JPH11224316A - Composite type ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the peeling of a connection part to bending torsion by using a conductive adhesive material, and a non-conductive adhesive material for the connection of an IC module and an antenna coil and fixation with a card base material. SOLUTION: For a contact type IC module 10, a connection terminal 13 is arranged at a flange part 17 on a diagonal line around a resin mold part 25. An antenna coil substrate 11 for communication is provided with the antenna coil 15 and antenna coil connection terminals 12 to be electrically connected to the IC module connection terminal 13 on both tips. At the prescribed position of the antenna coil substrate 11, a buried hole 18 is formed. The connection terminal 13 of the IC module 10 and the antenna coil connection terminals 12 exposed on the diagonal line of the buried hole 18 are connected by a conductive material such as the metal of solder or the like or conductive rubber or the like and further, the flange part 17 of the module 10 and the buried hole 18 are fixed by using the non-conductive adhesive material 19.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC card used for payment of fees, bank transactions, telephone communication, and the like in a transportation system, and more particularly, to a single IC card.
The present invention relates to a composite IC card that shares data with a C chip and can exchange signals with an external terminal by both a contact type and a non-contact type.

[0002]

2. Description of the Related Art Conventionally, in the fields of credit cards, ID cards, cash cards, and the like, as a card replacing a magnetic card, an IC module including a semiconductor memory such as a microprocessor, RAM, and ROM is mounted on a card material. A so-called IC card has been developed because of its extremely large information recording capacity and high security. These IC cards are roughly classified into a type that performs reading by a contact type and a type that performs reading by a non-contact type. The contact type performs power supply and information communication by directly contacting and connecting a reader-side terminal to an external terminal exposed on the surface of the card. Most current IC card types fall into this category.

[0003] In recent years, an IC card using a non-contact IC module comprising a memory IC chip and a coil having a function as a power supply and communication antenna has been developed. The non-contact type IC module used for this card does not need to expose the communication terminal to the card surface when making the card because the communication is performed in a non-contact manner. Don't worry.

That is, there are two types of IC cards: a contact type IC card that directly communicates with the outside through external terminals, and a non-contact type IC card that communicates by radio waves using an antenna coil without an external terminal. However, the non-contact type, for example, has the advantage of easy hardware maintenance and is resistant to static electricity, but may be stolen without knowing the information. on the other hand,
The contact type IC card is excellent in security, but has a problem in hardware maintenance since a contact is required for communication. Therefore, non-contact type IC card and contact type I
There has been proposed a composite IC card in which a non-contact function and a contact function are realized by one chip by combining C cards. In other words, by combining the ease of use of contactless type with the security of contact type, it is suitable for, for example, fee payment operation and billing in bank ticket systems, bank transactions, various identity confirmation operations, etc., and realizes convenient applications It is a composite type IC card for the purpose of doing.

The method of manufacturing the composite IC card varies depending on the form of the module. For example, as shown in FIG. 5, an external connection terminal 21 is provided on a substrate 22, and both ends are provided with external connection terminals. Through hole 23 for connection of
23, a wiring pattern 24,
Although not shown, the IC chip and the IC chip and the wiring patterns 24 and 24 are wire-bonded to a central portion, and this portion is
Then, on the lowermost surface, the connection terminals 13 with the antenna coil,
A contact type IC module 20a on which the antenna coil 13 is arranged is prepared, and the antenna coil 15 is embedded as shown in FIG.
A buried hole 18 for mounting the IC module 20a is formed by borrowing, and the connection terminals 12 and 12 with the IC module are exposed in the buried hole, so that the antenna coil connection terminals 12 and 12 and the IC module connection terminals 13 and
13 are connected by solder bumps 28, 28 and the like, and a brim portion 17 around a resin mold portion of the IC module 20a is fixed to the shoulder portion of the buried hole with an adhesive.

[0006]

However, in such a structure, the fixed portion of the IC module and the connecting portion of the antenna coil are separated from each other, so that the dimensional accuracy of the parts for fixing the two places and the card base are fixed. Material processing accuracy is required. That is, the terminals cannot be accurately connected to each other due to the accuracy of the member processing. Further, in the completed IC card, there is a problem in that when the card is bent or twisted, the card is distorted and the bonded portion and the connected portion are peeled off.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to improve the connection between the IC module and the antenna coil and the arrangement thereof so as to facilitate the connection. By using a conductive adhesive for conductivity and a non-conductive adhesive for fixing for connection between the antenna coil and fixing to the card substrate, peeling of the connection portion due to bending and torsion can be prevented. A composite IC card is provided.

[0008]

According to the present invention, there is provided a contact type IC module in which an IC chip is covered with a resin mold portion, and an antenna coil having a connection terminal at a tip is embedded in a card base material. A composite IC card comprising a non-contact type communication antenna coil substrate in which the antenna coil connection terminal is exposed in a buried hole of a card base material and wherein the contact IC module is mounted in the buried hole; A contact type IC module provided with a plurality of connection terminals on a diagonal line around the mold portion, and a connection terminal for an antenna coil provided at a position facing the connection terminal of the IC module and on a diagonal line; Is exposed in the buried hole, and the IC module connection terminal and the antenna coil connection terminal are connected by a conductive material,
A composite IC card, wherein the IC module is fixed to a buried hole with a non-conductive adhesive.

Further, the antenna coil connecting terminal is exposed on a diagonal line at the bottom of the buried hole.

[0010] The antenna coil connection terminal may include
It is characterized by being formed larger than the C module connection terminal.

Further, the IC module connection terminal is formed in a substantially L-shaped or circular shape having the same shape as the antenna coil connection terminal.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A composite IC card according to the present invention
A contact-type IC module having a plurality of connection terminals on a diagonal line of a peripheral corner portion of a resin mold portion of a C module; and a position facing the connection terminal of the IC module and a diagonal line extending from a connection terminal of the IC module An antenna coil substrate provided with an antenna coil connection terminal is also enlarged, and a region where the antenna coil connection terminal is provided is partially subjected to counterboring or the like to form a buried hole, and an antenna coil is formed in the buried hole. The connection terminals are exposed, the connection terminals are connected to each other with a conductive material such as metal or conductive rubber, and the collar portion on the back side of the IC module is fixed to the buried hole with a non-conductive adhesive. is there.

An embodiment will be described in detail with reference to the drawings.
FIG. 1 shows a contact type IC module according to the present invention,
(A) is an explanatory view of an IC module in which connection terminals are provided on a brim portion, and (B) is an IC module in which connection terminals are provided on a bottom portion.
FIG. 2 is an explanatory diagram of the module, and FIG. 2 is an explanatory diagram showing connection terminals of the IC module when the IC module is viewed from the bottom of a resin mold portion. In the IC module 10 according to the present invention, first, as shown in FIG. 1A, an external connection terminal is provided on a substrate, and a through hole for connection with the external connection terminal is provided at both ends thereof. A wiring pattern is provided below the hole, an IC chip t and the IC chip and the wiring pattern are connected in the center, and a resin mold portion 25 which is wholly or partially sealed is formed. A contact type IC module 10 in which connection terminals 13 of an IC module to be connected to an antenna coil connection terminal are arranged in a diagonal brim portion 17 around a portion 25.
It is. In addition, the IC module 10 according to another embodiment
As shown in FIG. 1B, the connection terminals 13 are arranged at the same height as the bottom surface of the resin mold portion 25.

The connection terminals of the contact type IC module are shown in FIG.
As shown in FIG.
The connection terminals 13 are provided. The shape of the connection terminal is substantially L-shaped in FIGS. 2A and 2C or circular in FIG. 2B, and the shape is not particularly limited. The size (area) of the terminal is characterized in that it is formed smaller than the connection terminal of the antenna coil described later.

FIG. 3 shows an embodiment of a non-contact type communication antenna coil substrate. FIG. 3 (A) is an explanatory view showing the communication antenna coil substrate in a plane.
(B) is an explanatory view represented by a cross section. As shown in FIG. 3A, a communication antenna coil substrate 11 is provided with an antenna coil 15 and antenna coil connection terminals 12 electrically connected to an IC module connection terminal at both ends thereof. Is embedded in an antenna coil substrate made of an insulating base material or the like. At this time, similarly to the connection terminals of the IC module, the antenna coil connection terminals 12,
12 are arranged diagonally. Then, as shown in FIG. 3B, a buried hole 18 is formed at a predetermined position (portion where the connection terminal is buried) of the antenna coil substrate 11, and the connection terminal 12, 12 is partially inserted into the buried hole. It has been exposed. That is, the connection terminal 12 is formed larger than the IC module connection terminal 13 described above, and the area exposed in the buried hole is increased, so that the connection terminal 12 can be easily connected to the IC module connection terminal 13. Further, the buried hole 18 is not limited to this, and although not shown, an antenna coil substrate having no shoulder portion in the buried hole and exposing a connection terminal at the bottom of the buried hole may be used. In this case, the IC module shown in FIG. 1B can be mounted, but the terminals are connected and fixed at the bottom of the buried hole. The embedding of the antenna coil in the base material of the antenna coil substrate and the formation of the embedding hole for exposing the connection terminal can be simultaneously performed by injection molding.

FIG. 4 is a partial explanatory view of a composite IC card in which a contact type IC module according to an embodiment of the present invention is mounted in a buried hole of a communication antenna coil substrate.
As shown in FIG. 4A, connection terminals 1 provided on a diagonal line around the resin mold portion 25 of the contact type IC module 10.
3 and 13 and buried holes 1 at positions facing the connection terminals.
Antenna coil connection terminal 1 exposed on diagonal line 8
2 and 12 are connected by a conductive material such as metal such as solder or conductive rubber, and the brim portion of the module and the buried hole are fixed using a non-conductive adhesive. That is, as shown in FIG. 4B, the exposed connection terminal 1
The IC module connection terminals 13 and 13 are connected to each other by a conductive material, and the other resin mold portion 25 and the buried hole are firmly fixed by a non-conductive adhesive 19.

Therefore, as shown in FIG. 4B, the connection terminal 13 of the IC module is connected to the antenna coil connection terminal 12.
When the terminals are formed smaller, the terminals can be electrically connected to each other even if the connection positions are slightly shifted.

In order to further strengthen the fixation of the IC module, the bottom of the resin mold portion 25 of the IC module and the bottom of the buried hole 18 can be fixed with a non-conductive adhesive. Can be strengthened.

[0019]

The composite IC card according to the present invention has an antenna coil connection terminal when a contact type IC module is mounted in a buried hole provided in a communication antenna coil substrate in which a non-contact type antenna coil is embedded. Is larger than the IC module connection terminals, and by arranging all the terminals on opposite diagonal lines, manufacturing tolerances can be extremely reduced. Further, since the connection and fixation are made at the brim portion of the IC module or at the module bottom and the buried hole using the conductive material and the non-conductive adhesive, the IC module can be more firmly fixed. Therefore, when the card is bent or twisted, distortion is exerted, and excellent effects such as prevention of peeling of the bonded portion and the connection portion are exhibited.

[Brief description of the drawings]

FIG. 1 is a contact-type IC used in the composite IC card of the present invention.
1A is an explanatory diagram of an IC module in which connection terminals are provided on a brim portion, and FIG. 1B is an explanatory diagram of an IC module in which connection terminals are provided on a bottom portion.

FIG. 2 is an explanatory diagram of connection terminals of the IC module when the IC module is viewed from the bottom side of a resin mold part;
(A) shows an example of a substantially L-shaped connection terminal, (B) shows a circular connection terminal, and (C) shows a small substantially L-shaped connection terminal.

FIG. 3 shows an example of a non-contact type communication antenna coil substrate used in the composite IC card of the present invention.
(A) is an explanatory view showing a communication antenna coil substrate in a plane, and (B) is an explanatory view showing a communication antenna coil substrate in a cross section.

4A and 4B show a state in which a contact-type IC module according to an embodiment of the present invention is mounted in a buried hole of a communication antenna coil substrate, wherein FIG. 4A is a partial explanatory view of a composite IC card, and FIG. () Is a partial explanatory view showing the composite IC card in a plane.

FIG. 5 is an explanatory diagram showing a cross section of an example of a conventional composite IC card.

FIG. 6 is an explanatory diagram showing a cross section of an example of a conventional communication antenna coil substrate.

[Explanation of symbols]

 10, 20a: contact type IC module 11: antenna coil substrate 12: connection terminal of antenna coil 13: connection terminal of IC module 15: antenna coil 17: brim portion of IC module 18: buried hole 19: non-conductive adhesive 21 ... Terminals for external connection 22 ... Substrate 23 ... Through hole 24 ... Wiring pattern 25 ... Resin molded part t ... IC chip

Claims (5)

[Claims] 1. A contact type IC module in which an IC chip is covered with a resin mold portion and an antenna coil having a connection terminal at a tip are embedded in a card base material, and the antenna coil connection terminal is exposed in an embedded hole of the card base material. A plurality of connection terminals provided on a diagonal line around the resin mold portion in a composite IC card comprising a non-contact type communication antenna coil substrate having the contact type IC module mounted in a buried hole. A contact type IC module, and a connection terminal of the antenna coil at a position facing the connection terminal of the IC module and on a diagonal line, exposing the antenna coil connection terminal to a buried hole, and connecting the IC module connection terminal to the antenna. Connect the coil connection terminal with a conductive material,
A composite IC card, wherein the IC module is fixed to the buried hole with a non-conductive adhesive. 2. The antenna coil connection terminal according to claim 1, wherein the antenna coil connection terminal is exposed on a diagonal line at a bottom of the buried hole.
2. The composite IC card according to item 1. 3. The composite IC card according to claim 1, wherein the antenna coil connection terminal is formed to be larger than an IC module connection terminal. 4. The composite IC card according to claim 3, wherein the IC module connection terminal is formed in a substantially L-shape having the same shape as the antenna coil connection terminal. 5. The composite IC card according to claim 3, wherein said contact type IC module connection terminal is formed in a circular shape.