JP3029736B2 - Manufacturing method of hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates relates to a method for manufacturing a hybrid integrated circuit equipment, particularly high density, a method of manufacturing a highly integrated capable hybrid integrated circuit equipment.

[0002]

2. Description of the Related Art Hybrid integrated circuit devices (hybrid ICs)
Basically, electronic components such as active elements and passive elements are mounted on a wiring board, electrodes of the electronic components are electrically connected to wiring layers by wires, and leads are connected to the wiring board. It is manufactured by sealing the whole of the lead except for the outer end with a package.

On the other hand, a technique using a lead frame has also been developed for a hybrid integrated circuit device from the viewpoint of improving productivity and improving automatic IC mounting. For example, Japanese Unexamined Patent Publication
Japanese Patent Laid-Open No. 10263 discloses a hybrid IC having a structure using a lead frame. This hybrid IC has a structure in which a multilayer wiring board is fixed on a land portion (support plate) of a lead frame.
The hybrid IC has a structure in which bonding pads provided on the uppermost wiring board and leads are connected by wires.

On the other hand, Japanese Patent Application Laid-Open No. 60-160135 discloses an example in which a plurality of semiconductor elements are mounted on a silicon motherboard, and the motherboard is mounted on a tab (land) of a lead frame and assembled. I have.

[0005] On the other hand, "Electronic Materials" 199
April, P22-P28, Fine Pitch SM
The latest trends of T are described. In this document,
For IC and LSI packages, products with a pitch of up to 0.4 mm are currently in practical use.
It is described that a pitch of about 3 mm (lead width of about 0.15 mm) will be the limit.

[0006]

With the progress of surface mounting (SMT), mounting on a wiring board in a hybrid integrated circuit device according to the prior art has also been increasing in density. The inventor of the present invention has proposed a hybrid integrated circuit device in which a wiring substrate is fixed to a part of a lead frame and manufactured, in which the wiring substrate is considered as a motherboard, and a hybrid integrated circuit device as a subassembly is mounted on the motherboard. The present invention was made based on the idea that the motherboard area could be effectively used.

An object of the present invention is to provide a manufacturing technique for achieving high density and high integration of a hybrid integrated circuit device. The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0008]

SUMMARY OF THE INVENTION A hybrid integrated circuit device according to the present invention.
The hybrid integrated circuit device manufactured by the manufacturing method of the device
A wiring board (second board) as a motherboard on which an active element (a second active element, in other words, a second electronic component) or a passive element (a second passive element, in other words, a second electronic component) is mounted. Of the hybrid integrated circuit device (hybrid integrated circuit). Further, a plurality of leads are attached to the periphery of the wiring board (second wiring board). The entirety of the leads except for the outer ends is covered with a resin mold package. The sub-assembly includes a wiring board (first wiring board) and an active element (first active element, in other words, a first active element) mounted on a main surface of the wiring board (first wiring board). Electronic components) and passive elements (first passive elements, in other words, first electronic components), and the passive element and the active element (first element) except for the peripheral surface of the wiring board (first wiring board). (A passive element and an active element). Further, the bonding pads are exposed at the peripheral portion of the main surface of the wiring board (first wiring board) of the sub-assembly. The bonding pad and the wiring layer of the wiring board (second wiring board) to which the leads are attached are electrically connected by wires. Such a hybrid integrated circuit device is manufactured by the following methods (1) to (3) .
Built. (1) a first wiring board having a bonding pad;
Provided in the first wiring board, and a first active element and the passive element are electrically connected via a wire to the bonding pad, which is resin-molded so as to expose the bonding pad A step of preparing a sub-assembly, a step of preparing a second wiring board, and forming the sub-assembly on the second wiring board.
Mounting a second active element and a passive element. The sub-assembly constitutes a hybrid integrated circuit. The resin mold is formed by a transfer mold. A plurality of sub-assemblies are mounted on the second wiring board. (2) a first wiring board having a bonding pad;
Preparing a resin-molded sub-assembly having a first active element and a passive element provided on the first wiring board and electrically connected to the bonding pads, respectively , and exposing the bonding pads; Performing a step of preparing a second wiring board to be a motherboard; mounting the sub-assembly, a second active element and a passive element on the second wiring board; Electrically connecting each of the active element and the passive element to the wiring of the second wiring board. The sub-assembly constitutes a hybrid integrated circuit. The registration Nmorudo is formed by transfer molding. A plurality of sub-assemblies are mounted on the second wiring board. (3) a first wiring board having a bonding pad;
A plurality of first electronic components provided on the first wiring board and electrically connected to the bonding pads, respectively;
Has the door, Les to expose said bonding pad
A step of preparing a gin-molded sub-assembly, a step of preparing a second wiring board to be a motherboard, a step of mounting a plurality of second electronic components on the second wiring board, Mounting the sub-assembly on the wiring board, electrically connecting the wiring of the second wiring board and the bonding pad using wires, and then sealing a region including the wires. And The sub-assembly constitutes a hybrid integrated circuit. The resin mold is formed by a transfer mold. A plurality of sub-assemblies are mounted on the second wiring board. Although a similar configuration is disclosed in Japanese Patent Application Laid-Open No. 03-22588,
The structure of the wiring board terminals and the method of manufacturing the device are different.

[0009]

According to the method of manufacturing a hybrid integrated circuit device, the second
A subassembly that forms a hybrid integrated circuit on a wiring board,
Hybrid integrated circuit mounting second active element and passive element
Form the device, but the sub-assembly is
Because it has a cage structure and is easy and reliable to hold
Automatic mounting is also possible, compatible with automatic mounting of other electronic components.
In addition, the assemblability is improved. Further, since the sub-assembly has a structure that is electrically connected to a wiring layer of a wiring board as a motherboard using wires,
The pitch of the bonding pad is 200 to 300 μm
It is possible to narrow the longitudinal, the sub-assembly will be able number of terminals or compact, high density
Of hybrid integrated circuit devices that can achieve high integration and high integration
It is possible. In the present invention, the sub-assembly is
Manufacture as work, then sub-assembly mother
Since it is mounted on a wiring board that becomes a board,
The effective use of the wiring area can be achieved.

[0010]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a main part of a hybrid integrated circuit device according to one embodiment of the present invention, FIG. 2 is a cross-sectional view of the hybrid integrated circuit device, FIG. 3 is a cross-sectional view of the sub-assembly, and FIG. FIG. 5 is a plan view of a lead frame used for manufacturing a hybrid integrated circuit device, FIG. 5 is a cross-sectional view showing a state where electronic components are mounted on one surface of a wiring board in manufacturing a hybrid integrated circuit device of the present invention, and FIG. FIG. 4 is a cross-sectional view showing a lead frame that has been placed.

According to the method of manufacturing a hybrid integrated circuit device of the present invention,
The hybrid integrated circuit device manufactured as shown in FIG.
A wiring board 1 serving as a motherboard composed of a thick film substrate or a printed circuit board (PCB, COB);
Although electronic components such as passive elements and active elements are mounted on the front and back surfaces of the device, a feature is that a sub-assembly 2 composed of a hybrid integrated circuit device is mounted. Although only about 1 to 2 points are shown for each part in the figure for convenience of explanation, there are actually many parts. The sub-assembly 2, the chip resistor 3, and the IC 4 are mounted on the upper surface of the wiring board 1, and the two sub-assemblies 2 and the chip resistor 3 are mounted on the back surface. These electronic components are fixed on a wiring layer (metallization layer) 5 provided on the surface of the wiring board 1 via a bonding material (not shown). A surface-mounted lead 7 is fixed to the periphery of the wiring board 1.
The leads 7 and the wiring layer 5, and the electronic components and the wiring layer 5 are electrically connected by wires 9. Although not shown, in the wiring board 1,
A predetermined portion of the wiring layer 5 on the front and back surfaces is electrically connected to a predetermined portion via a conductor filled in a through hole. The entire front and back surfaces of the wiring board 1 are covered with a transfer molding package 8 except for the outer ends of the leads 7.

As shown in FIG. 3, the sub-assembly 2 is manufactured on the basis of a wiring board 10 composed of a thick film substrate, a printed circuit board (PCB, COB) or the like. That is, the wiring layer (metallization layer) 1 is formed on the main surface of the wiring board 10.
1 is provided, and on this wiring layer 11,
A chip resistor 12 and an IC 13 are mounted. Although a large number of electronic components are actually mounted on the sub-assembly 2, one passive element and one active element are shown in the figure. In the drawings, a bonding material for fixing an electronic component is omitted.

The electrode (not shown) of the IC 13 and the wiring layer 1
1 are connected by a wire 14. The main surface of the wiring substrate 10 except for the peripheral portion of the main surface is covered with a package 15 formed by transfer molding. Then, bonding pads 17 formed of the wiring layer 11 are arranged at the peripheral portion of the main surface of the wiring substrate 10 which is not covered by the package 15, as shown in FIG. The bonding pad 17 has a minimum width required for wire bonding, and is, for example, 80 to 100 μm.
The width is about m. In addition, bonding pad 1
7 can be as narrow as 200 to 300 μm or less. As a result, the pitch of the external terminals in the subassembly 2 can be reduced, and the subassembly 2 can be downsized by increasing the integration and density, increasing the number of external terminals (increasing the number of pins), and downsizing the wiring board 10. Can be achieved.

Next, a method of manufacturing such a hybrid integrated circuit device will be described. In manufacturing the hybrid integrated circuit device, a lead frame 25 having a pattern as shown in FIG. 4 is prepared. Lead frame 25 is 0.1m
Fe-Ni-based alloy or C having a thickness of 0.2 to 0.25 mm
It is formed by patterning a metal plate made of a u alloy or the like by etching or precision press. The lead frame 25 has a shape in which a plurality of unit lead patterns are arranged in series in one direction. The unit lead pattern is a frame 28 formed by a pair of parallel extending outer frames 26 and a pair of inner frames 27 connecting the pair of outer frames 26 and extending in a direction perpendicular to the outer frames 26. Formed within.

On the other hand, from the inside of each of the outer frame 26 and the inner frame 27 of the frame 28, a plurality of leads 7 extending parallel to each other and extending to the center of the frame 28 are provided. The lead 7 has a pattern of intersecting with a thin dam 30 provided between support pieces 29 projecting from the four corners of the frame 28. Each lead 7 is supported midway by the dam 30. The dam 30 functions as a dam for preventing the melted resin from flowing out during transfer molding described later. The cantilever-shaped lead portion inside the dam 30 is referred to as an inner lead 31, and the outer portion is referred to as an outer lead 32. The tip of the inner lead 31 is not particularly limited, but is deformed in a one-step shape. The outer frame 26 has a guide hole (not shown). The guide hole is used as a guide for transferring and positioning the lead frame 25. The lead frame 25 is plated at a desired place as needed.

In the manufacture of the hybrid integrated circuit device, after the lead frame 25 is prepared, as shown in FIG. 4, each of the tips of the inner leads 31 is attached to the periphery of the main surface of the wiring board 1 serving as a motherboard. It is fixed by the joining material so as to overlap. Thereafter, as shown in FIG. 5, the electronic component is mounted on the surface of the wiring board 1 with the back side of the lead frame 25 facing upward. In this figure,
Two sub-assemblies 2 and one chip resistor 3 are fixed on a predetermined wiring layer 5 of the wiring board 1 via a bonding material (not shown). The bonding pad 17 of the sub-assembly 2 and the wiring layer 5 of the wiring board 1 are electrically connected by wires 9. In the present invention, since the sub-assembly 2 is manufactured as a separate operation, and then the sub-assembly 2 is mounted on the wiring board 1 serving as a motherboard, the wiring area in the wiring board 1 can be effectively utilized.

Next, as shown in FIG. 6, after the lead frame 25 is turned upside down again, electronic components are mounted on the surface of the wiring board 1 as a mother board on which no electronic components are mounted. In this figure, one sub-assembly 2, one chip resistor 3, and one IC 4 are fixed on a predetermined wiring layer 5 of the wiring board 1 via a bonding material (not shown). The bonding pads 17 of the sub-assembly 2 and the electrodes of the IC 4 are electrically connected to the wiring layer 5 of the wiring board 1 via wires 9.

Next, the assembled lead frame 2
5 is sealed by a transfer mold device.
Since the molding is performed from the wiring board 1 to the tip of the inner lead 31, each electronic component is sealed by the package 8 as shown in FIG.
Thereafter, the unnecessary lead frame portion is cut and removed, and at the same time, lead molding is performed. Thus, a gull-wing type hybrid integrated circuit device as shown in FIG. 2 is manufactured.

[0019]

(1) Manufacturing of the hybrid integrated circuit device of the present invention
According to the method, from this <br/> and mounting a subassembly comprising a hybrid integrated circuit device on the surface of the wiring substrate as a motherboard, for effective utilization of the wiring region of the wiring board for mounting the sub-assembly is a total mixed high integration of integrated circuit devices effect that FIG be. That is, in the present invention
The subassembly is manufactured as a separate operation and then
Mount the assembly on the wiring board that will be the motherboard
As a result, the wiring area on the wiring board can be effectively used
You.

(2) According to the above (1) , according to the method of manufacturing a hybrid integrated circuit device of the present invention, by adopting a method of mounting a sub-assembly, a higher integration of the hybrid integrated circuit device can be achieved.
The effect that high density can be achieved is obtained.

(3) Method of Manufacturing Hybrid Integrated Circuit Device of the Present Invention
According to the law, a subassembly consisting of a hybrid integrated circuit device should be mounted on the surface of the wiring board that will be the motherboard
Therefore , the sub-assembly has its external terminals connected to the conductor layer of the motherboard by wire bonding .
Can be. Therefore, the pitch of the bonding pads of the sub-assembly can be reduced, and the effect that the wiring board of the sub-assembly can be downsized can be obtained.

(4) According to the above (3) , according to the method of manufacturing a hybrid integrated circuit device of the present invention, the pitch of the sub-assemblies to be mounted can be narrowed, thereby increasing the density and integration of the sub-assemblies. Is obtained.

(5) Method of Manufacturing Hybrid Integrated Circuit Device of the Present Invention
According to the law, the sub-assembly is mounted on the motherboard, but the sub-assembly has a resin package structure and is easy and secure to hold, so automatic mounting is possible, and assembly is also possible in conjunction with automatic mounting of other electronic components. The effect that the property is also improved is obtained.

[0024] (6) by the above (1) to (5), according to the present invention, a hybrid of high density and high integration, miniaturization can be achieved
A method for manufacturing an integrated circuit device can be provided. The hybrid integrated circuit device manufactured by the manufacturing method of the present invention is:
A wiring board (second wiring board) as a motherboard on which active elements and passive elements (second active element (IC4) and second passive element (chip resistor 3), in other words, second electronic components) are mounted. 1) has a structure in which a subassembly 2 composed of a hybrid integrated circuit device (hybrid integrated circuit) is mounted. A plurality of leads 7 are attached to the periphery of the second wiring board 1, and the whole of the leads 7 except for the outer ends is covered with a resin-molded package 8. The sub-assembly 2 includes a wiring board (first wiring board 10) and the first
An active element and a passive element (a first active element (IC 13) and a first passive element (chip resistor 12), in other words, a first electronic component) mounted on the main surface of the wiring substrate 10; The IC except for the peripheral surface of the first wiring board 10
13 and a resin-molded package 15 covering the chip resistor 12. Further, the bonding pads 17 are exposed at the peripheral portion of the main surface of the first wiring substrate 10 of the sub-assembly 2. And
The bonding pad 17 and the wiring layer 5 of the wiring board (the second wiring board 1) to which the leads 7 are attached are electrically connected by wires 9.
Such a hybrid integrated circuit device has the following methods (1) to (1).
(3) can also be manufactured. (1) A first wiring board 10 having a bonding pad 17, and a first electronic component provided on the first wiring board 10 and electrically connected to the bonding pad 17 via a wire 14. A first active element (IC13) and a passive element (chip resistor 12), and the wire 14, the first active element (IC13) and the passive element (chip resistor 12), and the bonding pad 17 is exposed. Package 15 formed to
Preparing a sub-assembly 2 comprising:
Preparing the first wiring board 1 and the second wiring board 1
Mounting the sub-assembly 2, a second active element (IC4) and a passive element (chip resistor 3) as second electronic components. The sub-assembly 2 forms a hybrid integrated circuit. The package 15
Is formed by transfer molding. A plurality of sub-assemblies 2 are mounted on the second wiring board 1. (2) a first wiring board 10 having a bonding pad 17; and a first wiring board 10 provided on the first wiring board 10 and electrically connected to the bonding pad 17 respectively.
Active element (IC13) and passive element (chip resistor 1)
2) and a step of preparing a sub-assembly 2 including a package 15 formed so as to cover the IC 13 and the chip resistor 12 and expose the bonding pad 17. Preparing the sub-assembly 2, the second active element (IC4) and the passive element (chip resistor 3) in the second
Mounting the sub-assembly 2, the second active element (IC4) and the passive element (chip resistor 3) on the wiring (wiring layer 5) of the second wiring board 1 respectively. And a step of connecting to The sub-assembly 2 forms a hybrid integrated circuit. The package 15 is formed by transfer molding.
A plurality of sub-assemblies 2 are mounted on the second wiring board 1. (3) a first wiring board 10 having a bonding pad 17 and a plurality of first electronic components (such as IC 13 and chip) provided on the first wiring board 10 and electrically connected to the bonding pad 17, respectively. A step of preparing a sub-assembly 2 including a resistor 12) and a package 15 formed so as to cover the plurality of first electronic components and expose the bonding pad 17; and a second wiring board serving as a motherboard. Preparing the first and the second
Mounting a plurality of second electronic components on the wiring board 1, and mounting the sub-assembly 2 on the second wiring board 1.
And a step of electrically connecting the wiring (wiring layer 5) of the second wiring board 1 to the bonding pad 17 using a wire 9, and then sealing a region including the wire 9 Stopping to form the package 8. The sub-assembly 2 forms a hybrid integrated circuit. The packages 15 and 8 are formed by transfer molding. A plurality of sub-assemblies 2 are mounted on the second wiring board 1.

Although the invention made by the inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the gist of the invention. Needless to say, for example,
In the above-described embodiment, an example has been described in which the external terminals are connected to the wiring layer of the wiring board serving as the motherboard by wires.
A structure in which external terminals are arranged on the back surface of the wiring board of the subassembly and face-down bonded to the wiring layer of the wiring board serving as a motherboard may be employed. Also in this case, the pitch of the external terminals can be reduced. In the case of a sub-assembly that becomes an external terminal for face-down,
Wire bonding becomes unnecessary. Therefore, in this case, only the electronic components that are not subjected to wire bonding are mounted on one surface of the wiring substrate serving as the motherboard, and then the wiring substrate is turned over and the electronic components are mounted on the other wiring substrate surfaces. Since there is no wire on the lower surface side, workability is improved.

In the above description, the case where the invention made by the inventor is mainly applied to the manufacturing technique of a hybrid integrated circuit device using a lead frame, which is the background of the application, has been described. Not something. The present invention can be applied to at least a manufacturing technique of a hybrid integrated circuit device having a structure using a motherboard.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main part of a hybrid integrated circuit device according to one embodiment of the present invention.

FIG. 2 illustrates a method of manufacturing a hybrid integrated circuit device according to the present invention.
It is sectional drawing of the manufactured hybrid integrated circuit device.

FIG. 3 is a sectional view of a subassembly according to the present invention.

FIG. 4 is a plan view of a lead frame used for manufacturing the hybrid integrated circuit device of the present invention.

FIG. 5 is a cross-sectional view showing a state in which electronic components are mounted on one surface of a wiring board in manufacturing the hybrid integrated circuit device of the present invention.

FIG. 6 is a cross-sectional view showing a transfer-molded lead frame in manufacturing the hybrid integrated circuit device of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Wiring board, 2 ... Sub-assembly, 3 ... Chip resistance, 4 ... IC, 5 ... Wiring layer, 7 ... Lead, 9 ... Wire,
10 wiring board, 11 wiring layer, 12 chip resistance, 1
3 IC, 14 wire, 15 package, 17 bonding pad, 25 lead frame, 26 outer frame, 27 inner frame, 28 frame, 29 support piece, 30 dam, 31 inner lead, 32 ... Outer lead.

Continuation of the front page (72) Inventor Shiro Akazawa 15 Asahidai, Moroyama-cho, Iruma-gun, Saitama Prefecture Hitachi East Semiconductor Co., Ltd. (56) References JP-A-2-7547 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 25/04

Claims (6)

(57) [Claims] 1. A first wiring having a bonding pad
A board provided on the first wiring board;
Are electrically connected to the
A first active element and a passive element.
Resin molded to expose the
A step of preparing a subassembly ; a step of preparing a second wiring board;
Mounting an active element and a passive element.
A method for manufacturing a hybrid integrated circuit device, comprising: 2. The method of claim 1, wherein the subassembly comprises a hybrid integrated circuit.
2. A hybrid as claimed in claim 1, wherein
Manufacturing method of integrated circuit device. 3. The transfer mold according to claim 1, wherein the resin mold is a transfer mold.
2. The method according to claim 1, wherein the first electrode is formed by a metal.
A method for manufacturing the hybrid integrated circuit device according to claim 2. 4. A plurality of sub-ups are provided on the second wiring board.
3. The assembly according to claim 1, wherein the assembly is mounted.
4. Manufacturing of the hybrid integrated circuit device according to claim 1.
Method. 5. A first wiring having a bonding pad.
A board provided on the first wiring board;
First active elements electrically connected respectively to the
And a bonding pad.
Sub-assembly resin-exposed to be exposed
And a step of preparing a second wiring board to be a motherboard; and the sub-assembly, a second active element and a passive element.
Mounting on the second wiring board, the sub-assembly, the second active element and the passive element.
Are electrically connected to the wiring of the second wiring board, respectively.
And a hybrid integrated circuit device characterized by the following steps:
Production method. 6. A first wiring having a bonding pad.
A board provided on the first wiring board;
First pads electrically connected to the
An electronic component, and exposing the bonding pad.
Prepare the resin-molded sub-assembly
And a step of preparing a second wiring board to be a motherboard; and mounting a plurality of second electronic components on the second wiring board.
And that step, the second wiring board, to mounting said subassembly
And that step, the wiring of the second wiring board and the bonding pad
Electrically connecting the wire using a wire, and thereafter, sealing a region including the wire
A method of manufacturing a hybrid integrated circuit device.