JPH07262337A - Fitting structure for semiconductor package and ic card - Google Patents

Abstract

PURPOSE:To reduce the thickness of an entire substrate to which an SOJ type semiconductor package is fitted. CONSTITUTION:The bent part of a lead 14 of an SOJ type semiconductor package 10 is inserted to a fitting hole 24 formed on a substrate 20, the inserted lead 14 and a wiring printed on the surface of the substrate 20 are connected by soldering 30, and the semiconductor package 10 is fitted to the substrate 20. With this fitting structure, the thickness of the entire substrate can be reduced just by the insertion of the lead 14 to the fitting hole 24. Therefore, concerning a device (such as an IC card, for example,) for which the thickness limitation of the entire substrate is severe, even any SOJ type semiconductor package not to be conventionally used can be used when the thickness of the entire semiconductor package is less than that thickness limitation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for a semiconductor package and an IC card, and more particularly to a mounting structure for mounting a semiconductor package having leads protruding from a mounting surface of a main body on a substrate and an IC card adopting this mounting structure.

[0002]

2. Description of the Related Art Conventionally, in order to reduce the thickness of this type of IC card, TSOP (Thin Small Outline Packag
ICs in packages such as e) and VSOP (Very Small Outline Package) are used. These IC
Is a semiconductor package of the type in which the leads do not protrude from the mounting surface of the semiconductor package body in the thickness direction and the semiconductor package body is attached so as to directly contact the printed circuit board.

This IC card has a connection terminal at its end and is used by connecting it to a connection terminal provided at the innermost end of the IC card insertion slot of a computer. The IC card insertion slot of the computer has substantially the same size as the outer shape of the IC card for the purpose of protecting the IC card and facilitating the connection between the connection terminal of the IC card and the connection terminal on the computer side.

[0004]

However, this I
The IC such as TSOP used for the C card has a problem that the manufacturing process is complicated because the thickness needs to be thin, the yield is low, and the manufacturing cost is high.

In order to avoid this problem, instead of an IC such as TSOP, a semiconductor package of a type that is easy to manufacture and has a low manufacturing cost, for example, a portion protruding from the main body mounting surface of the lead is bent inward to form a J-shape. SOJ (Sm
It is possible to use all outline J lead package) type IC, but if you use SOJ type IC
There was a problem that the card became thick.
For this reason, the IC card using the SOJ type IC has a problem that it cannot be inserted depending on the shape of the IC card insertion opening provided in the computer. In the SOJ type IC, the bent portion of the lead is brought into contact with the mounting position surface of the printed circuit board, and the contact portion is fixed by soldering to be mounted on the printed circuit board. It is the sum of the thickness of the semiconductor package body and the thickness of the height of the leads protruding from the mounting surface of the body. Therefore, TSO
The thickness is thicker than when using ICs such as P,
The thickness limit of the IC card will be exceeded.

A semiconductor package mounting structure and an IC card according to the present invention are intended to solve these problems and to reduce the thickness of the entire substrate even if a semiconductor package such as SOJ is used to clear the thickness limitation. , Adopted the following configuration.

[0007]

A mounting structure for a semiconductor package according to the present invention is a mounting structure for mounting a semiconductor package, in which leads project from a mounting surface of a main body, on a substrate, and at a position for mounting each of the leads on the substrate. A gist of the present invention is to provide a hole for accommodating at least a part of a portion of each lead projecting from the main body mounting surface, fix the lead in the state of being accommodated in the hole, and attach the semiconductor package to the substrate.

Here, in the mounting structure, the holes may be a plurality of holes for accommodating the leads for each lead or a hole for accommodating at least two adjacent ones of the leads. .

The IC card of the present invention is provided with a semiconductor package having leads protruding from the body mounting surface and a hole for accommodating at least a part of the portion of the lead protruding from the body mounting surface. The gist of the present invention is to provide a substrate on which the semiconductor package is fixed in a housed state.

[0010]

In the semiconductor package mounting structure of the present invention constructed as described above, at least a part of each lead projecting from the main body mounting surface of the semiconductor package is housed in the hole provided at the position where each lead of the substrate is mounted. Then, the semiconductor package is fixed in this state and the semiconductor package is attached to the substrate. As a result, the thickness of the entire substrate is reduced by the amount of each lead accommodated in the hole.

In the IC card of the present invention, the semiconductor package is accommodated in a hole provided in the substrate at least a part of the portion of the lead projecting from the main body mounting surface, fixed in this state, and attached to the substrate. As a result, since the thickness of the entire substrate is reduced by the amount of the leads accommodated in the holes, it is possible to use a semiconductor package in which the leads protrude from the mounting surface of the main body for an IC card with severe thickness restrictions.

[0012]

Preferred embodiments of the present invention will be described below in order to further clarify the structure and operation of the present invention described above. FIG. 1 is an explanatory view showing a state where a semiconductor package 10 is attached to a substrate 20 as an example of a semiconductor package attachment structure of the present invention.

As shown, the semiconductor package 10
Is a semiconductor package body 1 having a semiconductor element inside.
2 and a plurality of leads 14 arranged on both sides of the semiconductor package body 12 to form an SOJ (Small Outlin).
e J lead Package) type IC. Lead 14
The lower part of the mounting surface of the semiconductor package body 12 is bent inward and has a J shape as a whole. The substrate 14 has leads 14 of the semiconductor package 10.
Two elongated mounting holes 24 for accommodating each row are formed. The semiconductor package 1 is provided on the back surface of the substrate 20.
Predetermined wiring to be connected with the lead 14 of 0 is printed.

How the semiconductor package 10 is attached to the substrate 20 will be described with reference to FIG. First, the substrate 2
The cream solder is printed at a predetermined position (the position where the lead 14 and the wiring are connected) on the surface of No. 0 on which the semiconductor package 10 is not mounted (step 1). The cream solder is printed by stacking a thin plate (metal mask) made of stainless steel punched out at a predetermined position on the surface of the substrate 20 to be printed, and pressing the cream solder on the metal mask with a squeegee. As a result, the cream solder having that thickness is printed on the punched portion of the metal mask. A cross-sectional view of a part of the substrate 20 on which the cream solder is printed is shown in FIG. As shown, the cream solder 30 is applied to the substrate 20.
It is printed so as to adhere not only to the surface on which the semiconductor package 10 is not mounted but also to the inside of the mounting hole 24. Mounting hole 2
The reason why the cream solder 30 is attached to the inside of the wiring 4 is to ensure the connection between the lead 14 and the wiring on the substrate 20 by the cream solder 30 when the lead 14 of the semiconductor package 10 is inserted into the mounting hole 24. .

Next, the leads 14 of the semiconductor package 10 are inserted into the mounting holes 24 of the substrate 20 and the semiconductor package 1
0 is mounted (step 2). FIG. 4 shows a part of the cross section of the substrate 20 on which the semiconductor package 10 is mounted. As shown in the figure, since the lead 14 is housed in the mounting hole 24,
The mounting surface of the semiconductor package body 12 contacts the substrate 20. When the lead 14 is inserted into the mounting hole 24, the lead 14 comes into contact with the cream solder 30 attached to the inner peripheral edge thereof.

Thus, the semiconductor package 10 is mounted on the substrate 20.
After mounting, the solder paste is passed through a reflow oven to reflow the cream solder 30 (step 3) to complete the attachment of the semiconductor package 10 to the substrate 20.

The semiconductor package 1 of the embodiment described above
According to the mounting structure of 0, the portion of the lead 14 located below the mounting surface of the semiconductor package body 12 is accommodated in the mounting hole 24 of the substrate 20, so that the thickness of the entire substrate can be reduced. Therefore, a device with a strict limitation on the thickness of the entire substrate, such as an IC card, can be an SOJ type I
C can be used. By using the mounting structure of the semiconductor package 10 of the embodiment as described above, the SOJ type IC can be used even in a device whose thickness is severely limited, so that the range of selection of the components forming the device is widened and the manufacturing cost is reduced. be able to.

In the embodiment, the semiconductor package 1 is printed on the substrate 20 by printing cream solder and reflowing.
0 is attached, but after the semiconductor package 10 is attached to the substrate 20, the wiring of the substrate 20 and the leads 14 are electrically connected by solder or the like, for example, an adhesive is applied to the mounting surface of the semiconductor package body 12. Alternatively, the lead 14 may be inserted into the mounting hole 24 of the board 20 and the semiconductor package body 12 may be bonded to the board 20, and then the lead 14 and the wiring of the board 20 may be connected by solder.

Further, in the embodiment, the two elongated mounting holes 24 for accommodating the leads 14 of the semiconductor package 10 in each row are formed in the substrate 20, but a plurality of mounting holes for accommodating each lead are formed or adjacent to each other. A configuration in which a plurality of mounting holes for accommodating a plurality of leads are formed is also suitable. FIG. 5 shows an example of a configuration in which a plurality of mounting holes for accommodating each lead are formed. As illustrated, the semiconductor package 10 is mounted on the substrate 20a.
The lead 14 of the semiconductor package 10 at the position where the
A plurality of mounting holes 24a for accommodating each one are formed. If this board 20a is used, one lead 14 is housed in each mounting hole 24a.
It is possible to reduce the risk of the solder coming into contact with the adjacent lead or wiring when the wiring of 0 is connected with solder or the like.

Next, a case where an IC memory card is constructed by using this mounting structure will be described. FIG. 6 is an explanatory view illustrating the configuration of the IC memory card 100, and FIG. 7 is a cross-sectional view illustrating a part of the cross section of the IC memory card 100. As shown in FIG. 6, the IC memory card 100 includes a substrate 120 and a plurality of SOJ type semiconductor packages 1 mounted on the substrate 120 as the above-described mounting structure.
10, a connection socket 130 for connecting to a computer interface circuit (not shown), and a cover case 140 for covering the substrate 120 on which the semiconductor package 110 is mounted. As shown in FIG. 7, the substrate 1
Two mounting holes 124 are formed for each of the semiconductor packages 110 at the positions where the 20 semiconductor packages 110 are mounted. The semiconductor package 110 should fix the leads 114 housed in the mounting holes 124 with solder 126. Is attached to the substrate 120.

The IC memory card 10 thus constructed
0 is used by connecting the connection socket 130 to a connection terminal prepared in the computer. The computer is provided with an interface circuit incorporating a device driver that handles the IC memory card 100 as a logical device similar to that of the flexible disk device. With this interface circuit, the IC memory card 100 is handled in the same manner as the flexible disk device. .

In such an IC memory card 100, the semiconductor package 110 is mounted on the substrate 1 by the mounting structure described above.
Since it is mounted on the substrate 20, it is possible to reduce the thickness of the entire substrate, and it is possible to use an SOJ type IC which cannot be used due to the thickness limitation of the conventional mounting structure. Therefore, it is possible to widen the selection range of the semiconductor packages that form the IC memory card and reduce the manufacturing cost thereof.

The embodiment of the present invention has been described above.
The present invention is not limited to these embodiments, and for example, various ICs having a CPU and a ROM therein are provided.
Configuration used for mounting the semiconductor package in the card,
Needless to say, the present invention can be implemented in various forms without departing from the scope of the present invention, such as a configuration used for mounting a semiconductor package inside a computer.

[0024]

As described above, in the semiconductor package mounting structure of the present invention, the leads are housed in the holes provided in the substrate to mount the semiconductor package. Therefore, the thickness of the entire substrate on which the semiconductor package is mounted is equal to that of the semiconductor package. It is possible to reduce the overall thickness. Therefore, even if the thickness of the entire substrate is strictly limited, the device can be used as long as the thickness of the entire semiconductor package is equal to or less than the thickness limit, and the manufacturing cost of the device can be reduced.

Further, the mounting structure in which holes are provided in the substrate for each lead can effectively prevent the inconvenience that the solder comes into contact with the adjacent lead or wiring when soldering the leads.

Alternatively, if the mounting structure is provided with holes for accommodating at least two adjacent ones of the leads, the number of holes provided in the substrate is reduced, so that the productivity is improved and the manufacturing cost can be reduced. .

According to the IC card of the present invention, it is possible to use a semiconductor package of a type that cannot be used conventionally due to its thickness limitation. Therefore, the range of selection of the semiconductor packages forming the IC card can be widened, and the manufacturing cost thereof can be reduced.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a state in which a semiconductor package 10 is mounted on a substrate 20 by a mounting structure that is an embodiment of the present invention.

FIG. 2 is a process diagram for attaching the semiconductor package 10 to the substrate 20.

FIG. 3 is a cross-sectional view showing a part of a cross section of a substrate 20 on which cream solder is printed.

FIG. 4 is a cross-sectional view showing a part of the cross section of the substrate 20 and the semiconductor package 10.

FIG. 5 is an explanatory diagram showing an example of a substrate in which mounting holes for accommodating leads are formed.

6 is an explanatory diagram illustrating the configuration of the IC memory card 100. FIG.

7 is a cross-sectional view illustrating a part of the cross section of the IC memory card 100. FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Semiconductor package 12 ... Semiconductor package main body 14 ... Lead 20 ... Board 20a ... Board 24 ... Attachment hole 24a ... Attachment hole 100 ... IC memory card 110 ... Semiconductor package 114 ... Lead 120 ... Board 124 ... Attachment hole 130 ... Connection socket 140 … Cover case

Claims (3)

[Claims] 1. A mounting structure for mounting a semiconductor package, in which leads project from a mounting surface of a main body, to a substrate, wherein at least one portion of the leads projecting from the mounting surface of the main body is located at a position where each of the leads is mounted. A mounting structure in which a hole for accommodating a portion is provided, and the leads are fixed in a state of being accommodated in the hole and the semiconductor package is mounted on a substrate. 2. The mounting structure according to claim 1, wherein the hole is a plurality of holes for accommodating the leads for each lead or a hole for accommodating at least two adjacent ones of the leads. 3. A semiconductor package having leads projecting from a body mounting surface, and a hole for accommodating at least a part of a portion of the lead projecting from the body mounting surface is provided, and the lead is fixed in a state of being housed in the hole. And a substrate to which the semiconductor package is attached.