DE19709985A1 - Smart card for data transmission using contact- or contactless technology - Google Patents

Abstract

The smart card comprises a body with recess (24) containing a chip with antenna contacts (31, 32). A layer (11) includes antenna(e), especially formed as coil in the body, having contacts (20, 21) for connection to the chip. The contacts have thickened sections (16, 17) embedded into the body of the card. These are coated on during working or milling of the recess. They form a conductive connection between the antenna contacts and the chip contacts (20, 21). Further claims include: the method of making the smart card; the smart card itself, with data transmission using contact-, or especially contactless technology; and a method of making both electrical and mechanical connections to a module using a hot-bonding or hot-melt adhesive. The corresponding bonding and arrangements are also claimed.

Description

The invention relates to a chip card, a connection arrangement voltage and a method for producing a chip card, wherein a semiconductor chip located on a module in an out Take a card holder while receiving an electrical and mechanical connection is used.

Chip cards for contact, but also contactless, d. H. Inductive data transmission have one with the cards body connected chip card module, one on one Plastic carrier located semiconductor chip, which in the case of contact cards with a galvanically generated one Contact field is connected. Be in a card reader these contact areas are electrically scanned so that the requ communication becomes possible.  

For contactless, inductive systems, this is done Data transmission through alternating electromagnetic fields, by means of at least one in the chip card or in the card carrier arranged induction coil or antenna.

In the case of so-called combination cards, both systems mentioned are in united in one card. The combination card therefore has both via a contact field for contact transfer as also via an inductively connectable contact. It is for that required, in addition to the electrically conductive connections from Semiconductor chip for the system for contact transmission also connections to the system for inductive data transmission manufacturing.

In a known method for producing a chip card, especially those where both means of contactless Data transmission as well as the mentioned galvanic contact level exists, a module is placed in a card body introduced, which comprises an IC chip.

The module is inserted into a recess in the card body and by joining or the like with the card body while maintaining a corresponding mechanical and electrical connection laminated.

An electrically conductive connection between the module and Card body or contacts located on the card body, which are connected to the induction coil comes with for example, the fact that an anisotropic conductor Adhesive in the area of the connection points and / or the connection of the respective agent for a contactless Data transfer applied and the adhesive at least in Area of the connection points so compressed or kompri is lubricated that an electrically conductive bridge is formed.

In the case of an adhesive with conductive particles, this leads so that the particles in the area between the connection and the means for contactless data transmission touch, resulting in the conductive connection.  

The modules used in the production of chip cards usually fall back on a plastic carrier the IC chip mentioned at the outset, if necessary, with ISO contact surfaces is provided. The prefabricated module comes with the card carrier z. B. can consist of polycarbonate, connected. This connecting or inserting the module in the card body in a z. B. milled recess usually using a gluing process Use a hot or hot melt adhesive.

In the case when the combo cards, both for contact loose and suitable for contact use, or contactless cards are to be produced, one must further contact level with connection points for the induction loop or the induction coil may be provided.

Chip cards are known, in which one in the card body coil wound from wire is provided, the end of which Antenna contacts of the chip or its carrier connected are. This overall arrangement is cast in the card body, the production is technologically very complex.

In addition, chip cards have already been presented at which the antenna is etched out of an antenna layer was, the antenna having chip contacts, which via a conductive adhesive with the antenna contacts of the chip or its carrier are connected. In the manufacture of the Card body, the chip contacts are on a corresponding Recess in an applied to the antenna layer Cover layer released, which is also the manufacture makes expensive.

With raised connection points, which are on the surface of the Module and / or on the surface or on the side surfaces the recess of the card carrier, a Verkle Exercise of module and card carriers by means of the production of the electrically conductive connection in a single operation be performed.  

However, it has been shown that the required temperature and Time regime for making reliable both electri shear and mechanical connections close tolerances is subject, so that with non-optimal process parameters the long-term stability of cards produced in this way is reduced and that it is due to the dimensions and the plastic Features of the module and card holder for Verwin Tensions and tensions in the map with the consequence of Contact faults and thus lower reliability comes.

It is therefore an object of the invention to provide a chip card, a Ver drive to manufacture a chip card as well as a connec to arrange for such a manufacturing process with which a half located on a module conductor chip in a recess of a card carrier both electrical and mechanical with high reliability and Torsionally rigid can be contacted, the resul overall arrangement is high in all circumstances Long-term stability and sufficient reliability of the sun created chip card guaranteed.

The object of the invention is achieved with a chip card, a connection arrangement or manufacturing process, as detailed in the independent claims are defined.

According to a first aspect of the invention an antenna layer completely built into the map material, but the chip contacts have such thickened sections indicate that in the conventional chip for the production of hitherto maps also usual milling of the recess for the Chip and its carrier abge parts of the thickened sections mills and thereby chip contact surfaces are created, the then with the antenna contacts of the chip or its carrier are easy to connect.

The thickened sections can be done in different ways getting produced. For example, it is possible selective application of material in electroplating baths too  produce. However, the thickened sections are preferred formed from solder, in particular from soft solder. This can happen with for example, in the usual way, when Tinning of printed circuits is applied, so e.g. B. by guiding the antenna layer over a wave of solder or a wave soldering device, in which case only the Kon clocks are not covered. In another embodiment of the Invention, the chip contacts by means of known soldering or Bond machines processed, where necessary, a short Leaves wire inside the soldering "hill" that is at the later connection with the antenna contacts of a chip or whose carrier can be advantageous. It is essential here only that the thickening is so strong that when later milling out the recess for the chip or its carrier despite sufficient milling tolerance Chip contacts can be safely exposed or formed. If one assumes that the antenna layer is a Carrier thickness of about 200 microns and a copper layer of about Has 35 microns, this would be the copper layer thickness predetermined milling tolerances of about 20 to 30 microns not uncovered perfectly and safely. However, if you have one Provides thickening of 100 to 200 µm by soldering and forms such a bump, it is easy to see that then a safe milling despite the given tole satchel is possible while ensuring that the very thin copper coating of the antenna layer is not damaged or injured.

So far, it has been common to have such antenna layers their etched relief on the surface Embed traces in map material. That the now path actually followed leads to success and such strong thickening of 100 to 200 µm easily in the Standard cards with a total thickness of 760 µm ± 80 µm can be embedded is extremely surprising.

The antenna contacts can be used with the chip cards Variety of electrical connection processes connected what will be explained in more detail later. It is here  for example on welding or gluing by means of electrical conductive adhesive reminds. This is preferably done However, connection by soldering, which is technologically easy too handle and at the same time particularly durable Provides connections. This applies in particular if the Manufacture of the chip contacts consist of soft solder.

Particularly favorable for the user or the program The manufacturer of the chip card is the arrangement if the chip or its carrier on its the antenna layer additional side for direct (contact affected) connecting. One trained in this way Card that uses both contactless and contact bar, can be obtained from the manufacturer via the direk programmed, and then by the Users can only be used contactlessly.

The card body according to the first aspect preferably comprises the invention at least two cover layers, between which the antenna layer is laminated. The top layer, which on the side of the chip contacts, the thickening takes off at the same time. Even if the thickening is on the outside of the card after lamination, what would not be optimal with a finished card is this harmless, since exactly the area in which the chip contacts are later milled off.

In a corresponding embodiment of the invention the chip has a carrier with contact on the outside of the card surfaces, whereby the antenna contacts of through-contact sections (e.g. holes with corresponding galvanic metal orders are formed in the borehole), which a insulating carrier material to hold the contact surfaces traverse. Such cards can also be in contact Systems.

In a further embodiment according to the first aspect of FIG Invention is the chip on a carrier with a card inside term contact surfaces attached so that the antenna contacts  come to rest directly on the chip contacts. To now To enable soldering of the contacts to each other, it is from Advantage if the carrier material for the contact surfaces of the Chips in the antenna contact areas is taken away, so that areas open to the outside over the back of the antenna there are no contacts. As a result, the contact surfaces are from the outside accessible to tools, especially those for heating up to be able to press the back of the antenna contact. It is also possible, by means of infrared radiation, in particular by a Laser to heat the contact areas for the purpose of soldering.

In the case of a support coated on both sides as explained above For the chip, a contactless as well as a con clocked auxiliary device can be used to the card program or use. In this case, too it is important, however, that a Heat transfer for soldering the antenna contacts to the Chip contacts can take place. There are openings for this again in the carrier or in the contact surfaces attached to it in the Area of the chip card provided.

The method according to the invention for producing a chip card according to the first aspect of the invention comprises the following steps:
An antenna with chip contacts for connecting a chip is formed on an antenna layer. It should be emphasized here that the term "antenna" is to be understood as a multitude of such structures which are possible for the formation of additional functions which are desired in addition to those of the chip and which have to be connected to the chip via its carrier .

In a next step, the chip contacts are ver thick sections formed. This can be done through all sorts electrochemical processes, by cladding or done by applying conductive plastics.  

In a next step, a card body is formed in this way det that include the antenna layer and the chip contacts Lich the thickened sections are covered by map material and be firmly connected to it.

A recess is formed in the card body such that the thickened sections at least partially removed and thereby being exposed.

A chip comprising a carrier with antenna contacts for Connection of the carrier conductor structures to the antenna is in the recess inserted.

The antenna contacts are connected to the chip contacts.

The antenna is formed from the antenna layer before preferably in an etching or cutting process.

The application of material to the chip contacts is preferred as featured in a soldering process in a known manner taken.

The card body is preferably formed by means of a lamination process, the antenna layer between two top layers are laminated. Is under cover layer here, of course, no absolutely homogeneous structure stand, because such layers in turn usually one more have a layered structure, for example an imprint is covered by a clear top layer, or for connection with layers underneath to be laminated Layer includes special connection or adhesive layers.

The recess in the card is made in a manner known per se preferably formed by milling. Into the resulting one The chip and its carrier are inserted into the recess preferably glued, using a hot melt adhesive. The reason for this is, in particular, that after following soldering of the antenna contacts to the chip contacts a loss of height due to flowing solder material to the  Contact occurs, which occurs when using known cyan Acrylic adhesives are difficult to compensate for when using Welding glue, however, easily, if necessary rewarming can be compensated.

The heat for soldering can be applied from outside Soldering tool, so be applied by heat conduction. At a further embodiment of the method based on In the first aspect of the invention, heat is radiated tion, in particular by radiation from an IR laser. It is of course also possible to use ultrasound to to provide quasi via frictional heat.

According to a second aspect of the invention, a chip card for contactless and / or contact-based data transmission specified which a semiconductor chip and contact areas for the contact-related data transmission and next to it Connection points and at least one means for contactless Data transmission, which is usually an induction coil, includes. The chip card according to the second Aspect of the invention is characterized in that the electrically conductive connections between the connection points and the means for contactless data transmission too is made by soldering, the mechanical Ver binding by hot or melt gluing, but also by Soldering, can be done.

According to the second aspect of the invention, the Partly electrical hot or hot melt adhesive used conductive, and also solderable particles. Especially before these electrically conductive, solderable particles are added already when preparing the adhesive on a carrier film added or applied.

Size and amount of the sections added to the adhesive Soldering particles depend on the contact formation or the Contact areas of the chip card. The diameter of one between provided contact surfaces and on a hot or melt  Solder ball located in the adhesive lies, for example, in the area between 15 and 25 µm.

The amount of conductive particles is expediently chosen so that that between the connection points and the means for contact there are enough particles to lie around for loose data transmission to establish an adequate electrical connection by soldering to build.

According to the inventive method according to the second aspect the invention provides the electrically conductive connection condition that the adhesive located on the carrier film at least in the area of the connection points and / or the connection of the agent for contactless data transmission has conductive particles or layers that an elek tric conductive bridge between the connection points and the Form means for contactless data transmission by soldering can.

In the manufacture of chip cards, it is predominantly used in this way went that a module is first manufactured, the one Plastic carrier comprises, on which a semiconductor chip is arranged is. The module is then attached to the plastic card holder, e.g. B. polycarbonate. The module is usually in implanted a cavity milled into the card body, such as this has already been explained.

The production of the invention is particularly preferably carried out modern chip cards using the described, already known components and process steps. Appropriately ver the invention applies a übli according to the second aspect Chen module, but a contact level with the connection represent the means for contactless data transmission will be added. Usually the module comes with two additional connection points, which are added in the usual way be connected to the semiconductor chip.

The connection points are particularly preferably raised on a Surface of the module carrier preferably the side that the  Semiconductor chip carries, trained. The amount of connection are based on the second aspect of the invention according to the type and dimensions of the card and can for example be between 1 and 20 µm. Preferably there are termination points made of metal and become known per se Way, e.g. B. by sticking, printing, vapor deposition, electroplating sieren or similar manufactured. Is particularly preferred the additional connection level is made by a strip laminated from metal to the module carrier and then is structured. Location and size depends on size and Location of the means for contactless data transmission and especially its junctions.

The means for contactless data transmission, preferably an induction coil or antenna is convenient integrated into the card body or arranged on it, the connection points to the connection points free lie. For example, in the case of one in the cards body integrated copper wire coil connection points at Milling the cavity with be exposed. With such a Arrangement it is possible to glue module and Card carrier simultaneously with the manufacture of the electrical conductive connection between the agent for contactless Data transmission and the connection points of the module to lead. A special stamp can be used for this, which both compressive forces and thermal energy to the Her provide the adhesive and soldered connection.

In order to be able to use the known hotmelt process, the adhesive, as explained, with conductive and solderable Provide particles in predetermined contact sections. The Production of the mechanical adhesive connection according to the second Aspect of the invention then takes place in a manner known per se, the electrical connection of the contacts by targeted Introducing or applying heat at least in or on the areas of the contact sections is realized.

According to a third aspect of the invention, a ver basic driving principle in the making of a  electrical and mechanical connection one in one Recession of a card holder of a chip card used Module on a film-like carrier use non-conductive hot or hot melt adhesive layers, this hot or hot melt adhesive layer in the area from forming electrical contacts between module and cards carrier with an additional conductive layer or with conductive particles is to be provided. This additional conductive layer or the conductive particles can by Punching the hot or hot melt adhesive layer with subsequent Filling trained using recourse to conductive material will.

The one prepared according to the third aspect of the invention Hot or hot melt adhesive layer with conductive sections is then on the module or in the recess of the card carrier prefixed. This fixing is done so that the additional conductive layer or the conductive parti sections provided between the contact surfaces of the module and the recess of the card carrier. in the Connection to this fixing is done in a single pressure Temperature action step both the mechanical between Module and card carrier as well as the electrical contact between the opposing contact surfaces reali siert. According to the third aspect of the invention, it is not necessary that the usually referred to the said Connection area only small contact area sections contribute significantly to the adhesive connection, rather should here optimized electrical properties, such as low conduction inductances or a low contact resistance achieved will. Through the usual hot or hot melt adhesive connection is used for sufficient compression and compression care of the conductive particles, so that the desired long-term contact stability results.

In the case when as to the third aspect of the invention explained for the conductive particles on a solder paste or a solder ball can be used by defined Supply of thermal energy in the contact area, like this already  for the second aspect of the invention, after or Soldering the module in the card carrier take place, which further increases the contact reliability given is. In this case, the solder joint is made by mecha African tensions, shear forces or other forces hold, because these are also in the ongoing use of the card by the Adhesive connection can be recorded over a large area.

According to a further basic idea according to the third aspect of According to the material of the card carrier or of the invention Module a suitable pre-assembled hot or melt adhesive selected and in terms of layer thickness and selection of the conductive particles for the respective application indi vidually prepared and thus optimized.

The conductive particles or the conductive layer are on the hot or hot melt adhesive film, for example by means of a Dispensers, a roller or a stamp can be applied locally, using a mask if necessary can, so that reproducibility when applied conductive coatings increased. In the case of the surface side application of a conductive layer or conductive capable particles in one embodiment according to the third aspect of the invention, the layer thus applied briefly exposed to thermal treatment, so that a certain melting of the respective particles and thus sticking and connecting with the hot melt adhesive or the hot melt adhesive Episode is. This measure ensures that the subsequent handling of the conductive layer or the conductive capable material is protected from unwanted removal.

In the case when the hot or hot melt adhesive layer is off Has recesses or perforations with conductive parts balls such as solder balls or solder paste can be filled in usual and proven solder can be used. The Dosage of the amount of particles to be introduced into the recess Holes or perforations is not critical, as there is excess material Soldering and / or pressing and simultaneously gluing into the  Adhesive layer can be pushed into it without the Overall contact security is impaired.

The connecting means according to the third aspect to carry out the described method consists of a non-conductive hot or on a carrier film Hot melt adhesive layer, which is to be produced in the area electrical contacts sections with conductive particles or has a conductive layer.

These sections can be made with solder paste or conductive adhesive filled recesses or perforations.

In one embodiment of the connecting means there are the conductive sections inside a hot or Hot melt adhesive layer, this during assembly by means of Pressure-temperature influence is displaced and sublime Contact surfaces in operative connection with the inner conductive Layer or the inner conductive sections occur.

According to the third aspect of the invention, one succeeds Method and a connecting means for producing a electrical and mechanical connection one in one Recession of a card holder of a chip card used Specify module, on the one hand to known hot or Hot melt adhesive can be used and on the other hand both high quality electrical contacts or electrical connections can be realized and the required mechanical strength of the module in the card carrier is given without disadvantageous shear during operation other forces act on the contact areas.

The inventive method according to the third aspect is especially for contactless chip cards or combination cards suitable in which both mechanically contactable Contact surfaces as well as inductive components are available. By using the hot or modified according to the invention Hot melt adhesive films can reduce the cost at Card manufacturing can be reduced as it is no longer necessary  is on costly anisotropically conductive adhesives to fall back on using the modules for gluing the card carrier are only suitable to a limited extent.

Due to the only partial electrical connection to the respective Electrical contact points remain sufficient Area for executing the integral adhesive bond in order securely attach the module to the card carrier.

Taking into account the problems mentioned regarding the Long-term stability of the card holder if this twists and / or is subjected to tension, according to one fourth aspect of the invention a procedural Grundge thank you that the one to be implanted in the card recess One module on its insert side or on its edge side conductive, insulated sections having stiffening owns frame. This stiffening frame has contact surfaces on when inserting the module in the recess mating contact surfaces are electrically connected to step.

When inserting the module with semiconductor chip and reinforcement tion frame according to the fourth aspect of the invention in the This is done, for example, by recessing the card carrier Press in, with additional material and / or form-fitting Connections are realizable. By training the Module with stiffening frame that is both mechanical and electrical functions can be performed on simple technologies the connection of module with the card carrier, namely A press or a snap-in connection can be used, so that overall productivity increases. The Verstei framework leads to a stable training of the module, which causes warping and tension when operating the IC card can be absorbed without unwanted forces the semiconductor chip or other electronic components reach.

It is in the sense of the fourth aspect of the invention that the Stiffening frame, for example, is formed in two parts,  so that there are two electrically insulated contact surfaces with corresponding counter-contact surfaces, for example with an induction loop or an antenna in the cards carrier is arranged, communicate, cooperate can.

The connection arrangement according to the fourth Aspect for the production of a chip card goes from that on the Insert side of the module arranged conductive, from each other stiffening frame having insulating sections, which is electrically connected to connections of the semiconductor chip that is. This stiffening frame has contact surfaces that for example in the lateral edge area and / or on the Bottom are so that with very different Mating contact surfaces in the recess of the card carrier gear can be processed.

As mentioned, there are counter in the recess of the card carrier molded contact surfaces, the when inserting the module Contact and mating contact surfaces in a press fit to one another long and / or cohesively or positively connected are.

In a special embodiment of the stiffening frame according to the fourth aspect of the invention, this is the outer edge on the side or with the outer edge of the module arranges and exhibits a substantially square or rectangular cutout shape.

To obtain a snap-in connection between module and off The stiffening frame has been in the card holder since Liche protrusions or locking lugs on the side walls recesses located in the recess interact.

Alternatively, the counter contact surfaces in the sides Have surfaces of the recess projections or locking lugs or be formed in such a way, and with corresponding Recesses in the stiffening frame when inserting or Press it together into the card carrier.  

As explained, the snap-in connection according to the invention Area of the contact and counter-contact surfaces, however, other sections of the stiffening frame can also be used or opposite surfaces of the recess of the card include carrier so that the desired strength and verver Ensure the connection between the module and the card is accomplished.

In a further embodiment according to the fourth aspect of the Invention, the arrangement has a stiffening frame, which is formed integrally with a chip carrier, the mutually insulated contact surfaces of the stiffening frame electrically ver with respective chip contacts or bond pads are bound.

In this embodiment, it is not necessary to have one to manufacture separate stiffening frame, but it can be from Chip carrier and stiffening frame the module to be used be formed, which on its underside the by chip Bond attached semiconductor chip carries. At the last one mentioned embodiment can therefore on a separate Plastic module or wiring support for the semiconductor chip can be dispensed with. An elec External insulation is by laminating an insulation tion layer, expediently over the entire area of the Chip card possible.

According to the fourth aspect of the invention, a ver drive to produce a chip card or a connection to provide an arrangement for such a manufacturing process, with which or with which a high use rigidity the card in particular in the area of the recess for receiving of a module containing a semiconductor chip is achieved. Through the stiffening frame provided, which is also integral can be formed with a chip carrier, it is possible press the complete module into the recess and advantageous positive and / or non-positive connections to electrical and mechanical contacting of the module in the Card holder to use.  

Of course, a cohesive, esp special solder joint, done by targeted thermal energy using the metallic stiffening frame Connection points is fed. Ultimately, too other types of connection, such as the hot or melt mentioned stick possible.

It is also within the meaning of the invention, the aspects mentioned to combine with each other.

The invention explained according to the first to fourth aspect is to be explained in more detail with the aid of exemplary embodiments and with the aid of FIG .

Here show:

Fig. 1 shows a schematic representations of five method steps according to the first aspect of the invention;

Figures 2 to 4 three different embodiments of the chip card according to the first aspect in schematic cross section;

5 schematically shows a cross section through a chip card according to the second aspect of the invention in the area of an electrically conductive joint between a connection point, and means for contactless data transmission.

FIG. 6 is a schematic sketch for explaining the method according to the second aspect of the invention, namely using the example of the production of the electrically conductive connection which is shown in FIG. 5;

Fig. 7 is a section through a hot-melt adhesive film according to the third aspect of the invention;

Fig. 8 is a plan view of a prepared hot melt film according to the third aspect of the invention;

Fig. 9 is a section through a hot-melt film with conductive particles located in the interior of the third aspect of the invention;

Fig. 10 is a schematic sectional view of the installation position of the module in the recess of a card carrier using the connecting means according to an embodiment according to the third aspect of the invention;

Fig. 11 is a perspective representation of a top view of a module with a semiconductor chip and the reinforcing frame according to the fourth aspect of the invention, and

FIG. 12 shows a sectional view through a module along the line A / A from FIG. 11, the module already being inserted into the card carrier.

With regard to the following description of execution Examples should be noted that in the drawings shown proportions not the actual Correspond to circumstances, in particular the layer thicknesses of the conductive layers versus the plastic layers significantly smaller or lower.

In Fig. 1, an antenna layer 10 is shown in cross section, which consists of a carrier 11 with a coating 12 thereon. The layer thickness of the carrier can be approximately 200 μm, the coating 12 approximately 35 μm (copper).

In a first method step, a conductor track pattern is formed in a manner known per se by selective etching, which according to FIG. 1b antenna tracks 13 , 14 , 15 (in itself is only a single track, but cut several times in FIG. 1b) and chip contacts 20 , 21 includes.

In a next step, the result of which is shown in FIG. 1c, thickenings 16 , 17 are created on the chip contacts 20 , 21 , which are formed as a soldering job in this embodiment of the invention. These thickening tongues can be about 100 to 200 microns thick, but they should in any case be so thick that the inevitable tolerances that occur during the subsequent milling can be safely absorbed in any case.

In a next step, the result of which is shown in FIG. 1d, an upper cover layer 18 and a lower cover layer 19 are laminated onto the overall arrangement shown in FIG. 1c, i.e. the antenna layer 10 together with the thickenings 16 and 17, so that the antenna layer ( is fully closed as shown in FIG. 1c).

In a next step, the end result of which is shown in FIG. 1e, a recess 24 is milled in the card body according to FIG. 1d in a manner known per se. The milling is so deep that in the area in which the carrier of the chip (not yet shown) comes to lie later, the thickenings 16 and 17 are also milled or milled, so that they are in a bottom surface of the depression 24 form exposed access areas 22 , 23 .

In a next step, the end result of which is shown for three alternative ages in FIGS. 2 to 4, a chip with carrier 25 is then used. This comprises an IC 26 and a carrier made of a carrier material 30 with external contacts 33 , 34 and internal antenna contacts 31 , 32 , the connection contacts (not shown) of the IC 26 being led via connecting wires 28 , 29 to the external contacts 33 , 34 . The IC 26 is covered together with parts of its carrier by means of a casting compound 27 .

When the chip with carrier 25 is inserted into the recess 24 of the card, the arrangement is fixed in the opening by means of hot-melt adhesive. Then a soldering tool is placed on the antenna contacts 31 , 32 so that the solder contained in them melts and also the underlying thickenings 16 , 17 , which are formed from solder material, melt with. This creates a continuous soldering between the chip contacts 20 , 21 and the external contacts 33 , 34 and over the connection wires 28 , 29 to the IC 26 . After soldering, another final fixation can be done by warming up the hot melt adhesive.

The embodiment of the invention shown in FIG. 3 differs from that of FIG. 2 in that the antenna contacts 31 , 32 are formed as metallization layers which are formed on the carrier material 30 on the surface carrying the IC 26 . In this embodiment of the invention, bores 35 , 36 are provided in the carrier material 30 , so that the thickenings 16 , 17 or the soldering application provided there are freely accessible from the outside. In this case, a laser beam can be directed through the bores 35 , 36 to heat the soldering job 16 or 17 in order to establish a soldered connection between the chip contacts 20 , 21 and the antenna contacts 31 , 32 .

The variant shown in FIG. 4 differs from that according to FIG. 3 in that the bores 35 , 36 are not led through the antenna contacts 31 , 32 or the layers forming them, but end on the rear side thereof. As a result, it is still possible to heat the antenna contacts 31 , 32 by means of attached tools or by thermal radiation (IR laser), so that a soldered connection between the antenna contacts 31 , 32 and the chip contacts 20 , 21 is built up.

From the above description it is apparent that several features, which are shown in the embodiments of FIGS. 2 to 4, can be combined with one another. In particular, the use of carrier materials 30 coated on both sides is possible. It is also possible to use self-supporting metal contact devices as chip carriers 25 , as are known per se.

Fig. 5 shows a cross section through a chip card 1 in the region of an electrically conductive joint between a connection point 2 and a means 3 for contactless data transmission, in this case an induction coil. The induction coil 3 is in the card carrier 5 , which is usually made of plastic, for. B. polycarbonate, is integrated. In the area of the connection point, a section of the coil is exposed, for example by milling the card carrier surface. One of the two connection points 2 shown in Fig. 5 of the card to the coil 3 is as a metal strip on the carrier 6 of the module, for. B. a plastic film, and is located outside the area of the carrier in which the semiconductor terchip is arranged. The electrically conductive connection is made between connection point 2 and induction coil 3 by means of soldering in the adhesive layer 4 of selectively introduced solder balls 8 . In the case shown, the adhesive is applied to the entire surface of the module, the conductive and solderable particles located selectively in the adhesive coming to lie between the induction coil 3 and the connection point 2 .

As mentioned, a hot or hot melt adhesive is used as the preferred adhesive. When using such adhesives, the connection from the module with plastic carrier 6 and connection point 2 to the card body 5 while simultaneously making the solder connection by means of solder balls 8 between connection point 2 and induction coil 3 using the widespread hotmelt process, for which a universal heating and versatility Stamp 9 can be used.

This is schematically illustrated in FIG. 6, where a cross section through the chip card according to FIG. 5 is shown before the module and card body 5 are connected.

In the area of the cavity for the module coated with adhesive card body 5 with integrated induction coil 3 is placed in a suitable position on the module with carrier 6 and connection point 2 . Now pressure and heat is supplied with the help of the heating and pressure stamp 9 . As a result, the adhesive layer 4 softens, and the module and card body 5 are pressed together until the coil 3 , electrically conductive particles 8 and connection point 2 touch and a soldered connection is thus achieved. At the same time, an adhesive connection is created between the surface of the card body cavity and the module. The adhesive is then allowed to harden by cooling.

In the manner described, the module and Card body and the production of electrically conductive connection to the contactless data transmission system in one Step using known methods.

The section shown in Fig. 7 through a hot melt film has a carrier film 41 which is coated with a hot or hot melt adhesive 42 . The layer thickness is between 20 and 80 µm, depending on the card material such as ABS, PVC, PC or PET, different adhesives are used.

The prepared hot or hot melt adhesive shown in FIG. 8 has perforations 43 for receiving the chip as well as laterally arranged sections 44 , which consist of a conductive layer or of conductive particles 416 or contain these.

These sections 44 can, for example, be perforations or recesses that have been filled with solder paste. As can be seen from FIG. 8, the hot or hot melt adhesive 42 located on a carrier film 41 is made up. On this blister-like film strip, the module 410 provided with a chip 411 ( FIG. 10) can be fastened in order to then in a next operation the module 410 provided with carrier film 41 and hot or hot melt adhesive 42 towards the recess 412 from a card carrier 413 position ( Fig. 10).

In a further embodiment, solder balls were used a diameter of 25 µm on the hot or hot melt adhesive layer applied selectively, so that in a subsequent Pressure-temperature process both a solder joint between the opposing contact surfaces using the  Solder ball as well as the adhesive connection between module and car can be realized.

In the hot or melt adhesive 42 shown in FIG. 9, this has an inside layer 45 made of conductive particles. In the case when the configuration according to FIG. 9 is used, raised contact surfaces on the module or on the card carrier are able to displace the hot or hot melt adhesive which changes into the semi-liquid state during the pressure-temperature treatment step, so that to come into active connection with the conductive particles of the inner layer, whereby the desired contact is formed.

With the help of FIG. 10, which shows a basic sectional representation through a card carrier 413 , which has a recess 412 , the method for establishing the connection will now be explained.

The provided with the prepared hot or hot melt adhesive layer 42 module 410 , which comprises a chip 411 , z. B. positioned in the recess 412 by means of a suitable tool.

Contact surfaces 414 , which are connected to an induction coil for contactless data transmission, are located on the inner surface side of the recess 412 . The hot or hot-melt adhesive in the layer 42 heats up by exerting a pressure force in the direction of the arrow and by the action of temperature. At the same time, the conductive particles 416 , which are located in the sections 44 or in the layer 55 , establish an electrical connection between the contact surfaces 414 and the opposite contact surfaces 415 of the module. When the adhesive cools and hardens, there is both a secure mechanical connection of the module 410 in the recess 412 of the card carrier 413 and a corresponding electrical connection between the contact surfaces 414 and 415 . If, for example, solder paste is introduced into recesses or holes in the hot or hot melt adhesive 41 , this serves to implement the electrical connection between the opposing contact surfaces 414 and 415 .

In a further exemplary embodiment, when using a solder ball in the adhesive film, during or after the pressure-temperature action step, additional heat can be applied locally in the area of the contact surfaces 414 and / or 415 , so that the desired soldering process is carried out.

The exemplary embodiments described above become clearly that the conductive particles or the conductive Layer both be inside the hot-melt film can, as well as can be applied to the surface. A fixation a layer applied on the surface or from the top Particles arranged on the surface can be caused by short-term Heat treatment take place, creating the appropriate particles stick to the adhesive. For heat treatment, for example point to a heated roller that is guided over the film will be used, the roller also being the same can be used in time to apply the conductive particles.

In the module shown in FIG. 11, it comprises a chip carrier 51 and a semiconductor chip 52 fastened to the chip carrier 51 by bonding. The chip carrier 51 can comprise from one another isolated or structured areas that are electrically connected to corresponding contact surfaces of the semiconductor chip 52 . This electrical connection can be achieved by wire bonding, but there is also the possibility to connect the semiconductor chip 52 directly to the chip carrier 51 by means of rear contacts.

A two-part stiffening frame 53 , which has insulated sections 54 , is arranged on the chip carrier 51 . The parts of the stiffening frame 53 each form contact surfaces; in the example shown 11 and 12 located in a side region 55 of FIG..

The side regions 55 , but also the other side surfaces of the stiffening frame 53, can have means for achieving a snap-in connection when the module is inserted into a recess in a card carrier ( FIG. 12).

In one embodiment, the chip carrier 51 is made with the stiffening frame 53 as a one-piece part. Alternatively, however, the parts or sections of the stiffening frame 53 can be arranged on the chip carrier 51 while maintaining the desired electrical and mechanical connection by soldering or the like. The surfaces 56 of the stiffening frame 53 pointing to the insert side can be provided on the upper side with an adhesive, in particular hot glue, so that a secure mechanical connection of the module is achieved without the contact and counter-contact surfaces 55 ; 513 excessive forces have to be absorbed.

The insertion of the module with stiffening frame will be explained in more detail with the aid of FIG .

An IC card 510 has a recess 511 , which can be produced by milling, for example. Inside the IC card 510 there are conductor tracks 512 , which, for. B. parts of an inductive element for wireless information exchange can be. These conductor tracks 512 extend to the recess 511 and have a mating contact surface 513 . This counter-contact surface 513 forms when the module 514 is inserted into the recess 511 of the IC card 510 with the stiffening frame 53 or the respective side regions 55 .

As already explained with reference to FIG. 11, the side regions 55 of the stiffening frame 53 can be provided with latching lugs or projections which cooperate with the corresponding recesses in the region of the side surfaces of the recess 511 in the IC card 510 . A reverse principle is also conceivable here, ie projections and latching lugs are formed in the IC card 510 , which interact with grooves, grooves or recesses in the stiffening frame 53 of the module 514 .

If, before the module 514 is inserted, the side region 55 is provided with a solder at least in the section of the contact surfaces, or solder or flux is applied to the counter-contact surfaces 513 , the module 514 can be pressed or pressed into the recess 511 of the IC card 510 are additionally applied specifically by soldering stamp / heat to the stiffening frame 53 , so that soldering is possible in the area of the connection between contact surfaces 55 and counter contact surfaces 513 .

Reference list

1

Smart card

2nd

Junction

3rd

Means for contactless data transmission

4th

Adhesive layer

5

Card body

6

Plastic carrier

8th

Solder balls

9

Heating pressure stamp

10th

Antenna layer

11

carrier

12th

Coating

13

Antenna track

14

Antenna track

15

Antenna track

16

Soldering job

17th

Soldering job

18th

upper cover layer

19th

lower cover layer

20th

Chip contact

21

Chip contact

22

Access area

23

Access area

24th

Recess

25th

Chip with carrier

26

IC

27

Sealing compound

28

Connecting wire

29

Connecting wire

30th

Backing material

31

Antenna contact

32

Antenna contact

33

External contact

34

External contact

35

drilling

36

drilling

41

Carrier film

42

Hot or hot melt adhesive

43

Hole for chip

44

Sections

45

inner layer

410

module

411

chip

412

Recess

413

Card carrier

414

Contact areas for card carriers

415

Contact area module

416

conductive particles

51

Chip carrier

52

Semiconductor chip

53

Stiffening frame

54

isolated sections

55

Side area, contact areas

56

Surfaces

510

IC card

511

Recess

512

Conductor tracks

513

Mating contact surfaces

514

module

Claims (51)

1. Chip card, comprehensive
a card body, a recess ( 24 ) machined therefrom, a chip ( 25 ) with antenna contacts ( 31 , 32 ) for connecting an antenna, an antenna layer ( 11 , 12 ) with antenna devices, in particular a coil in the card body, which chip contacts ( 20 , 21 ) for connecting the chip ( 25 ), the chip contacts ( 20 , 21 ) having thickened sections ( 16 , 17 ) which are embedded in the card body and are removed at least in sections when working out or milling out the recess ( 24 ) and wherein the antenna contacts ( 31 , 32 ) with the chip contacts ( 20 , 21 ) are conductively connected. 2. Chip card according to claim 1, characterized in that the thickened sections ( 16 , 17 ) are made of (soft) solder. 3. Chip card according to one of the preceding claims, characterized in that the antenna contacts ( 31 , 32 ) with the chip contacts ( 20 , 21 ) are connected by soldering. 4. Chip card according to one of the preceding claims, characterized in that the chip ( 25 ) on its side facing away from the antenna layer ( 11 , 12 ) has additional contacts ( 33 , 34 ) for direct connection. 5. Chip card according to one of the preceding claims, characterized in that the card body comprises at least two cover layers ( 18 , 19 ), between which the antenna layer ( 11 , 12 ) is laminated. 6. Chip card according to one of the preceding claims, characterized in that the chip ( 25 ) comprises a carrier ( 30 ) with contact surfaces on the outside of the card ( 33 , 34 ), and in that the antenna contacts ( 31 , 32 ) are formed by through-contacting sections which form the Cross the beam ( 30 ). 7. Chip card according to one of claims 1-5, characterized in that the chip ( 25 ) comprises a carrier ( 30 ) with contact surfaces inside the card ( 31 , 32 ). 8. Chip card according to claim 7, characterized in that the antenna contacts ( 31 , 32 ) directly or via openings ( 35 , 36 ) accessible from the outside, in particular are heated. 9. Chip card according to one of claims 1-5, characterized in that the chip ( 25 ) comprises a carrier coated on both sides. 10. Chip card according to one of claims 6, 7 or 9, characterized in that the carrier ( 30 ) and / or the contact surfaces mounted thereon ( 33 , 34 ) in the region of the chip contacts ( 20 , 21 ) openings ( 35 , 36 ) exhibit. 11. A method of manufacturing a smart card comprising the steps

• a) an antenna with chip contacts for connecting a chip is formed on an antenna layer;
• b) thickened sections are formed on the chip contacts;
• c) a card body is formed such that the antenna layer and the chip contacts including the thickened portions are completely covered by card material;
• d) a recess is formed in the card body in such a way that the thickened sections are at least partially removed and thereby exposed;
• e) a chip comprising a carrier with antenna contacts, the recess is used;
• f) the antenna contacts are connected to the chip contacts in an electrically conductive manner.

12. The method according to claim 11, characterized in that step a) comprises an etching process.   13. The method according to claim 11, characterized in that in step b) material in an electrochemical process is applied. 14. The method according to claim 11, characterized in that in step b) material is applied by a soldering process becomes. 15. The method according to claim 11, characterized in that step c) comprises a lamination process. 16. The method according to claim 15, characterized in that in step c) the antenna layer between at least two Top layers are laminated. 17. The method according to claim 11, characterized in that in step d) the recess is formed by milling. 18. The method according to claim 11, characterized in that in step e) the chip with carrier in the recess is stuck. 19. The method according to claim 18, characterized in that the chip with carrier by means of hot melt adhesive in the recess is stuck. 20. The method according to claim 11, characterized in that in step f) the antenna contacts with the chip contacts to be soldered.   21. The method according to claim 20, characterized in that when soldering heat using an externally attached Tool is fed. 22. The method according to claim 20, characterized in that when soldering heat from radiation, especially one IR laser is supplied. 23. The method according to claim 20, characterized in that when soldering heat by mechanical movement, esp special ultrasonic vibrations is supplied. 24. Chip card ( 1 ) for contactless and / or contact-free data transmission, which comprises a module with semiconductor chip, a contact body and connection points ( 2 ) and at least one means ( 3 ) for contactless data transmission, characterized in that the electrical conductive connection between the connection point ( 2 ) and the means ( 3 ) for the contactless data transmission by means of soldering is established. 25. Chip card according to claim 24, characterized in that the means ( 3 ) for contactless data transmission is an induction coil. 26. Chip card according to one of claims 24 or 25, characterized in that the means ( 3 ) for the contactless data transmission in the region of the card body ( 5 ) is arranged, for example printed or glued to this or integrated into this. 27. Chip card according to one of claims 24 to 26, characterized in that the connection points ( 2 ) are raised on a surface of a carrier ( 6 ) which carries the semiconductor chip and the contact surfaces for contact-based data transmission. 28. Chip card according to claim 27, characterized in that the connection points ( 2 ) are arranged on the surface of the carrier ( 6 ) which carries the semiconductor chip. 29. Chip card according to claim 27 or 28, characterized in that the connection points ( 2 ) consist of metal. 30. Chip card according to one of claims 27 to 29, characterized in that the connection points ( 2 ) protrude 1 to 20 µm over the upper surface of the carrier ( 6 ). 31. Chip card according to one of claims 24 to 30, characterized in that a hot or hot melt adhesive ( 4 ), in particular an adhesive based on phenolic resin, which is electrically conductive and solderable in the area of the connection point ( 2 ) is used for the connection Particles ( 8 ) are added or these are applied to the adhesive layer. 32. Method for producing a chip card according to one of claims 24 to 31, characterized in that an adhesive ( 4 ) substantially in the area of the entire surface of the chip card module, which in the card body ( 5 ), which the means ( 3 ) for contactless data transmission, is to be implanted, is applied, conductive and solderable particles ( 8 ), which are selectively inserted or applied in the adhesive ( 4 ), positioned in the area of the connection points ( 2 ). 33. The method according to claim 32, characterized in that the connection of connection points ( 2 ) and means ( 3 ) for contactless data transmission and of card body ( 5 ) and carrier ( 6 ), which carries a semiconductor chip and contact areas for contact-based data transmission, by a single common pressure-temperature exposure step. 34. A method for producing an electrical and mechanical connection of a module inserted in a recess of a card carrier of a chip card using a hot or hot melt adhesive,
characterized in that

• the non-conductive hot or hot-melt adhesive layer located on a film-like carrier is provided with an additional conductive layer or conductive particles in the area of electrical contacts to be formed between module and card carrier,
• - Then the hot or melt adhesive layer prepared in this way is fixed to the module or in the recess of the card carrier, the sections provided with the additional conductive layer or the conductive particles being located between the contact surfaces of the module and the recess of the card carrier and
• - Furthermore, both the mechanical connection between module and card carrier and the electrical contacting is realized in a single pressure-temperature action step.

35. The method according to claim 34, characterized in that depending on the given material of the card holder and the month duls suitable hot or hot melt adhesive selected and these with regard to their layer thickness and selection of  conductive particles for the respective application indi be prepared vidually. 36. The method according to claim 34 or 35, characterized in that the conductive particles or the conductive layer given locally by means of a dispenser, roller or stamp if applied by means of a mask, whereby by simultaneous or subsequent brief heat treatment the particles or the layer components with the Adhesive layer can be adhesively bonded. 37. Method according to one of the preceding claims, characterized in that solder balls are used as conductive particles. 38. The method according to any one of the preceding claims, characterized in that recesses or in the hot or hot melt adhesive layer Perforations are made, which with conductive par items are filled. 39. The method according to claim 38, characterized in that solder paste is used as the conductive particle. 40. Connection means for carrying out the method according to one of claims 34 to 39, characterized by a non-conductive hot or hot-melt adhesive layer ( 42 ) located on a carrier film ( 41 ), which in the area of the electrical contacts to be produced has sections ( 44 ) with conductive particles ( 416 ) or has a conductive layer. 41. Connecting means according to claim 40, characterized in that the sections ( 44 ) consist of ver filled with solder paste or hot glue recesses or perforations of the hot or hot melt adhesive film. 42. Connection means according to claim 40, characterized in that the conductive sections ( 44 ; 45 ) are located inside a hot or hot melt adhesive layer which can be displaced under the action of temperature and pressure. 43. Connection means according to claim 40, characterized in that the connection by means of pre-applied, rolled Solder wire is realized. 44. Method for producing a chip card, one on a semiconductor chip located in a module in a recess card holder while receiving an electrical one and mechanical connection is used, characterized, that the module to be implanted in the card recess to the insert side with a conductive stiffener frame is provided with contact surfaces, these Contact areas with in the recess of the card carrier mating contact surfaces located electrically connected will. 45. The method according to claim 44, characterized, that the connection between contact surfaces of the frame and Counter-contact surfaces of the recess in material, force and / or done positively. 46. The method according to claim 45, characterized, that the module provided with the stiffening frame in the Card recess to maintain the mechanical connection and the electrical contact is pressed.   47. Connection arrangement for producing a chip card, consisting of a module with a semiconductor chip and a card carrier with a recess for receiving the module, characterized in that
that on the insert side of the module ( 514 ) a conductive, mutually insulated sections having stiffening frame ( 53 ) is formed, which is electrically connected to terminals of the semiconductor chip ( 52 ), wherein the stiffening frame ( 53 ) has contact surfaces ( 55 ), and
that counter-contact surfaces ( 513 ) are formed in the recess ( 511 ) of the card carrier ( 510 ), the contact and counter-contact surfaces ( 55 ; 513 ) coming into a press fit when the module ( 414 ) is inserted and / or cohesively and / or positively are connected. 48. Connection arrangement according to claim 47, characterized in that the stiffening frame ( 53 ) is arranged on the outer edge side of the module ( 514 ) and has a substantially square or rectangular shape. 49. Connection arrangement according to claim 47 or 48, characterized in that the stiffening frame ( 53 ) has lateral projections or locking lugs which cooperate with recesses or grooves located on the side walls of the recess ( 511 ). 50. Connection arrangement according to one of claims 47 to 49, characterized in that the counter-contact surfaces ( 513 ) are located in the side surfaces of the recess ( 511 ) and have projections or detents which cooperate with corresponding recesses in the stiffening frame ( 33 ). 51. Connection arrangement according to one of claims 47 to 49, characterized in that the stiffening frame ( 53 ) is integrally formed with a chip carrier ( 51 ), wherein the mutually insulated contact surfaces of the connecting frame ( 53 ) are connected to respective chip contacts or bonding surfaces .