JP2606673C - - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a three-dimensional package using a flexible film and mounting at least a semiconductor element. 2. Description of the Related Art In recent years, development of devices and apparatuses using a large number of semiconductor elements has been promoted. In any case, it is necessary to mount a large number of ICs and LSIs on a substrate having a fixed area at a high density and a low thickness. In the conventional mounting method, IC,
In the LSI, in a form accommodated in a DIL or flat pack type package or in a film carrier method, only a lead group is cut and mounted on a relatively thick circuit board in a planar manner. [0005] However, if the planar area is limited, the circuit board is divided into a plurality of pieces, and a flexible film is pasted on the circuit board, and The flexible film was bent in the divided region of the above. In such a method, a step of dividing the circuit board and a step of bonding a new flexible film are required, so that the cost of the mounting body is extremely high. Also, when mounting semiconductor elements such as ICs and LSIs, since they are mounted in the form of packaging, not only the mounting area and the mounting volume of the ICs and LSIs become large, but also the number of connection points such as soldering becomes extremely large. It increased rapidly and was not preferable in terms of reliability. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a small, three-dimensional, and inexpensive mounting body in which the number of steps and the number of connection points when forming a substrate are extremely small. [0005] A package according to the present invention comprises: a flexible film having at least first and second openings; a lead group formed on the flexible film; A semiconductor element electrically connected to the lead group at the first opening, wherein the lead group traverses the second opening and the second opening has two lead groups; In this configuration, the flexible film is not formed on the lead group between the two bent portions of the lead group. According to the present invention, by having the above configuration, the number of connection points with the electrodes of the semiconductor element and the chip component can be significantly reduced, and the wiring distance can be shortened. Also,
A package having a high degree of freedom in mounting can be realized, and a mounting area can be remarkably reduced, so that a package with high reliability can be provided. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, openings 3, 3 ′, and 4 are formed on a flexible film (eg, a flexible film made of polyimide, glass epoxy, polyester, or the like) 1 on which a transport sprocket 2 is formed. In addition, the conductor wiring 5 and the lead group 6 are formed. In the openings 3, 3 ', a lead group 6 has a structure protruding from the end of the flexible film, and electrodes of the semiconductor elements 7, 7' are joined to the lead group 6. . Here, the size of the openings 3, 3 'is slightly larger than that of the semiconductor elements 7, 7'. In the opening 4, a lead group 6 ′ is formed so as to cross the opening 4. Further, chip components 8, 8 'such as resistors and capacitors are fixed to the conductor wiring 5 on the flexible film 1, for example, by soldering. Next, the structure of FIG. 1B can be obtained by cutting the flexible film 1 along the broken line 9 shown in FIG. 1A and bending the lead group 6 ′ in the area of the opening 4. In the configuration of this embodiment, only the lead group 6 ′ remains in the opening 4. According to the configuration shown in FIG. 1B, the flexible film can be easily cut 1 ′ after being cut into an arbitrary shape and then bent by the opening 4, and furthermore, the electrodes of the semiconductor element are directly connected to the lead group. Therefore, the plane area of the mounting body is small, and a small shape can be easily realized.
Further, since the side surface of the bent flexible film is formed only by the opening 4 (the flexible film is not formed on the lead group 6 'between the bent portions).
The flexible film can be bent at any position within the opening 4. The configuration shown in FIG. 2 is such that when the flexible film 1 is cut at 9, the flexible film regions 1 ′ at both ends of the opening 4 are left along the lead group 6 ′. is there. If only the flexible film is bent, not only the predetermined shape cannot be maintained due to the elastic force peculiar to the resin, but also the curvature of the bent portion is considerably required, so that a useless mounting area is required. As in the present invention, if an opening is formed in a bent region and bent by a lead group, it can be easily deformed and processed with a shape maintaining effect peculiar to metal. As shown in FIG. 2B, if a part 9 of the flexible film is left at one end or both ends of the lead group 6 'of the opening 4 in parallel with the lead group 6', at least the mechanical protection of the lead group 6 'is achieved. That is what you can expect. FIG. 3 shows a configuration in which the resin 10 is applied to a region of the lead group 6 ′ in which the opening portion 4 is bent, and the lead group 6 ′ is electrically and mechanically protected. It is. The resin 10 may have an epoxy-based, silicone-based, polyimide-based, or ptadene-based composition. Next, another embodiment will be described with reference to FIG. On the flexible film 1, an opening 11 is further provided.
And cut along the broken line 9 across the lead group 6 '(FIG. 4a). By this cutting, the lead group 6 ′ of the opening 11 is cut while leaving a part thereof, and the lead group 6 ′ is bent in the region of the opening 4. The cut lead group 6 ″ has a role as an electrode terminal to be soldered and fixed to another circuit board. In FIG. 4B, a wiring pattern 13 is formed on the circuit board 12 and the wiring pattern 1 is formed.
The lead group 6 ″ is soldered 14 to the base 3 and fixed. With such a configuration, a semiconductor element, a resistor, and a capacitor are connected to the conductor wiring and the lead group that are collectively formed on the flexible film. Such a chip component is mounted thereon, is freely bent at the opening, makes the package compact, and can be easily connected to another circuit board by using the lead group of the opening. (1) Since the semiconductor element and the chip component are directly mounted on the conductor wiring and the lead group which are collectively formed on the flexible film, the number of connection points with the electrodes of the semiconductor element and the chip component is increased. (2) A flexible film is provided with an opening, and a lead group is traversed by forming an opening in the flexible film. The side of the folded flexible film Since this area can be bent in the state of being formed only by the hole, the flexible film can be bent at any position within the opening, realizing a mounted body with high mounting flexibility. (3) The flexible film can be provided with a hole or a lead without having to form a connection terminal with an external circuit board in order to reduce the mounting area. It can be provided collectively at the stage of forming the group, so that the number of connection points of the mounting body is small and the cost can be reduced.

[Brief description of the drawings]   FIG.   (A) A perspective view of a package according to a first embodiment of the present invention before bending.   (B) A perspective view of the mounted body of the first embodiment of the present invention after bending.   FIG. 2   (A) Perspective view showing a state before bending of a package improved from the first embodiment of the present invention.   (B) Perspective view showing a state after bending of a package improved from the first embodiment of the present invention.   FIG. 3   (A) A perspective view of a package according to a second embodiment of the present invention.   (B) Bending cross-sectional view of the mounting body according to the second embodiment of the present invention   FIG. 4   (A) A perspective view of a package according to a third embodiment of the present invention.   (B) Folded sectional view of the mounting body according to the third embodiment of the present invention.   [Explanation of symbols]   1 Flexible film   3,3 ', 4,11 hole   6,6 ', 6 "lead group   7 Semiconductor elements   8,8 'chip parts

Claims (1)

[Claims] A flexible film 1 having a third opening 3 'slightly larger than' 1 ' , leads 6 and 6' formed on the flexible film 1 , and a first opening 3 A first semiconductor element 7 electrically connected to the lead group 6 and the first semiconductor element
A chip component 8 connected to the conductor wiring 5 on the flexible film 1 near the element 7;
A second semi-conductor electrically connected to the lead group 6 'at the third opening 3'.
'And a, the lead groups 6' body element 7 with traverses said second opening 4, the lead groups 6 'is bent in two places at the second opening 4 and mount assembly, wherein the the flexible film 1 is not formed on 'the lead group 6 between two positions which are bent in' the lead group 6.