIG. 4, the first flexible film carrying member 16
Has a first flexible film carrying member lower surface 50 and extends therethrough for coupling the circuit chip 14 to a first substrate electrical wiring pattern 40 (shown in FIG. 2). Then, a connection hole 52 is provided.

The upper surface 34 of the substrate carrying member shown in FIG.
As shown in FIGS. 1-3, it includes the first substrate electrical wiring pattern 40 described in connection with the card device 10.

As shown in FIG. 4, the substrate carrying member 30 has a substrate carrying member lower surface 54 upon which a second substrate electrical material is provided in the same manner as provided for the card device 10 as previously described. The lower surface substrate conducting wire 56 formed on the wiring pattern 58 is formed. The lower surface board conducting wire 56 of the second board electrical wiring pattern 58 extends to the board carrying member end surface 38, and terminates in an electrical connection pin member 36 for electrical connection to an external device.

As shown in FIG. 5, the second flexible film carrying member 60 having the plurality of circuit chips 14 attached thereto is engaged with the lower surface 54 of the substrate carrying member. The second flexible film carrying member 60 has connection holes 62 for interfacing and connecting the circuit chip 14 to the second substrate electrical wiring pattern 58. The upper surface 64 of the second flexible film carrying member 60 is inferior to the substrate carrying member lower surface in a manner similar to how the first flexible film carrying member lower surface 50 engages the substrate carrying member upper surface 34. Engage with 54. The circuit chips 14 on the first film carrying member 16 are routed through the substrate carrying member 30 by means of interconnection holes or other connectable means to the circuit chips 14 on the second flexible film carrying member 60. Electrically coupled to.

Accordingly, first and second electrical wiring patterns 40 and 58 are formed on both sides 34 and 54 of the substrate carrying member 30 to provide a double sided interconnection system. In this way, a plurality of flexible film carrying members, eg 16
, 60 will be mounted on both sides of the substrate carrying member 30 and will additionally provide new logic design considerations for the card device 10 '.

Referring now to FIG. 8, a mechanism is shown for electrically coupling at least a pair of circuit chips 14 to one another between predetermined contact areas 26. As will be seen in the following description, this chip electrical coupling mechanism is sandwiched between the substrate carrying member 30 and the first and second flexible film carrying members 16 and 60. This electrical coupling mechanism shown in FIG. 8 can be used when all the necessary electrical contacts cannot be made completely because the area and distance between the two circuit chips 14 are reduced.

If additional contact areas or leads are required, a flexible chip-bonding carrier 66 is provided for connecting the predetermined contact areas 26 of separate circuit chips 14 together. First and second flexible film carrying members 1
As with 6 and 60, the chip-bonding flexible carrier 66 comprises an electrically insulating tape member having first and second sides 68 and 70 on opposite sides. . The chip-bonding carrier member 66 further includes a plurality of conductive chip-bonding leads 72 that are securely attached to the first surface 68 of the electrically insulating tape member. Chip-bonded conductor 72
Has a structure in which the conductive layer 20 made of a conductive metal foil of the first flexible film carrying member 16 and the leads 24 are usually formed of the same metal foil layer as described above.

First surface 6 of chip-bonding flexible carrier 66
8 is the lower surface 50 of the first flexible film carrying member 16,
And / or attached adjacent to the upper surface 64 of the second flexible film carrying member 60.

The pin member passing through the holes 62 and / or 52 of the associated carrier members 60 and 16 contacts the chip coupling conductor 72, which pin member is connected to a given lead 24 and between the individual circuit chips 14. Provides electrical coupling. Therefore, in the embodiment shown in FIGS. 1 to 3, the chip-bonded flexible carrier member 66 is sandwiched between the first flexible film carrier member 16 and the substrate carrier member 30. In the embodiment shown in FIGS. 4 and 5, the card device 10 'comprises a first flexible film carrying member 16'.
Similarly to the case between the substrate carrying member 30 and the substrate carrying member 30, a pair of chip-bonding flexible carrying members 66 are sandwiched between the second flexible film carrying member 60 and the substrate carrying member 30. First and second flexible film carrying members 16 and 6
In order to make a connection between the circuit chip 14 on 0 and the related portions of the first and second substrate electric wiring patterns 40 and 58, a chip connection hole 74 is provided to connect another conductor pin member. It can be inserted.

Referring now to FIG. 9, there is shown an embodiment of the card device 10 shown in FIGS. It should be understood that the embodiment shown in FIG. 9 is equally applicable to card device 10 'as well as to card device 10. In the cross section shown in FIG. 9, the substrate carrying member 30
Appear to extend beyond the first flexible film carrying member 16 as well as beyond the peripheral boundaries of the upper and lower plastic layers 42 and 44. As can be seen, the substrate carrying member 30 is provided with an additional surface area 76 to assist in the extra heat dissipation required.
As was the case with the calculation of the edge thickness 38 of the substrate carrier surface, the additional surface area 76 is required by the special, heat-generating logic circuitry contained within the card device 10 or card device 10 '. It can be calculated based on the requirement of heat dissipation.

Although specific embodiments of the present invention have been described in detail above, the present invention should not be limited to these specific examples, and various modifications can be made without departing from the technical scope of the present invention. Of course, it can be modified.

[0042]

As described above in detail, according to the present invention, an improved method for manufacturing a card device is provided. That is, according to the method of the present invention, a plurality of circuit chips are fixed on a flexible carrier member formed of a flexible tape and a plurality of conductive leads. On the other hand, an electrical wiring pattern is formed on one surface of the substantially rigid substrate carrying member. Then, the flexible carrier member and the substrate carrier member are combined, and at this time, at least two circuit chips among the plurality of circuit chips are electrically connected by the wiring pattern. Therefore, it is possible to provide a high-density card device having a complicated function by an extremely simple method. Further, in the method of the present invention, a wiring pattern is provided on a substrate carrying member having rigidity, and between the two or more circuit chips fixed on the flexible carrying member by using this wiring pattern. Since the electrical connection is performed, the wiring of the entire card system can be performed easily and reliably.

[Brief description of drawings]

FIG. 1 is a perspective view of a card device.

FIG. 2 is an exploded perspective view of the card device with a part of the outer surface cut away so that the inside can be seen, showing a substrate carrying member sandwiched between plastic insulating layer members on both sides. Figure 3 shows a flexible carrier.

FIG. 3 is a cross-sectional view of the card device taken along section line 3-3 of FIG.

FIG. 4 is an exploded perspective view of an embodiment of a card device showing a substrate carrying member sandwiched between first and second flexible film carrying members. A plurality of circuit chips are attached to each of these two flexible carrier members, and electrically connect with the wiring patterns formed on both sides of the substrate carrier member.

FIG. 5 is a perspective view of a second flexible film carrying member, showing the surface of the circuit chip mounted on the member.

FIG. 6 is an exploded perspective view of portions of the first and second flexible film carrying members and the circuit chip aligned therewith.

7 is a cross-sectional view of the first and second flexible film carrying members taken along section line 7-7 of FIG.

FIG. 8 is a perspective view of a flexible carrier member for joining chips.

FIG. 9 is a cross-sectional view of the embodiment of the card device, showing an enlarged view of the substrate carrying member.

[Explanation of symbols]

 10: Card device 14: Circuit chip 16: First flexible film carrying member 18: Insulating tape 20: Conductive layer 24: Lead 30: Substrate carrying member 40: First substrate electrical wiring pattern

[Procedure amendment]

[Submission date] May 19, 1995

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[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit chip carrier which can be used in a data processing system and a method of manufacturing the same.

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[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a circuit chip carrier having a comparatively light weight and a small size, and a manufacturing method thereof.

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[0005]

According to the present invention, there is provided an improved circuit chip carrier and its manufacturing method. According to one aspect of the present invention, (a) there is provided a flexible carrying means for carrying at least two circuit chips, wherein the flexible carrying means has a predetermined conductive contact area of the circuit chip. An electrically insulating flexible tape having at least two openings formed therethrough and aligned therewith, and the contact area of the circuit chip formed on the flexible tape. A plurality of conductive leads extending into the opening for coupling with,
(B) Substantially rigid and electrically insulative substrate carrying means is provided, the flexible carrying means is located adjacent to the substrate carrying means, and the substrate carrying means is above it. A circuit chip carrier is provided, in which a predetermined electric wiring pattern is formed on the substrate, and the electric wiring pattern is electrically coupled to the circuit chip. Further, according to another aspect of the present invention, there is provided (a) a flexible carrier member having an electrically insulating flexible tape and a plurality of conductive leads formed on the flexible tape. A plurality of circuit chips are fixed, (b) a predetermined electrical wiring pattern is formed on one surface of a substantially rigid and electrically insulating substrate carrying member, and (c) the flexible carrying member. And the substrate supporting member, and at least two circuit chips among the plurality of circuit chips are electrically connected to the electrical wiring pattern formed on the substrate supporting member. A method for manufacturing a circuit chip carrier is provided.

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[0042]

As described in detail above, according to the first aspect of the present invention, an improved circuit chip carrier is provided. That is, at least two circuit chips are carried on a flexible carrier member formed of a flexible tape and a plurality of conductive leads. The flexible tape has at least two openings formed therethrough, each circuit chip being aligned with the corresponding opening and the contact area of the circuit chip extending into the opening. It is combined with the lead. Furthermore,
An electrical arrangement pattern is formed on one surface of the substantially rigid substrate carrying member, the flexible carrying means is arranged adjacent to the substrate carrying means, and the circuit chip is provided with the wiring pattern. Are electrically coupled by. Therefore, it is possible to provide a high-density circuit chip carrier having a complicated function with an extremely simple structure. Further, according to the present invention, a wiring pattern is provided on a substrate carrying member having rigidity, and an electrical connection between two or more circuit chips fixed on the flexible carrying member is provided by using this wiring pattern. The data processing system can be easily and reliably wired because it is connected mechanically, and because it is structurally robust, it has excellent durability and has a long life. ing. The circuit chip supporting device can be a flat card device such as a credit card as a specific embodiment.
Further, according to the second aspect of the present invention, an improved method for manufacturing a circuit chip carrier is provided. According to the method of the present invention, a plurality of circuit chips are fixed on a flexible carrier member formed of a flexible tape and a plurality of conductive leads. On the other hand, an electrical wiring pattern is formed on one surface of the substantially rigid substrate carrying member. Then, the flexible carrier member and the substrate carrier member are combined, and at this time, at least two circuit chips among the plurality of circuit chips are electrically connected by the wiring pattern. Therefore,
It is possible to provide a high-density circuit chip carrier having complex functions by a very simple method. Further, in the method of the present invention, a wiring pattern is provided on a substrate carrying member having rigidity, and between the two or more circuit chips fixed on the flexible carrying member by using this wiring pattern. Since the electrical connection is performed, the wiring of the entire data processing system can be performed easily and reliably.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Peter Poet Car Maryland, USA 21044 Columbia Trotting Ridge Way 10967

Claims (1)

[Claims] 1. A method of manufacturing a card device, comprising: (a) a flexible carrier member having an electrically insulating flexible tape and a plurality of conductive leads formed on the flexible tape. A plurality of circuit chips are fixed, (b) a predetermined electrical wiring pattern is formed on one surface of a substantially rigid and electrically insulating substrate carrying member, and (c) the flexible carrying member. And the substrate supporting member, and at least two circuit chips among the plurality of circuit chips are electrically connected to the electrical wiring pattern formed on the substrate supporting member. And a method for manufacturing a card device.