JP2526592Y2 - IC module - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module which, when applied to an IC card or the like, is resistant to card bending and can prevent the occurrence of chip cracks.

[0002]

2. Description of the Related Art First, a method of manufacturing an IC module and its configuration will be described. FIG. 5 is a cross-sectional view of the IC module, wherein 1 is a substrate, 2 is an electrode pattern, 2a is a through hole, 3 is a circuit pattern layer, 3b is a circuit pattern, 4 is an adhesive layer, 5 is a sealing frame layer, and 6 is a sealing frame layer. Denotes an IC chip, 7 denotes a bonding portion, 8 denotes a conductor, and 9 denotes a molding resin.

In the figure, a glass epoxy film (a film obtained by impregnating a glass cloth with an epoxy resin and curing) having a thickness of about 0.1 mm, a BP resin film (a glass cloth impregnated with a bismaleimide triazine resin is cured. An electrode pattern 2 for connection terminals having a thickness of 30 μm is formed on the surface of an IC module base layer 1 made of a film or the like. This electrode pattern 2 is formed on the IC module base layer 1
After patterning by photo-etching to a desired pattern using a film in which copper foil is laminated, Ni
And Au plating.

Next, a circuit pattern layer 3 in which holes and circuit patterns for arranging IC chips are formed is prepared. The circuit pattern layer 3 is formed into a desired circuit pattern by a photo-etching method or the like using an insulating film (for example, a glass epoxy film) having a copper foil of about 18 μm formed on its surface to form a circuit pattern 3b. And perform Ni plating and Au plating.
After the plating, a hole is drilled in a portion where the IC chip is to be installed. Next, the IC module base layer thus prepared and the circuit pattern layer are aligned with each other, and the respective layers are adhered via the adhesive layer 4 to be integrated. This attaching step can also be performed by thermocompression bonding via a semi-cured epoxy resin film, for example.

Next, a through hole 2a is provided at a desired position to make the connection terminal electrode pattern 2 and the circuit pattern 3b of the circuit pattern layer 3 conductive. Through hole 2
The formation of a is performed by covering a portion other than the through-hole processing portion with a resist, then performing a drilling process on the through-hole portion, a plating process inside the through-hole, and the removal of the resist.

Next, a sealing frame layer 5 for preventing the resin from flowing out when the IC module is resin-molded is prepared. The sealing frame layer 5 has a minimum size where an IC chip and a circuit portion for wiring these are exposed on an insulating substrate (about 0.2 mm thick) of the same material as that used for the IC module base layer and the circuit pattern layer. It is formed by providing a limited hole. Note that the sealing frame layer 5 may be extended to form a reinforcing body having a reinforcing effect against card bending.

Next, the sealing frame layer 5 is adhered to the surface of the laminate of the IC module base material layer and the circuit pattern layer, on which the circuit pattern 3b is formed, via the adhesive layer 4 to be integrated. . Note that an adhesive layer may also be formed on the extension of the sealing frame 5 that constitutes the reinforcing member.

[0008] The IC chip 6 is mounted on the circuit board for the IC module thus prepared using the adhesive 4. Thus, the IC chip 6 is supported by the IC module base layer 1 as shown in the figure. Next, the bonding portion 7 of the IC chip and the circuit pattern 3b are connected to the conductor 8
For connection by a wire bonding method or the like. This portion can also be implemented by a face bonding method that does not use wires, in which case a thinner I
A C module can be obtained. After wiring between the IC chip 6 and the circuit pattern 3b, a molding resin 9 such as epoxy resin is filled and molded so as to cover the IC chip and the wiring portion. At the time of molding, the surface of the resin 9 is made to coincide with the surface of the sealing frame layer 5. The mold is cured to complete the formation of the IC module.

[0009]

FIG. 6 shows such an IC.
FIGS. 11A to 11C are diagrams showing conventional terminal patterns of a module.
11f is an external connection terminal electrode pattern, 12a to 12f are through holes, 13a to 13d are long side direction electrode pattern separation parts, and 14a to 14f are short side direction electrode pattern separation parts. In the figure, the electrode pattern separating units 13a to 13
d is a straight line parallel to the long side, the electrode pattern separating portion 14a
14f are formed in a straight line parallel to the short side, and the copper foil is removed by etching or the like to electrically insulate this portion from other terminals. Such thickness of the IC card incorporating the IC module deformed and acts just bending moment because it is less 0.84 mm, easily occurs particularly in the long side direction bending. When the card is deformed in this way, the copper foil is removed to reduce the thickness by several tens of μm, and stress concentration occurs in the electrode pattern separation part where the rigidity of the metal is lost. As can be seen from FIG. 5, the IC chip 6 exists below the separation part in the short side direction.
If stress concentration occurs in the separation portion, chip cracks occur, and the IC module may be damaged.
In addition, the terminal positions conform to the ISO standard, and the electrode pattern intervals in the short side direction of the card (separating sections 14a to 14c and separating section 1
Since the distance between 4d and 14f cannot be increased by 5.62 mm or more, cracks are likely to occur in chips having a chip width of 5.62 mm or more due to the effect of stress concentration at the separation portion. However, in practice, the chip width is 4.5 mm in consideration of the electrode pattern width and the manufacturing margin such as die bonding.
Even to the extent, there is a risk of chip cracking.

In the short side direction, since the bending moment is small and the ground electrode pattern 11d exists continuously without a break, deformation is less likely to occur, and chip cracks are less likely to occur.

An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide an IC module which makes it difficult to bend in the direction of the long side of a card and prevents chip cracks from being generated by bending. And

[0012]

According to the present invention, a plurality of electrode patterns are divided into a plurality of electrode patterns by a long side electrode pattern separating section and a short side direction electrode pattern separating section. In the IC module having the terminal portions, the electrode pattern separating portions in the long side direction are linear, and each of the left and right electrode pattern separating portions in the short side direction to be joined is convex toward the side facing each other. An arc-shaped electrode pattern continuous in the long side direction is formed on the upper side and the lower side.

[0013]

In the IC module of the present invention, the electrode pattern separating portions in the long side direction are linear, and the left and right electrode pattern separating portions in the short side direction to be joined are respectively protruded toward the opposing sides. By forming an electrode pattern in an arc shape and continuous in the long side direction on the upper side and the lower side, it is difficult to bend in the long side direction of the card,
A chip crack is prevented from occurring by preventing stress concentration from occurring at the electrode pattern separating portion in the short side direction.

[0014]

Embodiments will be described below with reference to the drawings. FIG.
Is a diagram showing a terminal pattern of the IC module of the present invention,
The same numbers as those in FIG. 6 indicate the same contents. In addition, 21a
21f are electrode pattern separating portions, and 22 and 23 are reinforcing electrode patterns.

In this embodiment, the electrode pattern separating portions 21a to 21f in the short side direction are formed by connecting arc-shaped separating portions as shown in the figure. As described above, by preventing the electrode pattern separating portion in the short side direction from being a straight line parallel to the short side, the occurrence of stress concentration in the separating portions 21a to 21f due to bending in the long side direction is reduced or prevented. As a result, the occurrence of chip cracks can be prevented. In this case, the separation units 21a-2
1f does not need to be all arcuate as shown in the figure, but may be arcuate only partially and linear in others. further,
In this embodiment, the reinforcing electrode patterns 22 and 23 which are continuous in the long side direction are provided to make it difficult to bend in the long side direction and to prevent chip cracks. The continuous reinforcing electrode patterns 22 and 23 in the long side direction may not be provided on both sides but may be provided on either one.

FIG. 2 shows another embodiment according to the present invention, and the same reference numerals as those in FIG. 1 indicate the same contents. In the figure, 3
Reference numerals 1a, 31b and 31c are separation portions of the electrode pattern.

In this embodiment, the separation part 31 in the short side direction is used.
Although a, 31b, and 31c are straight lines, they are not arranged on a straight line so that stress concentration due to bending in the long side direction is less likely to occur. Also in this case, 31a, 31b, 31
Only one of c may not be aligned with the other. In this embodiment, the reinforcing electrode pattern 23 is used.
May work as an electrode or may not work.

It should be noted that the electrode pattern separating portion is not limited to the above embodiment, but may be selected as appropriate, for example, a triangular shape, a jagged shape, or an arbitrary shaped curve. In short, the short side direction separating portions are connected. What is necessary is just to prevent the shape from becoming a straight line parallel to the short side.

Next, a method of making an IC card using the IC module according to the present invention will be described. FIG. 3 is a diagram showing an IC card incorporating the IC module according to the present invention, and FIG. 4 is a sectional view taken along line XX of FIG. In the figure, 41 is an IC module, 42 is a magnetic recording section, 51 and 52 are center cores, 53 and 54 are oversheets, 55 is an adhesive layer, 56 is an electrode pattern, 57 is a reinforcing body, and 58 is a reinforcing sheet. .

First, a center core 5 on which desired printing is performed and both surfaces are coated with a urethane-based adhesive for lamination.
Holes for embedding IC modules are formed in predetermined portions of the first and second and the oversheet 53. Here, the center core 5
The hole provided in 2 is formed according to the shape of the reinforcing body 57. Next, the overseat 53, the center core 51,
52 are stacked in this order, the IC module 41 on which the adhesive layer 55 is formed is arranged via the reinforcing sheet 58, the oversheet 54 is stacked, and hot pressing (for example, at 110 ° C. for 15 minutes) is performed in this state. 25kg / c
m ² ). Furthermore, an IC card punched to a card size is completed. Note that a magnetic recording layer can be formed on the oversheets 53 and 54 as necessary.

[0021]

As described above, according to the present invention, it is difficult to bend in the long side direction of the card, and it is also possible to reduce or prevent the occurrence of stress concentration at the electrode pattern separating portion in the short side direction due to the bending, and to reduce the occurrence of chip cracks. This can be prevented.

[Brief description of the drawings]

FIG. 1 is a diagram showing a terminal portion of an IC module according to the present invention.

FIG. 2 is a view showing another embodiment of the present invention.

FIG. 3 is a diagram showing an IC card incorporating an IC module.

FIG. 4 is a sectional view taken along line XX of FIG. 4;

FIG. 5 is a cross-sectional view of the IC module.

FIG. 6 is a diagram showing a conventional terminal portion of an IC module.

[Explanation of symbols]

11a to 11f: external connection terminal electrode patterns, 12a to
12f: through hole, 13a to 13d: long side direction electrode pattern separation section, 14a to 14f: short side direction electrode pattern separation section, 22, 23: reinforcing electrode pattern, 31a,
31b, 31c: Separation part of electrode pattern, 41: IC module, 42: Magnetic recording part, 51, 52: Center core, 53, 54: Over sheet, 55: Adhesive layer, 5
6 ... electrode pattern.

Claims (1)

(57) [Scope of request for utility model registration] 1. A is divided into a plurality of electrode patterns by the electrode pattern separating portion and the short side direction of the electrode pattern separation portion in the long side direction, the IC module having a terminal portion in which the electrode patterns are formed on both right and left sides, the length Edge direction electrode pattern
The line separation part is straight, and the short side direction
Each of the left and right electrode pattern separation parts is
Arc-shaped convex toward the opposite side and continuous in the long side direction
An IC module characterized in that the formed electrode patterns are formed on the upper side and the lower side .