JP2606673B2 - Mounted body - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention uses a flexible film,
The present invention relates to a three-dimensional mounting body on which at least a semiconductor element is mounted.

[0002]

2. Description of the Related Art In recent years, the development of devices and devices using a large number of semiconductor elements has been promoted. In any case, it is necessary to mount a large number of ICs and LSIs on a substrate having a fixed area at a high density and a low thickness. In the conventional mounting method, ICs and LSIs are housed in a DIL or flat-pack type package or in a film carrier method, and only the leads are cut and mounted on a relatively thick circuit board in a planar manner. Was.

[0003]

However, if the planar area is limited, the circuit board is divided into a plurality of parts, and a flexible film is pasted on the circuit board to form the plurality of divided areas. Was used to bend the flexible film.

In such a method, a step of dividing the circuit board and a step of bonding a new flexible film are required, so that the cost of the mounting body is extremely high. Also, when mounting semiconductor elements such as ICs and LSIs, since they are mounted in the form of packaging,
Not only does the mounting area and mounting volume of C and LSI become large, but the number of connection points such as soldering increases remarkably, which is not preferable in terms of reliability. An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a small, three-dimensional, and inexpensive mounting body in which the number of steps and the number of connection points when forming a substrate are extremely small.

[0005]

According to the present invention, there is provided a package comprising: a flexible film having at least first and second openings; a lead group formed on the flexible film; A semiconductor element electrically connected to the lead group at the opening, and the lead group traverses the second opening;
In the second opening, the lead group is bent at two places ,
And has a structure which is not flexible film is formed on the lead group of folded on lead group between two places.

[0006]

According to the present invention, the number of connection points with the electrodes of the semiconductor element and the chip component can be significantly reduced and the wiring distance can be shortened by having the above configuration. Also,
A package having a high degree of freedom in mounting can be realized, and a mounting area can be remarkably reduced, so that a package with high reliability can be provided.

[0007]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

In FIG. 1, apertures 3, 3 ', 4 are formed on a flexible film (for example, a flexible film made of polyimide, glass epoxy, polyester, etc.) 1 on which a transport sprocket 2 is formed. In addition, the conductor wiring 5 and the lead group 6 are formed.

In the openings 3, 3 ', the lead group 6 has a structure projecting from the end of the flexible film.
Are connected to the electrodes of the semiconductor elements 7, 7 '. Here, the size of the openings 3, 3 'is slightly larger than that of the semiconductor elements 7, 7'. In the opening 4, a lead group 6 ′ is formed so as to cross the opening 4. Further, chip components 8, 8 'such as resistors and capacitors are fixed to the conductor wiring 5 on the flexible film 1, for example, by soldering.

Next, the flexible film 1 is cut along the dashed line 9 shown in FIG. 1A, and the lead group 6 'is bent in the area of the opening 4 to obtain the structure shown in FIG. 1B. In this conventional configuration, only the lead group 6 ′ remains in the opening 4. According to the configuration shown in FIG. 1B, the flexible film can be easily cut 1 ′ after being cut into an arbitrary shape and then bent by the opening 4, and furthermore, the electrodes of the semiconductor element are directly connected to the lead group. From this, the plane area of the mounting body is small,
A small shape can be easily realized. Further, since the side surface of the bent flexible film is formed only by the opening portion 4 (the flexible film is not formed on the lead group 6 'between the bent portions), the opening portion is formed. 4, the flexible film can be bent at any position.

The structure shown in FIG.
In this case, the flexible film regions 1 'at both ends of the opening 4 are left along the lead group 6'.
If only the flexible film is bent, not only the predetermined shape cannot be maintained due to the elastic force peculiar to the resin, but also the curvature of the bent portion is considerably required, so that a useless mounting area is required. As in the present invention, if an opening is formed in a bent area and bent by a lead group, it can be easily deformed and processed with a shape maintaining effect peculiar to metal. As shown in FIG. 2B, if a portion 9 of the flexible film is left at one end or both ends of the lead group 6 'in parallel with the lead group 6' of the opening 4, at least the mechanical protection of the lead group 6 'is achieved. That is what you can expect.

FIG. 3 shows a structure in which a resin 10 is applied to the area of the bent lead group 6 'of the opening 4 to protect the lead group 6' electrically and mechanically. It is. The resin 10 may have an epoxy-based, silicone-based, polyimide-based, or ptadene-based composition.

Next, another embodiment will be described with reference to FIG. An opening 11 is further formed on the flexible film 1, cut across the lead group 6 ′, and cut along the broken line 9 (FIG. 4).
a). By this cutting, the lead group 6 ′ of the opening 11 is formed.
Is cut, leaving a part thereof, and bends the lead group 6 ′ in the region of the opening 4. The cut lead group 6 "has a role as an electrode terminal to be soldered and fixed to another circuit board. In FIG. 4B, a wiring pattern 13 is formed on the circuit board 12, and the wiring pattern 13 is formed.
The lead group 6 ″ is soldered 14 and fixed.

With such a configuration, semiconductor elements, chip components such as resistors and capacitors are mounted on conductor wirings and leads which are collectively formed on the flexible film, and are freely bent at the opening. The package can be reduced in size and can be easily connected to another circuit board by using the lead group of the opening.

[0015]

【The invention's effect】

(1) Since the semiconductor element and the chip component are directly mounted on the conductor wiring and the lead group formed collectively on the flexible film, the number of connection points with the electrodes of the semiconductor element and the chip component is extremely small. In addition, a highly reliable package having a short wiring distance can be provided.

(2) An opening is provided in the flexible film, a lead group is traversed through the opening, and this area is folded in a state where the side surface of the bent flexible film is formed only by the opening. Since it can be bent, the flexible film can be bent at any position within the opening, so that not only a mounting body having a high degree of freedom in mounting can be realized, but also the mounting area can be significantly reduced. .

(3) Even if the connection terminal with the external circuit board is not formed on the mounting body, the flexible film can be collectively provided at the stage of forming the opening and the lead group. Therefore, the number of connection points of the mounting body is small, and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 (a) is a perspective view of a package according to a first embodiment of the present invention before bending; FIG. 1 (b) is a perspective view of a package according to the first embodiment of the present invention after bending;

FIG. 2 (a) is a perspective view showing a mounted body improved from the first embodiment of the present invention before bending; and (b) is a perspective view showing a mounted body improved from the first embodiment of the present invention after bending.

FIG. 3A is a perspective view of a package according to a second embodiment of the present invention. FIG. 3B is a cross-sectional view of the package according to the second embodiment of the present invention.

FIG. 4A is a perspective view of a package according to a third embodiment of the present invention. FIG. 4B is a cross-sectional view of the package according to the third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Flexible film 3,3 ', 4,11 Opening part 6,6', 6 "Lead group 7 Semiconductor element 8,8 'Chip component

Claims (4)

(57) [Claims] A flexible film having at least first and second apertures; a lead group formed on the flexible film; and a lead group formed at the first aperture. An electrically connected semiconductor element, wherein the lead group traverses the second opening, and the lead group is bent at two places in the second opening, and Before
A mounted body, wherein the flexible film is not formed on the lead group between two bent portions of the lead group. 2. The mounting body according to claim 1, wherein the lead group is bent while leaving only the traversing lead group in the second opening region. 3. A part of the flexible film remaining in a portion of the second opening area where the lead group does not exist and bent together with the lead group. The mounting body described in the section. 4. The flexible film according to claim 1, further comprising a third opening formed on the flexible film, wherein a lead group protruding from the third opening is connected to another circuit board. Range 1
Item 4. The mounting body according to any one of Items 3 to 3 .