WO2001015504A1 - Method for making hybrid smart cards and smart cards obtained by said method - Google Patents

Method for making hybrid smart cards and smart cards obtained by said method Download PDF

Info

Publication number
WO2001015504A1
WO2001015504A1 PCT/FR2000/002260 FR0002260W WO0115504A1 WO 2001015504 A1 WO2001015504 A1 WO 2001015504A1 FR 0002260 W FR0002260 W FR 0002260W WO 0115504 A1 WO0115504 A1 WO 0115504A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
perforations
electronic module
smart card
connection terminals
Prior art date
Application number
PCT/FR2000/002260
Other languages
French (fr)
Inventor
Olivier Brunet
Philippe Patrice
Original Assignee
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus filed Critical Gemplus
Priority to AU68510/00A priority Critical patent/AU6851000A/en
Publication of WO2001015504A1 publication Critical patent/WO2001015504A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards

Definitions

  • the present invention relates to the manufacture of smart cards, and more particularly of cards capable of ensuring a contact operating mode and a contactless operating mode.
  • This type of card will be called, throughout the rest of the description, cards with mixed operation, or hybrid or “combicard” smart card.
  • This type of card is provided with an antenna embedded in the card body and with a so-called “double-sided” micromodule to make the connection between the integrated circuit chip and the antenna.
  • the exchange of information with the outside is done either by the antenna which ensures electromagnetic coupling between the card's electronics and a reader (contactless operation), or by the contacts flush with the surface of the card which ensures an electrical transmission of data when they are in contact with a read head of a reader (operation with contacts).
  • Such cards with mixed operation, or with contactless operation are intended to perform various operations such as, for example, banking operations, telephone communications, various identification operations, debit operations or reloading of credit units. account, and all kinds of operations which can be carried out either by inserting the card in a reader, or remotely by electromagnetic coupling (in principle of inductive type) between a transmission-reception terminal and a card placed in a zone of action of this terminal.
  • Hybrid smart cards must have standardized dimensions identical to those of conventional smart cards with contacts. This is desirable for cards operating only contactless. The dimensions of these cards are defined by the usual standard ISO 7810 which corresponds to a standard format card 85 mm long, 54 mm wide and 0.76 mm thick.
  • the antenna generally consists of a conductive element deposited in a thin layer on a plastic support sheet. Connection terminals are provided at the ends of the antenna which must be updated in order to be able to connect them to the contact pads of the electronic module.
  • the conductive element forming the antenna will be called in the following antenna wire, since it may be, depending on the technology used, either a wire inlaid or laminated on a manufacturing support sheet, or conductive tracks printed on this support sheet.
  • FIGS. 1A and 1B A solution envisaged for manufacturing these hybrid smart cards is illustrated in FIGS. 1A and 1B.
  • This solution consists firstly in producing, on a support sheet 11, an antenna 12.
  • the antenna comprises several turns, before the arrangement these turns can be placed outside the connection terminals 120.
  • an insulating bridge makes it possible to connect each of the ends of the antenna respectively to a connection terminal of the antenna.
  • the sheet 11 supporting the antenna wire 12 thus produced is assembled with other plastic sheets 2, 3, 4, 5 to form the card body 10.
  • This card body 10 is then machined so as to form on the one hand, a cavity 100 reserved for a double-sided electronic module 20 and located between the connection terminals 120 of the antenna 12, and on the other hand, wells 121 for updating the connection terminals 120 of the antenna 12.
  • the connection wells 121 are then filled with an electrically conductive substance which provides the electrical connection between the antenna and contact pads 201 of the electronic module 20.
  • connection wells with an electrically conductive substance to make the electrical connection between the module and the antenna, is a delicate operation to carry out which tends to cause a reduction in the manufacturing yield and, by Consequently, an increase in the cost price.
  • An object of the present invention therefore consists in eliminating the most expensive specific steps, that is to say in particular the machining of the connection wells and in simplifying the other steps.
  • the invention provides a method of manufacturing a smart card, said smart card comprising a card body enclosing an antenna at the ends of which are provided connection terminals intended to be connected to an electronic module housed in a cavity of said card body, the electronic module comprising on one side at least one integrated circuit chip and on the other side of the connection pads, the chip being connected to the said pads, mainly characterized in that it comprises the following steps:
  • the microperforations are carried out directly on the contact pads before bonding and connection of the chip to said pads.
  • the cavity intended to receive the electronic module is produced so as to leave the antenna connection terminals visible.
  • the electronic module is transferred into the cavity so that the micro-perforations are located above the connection terminals of the antenna.
  • the electrically conductive material is a conductive ink.
  • the electrically conductive material is a molten metal.
  • the perforations also pass through this support.
  • the electronic module is a single-sided module.
  • the cavity is obtained by machining an opening in the card body, in which the antenna and its connection terminals are embedded. According to another embodiment, the cavity is obtained by lamination of sheets comprising perforations corresponding to the cavity.
  • Another object of the invention relates to a hybrid smart card comprising a card body enclosing an antenna at the ends of which are provided connection terminals intended to be connected to an electronic module housed in a cavity of said card body, the module electronics comprising on one side at least one integrated circuit chip and on the other side of the connection pads, the chip being connected to the said pads, characterized in that: micro-perforations pass through at least two contact pads, these micro - perforations being located above said antenna connection terminals and filled with an electrically conductive material.
  • the material consists of a superposition of points of conductive material obtained by the jet technology of material drops.
  • the cavity intended to receive the electronic module has a bottom revealing the connection terminals of one antenna.
  • the electronic module is a single-sided module comprising electrical contact areas on one side only.
  • the micro-perforations have a diameter less than or equal to 0.5 mm.
  • FIGS. 1A to 1B described above, sectional views of a smart card with hybrid operation during the stages of manufacturing of a previously envisaged process
  • FIG. 2A and 2B sectional views of a smart card illustrating the process according to one invention
  • FIG. 3 a schematic top view illustrating the cavity and antenna connection terminals before putting in place of the module
  • FIG. 4 is a schematic top view of the electronic module 20 intended to be placed in the cavity 100.
  • the card body is produced by gluing, for example by hot lamination, of superimposed plastic sheets 1-5 into which the conducting wire d has been inserted or inserted. antenna 12.
  • This antenna 12 is conventionally produced, on one of the plastic sheets of the assembly, by lammation of a conducting wire, or by inlaying, or even by a technique of printing conventional conductive ink, such as printing offset or pad printing or even screen printing for example.
  • the antenna can make several turns following the outer periphery of the card.
  • connection terminals 120 slightly spaced from one another.
  • the spacing between these two connection terminals 120 is chosen as a function of the contact pads 200 of the electronic module that will be inserted into the card.
  • the method of the invention makes it possible to use a single-sided module for the production of a hybrid card.
  • the contact pads 200 are in this case, as illustrated by FIGS. 2A and 2B on one side of the electronic module 20.
  • the cavity 100 is open in the assembled sheets to create there a housing reserved for the electronic module 20 which is placed so that two of its contact pads are located at the right of the two connection terminals 120 of the antenna.
  • the machining of the cavity 100 is carried out so that the connection terminals 120 of the antenna 12 are updated.
  • a second method consists in producing the cavity 100 during the assembly of the sheets for constituting the card body by laminating. These sheets then have perforations which, once the assembly has been completed, form the cavity.
  • the cavity 100 has, for example, a double bowl shape with two flat bottoms PI and P2.
  • the first flat bottom PI is produced in such a way that it is substantially flush with the plane of the connection terminals 120 of the antenna 12. In this way, the first flat bottom PI makes it possible to update the connection terminals 120.
  • the second flat bottom P2 is, for its part, produced between the connection terminals 120 and below their plane. This second flat bottom P2 is intended to receive the part of the electronic module 20 comprising the integrated circuit chip 21 embedded in a protective resin 212.
  • This cavity 100 making the connection terminals 120 of the antenna accessible, is also shown in plan view in FIG. 3.
  • it is preferably formed by two successive milling operations. Its shape is adapted to that of the electronic module 20 to be inserted.
  • the electronic module 20 is a single-sided printed circuit module carrying at least one integrated circuit chip 21. It includes an insulating support in the form of an insulating sheet 220, on the upper face of which the areas of contact 200.
  • the contact pads 200 are produced by any conventional process, such as printing of conductive ink, or metallization followed by etching for example.
  • the upper face of the module 20 is defined as being the face intended to be flush with the surface of the card 10.
  • the contact pads 200 are produced according to the usual ISO standards and will serve as access contacts for the smart card.
  • the integrated circuit chip 21 is for example glued to the underside of the insulating sheet 220 and is connected, by means of wires 211 welded for example, to the contact pads 200 by means of the perforations 210 of the support 220.
  • This chip 21 and the connecting wires 211 are encapsulated by the protective resin 212.
  • microperforations 213 of the module are produced before sticking it in the cavity 100 of the card body.
  • micro-perforations 213 may be produced directly on the support strip 220 of the contact pads 100, that is to say before transfer and bonding of the integrated circuit chip 21 on this support and cutting of the module for placing it place in the cavity 100.
  • micro-perforations are two in number and in fact pass through two contact pads as well as the support of the contact pads.
  • the micro-perforations 213 are located outside the area of connection of the chip 21 to the contact pads 200 as can be seen in FIG. 4. This area is standardized and corresponds substantially to the perimeter of the bottom of the cavity P2. The micro-perforations are intended to come opposite the connection terminals 120 of the antenna 12.
  • the module is placed in the cavity 100 where it is fixed in particular by an adhesive substance.
  • the connection between the antenna 12 and the integrated circuit chip 21 is made by means of the two contact pads on which the micro-perforations took place, and this thanks to metallization of said micro-perforations, produced by and of conductive material. .
  • the material used can be a conductive ink or molten metal.
  • two jet heads T1, T2 of known type will be used.
  • the invention thus makes it possible to considerably reduce the manufacturing costs of cards with mixed operation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention concerns a method for making smart cards, said smart card comprising a card body (10) enclosing an antenna (20) at the ends of which are provided connection terminals (120) to be connected to an electronic module (20) housed in a cavity of said card body, the electronic module comprising on one surface at least an integrated circuit chip and on the other surface connection pads, the chip being connected to said pads. The method comprises steps which consist in: producing micro-perforations (213) passing through at least two contact pads (200) and if necessary the support of said pads; connecting the antenna (120) to said pads (200) by spraying electrically conductive material into the micro-perforations.

Description

PROCEDE DE FABRICATION DE CARTES A PUCE HYBRIDES ET CARTES A PUCE OBTENUES PAR LEDIT PROCEDE. METHOD FOR MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED BY SAID METHOD.
La présente invention concerne la fabrication de cartes à puce, et plus particulièrement des cartes aptes à assurer un mode de fonctionnement à contacts et un mode de fonctionnement sans contact. On appellera ce type de carte, dans toute la suite de la description, cartes à fonctionnement mixte, ou carte à puce hybride ou « combicard ». Ce type de carte est muni d'une antenne noyée dans le corps de carte et d'un micromodule dit « double face » pour réaliser la connexion entre la puce de circuit intégré et 1 ' antenne .The present invention relates to the manufacture of smart cards, and more particularly of cards capable of ensuring a contact operating mode and a contactless operating mode. This type of card will be called, throughout the rest of the description, cards with mixed operation, or hybrid or “combicard” smart card. This type of card is provided with an antenna embedded in the card body and with a so-called "double-sided" micromodule to make the connection between the integrated circuit chip and the antenna.
Avec les cartes à fonctionnement mixte, les échanges d'informations avec l'extérieur se font soit par l'antenne qui assure un couplage électromagnétique entre l'électronique de la carte et un lecteur (fonctionnement sans contact), soit par les contacts affleurant la surface de la carte qui assurent une transmission électrique de données lorsqu'ils sont au contact d'une tête de lecture d'un lecteur (fonctionnement à contacts) .With mixed-operation cards, the exchange of information with the outside is done either by the antenna which ensures electromagnetic coupling between the card's electronics and a reader (contactless operation), or by the contacts flush with the surface of the card which ensures an electrical transmission of data when they are in contact with a read head of a reader (operation with contacts).
De telles cartes à fonctionnement mixte, ou a fonctionnement sans contact, sont destinées à réaliser diverses opérations telles que, par exemple, des opérations bancaires, des communications téléphoniques, diverses opérations d'identification, des opérations de débit ou de rechargement d'unités de compte, et toutes sortes d'opérations qui peuvent s'effectuer soit en insérant la carte dans un lecteur, soit à distance par couplage électromagnétique (en principe de type inductif) entre une borne d'émission-réception et une carte placée dans une zone d'action de cette borne. Les cartes à puce hybrides doivent avoir obligatoirement des dimensions normalisées identiques à celles des cartes à puce classiques pourvues de contacts. Ceci est souhaitable pour les cartes fonctionnant uniquement sans contact. Les dimensions de ces cartes sont définies par la norme usuelle ISO 7810 qui correspond à une carte de format standard de 85 mm de long, 54 mm de large et 0,76 mm d'épaisseur.Such cards with mixed operation, or with contactless operation, are intended to perform various operations such as, for example, banking operations, telephone communications, various identification operations, debit operations or reloading of credit units. account, and all kinds of operations which can be carried out either by inserting the card in a reader, or remotely by electromagnetic coupling (in principle of inductive type) between a transmission-reception terminal and a card placed in a zone of action of this terminal. Hybrid smart cards must have standardized dimensions identical to those of conventional smart cards with contacts. This is desirable for cards operating only contactless. The dimensions of these cards are defined by the usual standard ISO 7810 which corresponds to a standard format card 85 mm long, 54 mm wide and 0.76 mm thick.
Ces normes imposent des contraintes sévères pour la fabrication. L'épaisseur très faible de la carte est en particulier une contrainte majeure, plus sévère encore pour les cartes mixtes que pour les cartes simplement munies de contacts, car il faut prévoir l'incorporation d'une antenne dans la carte. Les problèmes techniques principaux qui se posent sont des problèmes de positionnement de l'antenne par rapport à la carte, car l'antenne occupe presque toute la surface de la carte, des problèmes de positionnement du module électrique de circuit intégré (comprenant la puce et les plages de contacts) qui assure le fonctionnement électronique de la carte et des problèmes de précision et de fiabilité de la connexion entre le module et l'antenne. Les contraintes de tenue mécanique, de fiabilité et de coût de fabrication doivent également être prises en compte.These standards impose severe constraints for manufacturing. The very small thickness of the card is in particular a major constraint, even more severe for mixed cards than for cards simply provided with contacts, since it is necessary to provide for the incorporation of an antenna in the card. The main technical problems which arise are problems of positioning the antenna with respect to the card, since the antenna occupies almost the entire surface of the card, problems of positioning of the electrical integrated circuit module (comprising the chip and the contact areas) which ensures the electronic operation of the card and the problems of precision and reliability of the connection between the module and the antenna. The constraints of mechanical strength, reliability and manufacturing cost must also be taken into account.
L'antenne est généralement constituée d'un élément conducteur déposé en couche mince sur une feuille support en plastique. Aux extrémités de l'antenne sont prévues des bornes de connexion qui doivent être mises à jour afin de pouvoir les connecter aux plages de contact du module électronique.The antenna generally consists of a conductive element deposited in a thin layer on a plastic support sheet. Connection terminals are provided at the ends of the antenna which must be updated in order to be able to connect them to the contact pads of the electronic module.
L'élément conducteur formant l'antenne sera dénommé dans la suite fil d'antenne, étant donné qu'il pourra s'agir, selon la technologie employée, soit d'un fil incrusté ou laminé sur une feuille support de fabrication, soit de pistes conductrices imprimées sur cette feuille support.The conductive element forming the antenna will be called in the following antenna wire, since it may be, depending on the technology used, either a wire inlaid or laminated on a manufacturing support sheet, or conductive tracks printed on this support sheet.
Une solution envisagée pour fabriquer ces cartes à puce hybrides est illustrée sur les figures 1A et 1B. Cette solution consiste dans un premier temps à réaliser, sur une feuille support 11, une antenne 12. Dans le cas où l'antenne comporte plusieurs spires, avant l'agencement ces spires peuvent être placées à l'extérieur des bornes de connexion 120. Alors un pont isolant permet de relier chacune des extrémités de l'antenne respectivement à une borne de connexion de 1 ' antenne .A solution envisaged for manufacturing these hybrid smart cards is illustrated in FIGS. 1A and 1B. This solution consists firstly in producing, on a support sheet 11, an antenna 12. In the case where the antenna comprises several turns, before the arrangement these turns can be placed outside the connection terminals 120. Then an insulating bridge makes it possible to connect each of the ends of the antenna respectively to a connection terminal of the antenna.
Dans un deuxième temps, la feuille 11 supportant le fil d'antenne 12 ainsi réalisé est assemblée avec d'autres feuilles plastiques 2, 3, 4, 5 pour former le corps 10 de carte.In a second step, the sheet 11 supporting the antenna wire 12 thus produced is assembled with other plastic sheets 2, 3, 4, 5 to form the card body 10.
Ce corps 10 de carte est ensuite usiné de manière à former d'une part, une cavité 100 réservée à un module électronique 20 double face et situé entre les bornes de connexion 120 de l'antenne 12, et d'autre part, des puits de connexion 121 destinés à mettre à jour les bornes de connexion 120 de l'antenne 12. Les puits de connexion 121 sont ensuite remplis par une substance électriquement conductrice qui assure la liaison électrique entre l'antenne et des plages de contact 201 du module électronique 20.This card body 10 is then machined so as to form on the one hand, a cavity 100 reserved for a double-sided electronic module 20 and located between the connection terminals 120 of the antenna 12, and on the other hand, wells 121 for updating the connection terminals 120 of the antenna 12. The connection wells 121 are then filled with an electrically conductive substance which provides the electrical connection between the antenna and contact pads 201 of the electronic module 20.
Cependant, cette solution reste encore relativement coûteuse. En effet, elle oblige à réaliser des modules électroniques double face, c'est-à-dire des modules dont les plages de contact se prolongent de manière à s'étendre sur la face du module en regard des bornes de connexion de l'antenne. En outre, l'étape spécifique d'usinage des puits de connexion, pour rattraper les bornes de connexion de l'antenne, contribue à l'obtention d'un coût de fabrication relativement élevé .However, this solution is still relatively expensive. Indeed, it requires the production of double-sided electronic modules, that is to say modules whose contact pads extend so as to extend on the face of the module opposite the antenna connection terminals. . In addition, the specific step of machining the connection wells, to catch up with the antenna connection terminals, contributes to obtaining a relatively high manufacturing cost.
De plus, le remplissage des puits de connexion par une substance électriquement conductrice, pour réaliser la liaison électrique entre le module et l'antenne, est une opération délicate à mettre en œuvre qui a tendance à entraîner une diminution du rendement de fabrication et, par conséquent, une augmentation du prix de revient .In addition, filling the connection wells with an electrically conductive substance, to make the electrical connection between the module and the antenna, is a delicate operation to carry out which tends to cause a reduction in the manufacturing yield and, by Consequently, an increase in the cost price.
Enfin, une adhérence de bonne qualité entre le module électronique et la substance électriquement conductrice est relativement difficile à obtenir, si bien que la connexion électrique entre le module et l'antenne n'est pas toujours fiable, ce qui implique qu'un grand nombre de cartes est encore destiné au rebut. Ce nombre élevé de cartes destinées au rebut contribue également à augmenter le prix de revient des cartes . Etant donné que les cartes à puce hybrides sont destinées à être fabriquées en très grande quantité, afin d'être distribuées dans le grand public, il faut pouvoir réduire au maximum leur coût de fabrication.Finally, good quality adhesion between the electronic module and the electrically conductive substance is relatively difficult to obtain, so that the electrical connection between the module and the antenna is not always reliable, which implies that a large number of cards is still intended for scrap. This high number of cards intended for scrap also contributes to increasing the cost price of the cards. Since hybrid smart cards are intended to be manufactured in very large quantities, in order to be distributed to the general public, it must be possible to reduce their manufacturing cost as much as possible.
Un but de la présente invention consiste donc à supprimer les étapes spécifiques les plus coûteuses, c'est-à-dire notamment l'usinage des puits de connexion et à simplifier les autres étapes.An object of the present invention therefore consists in eliminating the most expensive specific steps, that is to say in particular the machining of the connection wells and in simplifying the other steps.
Pour cela, l'invention propose un procédé de fabrication d'une carte à puce, ladite carte à puce comportant un corps de carte enfermant une antenne aux extrémités de laquelle sont prévues des bornes de connexion destinées à être reliées à un module électronique logé dans une cavité dudit corps de carte, le module électronique comprenant sur une face au moins une puce de circuit intégré et sur l'autre face des plages de connexion, la puce étant connectée aux dites plages, principalement caractérisé en ce qu'il comporte les étapes suivantes :For this, the invention provides a method of manufacturing a smart card, said smart card comprising a card body enclosing an antenna at the ends of which are provided connection terminals intended to be connected to an electronic module housed in a cavity of said card body, the electronic module comprising on one side at least one integrated circuit chip and on the other side of the connection pads, the chip being connected to the said pads, mainly characterized in that it comprises the following steps:
- réalisation de micro perforations traversant au moins deux plages de contact,- making micro perforations crossing at least two contact pads,
- connexion de l'antenne aux dites plages de contact par jet de matière électriquement conductrice dans les micro- perforations.- connection of the antenna to said contact pads by jet of electrically conductive material in the micro-perforations.
Selon une autre caractéristique, les microperforations sont réalisées directement sur les plages de contact avant collage et connexion de la puce aux dites plages. A cette fin, la cavité destinée à recevoir le module électronique, est réalisée de manière à laisser les bornes de connexion de l'antenne apparentes.According to another characteristic, the microperforations are carried out directly on the contact pads before bonding and connection of the chip to said pads. To this end, the cavity intended to receive the electronic module is produced so as to leave the antenna connection terminals visible.
Le report du module électronique dans la cavité est réalisé de manière à ce que les micro- perforations soient situées au-dessus des bornes de connexion de 1 ' antenne .The electronic module is transferred into the cavity so that the micro-perforations are located above the connection terminals of the antenna.
Selon une autre caractéristique, la matière électriquement conductrice est une encre conductrice.According to another characteristic, the electrically conductive material is a conductive ink.
Selon une autre caractéristique, la matière électriquement conductrice est un métal en fusion.According to another characteristic, the electrically conductive material is a molten metal.
Dans le cas où les plages de contact sont placées sur un support, les perforations traversent également ce support .In the case where the contact pads are placed on a support, the perforations also pass through this support.
Avantageusement le module électronique est un module simple face.Advantageously, the electronic module is a single-sided module.
Selon un mode de réalisation, la cavité est obtenue par usinage d'une ouverture dans le corps de carte, dans lequel sont noyées 1 ' antenne et ses bornes de connexion. Selon un autre mode de réalisation, la cavité est obtenue par lamination de feuilles comportant des perforations correspondant à la cavité.According to one embodiment, the cavity is obtained by machining an opening in the card body, in which the antenna and its connection terminals are embedded. According to another embodiment, the cavity is obtained by lamination of sheets comprising perforations corresponding to the cavity.
Un autre objet de l'invention concerne une carte à puce hybride comportant un corps de carte enfermant une antenne aux extrémités de laquelle sont prévues des bornes de connexion destinées à être reliées à un module électronique logé dans une cavité dudit corps de carte, le module électronique comprenant sur une face au moins une puce de circuit intégré et sur l'autre face des plages de connexion, la puce étant connectée aux dites plages, caractérisé en ce que: des micro-perforations traversent au moins deux plages de contact, ces micro- perforations étant situées au-dessus desdites bornes de connexion de l'antenne et remplies d'une matière électriquement conductrice .Another object of the invention relates to a hybrid smart card comprising a card body enclosing an antenna at the ends of which are provided connection terminals intended to be connected to an electronic module housed in a cavity of said card body, the module electronics comprising on one side at least one integrated circuit chip and on the other side of the connection pads, the chip being connected to the said pads, characterized in that: micro-perforations pass through at least two contact pads, these micro - perforations being located above said antenna connection terminals and filled with an electrically conductive material.
La matière est constituée d'une superposition de points de matière conductrice obtenus par la technologie jet de gouttes de matière.The material consists of a superposition of points of conductive material obtained by the jet technology of material drops.
Selon une autre caractéristique, la cavité destinée à recevoir le module électronique comporte un fond laissant apparaître les bornes de connexion de 1 ' antenne . Le module électronique est un module simple face comportant des plages de contacts électriques sur une face uniquement .According to another characteristic, the cavity intended to receive the electronic module has a bottom revealing the connection terminals of one antenna. The electronic module is a single-sided module comprising electrical contact areas on one side only.
Les micro-perforations ont un diamètre inférieur ou égal à 0,5 mm.The micro-perforations have a diameter less than or equal to 0.5 mm.
D'autres particularités et avantages de la présente invention apparaîtront à la lecture de la description donnée à titre d'exemple illustratif, et non limitatif et faite en référence aux figures annexées qui représentent :Other features and advantages of the present invention will appear on reading the description given by way of illustrative and non-limiting example. and made with reference to the appended figures which represent:
- les figures 1A à 1B, dé à décrites, des vues en coupe d'une carte à puce à fonctionnement hybride au cours des étapes de fabrication d'un procédé envisagé antérieurement ,FIGS. 1A to 1B, described above, sectional views of a smart card with hybrid operation during the stages of manufacturing of a previously envisaged process,
- les figures 2A et 2B, des vues en coupe d'une carte à puce illustrant le procédé conforme à 1 ' invention, - la figure 3, une vue de dessus schématique illustrant la cavité et les bornes de connexion d'antennes avant la mise en place du module,- Figures 2A and 2B, sectional views of a smart card illustrating the process according to one invention, - Figure 3, a schematic top view illustrating the cavity and antenna connection terminals before putting in place of the module,
- la figure 4 une vue de dessus schématique du module électronique 20 destiné à être mis en place dans la cavité 100.- Figure 4 is a schematic top view of the electronic module 20 intended to be placed in the cavity 100.
On va décrire le procédé de l'invention à l'aide schémas des figures 2A, 2B à 4. Cependant, les étapes de fabrication du corps de carte peuvent à titre d'exemple, être celles qui ont été décrites à propos de la figure 1A.The process of the invention will be described using the diagrams in FIGS. 2A, 2B to 4. However, the steps for manufacturing the card body may, by way of example, be those which have been described with reference to the figure. 1A.
En effet, comme cela a été décrit pour l'art antérieur, le corps de carte est réalisé par collage, par exemple par 1amination à chaud, de feuilles de matière plastique 1-5 superposées dans lesquelles on a inséré ou intercalé le fil conducteur d'antenne 12.In fact, as has been described for the prior art, the card body is produced by gluing, for example by hot lamination, of superimposed plastic sheets 1-5 into which the conducting wire d has been inserted or inserted. antenna 12.
Cette antenne 12 est réalisée classiquement, sur l'une des feuilles plastiques de l'assemblage, par lammation d'un fil conducteur, ou par incrustation, ou encore par une technique d'impression d'encre conductrice classique, telle qu'une impression offset ou une impression par tampographie ou encore une sérigraphie par exemple. L'antenne peut faire plusieurs tours en suivant la périphérie extérieure de la carte.This antenna 12 is conventionally produced, on one of the plastic sheets of the assembly, by lammation of a conducting wire, or by inlaying, or even by a technique of printing conventional conductive ink, such as printing offset or pad printing or even screen printing for example. The antenna can make several turns following the outer periphery of the card.
Dans cet exemple on a illustré le cas d'une antenne ne comportant qu'un tour. Les extrémités de l'antenne sont reliées à deux bornes de connexion 120 légèrement espacées l'une de l'autre. L'espacement entre ces deux bornes de connexion 120 est choisi en fonction des plages de contact 200 du module électronique que l'on va insérer dans la carte. Le procédé de l'invention permet d'utiliser un module simple face pour la réalisation d'une carte hybride .In this example, the case of an antenna comprising only one tower has been illustrated. The ends of the antenna are connected to two connection terminals 120 slightly spaced from one another. The spacing between these two connection terminals 120 is chosen as a function of the contact pads 200 of the electronic module that will be inserted into the card. The method of the invention makes it possible to use a single-sided module for the production of a hybrid card.
Les plages de contact 200 se trouvent dans ce cas, comme cela est illustré par des figures 2A et 2B sur une seule face du module électronique 20.The contact pads 200 are in this case, as illustrated by FIGS. 2A and 2B on one side of the electronic module 20.
La cavité 100 est ouverte dans les feuilles assemblées pour y créer un logement réservé au module électronique 20 qui est placé de sorte que deux de ses plages de contact se trouvent au droit des deux bornes de connexion 120 de l'antenne.The cavity 100 is open in the assembled sheets to create there a housing reserved for the electronic module 20 which is placed so that two of its contact pads are located at the right of the two connection terminals 120 of the antenna.
L'usinage de la cavité 100 est réalisé de manière à ce que les bornes de connexion 120 de l'antenne 12 soient mises à jour.The machining of the cavity 100 is carried out so that the connection terminals 120 of the antenna 12 are updated.
Une deuxième méthode consiste à réaliser la cavité 100 lors de l'assemblage des feuilles de constitution du corps de carte par laminâtion. Ces feuilles comportent alors des perforations qui, une fois l'assemblage réalisé, forment la cavité.A second method consists in producing the cavity 100 during the assembly of the sheets for constituting the card body by laminating. These sheets then have perforations which, once the assembly has been completed, form the cavity.
La cavité 100 a par exemple une forme de cuvette double à deux fonds plats PI et P2. Le premier fond plat PI est réalisé de telle sorte qu'il affleure sensiblement le plan des bornes de connexion 120 de l'antenne 12. De cette manière, le premier fond plat PI permet de mettre à jour les bornes de connexion 120. Le deuxième fond plat P2 est, quant à lui, réalisé entre les bornes de connexion 120 et en dessous de leur plan. Ce deuxième fond plat P2 est destiné à recevoir la partie du module électronique 20 comprenant la puce de circuit intégré 21 enrobée dans une résine de protection 212.The cavity 100 has, for example, a double bowl shape with two flat bottoms PI and P2. The first flat bottom PI is produced in such a way that it is substantially flush with the plane of the connection terminals 120 of the antenna 12. In this way, the first flat bottom PI makes it possible to update the connection terminals 120. The second flat bottom P2 is, for its part, produced between the connection terminals 120 and below their plane. This second flat bottom P2 is intended to receive the part of the electronic module 20 comprising the integrated circuit chip 21 embedded in a protective resin 212.
Cette cavité 100, permettant de rendre accessibles les bornes de connexion 120 de l'antenne, est également représentée en vue de dessus sur la figure 3. Lorsqu'elle est obtenue par usinage, elle est de préférence formée par deux opérations de fraisage successives. Sa forme est adaptée à celle du module électronique 20 à insérer.This cavity 100, making the connection terminals 120 of the antenna accessible, is also shown in plan view in FIG. 3. When it is obtained by machining, it is preferably formed by two successive milling operations. Its shape is adapted to that of the electronic module 20 to be inserted.
Le module électronique 20 est un module à circuit imprimé simple face portant au moins une puce de circuit intégré 21. Il comporte un support isolant se présentant sous la forme d'une feuille isolante 220, sur la face supérieure de laquelle sont réalisées les plages de contact 200. Les plages de contact 200 sont réalisées par un procédé classique quelconque, tel que l'impression d'encre conductrice, ou encore une métallisation suivie d'une gravure par exemple.The electronic module 20 is a single-sided printed circuit module carrying at least one integrated circuit chip 21. It includes an insulating support in the form of an insulating sheet 220, on the upper face of which the areas of contact 200. The contact pads 200 are produced by any conventional process, such as printing of conductive ink, or metallization followed by etching for example.
La face supérieure du module 20 est définie comme étant la face destinée à affleurer la surface de la carte 10. Les plages de contact 200 sont réalisées aux normes usuelles ISO et serviront de contacts d'accès de la carte à puce.The upper face of the module 20 is defined as being the face intended to be flush with the surface of the card 10. The contact pads 200 are produced according to the usual ISO standards and will serve as access contacts for the smart card.
La puce de circuit intégré 21 est par exemple collée sur la face inférieure de la feuille isolante 220 et se trouve reliée, par l'intermédiaire de fils 211 soudés par exemple, aux plages de contact 200 au moyen des perforations 210 du support 220. Cette puce 21 et les fils de liaison 211 sont encapsulés par la résine de protection 212.The integrated circuit chip 21 is for example glued to the underside of the insulating sheet 220 and is connected, by means of wires 211 welded for example, to the contact pads 200 by means of the perforations 210 of the support 220. This chip 21 and the connecting wires 211 are encapsulated by the protective resin 212.
Selon le procédé proposé, on réalise des microperforations 213 du module avant de le coller dans la cavité 100 du corps de carte.According to the proposed method, microperforations 213 of the module are produced before sticking it in the cavity 100 of the card body.
De façon pratique ces micro-perforations 213 pourront être réalisées directement sur la bande support 220 des plages de contact 100, c'est à dire avant report et collage de la puce de circuit intégré 21 sur ce support et découpe du module pour sa mise en place dans la cavité 100.In practical terms, these micro-perforations 213 may be produced directly on the support strip 220 of the contact pads 100, that is to say before transfer and bonding of the integrated circuit chip 21 on this support and cutting of the module for placing it place in the cavity 100.
Ces micro-perforations sont au nombre de deux et traversent en fait deux plages de contact ainsi que le support des plages de contact . Les micro-perforations 213 sont situées en dehors de la zone de connexion de la puce 21 aux plages de contact 200 comme on peut le voir sur la figure 4. Cette zone est normalisée et correspond sensiblement au périmètre du fond de cavité P2. Les micro-perforations sont destinées à venir en regard des bornes de connexion 120 de l'antenne 12.These micro-perforations are two in number and in fact pass through two contact pads as well as the support of the contact pads. The micro-perforations 213 are located outside the area of connection of the chip 21 to the contact pads 200 as can be seen in FIG. 4. This area is standardized and corresponds substantially to the perimeter of the bottom of the cavity P2. The micro-perforations are intended to come opposite the connection terminals 120 of the antenna 12.
Après réalisation des micro- perforations 213, le module est mis en place dans la cavité 100 où il est fixé notamment par une substance adhésive. La connexion entre l'antenne 12 et la puce de circuit intégrée 21 est réalisée par l'intermédiaire des deux plages de contacts sur lesquelles ont eu lieu les micro-perforations et cela grâce à une métallisation desdites micro perforations, réalisée par et de matière conductrice.After the micro-perforations 213 have been produced, the module is placed in the cavity 100 where it is fixed in particular by an adhesive substance. The connection between the antenna 12 and the integrated circuit chip 21 is made by means of the two contact pads on which the micro-perforations took place, and this thanks to metallization of said micro-perforations, produced by and of conductive material. .
La matière utilisée peut être une encre conductrice ou du métal en fusion. Pour réaliser la métallisation des microperforations, on utilisera deux têtes d'impression par jet Tl, T2 de type connu.The material used can be a conductive ink or molten metal. To make the metallization of the microperforations, two jet heads T1, T2 of known type will be used.
L'invention permet ainsi de réduire considérablement les coûts de fabrication des cartes à fonctionnement mixtes. The invention thus makes it possible to considerably reduce the manufacturing costs of cards with mixed operation.

Claims

REVENDICATIONS
1. Procédé de fabrication d'une carte à puce, ladite carte à puce comportant un corps de carte (10) enfermant une antenne (20) aux extrémités de laquelle sont prévues des bornes de connexion (120) destinées à être reliées à un module électronique (20) logé dans une cavité dudit corps de carte, le module électronique comprenant sur une face au moins une puce de circuit intégré et sur l'autre face des plages de contact, la puce étant connectée aux dites plages, caractérisé en ce qu'il comporte les étapes suivantes : réalisation de micro-perforations (213) traversant au moins deux plages de contact (200) ,1. A method of manufacturing a smart card, said smart card comprising a card body (10) enclosing an antenna (20) at the ends of which are provided connection terminals (120) intended to be connected to a module electronics (20) housed in a cavity of said card body, the electronic module comprising on one side at least one integrated circuit chip and on the other side of the contact pads, the chip being connected to said pads, characterized in that 'it includes the following steps: making micro-perforations (213) passing through at least two contact pads (200),
- connexion de l'antenne (12) aux plages de contact (200) par jet de matière électriquement conductrice dans les micro-perforations .- Connection of the antenna (12) to the contact pads (200) by jet of electrically conductive material in the micro-perforations.
2. Procédé de fabrication selon la revendication2. Manufacturing method according to claim
1, caractérisé en ce que les micro-perforations (213) sont réalisées directement sur les plages de contact (200) avant collage et connexion de la puce aux dites plages de contact .1, characterized in that the micro-perforations (213) are produced directly on the contact pads (200) before bonding and connection of the chip to said contact pads.
3. Procédé de fabrication selon la revendication3. Manufacturing method according to claim
2, caractérisé en ce que la cavité (100) destinée à recevoir le module électronique (20) , est réalisée de manière à laisser les bornes de connexion (120) de l'antenne apparentes.2, characterized in that the cavity (100) intended to receive the electronic module (20), is produced so as to leave the connection terminals (120) of the antenna visible.
4. Procédé de fabrication selon l'une quelconque des revendications précédentes, caractérisé en ce que le report du module électronique (20) dans la cavité (100) est réalisé de manière à ce que les microperforations (213) soient situées au-dessus des bornes de connexion (120) de l'antenne.4. Manufacturing method according to any one of the preceding claims, characterized in that the transfer of the electronic module (20) into the cavity (100) is made so that the microperforations (213) are located above the connection terminals (120) of the antenna.
5. Procédé de fabrication d'une carte à puce selon l'une quelconque des revendications précédentes, caractérisé en ce que les plages de contact (200) sont placées sur un support (220) et en ce que les perforations (213) traversent également ce support (220) .5. Method of manufacturing a smart card according to any one of the preceding claims, characterized in that the contact pads (200) are placed on a support (220) and in that the perforations (213) also pass through this support (220).
6. Procédé de fabrication d'une carte à puce selon l'une quelconque des revendications précédentes, caractérisé en ce que la matière électriquement conductrice est une encre conductrice.6. A method of manufacturing a smart card according to any one of the preceding claims, characterized in that the electrically conductive material is a conductive ink.
7. Procédé de fabrication d'une carte à puce selon l'une quelconque des revendications précédentes caractérisé en ce que la matière électriquement conductrice est un métal en fusion.7. A method of manufacturing a smart card according to any one of the preceding claims characterized in that the electrically conductive material is a molten metal.
8. Procédé selon l'une quelconque des revendications précédentes la revendication 1, caractérisé en ce que le module électronique est un module simple face.8. Method according to any one of the preceding claims claim 1, characterized in that the electronic module is a single-sided module.
9. Carte à puce hybride comportant un corps de carte (10) enfermant une antenne (20) aux extrémités de laquelle sont prévues des bornes de connexion (120) destinées à être reliées à un module électronique (20) logé dans une cavité dudit corps de carte, le module électronique comprenant sur une face au moins une puce de circuit intégré (21) et sur l'autre face des plages de contact (200) , la puce étant connectée aux dites plages, caractérisé en ce que: des micro-perforations (213) traversent au moins deux plages de contact (200) , ces micro-perforations étant situées au-dessus des bornes de connexion de l'antenne et remplies d'une matière électriquement conductrice .9. Hybrid smart card comprising a card body (10) enclosing an antenna (20) at the ends of which are provided connection terminals (120) intended to be connected to an electronic module (20) housed in a cavity of said body card, the electronic module comprising on one side at least one integrated circuit chip (21) and on the other side of the pads contact (200), the chip being connected to said areas, characterized in that: micro-perforations (213) pass through at least two contact areas (200), these micro-perforations being located above the connection terminals of the antenna and filled with an electrically conductive material.
10. Carte à puce hybride selon la revendication 9, caractérisé en ce que la matière est constituée d'une superposition de points de matière conductrice obtenus par la technologie jet de gouttes de matière.10. Hybrid smart card according to claim 9, characterized in that the material consists of a superposition of points of conductive material obtained by the jet of material drop technology.
11. Carte à puce hybride selon l'une quelconque des revendications précédentes, caractérisé en ce que la cavité (100) destinée à recevoir le module électronique (20) comporte un fond laissant apparaître les bornes de connexion de l'antenne.11. Hybrid smart card according to any one of the preceding claims, characterized in that the cavity (100) intended to receive the electronic module (20) has a bottom revealing the connection terminals of the antenna.
12. Carte à puce hybride selon l'une quelconque des revendications précédentes, caractérisé en ce que le module électronique (20) est un module simple face comportant des plages de contacts électriques sur une face uniquement .12. Hybrid smart card according to any one of the preceding claims, characterized in that the electronic module (20) is a single-sided module comprising electrical contact areas on one side only.
13 Carte à puce hybride selon l'une quelconque des revendications précédentes, caractérisé en ce que les micro-perforations (213) ont un diamètre inférieur ou égal à 0,5 mm. 13 Hybrid smart card according to any one of the preceding claims, characterized in that the micro-perforations (213) have a diameter less than or equal to 0.5 mm.
PCT/FR2000/002260 1999-08-25 2000-08-07 Method for making hybrid smart cards and smart cards obtained by said method WO2001015504A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU68510/00A AU6851000A (en) 1999-08-25 2000-08-07 Method for making hybrid smart cards and smart cards obtained by said method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR99/10784 1999-08-25
FR9910784A FR2797976B1 (en) 1999-08-25 1999-08-25 METHOD FOR MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED BY SAID METHOD

Publications (1)

Publication Number Publication Date
WO2001015504A1 true WO2001015504A1 (en) 2001-03-01

Family

ID=9549334

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2000/002260 WO2001015504A1 (en) 1999-08-25 2000-08-07 Method for making hybrid smart cards and smart cards obtained by said method

Country Status (3)

Country Link
AU (1) AU6851000A (en)
FR (1) FR2797976B1 (en)
WO (1) WO2001015504A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2575086A1 (en) 2011-09-27 2013-04-03 Gemalto SA Method for connecting a microcircuit with conductive areas embedded in a medium

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2541471A1 (en) * 2011-07-01 2013-01-02 Gemalto SA Portable device with recessed electrical contacts

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2468279A1 (en) * 1979-10-19 1981-04-30 Dujardin Editions Printed circuit board - has connections between faces through micro sized holes crossing thickness of board and linking components to tracks
WO1988009598A1 (en) * 1987-05-19 1988-12-01 Rino Doriguzzi Application of the ink jet process for manufacturing hybrid and printed electronic circuits
DE3728151A1 (en) * 1987-08-24 1989-03-09 Theo Dipl Ing Schmeller Method and device for producing through-plated holes in printed circuits by direct injection of the contact metal in the liquid state
US5133120A (en) * 1990-07-11 1992-07-28 Nippon Cmk Corp. Method of filling conductive material into through holes of printed wiring board
DE4327560A1 (en) * 1993-08-17 1995-02-23 Hottinger Messtechnik Baldwin Method for connecting interconnection arrangements and contact arrangement
DE19618099A1 (en) * 1996-05-06 1997-11-13 Siemens Ag Compound conductor system and method for producing electrically conductive connections between two or more conductor structures
DE19709985A1 (en) * 1997-03-11 1998-09-17 Pav Card Gmbh Smart card for data transmission using contact- or contactless technology
JPH11224316A (en) * 1998-02-06 1999-08-17 Toppan Printing Co Ltd Composite type ic card

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2468279A1 (en) * 1979-10-19 1981-04-30 Dujardin Editions Printed circuit board - has connections between faces through micro sized holes crossing thickness of board and linking components to tracks
WO1988009598A1 (en) * 1987-05-19 1988-12-01 Rino Doriguzzi Application of the ink jet process for manufacturing hybrid and printed electronic circuits
DE3728151A1 (en) * 1987-08-24 1989-03-09 Theo Dipl Ing Schmeller Method and device for producing through-plated holes in printed circuits by direct injection of the contact metal in the liquid state
US5133120A (en) * 1990-07-11 1992-07-28 Nippon Cmk Corp. Method of filling conductive material into through holes of printed wiring board
DE4327560A1 (en) * 1993-08-17 1995-02-23 Hottinger Messtechnik Baldwin Method for connecting interconnection arrangements and contact arrangement
DE19618099A1 (en) * 1996-05-06 1997-11-13 Siemens Ag Compound conductor system and method for producing electrically conductive connections between two or more conductor structures
DE19709985A1 (en) * 1997-03-11 1998-09-17 Pav Card Gmbh Smart card for data transmission using contact- or contactless technology
JPH11224316A (en) * 1998-02-06 1999-08-17 Toppan Printing Co Ltd Composite type ic card

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 13 30 November 1999 (1999-11-30) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2575086A1 (en) 2011-09-27 2013-04-03 Gemalto SA Method for connecting a microcircuit with conductive areas embedded in a medium

Also Published As

Publication number Publication date
FR2797976B1 (en) 2002-03-22
FR2797976A1 (en) 2001-03-02
AU6851000A (en) 2001-03-19

Similar Documents

Publication Publication Date Title
FR2716281A1 (en) Method of manufacturing a contactless card.
FR2756955A1 (en) METHOD FOR PRODUCING AN ELECTRONIC CIRCUIT FOR A CONTACTLESS MEMORY CARD
WO1999018541A1 (en) Method for making smart cards capable of operating with and without contact
EP3201843B1 (en) Chip card manufacturing method, and chip card obtained by said method
WO2015101489A9 (en) Electronic module, method for manufacturing same, and electronic device comprising a module of said type
EP3408799B1 (en) Method for manufacturing a smart card module and a smart card
EP2178032B1 (en) Module, chip card and corresponding manufacturing method
WO2000025265A1 (en) Method for making a chip card and an electronic module designed to be inserted in such a card
EP1190377B1 (en) Method for the production of a portable integrated circuit electronic device comprising a low-cost dielectric
FR2810768A1 (en) Method of fabrication of hybrid smart card with ohmic contacts and delocalized connection passages, uses passages passing through card and filled with conductive material to provide connection between chip and surface of card
EP2866173B1 (en) Method for manufacturing an electric circuit and electric circuit manufactured by said method
EP2045765B1 (en) Method of manufacturing an electronic key with USB connector
CA2293460A1 (en) Method for making a contactless smart card
EP1084481A1 (en) Method for making a portable electronic device comprising at least an integrated circuit chip
WO2000030032A1 (en) Method for making a hybrid smart card by double face printing
WO2001015504A1 (en) Method for making hybrid smart cards and smart cards obtained by said method
EP4154180A1 (en) Method for electrochemical metallisation of a double-sided electrical circuit for a smart card and electrical circuit produced using said method
EP1190379B1 (en) Method for producing contact chip cards with a low-cost dielectric
EP0969410B1 (en) Chip card comprising an antenna
FR3083892A1 (en) DUAL COMMUNICATION INTERFACE CHIP CARD AND MANUFACTURING METHOD THEREOF
WO2005064533A1 (en) Methods for the production of an external-contact-free card and card thus obtained
WO2003038746A1 (en) Deformable strip which is integrated into a module for core electrical connection
FR2795200A1 (en) ELECTRONIC DEVICE COMPRISING AT LEAST ONE CHIP FIXED ON A SUPPORT AND METHOD OF MANUFACTURING SUCH A DEVICE
FR2798002A1 (en) METHOD FOR MANUFACTURING ELECTRONIC MICROMODULES COMPRISING AN ANTENNA AND MICROMODULES OBTAINED BY THE PROCESS
FR3030087A1 (en) MODULE FOR MICROCIRCUIT CARDS, MICROCIRCUIT CARDS COMPRISING SUCH A MODULE AND METHOD OF MANUFACTURE

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP