JP2002236900A - Contact-noncontact common use type ic module and method of manufacturing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture an IC module in a simple process with high reliability. SOLUTION: The IC module has a base board 111 having the size of SIM, a contact terminal 114B formed on the surface side of the base board 111, a through part 118 with a conductive pattern 114C for electrically connecting the contact terminal 114B to the reverse side of the base board 111, a noncontact communication antenna 114A formed on the reverse side of the base board 111, a contact-noncontact common use type IC chip 115 mounted on the reverse of the base board 111, a bonding wire 116 for electrically connecting a connecting terminal part of the IC chip 115, the conductive pattern 114C of the through part 118, and a connecting terminal part of the noncontact communication antenna 114A, and a sealing material 117 for sealing the reverse of the base board 111.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, an SI
Contact / non-contact type IC used for M, IC tags, etc.
The present invention relates to a module and a method for manufacturing the module.

[0002]

2. Description of the Related Art A contact / non-contact type IC card has a contact type function of transmitting and receiving data by contacting an external terminal of the card with a terminal of an external processing device, and an antenna for transmitting and receiving data by electromagnetic waves. I for coil and data processing
A card that has a built-in C circuit, performs reading and writing with an external processing device by a so-called wireless system, and is supplied with driving power of an IC circuit by electromagnetic induction and has a non-contact system function that does not include a battery. It is what we have.

Japanese Patent Application Laid-Open No. 7-239922 discloses an IC module for an IC card in which a conductor pattern of an antenna and a conductor pattern of a terminal electrode are provided on the surface, respectively, and these conductor patterns are provided through through holes. An invention for electrically connecting to an internal IC chip is disclosed.

[0004]

However, in the above-mentioned conventional IC module, since the antenna has a conductor pattern on the surface, the antenna may be short-circuited or damaged when inserted into an external processing device for contact. Could be. Japanese Patent Application Laid-Open No. 7-239922 does not specifically describe a method of manufacturing an IC module, but has demanded the development of a method of manufacturing a simple process.

An object of the present invention is to provide a contact / non-contact type IC module which is highly reliable and can be manufactured by a simple process, and a method of manufacturing the same.

[0006]

According to a first aspect of the present invention, there is provided a semiconductor device comprising: a substrate; a contact terminal formed on a front side of the substrate; and the contact terminal formed on the substrate. Through hole with a conductive pattern for electrically connecting the antenna to the back side of the substrate, a non-contact communication antenna formed on the back side of the substrate, and a contact / non-contact type IC mounted on the back side of the substrate. Connecting means for electrically connecting the chip, the connection terminal portion of the IC chip, the conductive pattern of the penetrating portion, and the connection terminal portion of the non-contact communication antenna;
This is a contact / non-contact type IC module having:

According to a second aspect of the present invention, in the contact / non-contact type IC module according to the first aspect, the non-contact communication antenna is arranged such that the contact terminal is shifted with respect to the antenna inner area. Thus, an effective antenna area that does not interfere with the contact terminal is ensured, thereby providing a contact / non-contact type IC module.

According to a third aspect of the present invention, in the contact / non-contact type IC module according to the second aspect, the contact terminals have external connection terminal portions arranged in two rows, and the contactless communication is carried out. The contact antenna passes between the two rows of external connection terminals, and is a contact / non-contact type IC module.

[0009] The invention of claim 4 is the invention of claims 1 to 3.
Contact / non-contact type I described in any one of
In the C module, the base material is a polyimide substrate having a copper sputtering layer formed on both surfaces, and is a contact / non-contact type IC module.

[0010] The invention of claim 5 is the invention of claims 1 to 3.
Contact / non-contact type I described in any one of
In the C module, the base material is a glass cloth-containing epoxy resin substrate having copper foil layers formed on both sides, and is a contact / non-contact type IC module.

[0011] The invention of claim 6 is the invention of claims 1 to 4.
The method for manufacturing a contact / non-contact type IC module for manufacturing a contact / non-contact type IC module according to any one of the above, wherein the through-hole communicating with the connection terminal portion of the contact terminal is provided on the base material. Forming a penetrating portion;
A plating step of stacking at least one layer of the conductive pattern of the non-contact communication antenna, the conductive pattern of the contact terminal, and the conductive pattern of the penetrating portion on both sides of the base by plating; An IC chip mounting step of mounting a chip; and a connection step of electrically connecting a connection terminal of the IC chip with a conductive pattern of the through-hole and a connection terminal of the non-contact communication antenna. This is a method for manufacturing a non-contact IC module.

According to a seventh aspect of the present invention, there is provided a method for manufacturing a contact / non-contact type IC module for manufacturing the contact / non-contact type IC module according to any one of the first to third aspects and the fifth aspect. In the base material, a penetrating portion forming step of forming a penetrating portion communicating with the connection terminal portion of the contact terminal, and a conductive pattern of the non-contact communication antenna and the contact terminal on both surfaces of the base material The conductive pattern of
An etching step of forming by etching, an IC chip mounting step of mounting the IC chip on the back side of the substrate, a connection terminal portion of the IC chip, a conductive pattern of the through portion, and a connection terminal portion of the non-contact communication antenna. And a connection step of electrically connecting the IC module to the IC module.

[0013]

Embodiments of the present invention will be described below in more detail with reference to the drawings. (First Embodiment) FIGS. 1 to 3 are views showing a first embodiment of a contact / non-contact type IC module and a method of manufacturing the same according to the present invention.

As shown in FIG. 3 (i), a contact / non-contact type IC module 110 according to the first embodiment includes a substrate 111 of SIM size and contact terminals 114B formed on the front side of the substrate 111. A penetrating portion 118 formed on the substrate 111 and having a conductive pattern 114C for electrically connecting the contact terminal 114B to the back side of the substrate 111;
A non-contact communication antenna 114A formed on the back side of
Contact / non-contact type I mounted on the back side of the substrate 111
Sealing the back surface of the substrate 111 and the bonding wire 116 for electrically connecting the C chip 115, the connection terminal portion of the IC chip 115, the conductive pattern 114C of the through portion 118, and the connection terminal portion of the non-contact communication antenna 114A. Sealing material 117 and the like.

In the first embodiment, a polyimide substrate having a copper sputtering layer 112 formed on both surfaces is used as the substrate 111. This polyimide substrate with a copper sputtering layer is mass-produced and has the advantage that it can be obtained at low cost from the market.

The method of manufacturing the contact / non-contact type IC module according to the first embodiment includes a sputtering step # 11,
Penetration part formation step # 12, plating step # 13, IC chip mounting step # 14, connection step # 15, sealing step #
16 and the like.

In the sputtering step # 11, the substrate 111
This is a step of forming a copper sputtering layer 112 on both surfaces of the substrate. For example, a copper sputtering layer 112 having a thickness of 0.25 μm is formed on both surfaces of a substrate 111 made of a 25 μm polyimide film as shown in FIG. 1A by a sputtering apparatus [FIG. 1B]. This step can be omitted when the above-mentioned polyimide substrate with a copper sputtering layer is used.

The penetrating portion forming step # 12 includes the steps of:
Penetration portion 11 communicating with connection terminal portion of contact terminal 114B
8 is, for example, a step of forming with a laser drilling machine [FIG. 1 (c)].

The plating step # 13 is a step of stacking at least one layer of the conductive pattern of the non-contact communication antenna 114A, the conductive pattern of the contact terminal 114B, and the conductive pattern 114C of the through portion 118 on both surfaces of the base material 111 by plating. It is. First, a photosensitive dry film resist 113 is formed on the copper sputtering layer 112 of the substrate 111.
Is laminated on both sides, exposed and developed to produce an opening pattern 113a for plating [FIG. 1 (d)]. Copper plating, nickel plating, and gold plating steps are interposed between the opening pattern 113a and the water washing step, respectively, and are successively plated to form a plating layer 114 (FIG. 1E). The photosensitive dry film resist 113 is peeled off [FIG.
(F)], the copper sputtering layer 112 is removed by soft etching, and the non-contact communication antenna 114 is removed.
A, a contact terminal 114B and a conductive pattern 114C of the penetrating portion 118 are formed [FIG. 2 (g)].

In the IC chip mounting step # 14, the substrate 111
This is the step of mounting the IC chip 115 on the back side of the device. For example, a contact / non-contact type IC chip 115 is bonded with an adhesive [FIG. 2 (h)].

The connection step # 15 is a step of electrically connecting the connection terminal of the IC chip 115 and the connection terminal of the non-contact communication antenna 114A and the conductive pattern 114C of the penetrating part 118 by the bonding wire 116. [FIG. 2 (h)]. The sealing step # 16 is performed on the substrate 111
IC chip 115 and bonding wire 116 on the back surface of
And the like are sealed with a sealing material 117 [FIG.
(I)].

According to the first embodiment, since the non-contact communication antenna 114A is provided on the back side of the substrate 111, when the antenna is inserted into the external processing device for contact, the antenna comes into contact and the antenna is short-circuited. No longer hurt or damaged.

Further, since the conductive pattern of the non-contact communication antenna 114A, the conductive pattern of the contact terminal 114B, and the conductive pattern 114C of the through portion 118 are formed at one time by plating, the process can be simplified. In particular, there is an advantage that the conductive pattern of the non-contact communication antenna 114A can be miniaturized by plating. That is, a thin line width and space can be realized and the pitch can be narrowed, so that the conductive pattern of the non-contact communication antenna 114A can be formed at a high density. For example, line width 20 μm, space 2
0 μm (pitch of 40 μm) is possible. The plating is
This is because the photoresist is grown upright, so that a very good pattern shape can be formed. Therefore,
In the case of a small medium such as a SIM, the number of turns of the coil can be increased, which is preferable. Since the etching is shaving, the side edge goes around and the line width is 40 μm and the space 40 μm (pitch of 80 μm) is almost the limit.

(Second Embodiment) FIGS. 4 to 6 are views showing a contact / non-contact type IC module according to the present invention and a method of manufacturing the same according to a second embodiment. In the following embodiments, portions that perform the same functions as those in the first embodiment described above are denoted by the same reference numerals or the same reference numerals at the end, and overlapping drawings and descriptions will be omitted as appropriate.

In the second embodiment, as the base material 111-2,
An epoxy resin substrate containing a glass cloth having a copper foil layer 111-2 formed on both surfaces is used. The glass cloth-containing epoxy resin substrate has strength, moderate flexibility, flexibility, and resistance to impact. This glass-cloth-containing epoxy resin substrate is also mass-produced and has the advantage that it can be obtained at low cost from the market. The difference is that an etching step # 13-2 is performed instead of the plating step # 13 of the first embodiment.

Next, the structure of the contact / non-contact type IC module 110-2 of the second embodiment will be described together with the method of manufacturing the same. In the second embodiment, a copper foil layer 112 is provided on both sides of a base material 111-2 made of a 50 μm glass epoxy material.
-2 with a thickness of 100 μm [FIG. 4 (b), copper foil layer forming step # 11-2]. This step is performed when the above-described epoxy resin substrate containing glass cloth is used.
Can be omitted. Then, a penetrating portion 118 is formed by a laser drilling machine [FIG. 4 (c), penetrating portion forming step # 12].

Next, an etching step # 13-2 is performed on both surfaces of the base material 111-2 to form a conductive pattern of the non-contact communication antenna, a conductive pattern of the contact terminal, and a conductive pattern of the through portion 118 by etching. It is.
First, the entire surface (the copper foil layers 112-2 on the front and back surfaces of the substrate 111-2 and the inner wall surfaces of the penetrating portions 118) are formed by electroless plating.
Then, a 5 μm electroless copper plating layer 114-2 is formed [FIG. 4 (d)]. Photosensitive dry film resist 113
-2 is laminated on both sides, exposed and developed to produce an etching pattern [FIG. 4 (e)]. Then, etching is performed using this etching pattern as a mask [FIG. 5 (f)]. Then, photosensitive dry film resist 1
13-2 is peeled off, and the contactless communication antenna 114-2 is removed.
A, the contact terminal 114-2B and the conductive pattern 114-2C of the penetrating part 118 are formed [FIG. 5 (g)].

Further, the IC chip 115 is adhered to the back side of the substrate 111-2 with an adhesive [FIG. 5 (h), IC chip mounting step # 14], and the connection terminals of the IC chip 115 and the antenna for non-contact communication are provided. The connection terminals 114-2A and the connection terminals of the conductive patterns 114-2C of the through portions 118 are electrically connected by bonding wires 116 [FIG.
(H), connection step # 15]. Finally, the IC chip 115, the bonding wires 116, etc. on the back surface of the substrate 111 are sealed with a sealing material 117 [FIG. 5 (h), sealing step # 1].
6].

According to the second embodiment, as compared with the manufacturing method of the first embodiment, there is an advantage that the manufacturing can be further performed by simple steps.

(Third Embodiment) FIG. 7 is a view showing a contact / non-contact type IC module according to a third embodiment of the present invention. In the contact / non-contact type IC module 110-3 according to the third embodiment, a bump 116-3 is provided on an IC chip 115 instead of the bonding wire 116, and
It is manufactured so that the C chip mounting step and the connecting step are performed simultaneously. Therefore, the manufacturing process is further simplified, and the stability and reliability of the connection are extremely high. In the case of the third embodiment, the sealing step using a sealing material is not always necessary, and even if the sheet is laminated with another sheet for forming a base material such as a SIM,
The sealing effect can be improved.

(Fourth Embodiment) FIG. 8 is a view showing a contact / non-contact type IC module according to a fourth embodiment of the present invention. In the contact / non-contact type IC module 110-4 of the fourth embodiment, the non-contact communication antenna 114-
4A is a contact terminal 11 with respect to the antenna inner area B.
By displacing 4-4B to the left, the antenna effective area C that does not interfere with the contact terminal 114-4B.
Is secured. Specifically, as shown in FIG.
The contact terminal 114-4B is connected to the external connection terminal 114-4.
B-1 are arranged in two rows, and the non-contact communication antenna 114-4A has two rows of external connection terminal sections 114-4B-
1, the antenna effective area C with less interference can be secured, and the end 114-4A-1 of the antenna 114-4A can be easily connected to the connection terminal of the IC chip.

In the non-contact IC module, in order to stably secure a large communication distance, the larger the area of the non-contact antenna (hereinafter, coil antenna) 114-4A, the better. However, coil antenna 1
If 14-4A is large, the manufacturing cost, including the material cost, increases in proportion to the area, so that the minimum size required for communication is sufficient. As a result of studying the coil area and communication characteristics, the minimum required coil size differs depending on the coil shape and pitch, assuming ISO 14443 Type A and Type B methods.
It was found that at least mm ² was the minimum required, and 400 mm ² was sufficient.

Further, the size of the card or module,
When the size is determined by the standard, especially when the size of a small module is limited to about 2 cm square or less due to the restriction of equipment, the coil antenna 1 is naturally used.
The size of 14-4A with respect to the IC module 110
It is necessary to use it on the entire surface, and the coil antenna 114-
4A is required to be formed over the entire outer periphery of the IC module 110. From this restriction, the coil antenna 114
According to the design rule of -4A, the outer circumference is as large as possible, and it is better to arrange the outer circumference with a smaller pitch. The pitch is 100 μm or less, most preferably 50 μm or less. Further, when the pitch is 20 μm or less, it is difficult to stably manufacture. When face-down type flip chip mounting is performed, the IC module 110
Can be reduced in thickness, which is desirable. In the third embodiment, the external connection terminal portion 114-4B-1 of the contact terminal 114-4B is used.
It is necessary to install the coil wiring so as to pass between them, and also in this case, the pitch is 100 μm or less,
When the thickness is 0 μm or less, the degree of freedom in design can be ensured, and the inner area of the coil antenna 114-4A can be increased.

The thickness of the coil antenna 114-4A is desirably 5 μm or more, and most desirably, because the resistance increases as the design rule decreases.
10 μm or more. When the film thickness of the coil antenna 114-4A is increased, it is difficult to stably manufacture the coil antenna 114-4A. In order to satisfy these design rules, the coil antenna 11
The method of producing 4-4A is either an etching method or a semi-additive method by plating. However, in the case of producing a pitch of 50 μm or less, the method is limited to the semi-additive method by plating.

Further, a contact / non-contact IC module 1
In 10, the contact terminal 114-4B and the non-contact antenna 114-4A need to be formed in the same module. In general, a metal part placed inside the non-contact antenna 114-4A has an electromagnetic wave shielding effect, and hinders communication. Therefore, in the design of the IC card,
In order to avoid the electromagnetic wave shielding effect of the metal contact terminal 114-4B, it is necessary to displace the center of the coil antenna 114-4A from the terminal 114-4B. In this case, a new fact is obtained that the antenna effective area C is preferably 0.5 A to 0.9 A with respect to the module area A.

(Modifications) Various modifications and changes are possible without being limited to the above-described embodiments, and these are also within the equivalent scope of the present invention. (1) In this embodiment, the SI used for a mobile phone or the like is used.
Although M has been described as an example, a normal IC card or an IC tag whose base material shape is not specified may be used. (2) If the required communication distance cannot be secured with a small IC module alone, a booster coil can be separately manufactured outside and a resonance circuit can be formed in close proximity to the IC module to secure the communication distance. . This booster coil may be installed and used in a case for accommodating an IC module, for example, a regular case. In this case as well, the metal portion has an electromagnetic wave shielding effect, which is a considerable obstacle to communication, so that the coil is exposed to the electromagnetic wave,
It is necessary to avoid metal parts as much as possible. It goes without saying that the coil of the IC module and the booster coil are arranged so as to resonate electromagnetically in order to function as a booster.

(3) In the method of the present invention, the contact terminal and the non-contact antenna are provided. In some cases, however, only the contact terminal and the connection terminal portion of the non-contact antenna are provided in the IC module. Alternatively, the antenna coil may be separately manufactured. This antenna coil is installed in a case for accommodating an IC module,
It may work by inserting a module. In this case as well, the metal portion has an electromagnetic wave shielding effect, which is a considerable obstacle to communication. Therefore, it is necessary to form the coil so as to avoid the metal component so as to be exposed to the electromagnetic wave. The coil is as large as possible, and preferably has an effective area of 1 to ²⁰⁰ cm ² . It may be formed inside or outside the case.

[0038]

As described above in detail, according to the present invention, since the non-contact communication antenna is provided on the back side of the substrate, when the antenna is inserted into the external processing device for contact,
The antenna no longer shorts or is damaged by contact. Further, since the conductive pattern of the non-contact communication antenna, the conductive pattern of the contact terminal, and the conductive pattern of the penetrating portion are formed at one time by plating or etching, the process can be simplified. In particular, when a conductive pattern of a non-contact communication antenna is formed by plating, the conductive pattern can be miniaturized and the density of the conductive pattern can be increased. In the case of etching, it can be manufactured by a simpler process.

[Brief description of the drawings]

FIG. 1 is a diagram (part 1) showing a first embodiment of a contact / non-contact type IC module and a method of manufacturing the same according to the present invention.

FIG. 2 is a diagram (part 2) showing a first embodiment of a contact / non-contact type IC module and a method of manufacturing the same according to the present invention.

FIG. 3 is a diagram (part 3) showing a first embodiment of a contact / non-contact type IC module and a method of manufacturing the same according to the present invention;

FIG. 4 is a diagram (part 1) illustrating a contact / non-contact type IC module and a method of manufacturing the same according to a second embodiment of the present invention;

FIG. 5 is a diagram (part 2) illustrating a contact / non-contact type IC module according to a second embodiment of the present invention and a method for manufacturing the same.

FIG. 6 is a view (part 3) showing a contact / non-contact type IC module and a method of manufacturing the same according to a second embodiment of the present invention;

FIG. 7 is a view showing a third embodiment of a contact / non-contact type IC module according to the present invention.

FIG. 8 is a view showing a fourth embodiment of a contact / non-contact type IC module according to the present invention.

[Explanation of symbols]

 110 Contact / non-contact type IC module 111 Substrate 112 Copper sputtering layer 112-2 Copper foil layer 114B Contact terminal 114A Non-contact communication antenna 114C Conductive pattern 115 Contact / non-contact type IC chip 116 Bonding wire 117 Sealing Material 118 penetration part # 11 sputtering step # 12 penetration part formation step # 13 plating step # 13-2 etching step # 14 IC chip mounting step # 15 connection step # 16 sealing step

Claims (7)

[Claims] A substrate; a contact terminal formed on a front side of the substrate; a through-hole having a conductive pattern formed on the substrate and electrically connecting the contact terminal to a back side of the substrate; A non-contact communication antenna formed on the back side of the substrate, and a contact / non-contact type IC mounted on the back side of the substrate
A contact / non-contact type IC module comprising: a chip; and connection means for electrically connecting a connection terminal portion of the IC chip, a conductive pattern of the penetrating portion, and a connection terminal portion of the non-contact communication antenna. . 2. The contact / contactless type IC module according to claim 1, wherein the contactless communication antenna is arranged such that the contact terminal is displaced with respect to an antenna inner area. A contact / non-contact type IC module, wherein an effective antenna area which does not interfere with a contact terminal is secured. 3. The contact / non-contact type IC module according to claim 2, wherein the contact terminal has external connection terminal portions arranged in two rows, and the non-contact communication antenna includes: A contact / non-contact type IC module which passes between two rows of external connection terminals. 4. One of claims 1 to 3
The contact / non-contact type IC module according to the above item, wherein the substrate is a polyimide substrate having a copper sputtering layer formed on both surfaces. 5. The method according to claim 1, wherein:
In the contact / non-contact type IC module described in the paragraph, the base material is a glass cloth-containing epoxy resin substrate having a copper foil layer formed on both sides, wherein the substrate is a contact / non-contact type IC module. module. 6. One of claims 1 to 4
12. A method for manufacturing a contact / non-contact type IC module for manufacturing a contact / non-contact type IC module according to the above item, wherein a penetrating part is formed on the base material so as to communicate with a connection terminal part of the contact terminal. Forming a conductive pattern of the antenna for non-contact communication, a conductive pattern of the contact terminal, and a conductive pattern of the through portion by plating on both surfaces of the base material; An IC chip mounting step of mounting the IC chip on the back side, and a connection step of electrically connecting a connection terminal of the IC chip with a conductive pattern of the through portion and a connection terminal of the non-contact communication antenna. Contact / Non-contact I equipped with
Manufacturing method of C module. 7. A method for manufacturing a contact / non-contact type IC module for manufacturing the contact / non-contact type IC module according to claim 1, wherein the base material is provided. A penetrating portion forming step of forming a penetrating portion communicating with the connection terminal portion of the contact terminal, a conductive pattern of the non-contact communication antenna and a conductive pattern of the contact terminal on both surfaces of the base material, An etching step of forming by etching; an IC chip mounting step of mounting the IC chip on the back side of the substrate; a connection terminal of the IC chip, a conductive pattern of the through portion, and a connection terminal of the non-contact communication antenna. And a contact step of electrically connecting
Manufacturing method of C module.