JPS5556639A - Strip for carrying device for processing electric signal and method of manufacturing same - Google Patents

Strip for carrying device for processing electric signal and method of manufacturing same

Info

Publication number
JPS5556639A
JPS5556639A JP13007579A JP13007579A JPS5556639A JP S5556639 A JPS5556639 A JP S5556639A JP 13007579 A JP13007579 A JP 13007579A JP 13007579 A JP13007579 A JP 13007579A JP S5556639 A JPS5556639 A JP S5556639A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
strip
method
electric signal
carrying device
manufacturing same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13007579A
Inventor
Kuuran Patoritsuku
Dororumu Reemon
Shikuri Pariento Robeeru
Original Assignee
Cii
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4821Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839Assembly of a flat lead with an insulating support, e.g. for TAB
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145Organic substrates, e.g. plastic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49175Parallel arrangements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01057Lanthanum [La]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
JP13007579A 1978-10-19 1979-10-11 Strip for carrying device for processing electric signal and method of manufacturing same Pending JPS5556639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7829846A FR2439438B1 (en) 1978-10-19 1978-10-19

Publications (1)

Publication Number Publication Date
JPS5556639A true true JPS5556639A (en) 1980-04-25

Family

ID=9213944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13007579A Pending JPS5556639A (en) 1978-10-19 1979-10-11 Strip for carrying device for processing electric signal and method of manufacturing same

Country Status (5)

Country Link
JP (1) JPS5556639A (en)
DE (1) DE2942397A1 (en)
FR (1) FR2439438B1 (en)
GB (1) GB2047474A (en)
NL (1) NL7905298A (en)

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626451A (en) * 1979-05-17 1981-03-14 Gao Ges Automation Org Identification card having ic chip and method of manufacturing same
JPS57145354A (en) * 1980-11-21 1982-09-08 Gao Ges Automation Org Carrier element for ic module
JPS57188849A (en) * 1981-04-30 1982-11-19 Cii Device for protecting electronic circuit against static charge
JPS5812082A (en) * 1981-04-14 1983-01-24 Gao Ges Automation Org Data carrier for identification card or the like
JPS5892597A (en) * 1981-11-28 1983-06-01 Dainippon Printing Co Ltd Manufacture of identification card
JPS58118297A (en) * 1981-12-31 1983-07-14 Kyodo Printing Co Ltd Manufacture of identification card
JPS58134456A (en) * 1982-02-04 1983-08-10 Dainippon Printing Co Ltd Ic card
JPS58155058U (en) * 1982-04-09 1983-10-17
JPS58221478A (en) * 1982-06-16 1983-12-23 Kyodo Printing Co Ltd Ic card
JPS5948984A (en) * 1982-09-13 1984-03-21 Dainippon Printing Co Ltd Method of producing ic card
JPS59193596A (en) * 1983-04-18 1984-11-02 Kyodo Printing Co Ltd Ic module for ic card
JPS6082359U (en) * 1983-06-27 1985-06-07
JPS6211695A (en) * 1985-07-10 1987-01-20 Casio Computer Co Ltd Contact structure for external connection of integrated circuit card
JPS6230096A (en) * 1985-06-26 1987-02-09 Bull Sa Method of mounting integrated circuti to supporter, device assembled through said method and card with micro-electroniccircuit device
JPS6250196A (en) * 1985-06-26 1987-03-04 Bull Sa Method of mounting integrated circuit to substrate, device assembled by said method and card with microelectronic circuit device
JPS6283196A (en) * 1985-10-09 1987-04-16 Matsushita Electric Ind Co Ltd Integrated circuit card
JPS62152193A (en) * 1985-12-25 1987-07-07 Ibiden Co Ltd Printed wiring board for ic card
JPS6334196A (en) * 1986-07-29 1988-02-13 Ibiden Co Ltd Printed wiring board for ic card
JPS6351195A (en) * 1986-08-20 1988-03-04 Ibiden Co Ltd Printed wiring board for ic card
JPS6444171U (en) * 1987-09-14 1989-03-16
JPH01145197A (en) * 1987-06-11 1989-06-07 Dainippon Printing Co Ltd Ic card and production thereof
JPH03202400A (en) * 1989-04-07 1991-09-04 Sgs Thomson Microelectron Sa Method of encapsulating electronic module and micromodule formed by the method
JPH05270183A (en) * 1980-08-05 1993-10-19 Gao Ges Autom Org Mbh Carrier element for ic module
JPH07164787A (en) * 1992-03-26 1995-06-27 Dainippon Printing Co Ltd Manufacture of ic card

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
DE3123198C2 (en) * 1980-12-08 1993-10-07 Gao Ges Automation Org Support elements for an integrated circuit device
FR2496341B1 (en) * 1980-12-12 1984-07-20 Thomson Csf
CA1183280A (en) * 1981-02-09 1985-02-26 Francis N. Sinnadurai Integrated circuit chip carrier
FR2511544B1 (en) * 1981-08-14 1985-01-25 Dassault Electronique
FR2512990B1 (en) * 1981-09-11 1987-06-19 Radiotechnique Compelec Method for making an electronic payment card, and card made by such process
FR2520541A1 (en) * 1982-01-22 1983-07-29 Flonic Sa Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections
GB8309899D0 (en) * 1982-10-09 1983-05-18 Welwyn Electronics Ltd Printed circuit board
US5008656A (en) * 1984-12-20 1991-04-16 Raytheon Company Flexible cable assembly
CA1260623C (en) * 1984-12-20 1989-09-26
JPS61203695A (en) * 1985-03-06 1986-09-09 Sharp Kk Part mounting system for single-side wiring board
FR2580416B1 (en) * 1985-04-12 1987-06-05 Radiotechnique Compelec Method and apparatus for manufacturing an electronic identification card
FR2583574B1 (en) * 1985-06-14 1988-06-17 Eurotechnique Sa Micromodule is buried contacts and card containing circuits comprising such a micromodule.
FR2590051B1 (en) * 1985-11-08 1991-05-17 Eurotechnique Sa Card having a micromodule component and a contact flank
FR2590052B1 (en) * 1985-11-08 1991-03-01 Eurotechnique Sa Process for recycling a board having a component provided for card to be recycled
JP2502511B2 (en) * 1986-02-06 1996-05-29 日立マクセル株式会社 A method of manufacturing a semiconductor device
FR2601477B1 (en) * 1986-07-11 1988-10-21 Bull Cp8 A method of mounting an integrated circuit in an electronic microcircuit card, and card resulting
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
FR2620586A1 (en) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Method for manufacturing electronic modules, including cards microcircuits
GB8901189D0 (en) * 1989-01-19 1989-03-15 Avery W & T Limited Portable electronic token
DE3905657A1 (en) * 1989-02-24 1990-08-30 Telefunken Electronic Gmbh Flexible supporting film
US5250470A (en) * 1989-12-22 1993-10-05 Oki Electric Industry Co., Ltd. Method for manufacturing a semiconductor device with corrosion resistant leads
JP2875562B2 (en) * 1989-12-22 1999-03-31 沖電気工業株式会社 Semiconductor device and manufacturing method thereof
FR2673017B1 (en) * 1991-02-18 1995-03-17 Schlumberger Ind Sa
JP3383398B2 (en) * 1994-03-22 2003-03-04 株式会社東芝 Semiconductor package
ES2135656T3 (en) * 1994-06-15 1999-11-01 Rue Cartes Et Systemes De Procedure of manufacture and assembly of an integrated circuit card.
FR2736740A1 (en) * 1995-07-11 1997-01-17 Trt Telecom Radio Electr Method for production and assembly of card and IC card thus obtained
JPH0964240A (en) * 1995-08-25 1997-03-07 Toshiba Corp Semiconductor device and manufacture thereof
EP1102316A1 (en) * 1999-11-16 2001-05-23 Infineon Technologies AG Multichip IC card with bus structure
EP1930843A1 (en) * 2006-12-07 2008-06-11 Axalto SA Backing film adapted for preventing electronic module electrostatic discharges and method of manufacturing a module implementing the backing film
DE102007019795B4 (en) * 2007-04-26 2012-10-04 Infineon Technologies Ag Chip module and method of manufacturing this chip module
WO2018172525A1 (en) * 2017-03-24 2018-09-27 Cardlab Aps Assembly of a carrier and a plurality of electrical circuits fixed thereto, and method of making the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3919602A (en) * 1972-03-23 1975-11-11 Bosch Gmbh Robert Electric circuit arrangement and method of making the same
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0380638B2 (en) * 1979-05-17 1991-12-25 Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh
JPS5626451A (en) * 1979-05-17 1981-03-14 Gao Ges Automation Org Identification card having ic chip and method of manufacturing same
JPH05270183A (en) * 1980-08-05 1993-10-19 Gao Ges Autom Org Mbh Carrier element for ic module
JPS57145354A (en) * 1980-11-21 1982-09-08 Gao Ges Automation Org Carrier element for ic module
JPS5812082A (en) * 1981-04-14 1983-01-24 Gao Ges Automation Org Data carrier for identification card or the like
JPS6315638B2 (en) * 1981-04-14 1988-04-05 Gee Aa Oo G Fuyuuru Automatsuioon Unto Oruganizatsuioon Mbh
JPS57188849A (en) * 1981-04-30 1982-11-19 Cii Device for protecting electronic circuit against static charge
JPS6227747B2 (en) * 1981-04-30 1987-06-16 See Ii Ii Haneueru Buru
JPH0216233B2 (en) * 1981-11-28 1990-04-16 Dainippon Printing Co Ltd
JPS5892597A (en) * 1981-11-28 1983-06-01 Dainippon Printing Co Ltd Manufacture of identification card
JPH025599B2 (en) * 1981-12-31 1990-02-02 Kyodo Printing Co Ltd
JPS58118297A (en) * 1981-12-31 1983-07-14 Kyodo Printing Co Ltd Manufacture of identification card
JPH0241073B2 (en) * 1982-02-04 1990-09-14 Dainippon Printing Co Ltd
JPS58134456A (en) * 1982-02-04 1983-08-10 Dainippon Printing Co Ltd Ic card
JPS622706Y2 (en) * 1982-04-09 1987-01-22
JPS58155058U (en) * 1982-04-09 1983-10-17
JPS6334510B2 (en) * 1982-06-16 1988-07-11 Kyodo Printing Co Ltd
JPS58221478A (en) * 1982-06-16 1983-12-23 Kyodo Printing Co Ltd Ic card
JPH0216234B2 (en) * 1982-09-13 1990-04-16 Dainippon Printing Co Ltd
JPS5948984A (en) * 1982-09-13 1984-03-21 Dainippon Printing Co Ltd Method of producing ic card
JPS59193596A (en) * 1983-04-18 1984-11-02 Kyodo Printing Co Ltd Ic module for ic card
JPH0332832B2 (en) * 1983-04-18 1991-05-14 Kyodo Printing Co Ltd
JPH049649Y2 (en) * 1983-06-27 1992-03-10
JPS6082359U (en) * 1983-06-27 1985-06-07
JPH054914B2 (en) * 1985-06-26 1993-01-21 Bull Sa
JPS6250196A (en) * 1985-06-26 1987-03-04 Bull Sa Method of mounting integrated circuit to substrate, device assembled by said method and card with microelectronic circuit device
JPS6230096A (en) * 1985-06-26 1987-02-09 Bull Sa Method of mounting integrated circuti to supporter, device assembled through said method and card with micro-electroniccircuit device
JPS6211695A (en) * 1985-07-10 1987-01-20 Casio Computer Co Ltd Contact structure for external connection of integrated circuit card
JPS6283196A (en) * 1985-10-09 1987-04-16 Matsushita Electric Ind Co Ltd Integrated circuit card
JPS62152193A (en) * 1985-12-25 1987-07-07 Ibiden Co Ltd Printed wiring board for ic card
JPS6334196A (en) * 1986-07-29 1988-02-13 Ibiden Co Ltd Printed wiring board for ic card
JPS6351195A (en) * 1986-08-20 1988-03-04 Ibiden Co Ltd Printed wiring board for ic card
JPH01145197A (en) * 1987-06-11 1989-06-07 Dainippon Printing Co Ltd Ic card and production thereof
JPS6444171U (en) * 1987-09-14 1989-03-16
JPH03202400A (en) * 1989-04-07 1991-09-04 Sgs Thomson Microelectron Sa Method of encapsulating electronic module and micromodule formed by the method
JPH07164787A (en) * 1992-03-26 1995-06-27 Dainippon Printing Co Ltd Manufacture of ic card

Also Published As

Publication number Publication date Type
NL7905298A (en) 1980-04-22 application
FR2439438B1 (en) 1981-04-17 grant
DE2942397A1 (en) 1980-04-30 application
GB2047474A (en) 1980-11-26 application
FR2439438A1 (en) 1980-05-16 application

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