JPH0430741B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a three-dimensional package using a flexible film and mounting at least a semiconductor element.

2. Description of the Related Art Structures of Conventional Examples and Their Problems In recent years, the development of devices and equipment that use a large number of semiconductor elements has been promoted. In either case, a large number of ICs and LSIs must be mounted thinly and densely on a board with a certain area. In conventional mounting methods, ICs and LSIs are DIL
In the case of housing in a flat pack type package or film carrier method, only a group of leads were cut and mounted flat on a relatively thick circuit board. However, if there is a limit to the planar area, the circuit board may be divided into a plurality of parts, a flexible film is pasted onto the circuit board, and the flexible film is bent at the plurality of divided areas. Ta.

This method requires a process of dividing the circuit board and a process of newly bonding a flexible film, resulting in a significantly high cost of the package. Furthermore, when mounting semiconductor elements in ICs and LSIs, they are mounted in the form of packaging, which not only increases the mounting area and volume of the ICs and LSIs, but also significantly increases the number of connection points such as soldering. It increased considerably and was not favorable in terms of reliability.

OBJECTS OF THE INVENTION In view of these conventional problems, it is an object of the present invention to provide a compact, three-dimensional, and inexpensive mounting body that significantly reduces the number of man-hours and connection points during board formation.

Structure of the Invention The present invention provides a plurality of first and second openings on a flexible film having at least a certain width, and forms a conductor wiring, that is, a group of leads on the flexible film. In the opening part 1,
The group of leads protrudes and is connected to an electrode of a semiconductor element, while in the second aperture, the group of leads extends to cross the aperture, and in the second aperture. This is a structure in which the flexible film is bent.

Description of Examples Opening portions 3, 3', 4 are formed on a flexible film (for example, a flexible resin film of polyimide, glass epoxy, polyester, etc.) 1 on which a sprocket 2 for conveyance is formed, Further, conductor wiring 5 and lead group 6 are formed.

The openings 3 and 3' have a structure in which a lead group 6 protrudes from the end of the flexible film.
The electrodes of the semiconductor elements 7, 7' are connected to the electrodes of the semiconductor elements 7, 7'.
Here, the sizes of the openings 3 and 3' are determined by the size of the semiconductor elements 7 and 3'.
It is formed slightly larger than 7'. Further, in the opening 4, a lead group 6' is formed so as to cross the opening 4. Further, chip components 8, 8' such as resistors and capacitors are fixed to the conductor wiring 5 on the flexible film 1 by, for example, soldering.

Next, the flexible film 1 is cut along the dashed line 9 shown in FIG. 1a, and the lead group 6' is bent in the area of the opening 4 to obtain the structure shown in FIG. 1b. In this conventional configuration, only the lead group 6' remains in the opening 4. With the configuration shown in FIG. 1b, the flexible film can be easily bent through the opening 4 after cutting into an arbitrary shape 1', and furthermore, the electrodes of the semiconductor element can be directly connected to the lead group.
Because they are connected, the surface area of the mounting body is small.
A compact shape can be easily realized.

Further, the configuration shown in FIG. 2 is such that when the flexible film 1 is cut at 9, the flexible film regions 1' at both ends of the opening 4 are left along the lead group 6'. If only the flexible film is bent, not only will it not be possible to maintain a predetermined shape due to the elastic force unique to the resin, but also a considerable amount of curvature will be required at the bent portion, resulting in a wasted mounting area. If an opening is formed in the bending region and the lead group is bent as in the present invention, it can be easily deformed and processed due to the shape maintenance effect peculiar to metals. As shown in FIG. 2b, parallel to the lead group 6' of the opening 4,
By leaving a portion 9 of the flexible film at one or both ends, it can be expected that at least the lead group 6' will be mechanically protected.

In the configuration shown in FIG. 3, resin 10 is applied to the area of the bent lead group 6' of the opening 4.
The purpose is to electrically and mechanically protect the lead group 6'. The resin 10 can be made of epoxy, silicone, polyimide, butadiene, or the like.

Next, another embodiment will be explained with reference to FIG. Further, an opening 11 is formed on the flexible film 1, and cut across the lead group 6'' along the broken line 9 (FIG. 4a). The lead group 6″ is cut, leaving a part of it,
The lead group 6' is bent in the area of the opening 4. The cut lead group 6'' serves as an electrode terminal to be soldered and fixed to another circuit board. In FIG.
3 is formed, and the lead group 6'' is soldered 14 and fixed to the wiring pattern 13.

With this configuration, semiconductor elements, resistors, capacitors, and other chip components are mounted on the conductor wiring and lead groups formed all at once on the flexible film, and the mounted body is folded freely at the openings. Make it small and
Moreover, it can be easily connected to another circuit board using the lead group in the opening.

Effects of the Invention Since semiconductor elements and chip parts are directly mounted on conductor wiring and lead groups formed all at once on a flexible film, the number of connection points with electrodes of the semiconductor elements and chip parts is significantly reduced. In addition, a highly reliable mounting body with short wiring distance can be provided.

Openings are provided in the flexible film, and the lead group is passed through the openings, and this area can be bent, allowing the mounting body to be formed into any shape, making it possible to create a mounting body with a high degree of freedom in mounting. Alternatively, the mounting area can be significantly reduced.

There is no need to take the trouble to form connection terminals to the external circuit board on the mounting body, and they can be provided all at once at the stage of forming the openings and the lead group in the flexible film. Therefore, the number of connection points of the mounting body is small and the cost can be reduced.

[Brief explanation of drawings]

Figures 1a and b are perspective views of a mounting body according to the first embodiment of the present invention before and after folding, and Figures 2a and b are before and after folding of a mounting body that is an improved version of the first embodiment of the present invention. , a perspective view showing the rear; FIGS. 3a and 3b are perspective views and folded sectional views of the mounting body of the second embodiment of the present invention;
FIGS. 4a and 4b are a perspective view and a folded sectional view of a mounting body according to a third embodiment of the present invention. 1... Flexible film, 3, 3', 4, 11...
...Opening portion, 6, 6', 6''... Lead group, 7... Semiconductor element, 8, 8'... Chip parts.

Claims (1)

[Scope of Claims] 1. Electrodes of a semiconductor element are bonded to a group of leads formed on a flexible film having at least first and second openings and protruding from the first openings; The other end of the lead group is connected to the second
A mounting body characterized in that the flexible film is folded in the second opening area and the flexible film is bent in the second opening area. 2. The mount assembly according to claim 1, wherein the lead group is bent so that only the crossing lead group remains in the second opening region. 3. The mounting body according to claim 1, wherein a part of the flexible film is left in the second opening area and is bent together with the lead group. 4. The mount according to claim 1, wherein after bending in the second aperture region, a resin layer is formed in the aperture region. 5. The mounted body according to claim 1, wherein a third opening is formed in the flexible film, and a group of leads of the third opening are connected to another circuit board. .