JP2002203224A - Data carrier module used for both contact type and non- contact type - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a data carrier module to be used for both a contact type and a non-contact type which is excellent in versatility and can satisfy need for a security property. SOLUTION: This data carrier module has a base material, a semiconductor chip mounted on the base material, a coil connected to the semiconductor chip and to perform communication in a non-contact manner by electromagnetic coupling with an external booster antenna part, and contact terminal parts connected to the semiconductor chip and subjected to contact connection to external contacts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a data carrier module used in an IC card or the like, and more particularly, to an external read / write device (reader / writer).
The present invention relates to a contact-type and non-contact type data carrier module capable of exchanging information in any form of a contact type and a non-contact type with the data carrier module.

[0002]

2. Description of the Related Art In recent years, IC cards have been widely used from the aspect of confidentiality of information. In recent years, non-contact type IC cards which exchange information without contacting an external reader / writer have been proposed. .

A non-contact type IC card generally employs a system in which signal exchange with an external reader / writer or both signal exchange and power supply are performed by electromagnetic waves. Both the non-contact type IC card and the reader / writer of such a system have a built-in antenna for transmitting and receiving electromagnetic waves to and from each other. In the non-contact type IC card, the operating power is obtained by electromagnetic induction from the electromagnetic waves received from the reader / writer. In addition, the signals are exchanged with a reader / writer using electromagnetic waves.

[0004] Such a non-contact type IC card has no contact with a reader / writer, so there is no contact failure, and it can be used at a place several cm to several tens cm away from the reader / writer. Due to its features such as resistance to rain, rain and static electricity, its demand is expected to increase further in the future.

[0005] On the other hand, in recent years, various non-contact IC tags in the form of a sheet or a tag, in which an antenna coil is connected to an IC chip (semiconductor chip) storing data, have been proposed. Attached to boxes and the like, they have been used to prevent shoplifting and to improve distribution systems.

Under these circumstances, recently, a test product of a so-called coil-on-chip type semiconductor chip module in which an antenna is provided on an IC chip itself as a data carrier for storing data has been provided. Research on non-contact type IC cards and IC tags using such test articles is also in progress.

A non-contact type data carrier device such as a non-contact type IC card or an IC tag usually has a booster antenna coil for exchanging signals with the outside, a primary coil using the booster antenna coil and an electromagnetic coil. A data carrier module such as a coil-on-chip type semiconductor chip provided with a secondary coil for coupling. In this specification, the term "data carrier module" is used as a generic term for a module having a fine coil serving as a secondary coil and connecting this to a data carrier portion such as a semiconductor chip.

[0008] In this case, the booster antenna coil as the primary coil and the secondary coil of the data carrier module are not directly connected but are relatively aligned and used. Specifically, for example, a dense coil portion is provided on the side of the booster antenna coil (primary coil), and a data carrier module is mounted thereon so that the secondary coil is overlapped thereon. At this time, the shape of the densely-coiled portion of the booster antenna coil (primary coil) substantially matches the shape of the secondary coil of the data carrier module, thereby increasing the efficiency of electromagnetic coupling.

In recent years, PHS (Personal Handy)
mobile systems such as mobile phone systems and mobile phones, and mobile computer terminals, etc., have rapidly become widespread and many people are carrying them. Attempts have been made to add various added values to the system.

[0010] For example, Japanese Patent Application Laid-Open No. Hei 8-87655 discloses that an IC card in which information of a bank is recorded is inserted into a portable telephone device so that the owner of the IC card (owner of the portable telephone device) can purchase an article. When receiving paid services,
There has been disclosed an information processing system in which a device for providing goods or the like acquires record information of an IC card through a mobile phone device and automatically performs electronic payment using the acquired record information. In general, an IC card used in such an information processing system is a contact-type IC card, and a contact-type reader / writer having an electrical contact is provided on the mobile phone device side.

[0011]

As described above, as the IC card, although the non-contact type IC card as described above is becoming widespread, an electronic payment card in electric commerce and an ID card are not used. like,
If security is required, contactless IC
2. Description of the Related Art Contact-type IC cards having electrical contacts, which are more excellent in security than cards, are generally put into practical use. Note that the contact-type IC card has a structure in which it is electrically connected directly to the reader / writer through the contact point, so that the operation is generally stable.

Further, the non-contact type IC card as described above is used by embedding a data carrier module (a non-contact IC module) such as a coil-on-chip type semiconductor chip in a card-shaped medium and using the card unit. However, the non-contact type IC media equipped with such a data carrier module does not have to be limited to a conventional use form. In addition, the use thereof can be expected to be widely used not only in a specific field but also in various fields in which information is transmitted.

The present invention has been made in consideration of the above points, and has excellent versatility and can sufficiently cope with security requirements. It is intended to provide a data carrier module.

[0014]

According to the present invention, there is provided a base member, a semiconductor chip mounted on the base member, and a non-contact formed by electromagnetic coupling between the semiconductor chip and an external booster antenna. A coil for performing communication with the semiconductor chip, comprising: a contact terminal portion connected to the semiconductor chip for contact connection with an external contact.
Provided is a data carrier module for both contact type and non-contact type.

In the first aspect of the present invention, the semiconductor chip is disposed on one surface of the base member such that a terminal surface on which a terminal is provided faces outward. The semiconductor chip is disposed on the other surface opposite to the one surface on which the semiconductor chip is disposed, and the semiconductor chip and the contact terminal portion pass through a contact terminal portion opening formed in the base substrate. It is preferable that they are connected to each other by a connection portion for a contact terminal portion. Here, it is preferable that the connection portion for the contact terminal portion is a bonding wire for connecting a terminal of the semiconductor chip and the contact terminal portion. In addition, the contact terminal portion connection portion, a bonding wire that connects the terminal of the semiconductor chip and the connection wiring portion, and a connection wiring portion disposed on the one surface of the base substrate, Preferably, the base member includes a via portion formed in the contact terminal portion opening and connecting the contact wiring portion to the contact terminal portion.

Further, in the first aspect of the present invention, the coil is disposed on the terminal surface of the semiconductor chip, and the semiconductor chip and the coil are connected to each other by a coil connection portion. Is preferred. Here, it is preferable that the coil connection portion is a bonding wire that connects a terminal of the semiconductor chip to an end of the coil.

Further, in the first aspect of the present invention, the coil is disposed on the one surface of the base member, and the semiconductor chip and the coil are connected to each other by a coil connecting portion. Is preferred. Here, it is preferable that the coil connection portion is a bonding wire that connects a terminal of the semiconductor chip to an end of the coil. In addition, it is preferable that the coil is disposed near the periphery of the semiconductor chip on the one surface of the base substrate.

In a second aspect of the present invention, the semiconductor chip is disposed on one surface of the base substrate such that a terminal surface on which a terminal is provided faces the base substrate side. The part is disposed on the other surface opposite to the one surface on which the semiconductor chip is disposed, and the semiconductor chip and the contact terminal part are contact terminal parts formed on the base material. It is preferable that they are connected to each other by a contact terminal connecting portion through the opening for contact. Here, the connection portion for the contact terminal portion is a connection wiring portion provided on the one surface of the base material, and the connection portion formed in the contact terminal portion opening of the base material. It is preferable that the semiconductor chip comprises a wiring portion for connection and a via portion for connecting the contact terminal portion, and the terminal of the semiconductor chip is flip-chip connected to the wiring portion for connection.

Further, in the second aspect of the present invention, the coil is disposed on the terminal surface of the semiconductor chip, and the semiconductor chip and the coil are connected to each other by a coil connection portion. Is preferred. Here, the coil is provided via a wiring layer formed on the terminal surface of the semiconductor chip and an insulating layer formed so as to cover the wiring layer, and the wiring layer is provided on the semiconductor chip. It is preferable that the coil connection portion, which is connected to a terminal, includes the wiring layer and a via portion formed on the insulating layer and connecting the wiring layer to an end of the coil.

Further, in the second aspect of the present invention, the coil is disposed on the one surface of the base member, and the semiconductor chip and the coil are formed on the base member. It is preferable that they are connected to each other by a coil connection portion through a pair of coil openings.
Here, the connection portion for the coil includes a connection wiring portion provided on the other surface of the base material, and a connection terminal portion provided on the one surface of the base material. And formed in the pair of coil openings of the base material,
One end of the coil and the connection wiring portion, and a pair of via portions connecting the connection wiring portion and the connection terminal portion, wherein the terminal of the semiconductor chip is one terminal of the coil It is preferable that the connection terminal portion and the other terminal of the coil be flip-chip connected.

In the present invention, it is preferable that the semiconductor device further includes a sealing resin layer for resin-sealing the semiconductor chip, the coil and the wiring portion.

Further, the data carrier module according to the present invention is preferably used as a SIM for a booster card or a SIM (Subscriber Identity Module) for a portable telephone device.

Further, the semiconductor chip of the data carrier module according to the present invention can download various information via the Internet using a personal authentication function circuit for performing an authentication process of the owner and a communication device connectable to the Internet. And a non-contact communication function circuit for performing the operation.

According to the present invention, it is possible to perform non-contact communication with an external device or an external medium provided with a booster antenna coil by using a coil, and to use an external device or an external device having an electric contact with a contact terminal portion. A signal can be generated by contact connection with a contact of an external medium. Therefore, it is widely used, excellent in versatility, and can sufficiently meet security requirements.

[0025]

Embodiments of the present invention will be described below with reference to the drawings.

First Embodiment First, a first embodiment of a contact-type and non-contact type data carrier module according to the present invention will be described with reference to FIG.

As shown in FIG. 1, in the data carrier module 101 according to the first embodiment of the present invention,
The semiconductor chip 110 is mounted on one surface 120a of the base material 120. Note that the semiconductor chip 110 is
The base substrate 120 is arranged such that the terminal surface 110a on which the terminals 111a, 111b, 111c, 111d are provided faces outward.
Are arranged on one surface 120a. Here, a coil 115 is provided on the terminal surface 110 a of the semiconductor chip 110. The semiconductor chip 110 and the coil 115 constitute a coil-on-chip type semiconductor chip module 106.

Contact terminals 131 and 132 are provided on the other surface 120b of the base material 120 opposite to the one surface 120a on which the semiconductor chip 110 is provided.

Here, the semiconductor chip 110 and the contact terminal portions 131 and 132 correspond to the terminals 111 of the semiconductor chip 110.
The connection terminals a and 111b are connected to the contact terminal portions 131 and 132 by bonding wires (connection portions for contact terminal portions) 145 and 146. In addition,
A hole (opening for contact terminal) 1
25, 125 are formed, and the bonding wire 1 is formed.
45 and 146 extend from the terminals 111a and 111b of the semiconductor chip 110, pass through the holes 125 and 125, and reach the surfaces of the contact terminals 131 and 132 on the base substrate 120 side, respectively.

The semiconductor chip 110 and the coil 115
Are connected to each other by connecting the terminals 111c and 111d of the semiconductor chip 110 and the ends 115a and 115b of the coil 115 by bonding wires (coil connection portions) 141 and 142.

Here, the semiconductor chip 110 exchanges data with an external reader / writer (not shown) via a coil 115 electrically connected to the semiconductor chip 110. Unit, a memory, a receiving circuit, and a transmitting circuit.

The coil 115 is a secondary coil for performing non-contact communication by electromagnetic coupling with a booster antenna coil (primary coil) of an external device or an external medium, and is generally a high-density integrated wire. Those having a fine width are used. The coil 115 is electromagnetically exposed so that electromagnetic waves can be exchanged with a booster antenna coil as a primary coil, and forms a resonance circuit with the primary coil.

Referring to FIG. 6A, the positioning of the booster antenna coil as the primary coil and the secondary coil will be described.
The 0 booster antenna coil 621 is provided with a coil dense portion (see reference numeral 650), and the data carrier module 610 is mounted on the coil dense portion so that the coil 611 (corresponding to the coil 115 in FIG. 1) overlaps. You.

The line width and density of the coil 115 are as follows:
It is not always necessary to match the line width and density of the booster antenna coil, but by matching the line width and density of both as much as possible, the efficiency of electromagnetic coupling can be increased.

Here, as the coil-on-chip type semiconductor chip module 106 including the semiconductor chip 110 and the coil 115, various ones manufactured at a wafer level, cut and separated have been proposed as described later. As the coil 115, a copper layer is used as a single layer, and a copper layer is used as a main layer, and a nickel (Ni) layer, a gold (Au) layer, or the like is laminated from the viewpoint of conductivity and cost. Can be.

The base material 120 is a semiconductor chip 110
In addition, it holds the contact terminal portions 131 and 132, and can use an electromagnetic wave transmitting insulating material generally used as a communication device material. Examples of such an insulating material include an epoxy resin, a polyimide resin, and a fluororesin.

The contact terminals 131 and 132 are electrically connected to the semiconductor chip 110, and function as contacts for contacting and connecting to contacts of an external device or an external medium. The form of the contact terminals 131 and 132 is I
It is preferable that the contact terminals are basically the same as the contact terminals generally used in C cards and the like. Also, the contact terminal portion 13
As 1,132, a layer in which a copper layer is a main layer and a nickel (Ni) layer or a gold (Au) layer is provided on the surface thereof can be used.

Next, an example of a method for manufacturing the data carrier module 101 having such a configuration will be described.

First, the semiconductor chip 110 and the coil 1
Then, a coil-on-chip type semiconductor chip module 106 composed of fifteen is manufactured.

Specifically, after the semiconductor chip 110 is formed at the wafer level, the terminal surface 11 of the semiconductor chip 110 is formed.
A power supply layer for electrolytic plating is formed on the entire surface on the 0a side, and a photosensitive insulating layer is formed on the entire surface thereon. Next, the photosensitive insulating layer is exposed by photolithography to form a plating-resistant resist layer having an opening corresponding to the shape of the coil 115 to be formed. Then, electrolytic plating is performed on the power supply layer exposed from the opening of the plating-resistant resist layer, and after providing the coil wiring layer (coil 115) on the power-supply layer, the plating-resistant resist layer is peeled off. Thereafter, the power supply layer exposed by peeling and removing the plating resist layer is removed by soft etching so as not to damage the coil wiring layer. Thereby, the terminal surface 110 of the semiconductor chip 110
A coil wiring layer (coil 115) is formed on a. Finally, the wafer is diced and separated for each semiconductor chip 110 to obtain a coil-on-chip type semiconductor chip module 106 in which the coil 115 is disposed on the terminal surface 110a.

On the other hand, holes 125, 1 are formed in base material 120.
25, the first surface 120 of the base substrate 120 is formed.
The semiconductor chip module 106 is disposed on the substrate a through an adhesive layer (not shown) as necessary.

The other surface 120 of the base material 120
The contact terminal portions 131 and 132 are pressure-bonded or bonded on the layer b through an adhesive layer (not shown) as necessary.

Thereafter, the terminals 111a and 111b of the semiconductor chip 110 and the contact terminals 131 and 132 are connected by bonding wires 145 and 146 through the holes 125 and 125, respectively, by wire bonding.
The terminals 111 c and 111 d of the semiconductor chip 110 are connected to the ends 115 a and 115 b of the coil 115 by bonding wires 141 and 142.

Thus, finally, the data carrier module 101 as shown in FIG. 1 is manufactured.

In the first embodiment described above, the semiconductor chip module 106 side of the data carrier module 101 is sealed with resin, and the semiconductor chip 110,
Coil 115 and bonding wires 141, 14
A sealing resin layer 190 may be provided so as to cover 2,145,146.

Second Embodiment Next, referring to FIG. 2, a second embodiment of a contact-type and non-contact type data carrier module according to the present invention will be described. The second embodiment of the present invention is substantially the same as the first embodiment shown in FIG. 1 except that the method of connecting the terminals of the semiconductor chip and the contact terminals is different. In the second embodiment of the present invention, the same parts as those in the first embodiment shown in FIG.

As shown in FIG. 2, in the data carrier module 102 according to the second embodiment of the present invention,
On one surface 120a of the base member 120, connection wiring portions 151 and 152 are provided. The semiconductor chip 110 is provided on the connection wiring section 152.
The contact terminals 131 and 132 are provided on the other surface 120b of the base member 120.

Here, holes (openings for contact terminal portions) 126, 126 are formed in the base material 120,
In the holes 126, 126, connection wiring portions 151, 1 are provided.
Via portions (via hole portions) 155 and 156 for connecting the contact terminals 52 and the contact terminal portions 131 and 132 are provided. Further, the terminals 111a, 11a of the semiconductor chip 110
1b and the connection wiring portions 151 and 152 are connected by bonding wires 145 and 146. Thus, the semiconductor chip 110 and the contact terminal portions 131 and 132 connect the semiconductor chip terminals 111 a and 111 b and the contact terminal portions 131 and 132 to the bonding wires 145 and 14.
6, connection wiring portions 151, 152 and via portions 155,
By being connected by 156, they are connected to each other. The bonding wires 145 and 146, the connection wiring portions 151 and 152, and the via portions 155 and 156 form a connection portion for a contact terminal portion.

Next, an example of a method for manufacturing the data carrier module 102 having such a configuration will be described.

First, a coil-on-chip type semiconductor chip module 106 having a coil 115 disposed on a terminal surface 110a of a semiconductor chip 110 is manufactured in the same manner as in the first embodiment.

On the other hand, a double-sided copper-clad laminate is prepared as the base material 120, and one side 120 of the base material 120 is prepared.
a on the other surface 120.
The contact terminal portions 131 and 132 are formed on the surface b by photoetching. Here, the base material 12
0 has holes 126, before or after photoetching.
126 is formed.

Then, the holes 126,
After the via portions 155 and 156 are formed in the 126 by electroless plating and electrolytic plating, the semiconductor chip 106 is disposed on the connection wiring portion 152 formed on one surface 120 a of the base substrate 120. In this case, it is preferable that gold (Au) plating or the like is applied to the surfaces of the contact terminal portions 131 and 132 as necessary before the electroless plating or the electrolytic plating.

Thereafter, the terminals 111a, 111b of the semiconductor chip 110 and the connection wiring portions 151, 152 are bonded to the bonding wires 145, 14 by wire bonding.
6, the terminals 111c, 111d of the semiconductor chip 110 and the ends 115a, 1
15b are connected by bonding wires 141 and 142.

Thus, finally, the data carrier module 102 as shown in FIG. 2 is manufactured.

As a method of manufacturing the data carrier module 102, the following method can be used in addition to the method described above.

That is, the hole 12 is formed in the base material 120.
6 and 126, a plating-resistant resist layer is formed on one surface 120a and the other surface 120b of the base substrate 120 by a photolithography method.
20, both sides 120a, 120b and holes 126, 12
6 is activated and electroless plating is performed, and then the connection wiring portions 151 and 152 and the contact terminal portions 13 are formed by electrolytic plating.
1 and 132 and via portions 155 and 156 are formed.

Then, after the base material 120 thus obtained is soft-etched, the base material 120
Connecting wiring portion 152 formed on one surface 120a of
The semiconductor chip 106 is provided thereon. Also in this case, before the soft etching, if necessary, the contact terminal portion 1 may be used.
It is preferable to apply gold (Au) plating or the like to the surfaces of the bases 31 and 132.

Thereafter, the terminals 111a, 111b of the semiconductor chip 110 and the connection wiring portions 151, 152 are connected to the bonding wires 145, 14 by wire bonding.
6, the terminals 111c, 111d of the semiconductor chip 110 and the ends 115a, 1
15b are connected by bonding wires 141 and 142.

As a result, similarly to the above-described method, finally, the data carrier module 10 as shown in FIG.
2 is manufactured.

In the above-described second embodiment, the semiconductor chip module 106 of the data carrier module 102 is similar to the first embodiment shown in FIG.
Side is sealed with resin, and the semiconductor chip 110, the coil 115,
A sealing resin layer may be provided so as to cover the bonding wires 141, 142, 145, 146 and the connection wiring portions 151, 152.

Third Embodiment Next, a third embodiment of a contact-type and non-contact type data carrier module according to the present invention will be described with reference to FIG. The third embodiment of the present invention is substantially the same as the first embodiment shown in FIG. 1 except that the arrangement position of the coil is different. In the third embodiment of the present invention, the same parts as those in the first embodiment shown in FIG.

As shown in FIG. 3, in the data carrier module 103 according to the third embodiment of the present invention,
The coil 160 as a secondary coil is connected to the semiconductor chip 11
The base member 120 is provided not on the terminal surface 110 a but on one surface 120 a of the base member 120. The semiconductor chip 110 and the coil 160 are connected to the terminals 111 c and 11 d of the semiconductor chip 110 and the ends 160 a and 1
60b and the bonding wire (coil connection part) 14
1 and 142 are connected to each other. As shown in FIG. 3, the coil 160 is disposed on one surface 120 a of the base member 120 near the periphery of the semiconductor chip 110.

Next, an example of a method of manufacturing the data carrier module 103 having such a configuration will be described.

First, a single-sided copper-clad laminate is prepared as the base material 120, and the coil 1 is placed on one surface 120a.
60 is formed by photo-etching.
Here, the holes 125 are formed in the base material 120 before or after the photoetching.

Next, the semiconductor chip 110 is provided on one surface 120a of the base material 120 thus obtained via an adhesive layer (not shown) as necessary.

The other surface 120 of the base material 120
The contact terminal portions 131 and 132 are pressure-bonded or bonded on the layer b through an adhesive layer (not shown) as necessary.

Thereafter, the terminals 111a and 111b of the semiconductor chip 110 and the contact terminals 131 and 132 are connected by bonding wires 145 and 146 through the holes 125 and 125, respectively, by wire bonding.
The terminals 111 c and 111 d of the semiconductor chip 110 and the ends 160 a and 160 b of the coil 160 are connected by bonding wires 141 and 142.

Thus, finally, the data carrier module 103 as shown in FIG. 3 is manufactured.

In the third embodiment described above, similarly to the first embodiment shown in FIG. 1, the semiconductor chip 110 side of the data carrier module 103 is resin-sealed, and the semiconductor chip 110 and the coil are sealed. 160, a sealing resin layer may be provided to cover the bonding wires 141, 142, 145, and 146.

Fourth Embodiment Next, a fourth embodiment of a contact-type and non-contact type data carrier module according to the present invention will be described with reference to FIGS. FIG. 4A shows the fourth embodiment of the present invention.
4B is a schematic sectional view showing the data carrier module according to the embodiment, and FIG. 4B is an enlarged schematic view showing the IVB portion in FIG. 4A. The fourth embodiment of the present invention is the same as the fourth embodiment except that the arrangement of the semiconductor chip, the method of connecting the terminals of the semiconductor chip to the contact terminals, and the method of connecting the terminals of the semiconductor chip to the coil are different. This is substantially the same as the first embodiment shown in FIG. In the fourth embodiment of the present invention, the same parts as those of the first embodiment shown in FIG.

As shown in FIGS. 4A and 4B, in the data carrier module 104 according to the fourth embodiment of the present invention, the semiconductor chip 110 includes terminals 111a and 111a.
The terminal surface 110a provided with b, 111c and 111d is disposed on one surface 120a of the base material 120 so as to face the base material 120 side.

As shown in FIG. 4B, the semiconductor chip 11
The wiring layers 171 and 172 connected to the terminals 111c and 111d of the semiconductor chip 110
Is formed, and an insulating layer 180 is formed on the wiring layers 171 and 172 so as to cover the wiring layers 171 and 172. The coil 1 is disposed on the surface 180a of the insulating layer 180.
15 are provided. The semiconductor chip 110 and the coil 115 form a coil-on-chip type semiconductor chip module 107.

Here, a via portion 157 is formed in the insulating layer 180.
a, 157b are formed, and the wiring layers 171 and 172 are formed.
And the ends 115a and 115b of the coil 115 can be connected to each other. This allows
The semiconductor chip 110 and the coil 115 are connected to the wiring layer 17.
1, 172 and via portions 157a, 157b. The wiring layers 171 and 172 and the via portions 157a and 157b constitute a coil connection portion.

The insulating layer 180 has via portions 158a,
158b are formed, and the terminals 111a and 111b of the semiconductor chip 110 can be connected to the convex terminals 112a and 112b provided on the surface 180a of the insulating layer 180, respectively.

On the other hand, as shown in FIG. 4A, the connection wiring portions 151 and
152 are provided, and contact terminal portions 131 and 132 are provided on the other surface 120b.

Here, holes (openings for contact terminals) 126, 126 are formed in the base material 120.
In the holes 126, 126, connection wiring portions 151, 1 are provided.
Via portions (via hole portions) 155 and 156 for connecting the contact terminals 52 and the contact terminal portions 131 and 132 are provided. Further, the terminals 111a, 11a of the semiconductor chip 110
The convex terminals 112a and 112b connected to 1b are flip-chip connected to connection wiring portions 151 and 152. Thereby, the semiconductor chip 110 and the contact terminal portion 13
1, 132 are connected to each other by via portions 158a, 158b, convex terminals 112a, 112b, connecting wiring portions 151, 152, and via portions 155, 156. The via portions 158a and 158b and the convex terminals 112
a, 112b, the connection wiring portions 151, 152, and the via portions 155, 156 constitute a connection portion for a contact terminal portion.

Next, an example of a method for manufacturing the data carrier module 104 having such a configuration will be described.

First, the semiconductor chip 110 and the coil 1
A coil-on-chip type semiconductor chip module 107 composed of the fifteen coils 15 is manufactured.

Specifically, after the semiconductor chip 110 is formed at the wafer level, the terminal surface 11 of the semiconductor chip 110 is formed.
A power supply layer for electrolytic plating is formed on the entire surface on the 0a side, and a photosensitive insulating layer is formed on the entire surface thereon. Next, the photosensitive insulating layer is exposed by a photolithography method to form a plating resist layer having openings corresponding to the shapes of the wiring layers 171 and 172 to be formed. Then, electrolytic plating is performed on the power supply layer exposed from the opening of the plating resist layer,
After providing the wiring layers 171 and 172 on the power supply layer, the plating-resistant resist layer is peeled off. Then, the power supply layer exposed by peeling and removing the plating resist layer is removed from the wiring layer 171,1.
72 is removed by soft etching so as not to damage. Thus, the wiring layers 171 and 172 are formed on the terminal surfaces 110a of the semiconductor chip 110.

Next, photosensitive polyimide is coated on the terminal surface 11 of the semiconductor chip 110 so as to cover the wiring layers 171 and 172.
After coating the entire surface on the 0a side and opening the formation portions of the via portions 157 and 158 by photolithography, the entire surface of the photosensitive polyimide film including the openings is activated to perform electroless plating to form a power supply layer. I do.

Next, a photosensitive insulating layer is formed on the entire surface of the power supply layer, and the photosensitive insulating layer is exposed to light by a photolithography method.
A plating-resistant resist layer having openings corresponding to the shapes of 7a, 157b, via portions 158a, 158b, and convex terminals 112a, 112b is formed. Then, electrolytic plating is performed on the power supply layer exposed from the opening of the plating resist layer, and after the wiring layers 171 and 172 are provided on the power supply layer, the plating resist layer is peeled off. Thereafter, the power supply layer exposed by peeling and removing the plating resist layer is removed by soft etching so as not to damage the coil 115, the via portions 157a and 157b, the via portions 158a and 158b, and the convex terminals 112a and 112b. Thereby, the wiring layers 171 and 1 are formed on the terminal surfaces 110a of the semiconductor chip 110.
72 are formed.

Finally, the wafer is transferred to each semiconductor chip 110.
The insulating layer 18 is separated by dicing every
Thus, a coil-on-chip type semiconductor chip module 107 having the coil 115 disposed on the surface 180a of the “0” is obtained.

On the other hand, a double-sided copper-clad laminate is prepared as the base substrate 120, and one surface 120 of the base substrate 120 is prepared.
a on the other surface 120.
The contact terminal portions 131 and 132 are formed on the surface b by photoetching. Here, the base material 12
0 has holes 126, before or after photoetching.
126 is formed.

Then, the holes 126,
After the via portions 155 and 156 are formed in the 126 by electroless plating and electrolytic plating, the convex terminals 112 a and 112 b connected to the terminals 111 a and 111 b of the semiconductor chip 110 are formed.
112b is flip-chip connected to the connection wiring portions 151 and 152. In addition, if necessary, the connection wiring portion 15
A bump may be formed at a position corresponding to the protruding terminals 112a and 112b among the bumps 1 and 152.

Thus, finally, the data carrier module 104 as shown in FIGS. 4A and 4B is manufactured.

As a method of manufacturing the data carrier module 104, the following method can be used in addition to the method described above.

That is, the hole 12 is formed in the base material 120.
6 and 126, a plating-resistant resist layer is formed on one surface 120a and the other surface 120b of the base substrate 120 by a photolithography method.
20, both sides 120a, 120b and holes 126, 12
6 is activated and electroless plating is performed, and then the connection wiring portions 151 and 152 and the contact terminal portions 13 are formed by electrolytic plating.
1 and 132 and via portions 155 and 156 are formed.

After the base material 120 thus obtained is soft-etched, the semiconductor chip 11
0 terminal 111a, 111b, convex terminal 11 connected to 111b
2a and 112b are flip-chip connected to the connection wiring portions 151 and 152. If necessary, bumps may be formed at positions corresponding to the protruding terminals 112a and 112b in the connection wiring portions 151 and 152.

As a result, similarly to the above-described method, finally, the data carrier module 104 as shown in FIGS. 4A and 4B is manufactured.

In the fourth embodiment described above, similarly to the first embodiment shown in FIG. 1, the semiconductor chip module 107 of the data carrier module 104 is provided.
The side may be resin-sealed, and a sealing resin layer may be provided so as to cover the semiconductor chip 110, the coil 115, and the connection wiring portions 151 and 152.

Fifth Embodiment Next, a fifth embodiment of a contact-type and non-contact type data carrier module according to the present invention will be described with reference to FIG. The fifth embodiment of the present invention is similar to the fourth embodiment shown in FIGS. 4A and 4B except that the arrangement position of the coil and the method of connecting the terminal of the semiconductor chip to the coil are different.
This is substantially the same as the embodiment. In the fifth embodiment of the present invention, the same portions as those of the fourth embodiment shown in FIGS. 4 (a) and 4 (b) are denoted by the same reference numerals, and detailed description is omitted.

As shown in FIG. 5, in the data carrier module 105 according to the fifth embodiment of the present invention,
The coil 160 as a secondary coil is connected to the semiconductor chip 11
The base member 120 is provided not on the terminal surface 110 a but on one surface 120 a of the base member 120.

On one surface 120a of the base member 120, connection terminals (rounds) 165, 166, and 167 connected to the terminals 111a, 111b, and 111c are provided. Also, the other surface 120 of the base substrate 120
The contact terminal portions 131 and 132 and the connection wiring portion 159 are provided on “b”.

Here, holes (openings for coil) 127, 127 are formed in the base material 120, and one end 16 of the coil 160 is formed in the holes 127, 127.
0a and connection wiring portion 159, and connection wiring portion 159
And a pair of via portions 157 connecting the connection terminal portions 167
a, 157b are provided. In addition, the semiconductor chip 1
Convex terminal 1 connected to ten terminals 111c and 111d
12c and 112d are connection terminal portions 167 finally connected to one end 160a of the coil 160, respectively.
And the other end 160b of the coil 160 are flip-chip connected. Thereby, the semiconductor chip 110 and the coil 160 are connected to the terminal 111c of the semiconductor chip 110.
And the end 160a of the coil 160 are connected to the semiconductor chip 11
0 terminal 111c, 111d, the convex terminal 11 connected to 111d
2c, the connection terminal portion 167, the via portion 157b, the connection wiring portion 159, and the via portion 157a, and the terminal 111d of the semiconductor chip 110 and the coil 160 are connected.
Are connected to each other by connecting the end portion 160b of the first terminal 160b with the convex terminal 112d. In addition, the convex terminal 11
2c, 112d, connection terminal 167, via 157
a, 157b and the connection wiring portion 159 constitute a coil connection portion.

Further, holes (opening portions for contact terminal portions) 126, 126 are formed in the base material 120, and connection terminal portions 165, 16 are formed in the holes 126, 126.
Via portions 155 and 156 for connecting the contact terminals 6 and the contact terminal portions 131 and 132 are provided. The protruding terminals 112a and 112b connected to the terminals 111a and 111b of the semiconductor chip 110 are connected to the connection terminal portion 1 respectively.
65 and 166 are flip-chip connected. Thereby, the semiconductor chip 110 and the contact terminal portions 131, 132
This means that the terminals 111a and 111b of the semiconductor chip and the contact terminals 131 and 132 are connected by connection terminals 165 and 166 and vias 155 and 156, respectively.
Connected to each other. The connection terminals 165, 1
66 and the via portions 155 and 156 constitute a connection portion for a contact terminal portion.

Next, a method of manufacturing the data carrier module 105 having such a configuration will be described.

First, a double-sided copper-clad laminate is prepared as the base substrate 120, and one side 120 of the base substrate 120 is prepared.
a on the coil 160 and the connection terminals 165, 16
6,167 on the other surface 120b.
1, 132 and the connection wiring portion 159 are formed by etching using a photoetching method. Here, the hole 12 is formed in the base material 120 before or after the photoetching.
6, 126, 127 and 127 are formed.

Then, the holes 126,
Via portions 155, 156, and 1 in 126, 127, and 127
57a and 157b are formed by electroless plating and electrolytic plating, and the terminals 111a and 111 of the semiconductor chip 110 are formed.
b, 111c, 111d connected to the convex terminal 112
a, 112b, 112c, and 112d are connected to the connection terminal 1
65, 166, 167 and the other terminal 1 of the coil 160
Flip chip connection is made to 60b.

Thus, finally, the data carrier module 105 as shown in FIG. 5 is manufactured.

As a method of manufacturing the data carrier module 105, the following method can be used in addition to the method described above.

That is, the hole 12 is formed in the base material 120.
6, 126, 127 and 127 are formed, a plating resist layer is formed on one surface 120a and the other surface 120b of the base substrate 120 by a photolithography method, and both surfaces 120a, 120b and After activating the holes 126, 126, 127, 127 and performing electroless plating, the coils 16 are formed by electrolytic plating.
0, connection terminal portions 165, 166, 167, contact terminal portions 131, 132, connection wiring portion 159, and via portion 15.
5, 156, 157a and 157b are formed.

Then, after soft etching the base material 120 thus obtained, the semiconductor chip 11
0 terminal 111a, 111b, 111c, 111d connected to convex terminal 112a, 112b, 112c, 11
2d is flip-chip connected to the connection terminals 165, 166, 167 and the other terminal 160b of the coil 160.

Thus, finally, the data carrier module 105 as shown in FIG. 5 is manufactured.

In the fifth embodiment described above, similarly to the first embodiment shown in FIG. 1, the semiconductor chip 110 side of the data carrier module 105 is resin-sealed, A sealing resin layer may be provided so as to cover 160 and connection terminal portions 165, 166, and 167.

- 0105] The use forms Next, FIG. 6 (a) (b) ( c), the use form of the first to fifth contact and non-contact combined data carrier module according to the embodiment of the above described I do.

As shown in FIG. 6A, a data carrier module 610 (corresponding to the data carrier modules 101 to 105 shown in FIGS. 1 to 5) is a SIM (Subscriber Identity Module) for a booster card or a portable telephone. It can be used as a SIM for the device.

As shown in FIG. 6A, when the data carrier module 610 is used as a SIM for the booster card 620, it is inserted into the slot 650 of the booster card 620 and used.

In this case, the booster antenna coil (primary coil) 621 of the booster card 620 is provided with a coil dense portion at the position of the slot 650, and the coil (secondary coil) 611 overlaps the coil dense portion. Is mounted with a data carrier module 610. At this time, by making the shape of the coil dense portion of the booster antenna coil 621 substantially coincide with the shape of the coil 611 of the data carrier module 610, the efficiency of electromagnetic coupling can be increased.

In this way, when the data carrier module 610 is inserted into the slot 650 of the booster card 620, an external read / write device (reader / writer)
, Through a booster antenna coil 621, a contact-type and non-contact type data carrier module 61
0 can be accessed without contact.

Here, the data carrier module 610
Has a control unit, a memory, a reception circuit, and a transmission circuit, an input signal from the coil 611 is accessed to the memory via the reception circuit and the control unit, and a signal from the memory is transmitted via the control unit. The signal is sent to the transmission circuit, and is sent to an external reader / writer via the coil 611 and the booster antenna coil 621 of the booster card 620. Note that various information necessary for the data carrier device is stored in the memory of the semiconductor chip.

Here, for communication between the booster card 620 and an external reader / writer, a frequency band such as 125 kHz (medium wave), 13.56 MHz, 2.45 GHz (microwave) is used. Although the communication distance is about 2 cm at 125 kHz and about 20 cm at 13.56 MHz, the actual communication distance varies greatly depending on the antenna area and the output power of the reader / writer.

A plurality of slots are provided in the booster card 620 so that a plurality of data carrier modules 610 can be inserted, and communication between the data carrier module 610 and an external reader / writer is performed for each slot. You may do so.

On the other hand, as shown in FIG. 6B, the data carrier module 610 is a SIM for the mobile phone 630.
When it is used as a mobile phone, it is inserted into the slot 650 of the mobile phone 630 and used.

In this case, a booster antenna coil (primary coil, not shown) of the portable telephone device 630 is provided with a coil dense portion at the position of the slot 650, and a coil (secondary coil) is placed on the coil dense portion. The data carrier module 610 is mounted so that 611 overlaps. At this time, the shape of the coil dense portion of the booster antenna coil and the coil 6 of the data carrier module 610
By substantially matching the shape of the eleventh shape, the efficiency of electromagnetic coupling can be increased. Note that the mobile phone device 63
At 0, the booster antenna coil is preferably formed on the back side of the mobile phone device 630.

When the data carrier module 610 is inserted into the slot 650 of the portable telephone device 630 in this manner, the data carrier module 610 for both contact and non-contact uses the portable telephone device via the booster antenna coil. 6B, information can be exchanged with the personal computer 641. As shown in FIG. 6B, Internet communication can be performed via the mobile phone 630, or as shown in FIG. To send and receive information. 6B and 6C, reference numeral 631 denotes a display unit of the mobile phone 630, and reference numeral 61 denotes a display unit.
32 is a communication antenna, and 634 is a communication antenna 6
Reference numeral 641 denotes an electromagnetic wave emitted from 32, which is a display unit of the personal computer 640.

The semiconductor chip of the contact-type and non-contact type data carrier module according to the first to fifth embodiments has a personal authentication function circuit for performing owner authentication processing, It is preferable to provide a non-contact communication function circuit for downloading various information via the Internet using a communication device connectable to the Internet.

In this case, as shown in FIGS. 6B and 6C,
By inserting a contact-type and non-contact type data carrier module 610 into a slot of a communication device such as a mobile phone device 630 that can be connected to the Internet, the owner can selectively select various information via the Internet. You can download it and get paid for it.

In such a contact-type and non-contact type data carrier module 610, after writing information to the data carrier module 610 via the Internet, (1) the data carrier module 610 is used as a non-contact IC module. And (2) the portable telephone device 630 in which the data carrier module 610 is inserted.
And (3) the mobile phone device 6 in which the data carrier module 610 is inserted.
A signal can be exchanged with another memory device such as a personal computer 640 via the contact 30 through a contact method.

[0119]

As described above, according to the present invention, a contact-type and non-contact type data carrier module which is excellent in versatility and can sufficiently cope with security requirements is provided. can do.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a first embodiment of a contact-type and non-contact type data carrier module according to the present invention.

FIG. 2 is a schematic sectional view showing a second embodiment of a contact-type and non-contact type data carrier module according to the present invention.

FIG. 3 is a schematic sectional view showing a third embodiment of a contact-type and non-contact type data carrier module according to the present invention.

FIG. 4 is a diagram showing a fourth embodiment of a contact-type and non-contact type data carrier module according to the present invention.

FIG. 5 is a schematic sectional view showing a fifth embodiment of a contact-type and non-contact type data carrier module according to the present invention;

FIG. 6 is a schematic diagram for explaining a usage form of a contact-type and non-contact type data carrier module according to the present invention.

[Explanation of symbols]

101 to 105 Data carrier module 106, 107 Coil-on-chip type semiconductor chip module 110 Semiconductor chip 110a Terminal surface 111a, 111b, 111c, 111d Terminal 112a, 112b Convex terminal 115 Coil (secondary coil) 115a, 115b End 120 Base material 125, 125 Hole (opening for contact terminal) 126, 126 Hole (opening for contact terminal) 127, 127 Hole (opening for coil) 131, 132 Contact terminal 141, 142 Bonding Wire (coil connection part) 145, 146 Bonding wire (contact terminal part connection part) 151, 152 Connection wiring part 155, 156 Via part (via hole part) 157a, 157b Via part 158a, 158b Via part 159 For connection Wiring section 160 Il (secondary coil) 160a, 160b End 165, 166, 167 Connection terminal (round) 171 172 Wiring layer 180 Insulating layer 190 Sealing resin layer 610 Data carrier module 611 Coil (secondary coil) 620 Booster Card 621 Booster antenna coil (primary coil) 630 Mobile phone 631 Display 632 Communication antenna 634 Electromagnetic wave 640 Personal computer 641 Display 650 Slot

Claims (19)

[Claims] 1. A base material, a semiconductor chip mounted on the base material, and a coil connected to the semiconductor chip for performing non-contact communication by electromagnetic coupling with an external booster antenna unit. A contact terminal unit connected to the semiconductor chip for contacting and connecting to an external contact; and a contact-type and non-contact type data carrier module. 2. The semiconductor chip is disposed on one surface of the base member such that a terminal surface on which a terminal is provided faces outward, and the contact terminal portion is disposed on the semiconductor chip. The semiconductor chip and the contact terminal portion are disposed on the other surface opposite to the one surface, and the contact portion is formed through the contact terminal portion opening formed in the base material. The data carrier module according to claim 1, wherein the data carrier modules are connected to each other by: 3. The data carrier module according to claim 2, wherein said contact terminal portion connection portion is a bonding wire for connecting a terminal of said semiconductor chip to said contact terminal portion. 4. A connection wire for connecting a terminal of the semiconductor chip to the connection wiring portion, and a connection wire provided on the one surface of the base material. 3. The data according to claim 2, comprising: a wiring portion; and a via portion formed in the opening for the contact terminal portion of the base material and connecting the connection wiring portion and the contact terminal portion. Carrier module. 5. The semiconductor device according to claim 2, wherein the coil is provided on the terminal surface of the semiconductor chip, and the semiconductor chip and the coil are connected to each other by a coil connection portion. Data carrier module as described. 6. The data carrier module according to claim 5, wherein said coil connection portion is a bonding wire for connecting a terminal of said semiconductor chip to an end of said coil. 7. The semiconductor device according to claim 7, wherein the coil is disposed on the one surface of the base member, and the semiconductor chip and the coil are connected to each other by a coil connecting portion. Item 3. The data carrier module according to Item 2. 8. The data carrier module according to claim 7, wherein said coil connection portion is a bonding wire for connecting a terminal of said semiconductor chip to an end of said coil. 9. The data carrier module according to claim 7, wherein said coil is disposed on said one surface of said base substrate in the vicinity of said semiconductor chip. 10. The semiconductor chip is disposed on one surface of the base substrate such that a terminal surface on which a terminal is provided faces the base substrate side. The semiconductor chip and the contact terminal portion are disposed on the other surface opposite to the one surface to be disposed,
2. The data carrier module according to claim 1, wherein the data carrier modules are connected to each other by a contact terminal connection portion through a contact terminal portion opening formed in the base material. 3. 11. The connecting portion for a contact terminal portion is formed in a connection wiring portion provided on the one surface of the base material and in an opening for the contact terminal portion in the base material. It comprises a via portion for connecting the connection wiring portion and the contact terminal portion, and a terminal of the semiconductor chip is flip-chip connected to the connection wiring portion.
The data carrier module according to claim 10. 12. The semiconductor device according to claim 10, wherein the coil is disposed on the terminal surface of the semiconductor chip, and the semiconductor chip and the coil are connected to each other by a coil connection portion. Data carrier module as described. 13. The coil is disposed via a wiring layer formed on the terminal surface of the semiconductor chip and an insulating layer formed to cover the wiring layer, wherein the wiring layer is formed of the semiconductor chip. The coil connection part, which is connected to a terminal of a chip, includes the wiring layer, and a via part formed in the insulating layer and connecting the wiring layer and an end of the coil. Item 13. The data carrier module according to item 12. 14. The coil is disposed on the one surface of the base member, and the semiconductor chip and the coil are connected to each other through a pair of coil openings formed in the base member. The data carrier module according to claim 10, wherein the data carrier modules are connected to each other by a connection unit. 15. The connection portion for a coil provided on the other surface of the base material, and the connection portion for a connection provided on the one surface of the base material. A terminal portion and a pair of terminals formed in the pair of coil openings of the base material and connecting one end of the coil to the connection wiring portion, and connecting the connection wiring portion to the connection terminal portion. Wherein the terminal of the semiconductor chip is flip-chip connected to the connection terminal portion connected to one terminal of the coil and the other terminal of the coil. Item 15. The data carrier module according to Item 14. 16. The data carrier module according to claim 1, further comprising a sealing resin layer for resin-sealing said semiconductor chip, said coil and said wiring portion. 17. The data carrier module according to claim 1, wherein the data carrier module is used as a SIM for a booster card. 18. The data carrier module according to claim 1, wherein the data carrier module is used as a SIM for a portable telephone device. 19. The semiconductor chip includes a personal authentication function circuit for performing an authentication process of an owner and a contactless communication function for downloading various information via the Internet using a communication device connectable to the Internet. 19. The data carrier module according to claim 1, further comprising a circuit.