JPS62135393A - Integrated circuit module - Google Patents
Integrated circuit moduleInfo
- Publication number
- JPS62135393A JPS62135393A JP60276056A JP27605685A JPS62135393A JP S62135393 A JPS62135393 A JP S62135393A JP 60276056 A JP60276056 A JP 60276056A JP 27605685 A JP27605685 A JP 27605685A JP S62135393 A JPS62135393 A JP S62135393A
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- substrate
- board
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 239000011888 foil Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 239000011889 copper foil Substances 0.000 description 12
- 238000005452 bending Methods 0.000 description 8
- 230000003014 reinforcing effect Effects 0.000 description 8
- 239000011111 cardboard Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＩＣカードに埋め込まれるべきＩＣモジュール
であって曲げ力に対して丈夫なＩＣモジュールに関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC module that is to be embedded in an IC card and is strong against bending force.
（従来技術）
従来のＩＣモジュールは第Ｓ、ｂ図に示す如く、コンタ
クト基板１、中基板２、ダム基板３が重ねられて形成さ
れた基板群４の中に設けられた凹部の、コンタクト基板
１上のダイパッド５上にＩＣチ。(Prior Art) As shown in FIGS. S and B, a conventional IC module has a contact substrate in a recess provided in a substrate group 4 formed by stacking a contact substrate 1, a middle substrate 2, and a dam substrate 3. IC chip is placed on die pad 5 on top of 1.
プロがグイボンドされて固定され、ＩＣチップ６と、中
基板２の配線７に接続している基板側バッド８との間は
ボンディングワイヤ９でボンディングされ、樹脂１０で
モールドされている。１１１よ外部ＴｔＷｔである。The IC chip 6 and the board side pad 8 connected to the wiring 7 of the middle board 2 are bonded with a bonding wire 9 and molded with a resin 10. 111 and external TtWt.
ＩＣカードはこのようなＩＣモジュールをカード基板に
設けた凹部に埋め込んで製作されるのであるが、ＩＣカ
ードは携行する際に曲げ力を受けやすく、当然この曲げ
力はＩＣモジュールにも及び、ＩＣモジュールの変形に
よりＩＣチップが破壊されたり、ボンディングや配線が
断線する等のトラブルの原因となることが知られている
。IC cards are manufactured by embedding such an IC module in a recess provided in a card board, but IC cards are susceptible to bending force when carried, and naturally this bending force also extends to the IC module, causing the IC card to It is known that deformation of the module causes troubles such as destruction of the IC chip and breakage of bonding and wiring.
このようなトラブルに対処するために、従来よりモール
ド用の樹脂の硬度を高めて、カードの曲げ力がモジュー
ル内部に及ぶのを防止しようとすることが試みられてい
るが、カードの剛性とＩＣモジュールの剛性不一致によ
り、カード彎曲時にＩＣモジュールがカードから剥離、
脱落したり、オーバーレイフィルム等のカード構成材を
破壊したりすることがあった。To deal with such troubles, attempts have been made to increase the hardness of the molding resin to prevent the bending force of the card from reaching the inside of the module, but this has resulted in problems with card rigidity and IC. Due to the rigidity mismatch between the modules, the IC module may peel off from the card when the card is bent.
It could fall off or destroy card components such as overlay film.
また、このＩＣモジュールをカード基板の凹部に固定す
るについては、一般に接着剤が用いられ、この接着剤で
できる限りカードの変形を吸収するよう一定の弾性を有
する接着剤を選択することも行われているが、依然とし
て不十分なものといわざるを得ない。Additionally, an adhesive is generally used to fix the IC module in the recess of the card board, and an adhesive with a certain degree of elasticity is also selected to absorb as much deformation of the card as possible. However, it must be said that it is still insufficient.
一方、カード基板に補強板を付設することにより、カー
ド基板自体の剛性を高めて、実質的に曲げ変形をなくし
てしまおうという提案もあるが、実際にカードの変形を
ゼロにすることは不可能に近く、更に、カード厚は薄く
なる傾向にあり、カード厚の増加につながる補強板の付
設は好ましくない。On the other hand, there is a proposal to increase the rigidity of the card board itself by attaching a reinforcing plate to the card board and virtually eliminate bending deformation, but it is impossible to actually eliminate card deformation. This is close to possible, and furthermore, the card thickness tends to become thinner, and it is not preferable to add a reinforcing plate that increases the card thickness.
また、ＩＣモジュール自体に補強板を入れることも考え
られたが、前述のごとくカード厚が薄くなった場合には
、ＩＣモジュールも当然に厚みが限定されてしまい、補
強板を入れることが困難となるか、もしくは補強板を入
れるとカード厚が増加せざるを得ないこととなり、いず
れにしても好ましいことではなかった。It was also considered to insert a reinforcing plate into the IC module itself, but as mentioned above, when the card thickness becomes thinner, the thickness of the IC module is naturally limited, making it difficult to insert a reinforcing plate. Otherwise, if a reinforcing plate is inserted, the card thickness has to be increased, which is not desirable in any case.
なお、従来のＩＣモジエールにおいては、構成基板上に
ダイパッドや配線等の銅箔層があるが、その目的以上の
構成がなく、電気回路上必要な面積のみとなっており、
強度向上にほとんど寄与していない。In addition, in conventional IC modules, there is a copper foil layer for die pads, wiring, etc. on the component board, but there is no structure beyond that purpose, and the area is only necessary for the electric circuit.
It hardly contributes to strength improvement.
本発明は、上記の如き問題点を解決するための手段とし
て、単数の、もしくは複数枚を重ねてなる基板に、単数
もしくは複数のＩＣチップを収容して形成されたＩＣモ
ジュールにおいて、前記基板に導通回路と絶縁状態で、
該基板の少な（とも片面の概ね全面をおおう金属箔を設
けたことを特徴とするＩＣモジュールを提供せんとする
ものである。As a means for solving the above-mentioned problems, the present invention provides an IC module formed by accommodating a single or a plurality of IC chips in a single or a plurality of stacked substrates. In a conducting circuit and insulated state,
It is an object of the present invention to provide an IC module characterized in that a metal foil is provided covering almost the entire surface of one side of the substrate.
本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described using the drawings.
第１図、第２図、第３図において第５図同符号の部分は
同様な構成、作用を有する。In FIGS. 1, 2, and 3, the parts with the same reference numerals in FIG. 5 have the same structure and function.
１２及び１３はコンタクト基板１のほぼ全面をおおうよ
うに形成された銅箔であり、二つのＩＣチップ６それぞ
れのダイパッドを兼用しており、相互間は絶縁されてい
る。相互間の絶縁部は、細い一直線の溝状としてもよい
が、第２図の如く相互にジグザグに入り組ませると曲げ
強度を増すことができる。Copper foils 12 and 13 are formed to cover almost the entire surface of the contact substrate 1, and serve as die pads of the two IC chips 6, and are insulated from each other. The insulating parts between them may be in the form of thin, straight grooves, but the bending strength can be increased by interlacing them in a zigzag pattern as shown in FIG.
コンタクト基板１の裏側にも導通回路である電掻１１の
周囲に絶縁溝を設けて絶縁した状態で、概ね全面に銅箔
１４を設ける。A copper foil 14 is provided on almost the entire surface of the contact substrate 1, with an insulating groove provided around the electric scraper 11, which is a conductive circuit, for insulation.
また、中基板２上の配線７の周囲には絶４ｉ′ｍを設け
て絶縁した状態で、概ね全面にわたって銅箔１５が設け
られる。Further, a copper foil 15 is provided around the wiring 7 on the middle substrate 2 over almost the entire surface thereof, with an insulation layer 4i'm provided therebetween.
第４図は別の実施例であり、第１図の実施例のもののダ
ム基板３の上面の概ね全面に銅箔１６を設け、ＩＣモジ
ュールの表、裏面を補強したものである。FIG. 4 shows another embodiment, in which a copper foil 16 is provided on almost the entire upper surface of the dam board 3 of the embodiment shown in FIG. 1, and the front and back surfaces of the IC module are reinforced.
基板はガラスエポキシフィルム（５０〜１２０μｍ厚）
の少なくとも片面に接着剤を会して銅箔（２０μｍ程度
）を貼合わせ、この銅箔を通常の方法でエツチングする
ことにより補強用パターン、配線パターンを作成し、パ
ターンニングされた銅箔上をハα次ニッケル、金メ・ツ
キして完成する。The substrate is glass epoxy film (50-120μm thick)
Copper foil (approximately 20 μm) is pasted on at least one side of the copper foil with an adhesive, and this copper foil is etched using a normal method to create a reinforcing pattern and a wiring pattern. The next step is nickel and gold plating to complete the process.
ガラスエポキシフィルム以外に使用可能な基材としては
、エポキシ、ＰＥＴ、ＰＣ等のフィルムやセラミック、
ホーロー、表面処理したアルミニウム材等が挙げられる
。Substrates that can be used other than glass epoxy film include epoxy, PET, PC films, ceramics, etc.
Examples include enamel and surface-treated aluminum materials.
各基板に接着する金属箔としては銅箔が一般的であり、
そのエソチング工程は、通常のように■レジスト塗布、
■現像、■エツチング、■レジスト塗布の各工程順に進
められる。メッキはスルーホール内面は無電解メッキが
使用されるが、その他は電気メッキが通常使用される。Copper foil is commonly used as the metal foil to be bonded to each board.
The ethoching process consists of ■ resist coating,
The following steps are performed in order: ■Development, ■Etching, and ■Resist coating. Electroless plating is used for the inner surface of the through hole, but electroplating is normally used for the other parts.
補強用銅箔は、全基板に設けることが好ましいのである
が、手間やコスト等の観点から優先順位をつけるとする
と、基板が複数の場合、補強用銅箔は量外層から設ける
のが好ましい。It is preferable to provide the reinforcing copper foil on all the boards, but when prioritizing from the viewpoint of time and cost, when there are multiple boards, it is preferable to provide the reinforcing copper foil starting from the outer layer.
金属箔としてＣｕの他に、Ｎｉ、Ａｇ、ＡＩ。In addition to Cu, Ni, Ag, and AI can be used as metal foils.
Ｓｎ、Ｆｅ、或いはそれらの合金などの箔を用いてもよ
い。Foils of Sn, Fe, or alloys thereof may also be used.
各基板全部に対し金属箔を設けずに、一部の基板上に設
けてもよい。The metal foil may not be provided on all of the substrates, but may be provided on some of the substrates.
〔発明の効果］
本発明により、金属箔が曲げに対する強度部材として十
分作用し、曲げ力に対して強度が高くなり、また、電磁
誘導に対するシールド効果が向上するＩＣモジュールを
提供することができ、実用上極めて大なる効果を奏する
。[Effects of the Invention] According to the present invention, it is possible to provide an IC module in which the metal foil sufficiently acts as a strength member against bending, has high strength against bending force, and has an improved shielding effect against electromagnetic induction. It has a great practical effect.
第１図は本発明の実施例の断面図、第２図はＡ部或いは
Ｂ部の詳細平面図、第３図は０部の詳細平面図、第４図
は本発明の他の実施例、第５図は従来例の断面図、第６
図はそのＤ部の詳細平面図である。
ｌ・・・コンタクト基板、２・・・中基＋反、３・・・
ダム基板、４・・・基板群、５・・・ダイパッド、６・
・・ＩＣチップ、７・・・配線、８・・・Ｗ板側パッド
、９・・・ボンディングワイヤ、１０・・・樹脂、１１
・・・外部電極、１２゜１３．１４，１５．１６・・・
銅箔。Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a detailed plan view of part A or B, Fig. 3 is a detailed plan view of part 0, Fig. 4 is another embodiment of the invention, Figure 5 is a sectional view of the conventional example;
The figure is a detailed plan view of the D section. l...Contact board, 2...Medium base+anti, 3...
Dam board, 4... Board group, 5... Die pad, 6...
... IC chip, 7... Wiring, 8... W board side pad, 9... Bonding wire, 10... Resin, 11
...External electrode, 12゜13.14, 15.16...
Copper foil.
Claims (4)
数もしくは複数のＩＣチップを収容して形成されたＩＣ
モジュールにおいて、 前記基板に導通回路と絶縁状態で、該基板 の少なくとも片面の概ね全面をおおう金属箔を設けたこ
とを特徴とするＩＣモジュール。1. An IC formed by accommodating a single or multiple IC chips on a single or multiple substrate stacked together.
An IC module, characterized in that the substrate is provided with a metal foil covering substantially the entire surface of at least one side of the substrate, insulated from the conductive circuit.
に設けられている特許請求の範囲第１項記載のＩＣモジ
ュール。2. 2. The IC module according to claim 1, wherein said metal foil is provided on each of said plurality of overlapping substrates.
範囲第１項記載のＩＣモジュール。3. The IC module according to claim 1, wherein the metal foil also serves as a die pad.
られている特許請求の範囲第１項記載のＩＣモジュール
。4. The IC module according to claim 1, wherein the metal foil is provided on the front and back surfaces of the IC module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60276056A JPH07121628B2 (en) | 1985-12-10 | 1985-12-10 | IC Module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60276056A JPH07121628B2 (en) | 1985-12-10 | 1985-12-10 | IC Module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62135393A true JPS62135393A (en) | 1987-06-18 |
| JPH07121628B2 JPH07121628B2 (en) | 1995-12-25 |
Family
ID=17564177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60276056A Expired - Lifetime JPH07121628B2 (en) | 1985-12-10 | 1985-12-10 | IC Module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07121628B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01166565U (en) * | 1988-05-17 | 1989-11-22 | ||
| JP2012221212A (en) * | 2011-04-08 | 2012-11-12 | Toppan Printing Co Ltd | Non-contact ic module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827287A (en) * | 1981-07-30 | 1983-02-17 | シ−メンス・アクチエンゲゼルシヤフト | Portable card for processing information |
| JPS6076463U (en) * | 1983-10-27 | 1985-05-28 | 三菱電機株式会社 | IC built-in card |
| JPS60189587A (en) * | 1984-03-09 | 1985-09-27 | Dainippon Printing Co Ltd | Ic card |
-
1985
- 1985-12-10 JP JP60276056A patent/JPH07121628B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827287A (en) * | 1981-07-30 | 1983-02-17 | シ−メンス・アクチエンゲゼルシヤフト | Portable card for processing information |
| JPS6076463U (en) * | 1983-10-27 | 1985-05-28 | 三菱電機株式会社 | IC built-in card |
| JPS60189587A (en) * | 1984-03-09 | 1985-09-27 | Dainippon Printing Co Ltd | Ic card |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01166565U (en) * | 1988-05-17 | 1989-11-22 | ||
| JP2012221212A (en) * | 2011-04-08 | 2012-11-12 | Toppan Printing Co Ltd | Non-contact ic module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07121628B2 (en) | 1995-12-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |