DE19500925A1 - Integrated circuit (I.C) card or "chip" card - Google Patents

Integrated circuit (I.C) card or "chip" card

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Publication number
DE19500925A1
DE19500925A1 DE1995100925 DE19500925A DE19500925A1 DE 19500925 A1 DE19500925 A1 DE 19500925A1 DE 1995100925 DE1995100925 DE 1995100925 DE 19500925 A DE19500925 A DE 19500925A DE 19500925 A1 DE19500925 A1 DE 19500925A1
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DE
Grant status
Application
Patent type
Prior art keywords
module
antenna
contact
surfaces
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE1995100925
Other languages
German (de)
Other versions
DE19500925C2 (en )
Inventor
Uwe Trueggelmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Morpho Cards GmbH
Original Assignee
ORGA Kartensysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48095Kinked
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49109Connecting at different heights outside the semiconductor or solid-state body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

The I.C. cad (1) has a transmission module (3) built into the body (2) as a separate unit. The module is equipped with an antenna (4,5). the antenna has at least one coil (4), for transmitting energy and data inductively. Alternatively there is at least one electrical conducting layer (5), for transmitting energy and data capacitively. The module has also contact surfaces (6) to couple the "chip" module (7) with an I.C. package and contact surfaces (21) for coupling. There is a support layer (9) for the antenna.

Description

Seit geraumer Zeit gibt es parallel zu den auf breiter Ebene eingeführten kontaktbehafteten Chipkarten nach ISO 7816 auf dem Markt Chipkarten, bei denen der Datenaustausch mit entsprechenden Datenaustauschgeräten nicht über galvanische Kontakte, sondern induktiv oder kapazitiv erfolgt. For some time, there are parallel to those established on a broad level contact smart cards in accordance with ISO 7816 smart card on the market in which the data is exchanged with corresponding data exchange devices do not have electrical contacts but inductive or capacitive.

Die bisher bekannten kontaktlosen Chipkarten weisen einen gemeinsamen Träger für die Chips und die passiven Übertragungselemente (Spulen für eine induktive Daten- und Energieübertragung und/oder elektrisch leitende Schichten für eine kapazitive Daten- und Energieübertragung) auf. The previously known contactless smart cards have a common support for the chips and the passive transmission elements (coils for inductive data and power transmission and / or electrically conductive layers for capacitive data and energy transfer). Dieser Träger mit Chip und Übertragungselementen wird zwischen mindestens zwei Schichten (z. B. PVC-Schichten) des Kartenkörpers eingebettet und so in der Karte verankert. This carrier with chip and transmission elements is between at least two layers (z. B. PVC layers) embedded in the card body and so anchored in the card.

Problematisch bei der Herstellung dieser Art von kontaktlosen Chiparten sind die folgenden Punkte: A problem in the manufacture of this type of contactless IC types are the following points:

Die dem gemeinsamen Träger zugrunde liegende flexible Leiterplatte ist, da sie die Flächen für das Aufbringen und Anbinden der Halbleiterbauelemente (Chips) und zugleich die großflächigen Übertragungselemente trägt, in der Herstellung teuer, da die ganze Fläche in einer Qualität hergestellt wird, die ein Bonden der Halbleiterchips ermöglicht. The said common substrate using a flexible circuit board, since it carries the surfaces for the application and bonding of the semiconductor devices (chips), and at the same time the large-area transmission elements, expensive to manufacture, since the whole surface is produced in a quality that a bonding of the semiconductor chips possible. Außerdem ist die Aufbringung, Anbindung und Verkapselung der Chips aufgrund der großen Fläche der Leiterplatte für den Träger in den Bondierautomaten sehr umständlich und stellt unter Kostengesichtspunkten einen nicht zu vertretenden Aufwand dar. In addition, the application, connection and encapsulation of the chips due to the large area of ​​the board for the carrier in the Bondierautomaten is very cumbersome and provides a cost point represents a not responsible effort.

Da der Träger im Bereich des Halbleiterchips sehr viel dicker ist als in den Bereichen der passiven Übertragungselemente, müssen die Schichten, in die der Träger zur Herstellung einer normgerechten Karte in einer entsprechenden Negativform ausgeführt werden, wodurch die Herstellung ebenfalls teuer ist. Because the carrier in the region of the semiconductor chips is very much thicker than in the regions of the passive transmission elements, the layers, in which the carrier for manufacturing a standard-compliant card in a corresponding negative mold are performed need, whereby the production is also expensive.

Aufgrund fertigungsbedingter Toleranzen kommt es trotz sorgfältiger Ausformung der Negativformen bei der Verbindung der den Träger einbettenden Teile zur Deformierung der Oberflächen und damit zur Deformierung eines sich eventuell auf der Oberfläche befindlichen Druckbildes. Due to production-related tolerances occur despite careful shaping of the negative forms in the connection of the carrier embedding parts for deforming the surface and thus to deformation of a printed image is possibly present on the surface. Mit einem derart deformierten Druckbild ist die Karte jedoch als Ausschuß zu bewerten. With such a deformed print image the card, however, is to be regarded as scrap. Aus Gründen der Sicherheit und Zuverlässigkeit werden beim Verbinden zur Herstellung von Chipkarten Materialien und Verfahren eingesetzt, die eine Trennung der Karte in die einzelnen Schichten ohne massive Beschädigung nur sehr schwer oder gar nicht zu lassen. For reasons of safety and reliability are used when connecting for the production of smart cards materials and processes is very difficult or impossible to allow the separation of the card into the individual layers without massive damage. Damit ist auch der Träger mit dem sehr teueren Halbleiterchip nur sehr schwer oder gar nicht aus einer als Ausschuß bewerteten Karte für eine weitere Verwendung zu entfernen. Thus the carrier is very difficult or impossible from a committee as rated card for further use to remove. With the very expensive semiconductor chip

Bei der Bedruckung des Kartenkörpers nach dem Einbringen des Trägers und dem Verbinden der beteiligten Schichten kann zwar eine Deformation des Druckbildes durch den Einbring- und Verbindungsvorgang ausgeschlossen werden. When printing of the card body after the introduction of the support and the bonding of the layers involved, although a deformation of the printed image by the carry-in and connecting operation can be excluded. Allerdings treten jedoch auch beim Bedrucken relativ häufig Fehler auf, so daß auch in diesem Fall teure Ausschußkarten mit nicht mehr zu entfernendem Halbleiterchip produziert werden. but however also occur when printing relatively common errors are produced so that in this case too expensive Committee cards with no more to be removed semiconductor chip.

Die Probleme beim Einbringen des Trägers in die Karte und beim Bedrucken verstärken sich noch, wenn die kontaktlose Karte zusätzlich über Kontaktflächen (z. B. nach ISO 7816/2) verfügen soll, um wahlweise eine kontaktlose oder eine kontaktbehaftete Daten- und Energieübertragung zu ermöglichen. The problems associated with introducing the carrier into the card and when printing reinforce even when the contactless card also has contact surfaces (z. B. ISO 7816/2) should have in order to allow selectively a contactless or a contact-type data and energy transmission , In einer solchen Ausführung befinden sich die Kontaktflächen mit auf der die kontaktlosen Übertragungselemente und den Halbleiterchip tragenden Leiterplatte oder sind zumindest fest und elektrisch leitend mit dieser verbunden. In such an embodiment, the contact surfaces on which the contact-free transmission elements, and the semiconductor chip-carrying printed circuit board or at least firmly and electrically conductively connected therewith. Das Einbringen eines so ausgestalteten Trägers für kontaktlose und kontaktbehaftete Datenübertragung in einen Kartenkörper ist mit noch mehr Fertigungsrisiken verbunden als das Einbringen eines nur kontaktlosen Trägers. The incorporation of a thus configured carrier for contactless and contact-type data transfer in a card body is connected with even more production risks as the introduction of only a non-contact carrier.

Aufgabe der Erfindung ist es, eine Chipkarte zur kontaktlosen Daten- und Energieübertragung zu schaffen, die rationell und bei minimalen Ausschußkosten herzustellen ist, und eine dauerhaft sichere und zuverlässige Verwendung gewährleistet. The object of the invention is to provide an IC card for contactless data and energy transmission, to be produced efficiently and with minimal scrap costs, and ensures a permanently safe and reliable use.

Diese Aufgabe wird erfindungsgemäß durch die kennzeichnenden Merkmale des Patentanspruches 1 gelöst. This object is achieved by the characterizing features of claim 1. Die sich daran anschließenden Unteransprüche enthalten vorteilhafte und förderliche Ausgestaltungen der Erfindung. The subsequent sub-claims contain advantageous and beneficial embodiments of the invention.

Erfindungsgemäß wird in den Kartenkörper ein separates Übertragungsmodul, welches eine Antenne in Form mindestens einer Spule und/oder in Form elektrisch leitender Schichten aufweist, eingebaut, wobei der Kartenkörper bereits bedruckt sein kann. According to the invention in the card body, a separate transmission module comprising an antenna in the form of at least one coil and / or in the form of electrically conductive layers incorporated, wherein the card body may already be printed. Das Übertragungsmodul weist Anschlußflächen zur elektrischen Ankopplung an das Chipmodul auf. The transmission module has pads on the electrical connection to the chip module. Dieses Zwischenerzeugnis (Kartenkörper mit eingelagertem Übertragungsmodul ohne teueres Chipmodul) kann nun gegebenenfalls bedruckt werden und wird anschließend optisch nach Ausschußkriterien begutachtet. This intermediate product (card body with embedded transmission module without expensive chip module) can then be optionally printed and is then assessed visually by Committee criteria.

Das Chipmodul mit dem teueren Halbleiterbaustein wird nur in beanstandungsfrei bedruckte Kartenkörper mit einwandfreien Oberflächen eingesetzt. The chip module with the expensive semiconductor chip is used only in beanstandungsfrei printed card body with flawless surfaces.

Auf diese Weise werden die Ausschußkosten erheblich reduziert, wodurch die Herstellung von kontaktlosen Chipkarten unter Kostengesichtspunkten attraktiv gemacht wird. In this way, the scrap costs are significantly reduced, making the manufacture of contactless IC cards is made attractive from a cost perspective.

Auf den Zeichnungen sind Ausführungsbeispiele dargestellt, welche nachfolgend näher erläutert werden. In the drawings, embodiments are shown which will be explained in more detail below.

Es zeigt It shows

Fig. 1 + Fig. 2 einen Schnitt durch einen Kartenkörper mit einem schematisch angedeuteten Chipmodul, Fig. 1 + FIG. 2 is a section through a card body with a schematically indicated chip module,

Fig. 3 eine Draufsicht auf ein Übertragungsmodul mit einer Spule und elektrisch leitenden kapazitiven Schichten, Fig. 3 is a plan view of a transmission module with a coil and electrically conductive capacitive layers,

Fig. 4 einen Schnitt durch ein Chipmodul, Fig. 4 shows a section through a chip module,

Fig. 5 einen Schnitt durch ein Chipmodul mit elektrisch leitenden Stützfüßen, Fig. 5 is a sectional view of a chip module having electrically conductive support legs,

Fig. 6 eine Unteransicht auf das Chipmodul von Fig. 5, Fig. 6 is a bottom view of the chip module of FIG. 5,

Fig. 7 einen Schnitt durch Chipmodul (vgl. Fig. 4) und Kartenkörper vor dem Zusammenbau, Fig. 7 is a section through chip module (see. Fig. 4) and the card body prior to assembly,

Fig. 8 wie in Fig. 7, jedoch im zusammengesetzten Zustand, Fig. 8 as shown in Fig. 7, but in the assembled state,

Fig. 9 einen Schnitt durch Chipmodul (vgl. Fig. 5) und Kartenkörper vor dem Zusammenbau, Fig. 9 is a section through chip module (see. Fig. 5) and the card body prior to assembly,

Fig. 10 wie in Fig. 9, jedoch im zusammengesetzten Zustand, Fig. 10 as in FIG. 9, but in the assembled state,

Fig. 11 eine Ansicht eines Chipmoduls mit einem leadframe und flip-chip gebondetem Halbleiterbaustein, Fig. 11 is a view of a chip module with a lead frame and flip-chip Bonded semiconductor device,

Fig. 12 einen Schnitt durch ein Chipmodul mit Keramikblock, Fig. 12 is a section through a chip module with ceramic block,

Fig. 13 eine Ansicht einer zweiseitigen Antenne, Fig. 13 is a view of a two-side antenna,

Fig. 14 + Fig. 15 die Verbindung zwischen den Anschlußflächen von Chipmodul und Übertragungselement mittels leitfähiger Partikel, die in ein thermoplastisches Material eingebettet sind (vor der Kontaktierung und nach erfolgter Kontaktierung), Fig. 14 + Fig. 15, the connection between the terminal areas of the chip module and the transmission element by means of conductive particles embedded in a thermoplastic material (before the contacting and after the contacting),

Fig. 16 die Verbindung zwischen den Anschlußflächen von Chipmodul und Übertragungselement durch einen Lötvorgang oder durch leitfähiges Kleben, Fig. 16, the connection between the terminal areas of the chip module and the transmission element by soldering or by conductive gluing,

Fig. 17 wie in Fig. 16, jedoch mit zusätzlich auf den Anschlußflächen aufgebrachten Lothügeln, Fig. 17 as in FIG. 16, but with additionally applied on the pads solder bumps,

Fig. 18 einen federnden Kontakt zwischen den Anschlußstellen, Fig. 18 is a resilient contact between the connection points,

Fig. 19 die Verbindung zwischen den Anschlußflächen von Chipmodul und Übertragungselement mittels eines leitend beschichteten, flexiblen Balls. Fig. 19, the connection between the terminal areas of the chip module and the transmission element by means of a conductive coated flexible ball.

Die Chipkarte ( Fig. 1 und Fig. 2) zur kontaktlosen Datenübertragung, weist ein separat in den Kartenkörper ( 2 ) eingebautes Übertragungsmodul ( 3 ) auf, welches eine Antenne ( 4,5 ) in Form mindestens einer Spule ( 4 ) zur induktiven Daten- und Energieübertragung und/oder in Form elektrisch leitender Schichten ( 5 ) zur kapazitiven Daten- und Energieübertragung besitzt. The chip card (Fig. 1 and Fig. 2) for contactless data transmission, has a separately into the card body (2) built-in communication module (3) having an antenna (4,5) in the form of at least one coil (4) for inductive data - and power transmission and / or in the form of electrically conductive layers (5) has for capacitive data and energy transmission. Das Übertragungsmodul ( 3 ) weist Anschlußflächen ( 6 ) zur elektrischen Ankopplung an das Chipmodul ( 7 ) auf. The transmission module (3) comprises pads (6) for electrically coupling to the chip module (7).

Getrennt vom Übertragungsmodul ( 3 ) wird in den Kartenkörper ( 2 ) ein Chipmodul ( 7 ) mit mindestens einem IC-Baustein ( 8 ) und Anschlußflächen ( 21 ) zur elektrischen Ankopplung an das Übertragungsmodul ( 3 ) eingebaut. Separated from the transfer module (3) a chip module (7) with at least one IC module (8) and connecting surfaces (21) for electrically coupling to the transmission module (3) is incorporated into the card body (2).

Das Übertragungsmodul ( 3 ) kann eine geschlossene Trägerschicht ( 9 ) aufweisen, auf der die Antenne ( 4 , 5 ) mit den entsprechenden Anschlußflächen ( 6 ) angeordnet ist, wobei das Chipmodul ( 7 ) mit seinen Anschlußflächen ( 21 ) auf der Trägerschicht ( 9 ) des Übertragungsmoduls ( 3 ) angeordnet ist (vgl. Fig. 1). The transmission module (3) may have a closed supporting layer (9), on which the antenna (4, 5) with the corresponding pads (6) is arranged, wherein the chip module (7) with its pads (21) on the support layer (9 ) of the transmission module (3) is disposed (see. Fig. 1).

In der Trägerschicht ( 9 ) kann auch eine Aussparung ( 10 ) für eine zumindest teilweise Aufnahme des Chipmoduls ( 7 ) vorgesehen sein (vgl. Fig. 2 und Fig. 7). In the support layer (9) a recess (10) for at least partially receiving the chip module (7) can be provided (see. Fig. 2 and Fig. 7). Im Bereich der Aussparung ( 10 ) der Trägerschicht ( 9 ) ist außerdem eine Kavität ( 11 ) zur teilweisen Aufnahme des Chipmoduls ( 7 ) vorgesehen. In the region of the recess (10) of the support layer (9) a cavity (11) for partially receiving the chip module (7) is also provided.

Die Trägerschicht ( 9 ) des Übertragungsmoduls ( 3 ) kann eine einseitige oder zweiseitige Schaltung aufweisen. The backing layer (9) of the transmission module (3) may have a unilateral or bilateral circuit.

In Fig. 13 ist ein Trägerelement dargestellt, auf dem über Durchkontaktierungen ( 14 ) eine elektrisch leitende Verbindung zu einem Leiterbahnenstück auf der der Spule abgewandten Seite des Trägerelementes hergestellt wird. In Fig. 13, a support member is shown, an electrically conductive connection is produced to a conductor path section on the side remote from the coil side of the carrier element on the plated-through holes (14). Dies ermöglicht die kreuzungs- und brückungsfreie Anbindung des Spulenendes an die entsprechende Anschlußfläche ( 6 ). This allows the intersection and brückungsfreie connection of the coil end to the corresponding pad (6).

Die Fläche der Trägerschicht ( 9 ) entspricht in vorteilhafter Weise der Grundfläche des Kartenkörpers ( 2 ), um Deformationen des Kartenkörpers ( 2 ) und Verwerfungen der Kartenoberfläche zu vermeiden. The surface of the support layer (9) corresponds advantageously the base surface of the card body (2) in order to avoid deformation of the card body (2) and warps the card surface.

In einer alternativen Ausführungsform (nicht dargestellt) ist das Übertragungsmodul ( 3 ) mit Antenne ( 4,5 ) und Anschlußflächen ( 6 ) als Stanz- oder Ätzteil ohne Trägerschicht ausgebildet. In an alternative embodiment (not shown), the transfer module (3) with antenna (4.5) and connecting surfaces (6) are formed as punching or etching part without a carrier layer. Ein solches Übertragungsmodul ( 3 ) kann in einfacher Weise in einen gespritzten Kartenkörper eingeformt werden. Such a transmission module (3) can be formed easily in a molded card body.

In einer weiteren Ausführungsform wird die Antenne ( 4,5 ) in einem additiven Verfahren, z. In another embodiment, the antenna (4,5) is in an additive process, z. B. Schablonendruck leitfähiger Pasten, auf eine innen liegende Lage des Kartenkörpers ( 2 ) aufgebracht. B. stencil printing of conductive pastes, connected to an internal layer of the card body (2) is applied.

Die Anschlußflächen ( 21 ) des Chipmoduls ( 7 ) und die Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) können in einem Lötprozeß mit Widerstandsheizung, Infrarot- oder Laseraufheizung miteinander verbunden werden. The pads (21) of the chip module (7) and the pads (6) of the transmission module (3) can be connected together in a soldering process using resistance heating, infrared or laser heating.

Alternativen hierfür sind are alternatives for this

  • - die Verbindung über einen leitfähigen Kleber ( 15 ) - vgl. - the connection via a conductive adhesive (15) - see FIG. Fig. 16, Fig. 16
  • - die Verbindung über auf die Anschlußflächen ( 6,21 ) aufgebrachte leitfähige Erhöhungen ( 32 ) mittels Löten oder Kleben - vgl. - the connection via the pads (6,21) applied conductive protrusions (32) by soldering or gluing - cf. Fig. 17, FIG. 17
  • - Ultraschallschweißen, - ultrasonic welding,
  • - in einem thermoplastischen Material ( 16 ) eingebettete, leitfähige Partikel ( 17 ) - vgl. - in a thermoplastic material (16) embedded conductive particles (17) - see FIG. Fig. 14+15, Fig. 14 + 15,
  • - ein federnd unterstützter, mechanischer Berührungskontakt, z. - a resiliently supported, mechanical touching contact, for. B. mittels einer Kontaktfeder - vgl. For example by means of a contact spring - see. Fig. 18, FIG. 18
  • - ein elastisch deformierbarer Körper ( 18 ), dessen Oberfläche eine leitende Beschichtung ( 19 ) aufweist - vgl. - an elastically deformable body (18) whose surface has a conductive coating (19) - see FIG. Fig. 19. Fig. 19.

Auf dem Chipmodul ( 7 ) sind optional zusätzlich Kontaktflächen ( 20 ) für eine kontaktbehaftete Datenübertragung vorgesehen. On the chip module (7) contact surfaces (20) for a contact-type data transmission are optionally additionally provided.

Das Chipmodul ( 7 ) weist in einer Ausführungsform einen nicht leitenden Substratfilm ( 22 ) auf, auf dem der Chip ( 8 ) und die metallischen Anschlußflächen ( 21 ) angeordnet sind, wobei der Chip ( 8 ) über Bonddrähte ( 23 ) mit den Anschlußflächen ( 21 ) verbunden ist, und der Chip ( 8 ) und die Bonddrähte ( 23 ) von einer schützenden Vergußmasse ( 24 ) umgeben sind. The chip module (7) has in one embodiment a non-conducting substrate film (22) on which the chip (8) and the metallic pads (21) are arranged, wherein the chip (8) via bonding wires (23) (with the pads 21) and the chip (8) and the bonding wires (23) by a protective encapsulant (24) are surrounded.

Auf der einen Seite des Substratfilms ( 22 ) sind der Chip ( 8 ) und die metallischen Anschlußflächen ( 21 ) angeordnet und auf der anderen Seite die Kontaktflächen ( 20 ) für einen kontaktbehafteten Datenaustausch der Chipkarte ( 1 ). On one side of the substrate film (22) of the chip (8) and the metallic pads (21) are arranged on the other side of the contact surfaces (20) for a contact-type data exchange of the chip card (1). Im Substratfilm ( 22 ) sind Zugangsöffnungen ( 25 ) zu den Kontaktflächen ( 20 ) ausgespart (vgl. Fig. 5). In the substrate film (22) access openings (25) to the contact surfaces (20) recessed (see. Fig. 5).

In einer nicht dargestellten Ausführungsform ist der Chip ( 8 ) in einer Aussparung des Substratfilms ( 22 ) auf den Kontaktflächen ( 20 ) angeordnet. In an embodiment not shown, the chip (8) in a recess of the substrate film (22) on the contact surfaces (20) is arranged.

In einer vorteilhaften Ausführungsform weisen die Anschlußflächen ( 21 ) des Chipmoduls ( 7 ) elektrisch leitende Stützfüße ( 27 ) auf, die sich auf den Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) abstützen (vgl. Fig. 5, 9, 10). In an advantageous embodiment, the pads (21) (9, 10 cf. Fig. 5) show the chip module (7) electrically conductive support feet (27) on which are supported on the pads (6) of the transmission module (3).

In einer weiteren Ausführungsform (vgl. Fig. 12) wird das Chipmodul ( 7 ) von einen im Querschnitt U-förmigen Keramik- und/oder Kunststoffblock ( 29 ) mit einer dreidimensionalen, die Anschlußflächen ( 21 ) und die Kontaktflächen ( 20 ) aufweisenden Metallisierung gebildet. In a further embodiment (see. Fig. 12), the chip module (7) of a cross-sectionally U-shaped ceramic and / or plastic block (29) having a three-dimensional, the pads (21) and the contact surfaces (20) having metallization educated.

In einer alternativen Ausführungsform (vgl. Fig. 11) weist das Chipmodul ( 7 ) ein die Kontakt- und Anschlußflächen ( 20 , 21 ) bildendes Stanz- oder Ätzteil ( 28 ) (einen sogenannten leadframe) auf, auf dem der Chip ( 8 ) angeordnet ist. In an alternative embodiment (see Fig., 11), the chip module (7), the contact and connecting surfaces (20, 21) forming punching or etching part (28) (a so-called lead frame), on which the chip (8) is arranged.

Auf einem solchen leadframe ist der Chip ( 8 ) in vorteilhafter Weise mit seinen Anschlußstellen mittels Flip-Chip Kontaktierung direkt auf den entsprechenden Kontaktflächen ( 20 ) und den Anschlußflächen ( 21 ) elektrisch leitend fixiert. On such a lead frame, the chip (8) is fixed advantageously with its connection points by means of flip chip contacting directly on the corresponding contact surfaces (20) and the pads (21) electrically conductive.

Der Kartenkörper ( 2 ) kann von mehreren durch Lamination miteinander verbundenen Schichten ( 2 A) gebildet werden. The card body (2) can be formed from several interconnected by lamination layers (2 A).

Die Verbindung zwischen den Anschlußflächen ( 21 ) des Chipmodul ( 7 ) und den Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) bewirkt zusätzlich zur elektrischen Kontaktierung eine mechanisch stabilisierende Verbindung der beiden Module ( 3 , 7 ). The connection between the pads (21) of the chip module (7) and the pads (6) of the transmission module (3) in addition to the electrical contact causes a mechanically stabilizing connection of the two modules (3, 7).

In einer nicht dargestellten Ausführungsform weist das Übertragungsmodul ( 3 ) mehrere, unterschiedlich dimensionierte Spulen ( 4 ) mit entsprechenden Anschlußflächen ( 6 ) auf, die die Auswahl der unterschiedlichen Spulen ( 4 ) durch entsprechenden Anschluß der den Spulen ( 4 ) zugehörigen Anschlußflächen ( 6 ) ermöglicht. In an embodiment not shown, the transfer module (3) (6) has a plurality of different sized coils (4) with corresponding pads (6) on which the selection of the different coils (4) associated with the corresponding terminal of the coil (4) pads allows.

Claims (35)

  1. 1. Chipkarte zur kontaktlosen Datenübertragung, gekennzeichnet durch 1. Chip card for contactless data transmission, characterized by
    • - ein separat in den Kartenkörper ( 2 ) eingebautes Übertragungsmodul ( 3 ), welches eine Antenne in Form mindestens einer Spule ( 4 ) zur induktiven Daten- und Energieübertragung und/oder in Form elektrisch leitender Schichten ( 5 ) zur kapazitiven Daten- und Energieübertragung aufweist, und welches Anschlußflächen ( 6 ) zur elektrischen Ankopplung an das Chipmodul ( 7 ) aufweist, - a separately into the card body (2) built-in communication module (3), comprising an antenna in the form of at least one coil (4) for inductive data and power transmission and / or in the form of electrically conductive layers (5) for capacitive data and energy transmission and which pads (6) for electrically coupling to the chip module (7),
    • - ein getrennt vom Übertragungsmodul ( 3 ) in den Kartenkörper ( 2 ) eingebautes Chipmodul ( 7 ) mit mindestens einem IC-Baustein ( 8 ) und Anschlußflächen ( 21 ) zur elektrischen Ankopplung an das Übertragungsmodul ( 3 ). - separated from a transfer module (3) in the card body (2) built-in chip module (7) with at least one IC module (8) and connecting surfaces (21) for electrically coupling to the transmission module (3).
  2. 2. Chipkarte nach Anspruch 1, dadurch gekennzeichnet, daß das Übertragungsmodul ( 3 ) eine geschlossene Trägerschicht ( 9 ) aufweist, auf der die Antenne ( 4,5 ) mit den entsprechenden Anschlußflächen ( 6 ) angeordnet ist, wobei das Chipmodul ( 7 ) mit seinen Anschlußflächen ( 21 ) auf den Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) angeordnet ist. 2. A smart card according to claim 1, characterized in that the transmission module (3) has a closed support layer (9), on which the antenna (4,5) with the corresponding pads (6) is arranged, wherein the chip module (7) its pads (21) on the pads (6) of the transmission module (3) is arranged.
  3. 3. Chipkarte nach Anspruch 1, dadurch gekennzeichnet, daß in der Trägerschicht ( 9 ) eine Aussparung ( 10 ) für eine zumindest teilweise Aufnahme des Chipmoduls ( 7 ) vorgesehen ist, wobei das Chipmodul ( 7 ) mit seinen Anschlußflächen ( 21 ) auf den Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) angeordnet ist. 3. A smart card according to claim 1, characterized in that in the support layer (9) is provided a recess (10) for at least partially receiving the chip module (7), wherein the chip module (7) with its pads (21) on the pads (6) the transmission module (3) is arranged.
  4. 4. Chipkarte nach Anspruch 3, dadurch gekennzeichnet, daß in dem Kartenkörper ( 2 ) im Bereich der Aussparung ( 10 ) der Trägerschicht ( 9 ) eine Kavität ( 11 ) zur teilweisen Aufnahme des Chipmoduls ( 7 ) vorgesehen ist. 4. Chip card according to claim 3, characterized in that in the card body (2) in the region of the recess (10) of the support layer (9) a cavity (11) for partially receiving the chip module (7).
  5. 5. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Trägerschicht ( 9 ) des Übertragungsmoduls ( 3 ) eine einseitige Schaltung aufweist. 5. Chip card according to one of the preceding claims, characterized in that the support layer (9) of the transmission module (3) has a one-sided circuit.
  6. 6. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Trägerschicht ( 9 ) eine zweiseitige Schaltung aufweist. 6. Chip card according to one of the preceding claims, characterized in that the support layer (9) has a two-sided circuit.
  7. 7. Chipkarte nach Anspruch 6, dadurch gekennzeichnet, daß die Trägerschicht ( 9 ) mindestens eine Durchkontaktierung ( 14 ) zur Verbindung eines Spulenendes mit der entsprechenden Anschlußfläche ( 6 ) aufweist. 7. A smart card according to claim 6, characterized in that the support layer (9) has at least one plated-through hole (14) for connection of a coil end with the corresponding connection face (6).
  8. 8. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Fläche der Trägerschicht ( 9 ) der Grundfläche des Kartenkörpers ( 2 ) entspricht, um Deformationen des Kartenkörpers ( 2 ) und Verwerfungen der Kartenoberfläche zu vermeiden. 8. Chip card according to one of the preceding claims, characterized in that the surface of the support layer (9) corresponds to the base area of the card body (2) in order to avoid deformation of the card body (2) and warps the card surface.
  9. 9. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß das Übertragungsmodul ( 3 ) mit Antenne ( 4 , 5 ) und Anschlußflächen ( 6 ) als Stanz- oder Ätzteil ohne Trägerschicht ausgebildet ist. 9. smart card is designed according to one of the preceding claims, characterized in that the transmission module (3) with antenna (4, 5) and connecting surfaces (6) as a stamping or etching part without a carrier layer.
  10. 10. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Antenne ( 4 , 5 ) in einem additiven 10. Chip card according to one of the preceding claims, characterized in that the antenna (4, 5) additive in a
    Verfahren, z. Methods such. B. Schablonendruck leitfähiger Pasten, auf eine innen liegende Lage des Kartenkörpers ( 2 ) aufgebracht wird. B. stencil printing of conductive pastes, connected to an internal layer of the card body (2) is applied.
  11. 11. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Anschlußflächen ( 21 ) des Chipmoduls ( 7 ) und die Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) in einem Lötprozeß mit Widerstandsheizung, Infrarot- oder Laseraufheizung miteinander verbunden sind. 11. Chip card according to one of the preceding claims, characterized in that the pads (21) of the chip module (7) and the pads (6) of the transmission module (3) are connected in a soldering process using resistance heating, infrared or laser heating each other.
  12. 12. Chipkarte nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, daß die Anschlußflächen ( 21 ) des Chipmoduls ( 7 ) und die Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) über einen leitfähigen Kleber ( 15 ) miteinander verbunden sind. 12. Chip card according to one of claims 1 to 10, characterized in that the pads (21) of the chip module (7) and the pads (6) of the transmission module (3) via a conductive adhesive (15) are connected together.
  13. 13. Chipkarte nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, daß die Anschlußflächen ( 21 ) des Chipmoduls ( 7 ) und die Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) durch Ultraschallschweißen miteinander verbunden sind. 13. Chip card according to one of claims 1 to 10, characterized in that the pads (21) of the chip module (7) and the pads (6) of the transmission module (3) by ultrasonic welding are interconnected.
  14. 14. Chipkarte nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, daß die Anschlußflächen ( 21 ) des Chipmoduls ( 7 ) und die Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) durch in einem thermoplastischen Material ( 16 ) eingebettete, leitfähige Partikel ( 17 ) miteinander verbunden sind, wobei beim Einsetzen des Chipmoduls ( 7 ) in den mit einem Übertragungsmodul ( 3 ) bestückten Kartenkörper ( 2 ) die leitfähigen Partikel ( 17 ) infolge einer Erweichung und Kompression des thermoplastischen Materials ( 16 ) eine Kontaktierung der entsprechenden Anschlußflächen ( 6,21 ) bewirken. 14. Chip card according to one of claims 1 to 10, characterized in that the pads (21) of the chip module (7) and the pads (6) of the transmission module (3) in a thermoplastic material (16) embedded conductive particles (17 ) are interconnected, wherein (upon insertion of the chip module (7) in the (a transmission module 3) equipped card body 2), the conductive particles (17) as a result of softening and compression of the thermoplastic material (16) contacting the corresponding connection faces (6 effect, 21).
  15. 15. Chipkarte nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, daß die Anschlußflächen ( 21 ) des Chipmoduls ( 7 ) und die Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) nur durch einen federnd unterstützten, mechanischen Berührungskontakt miteinander elektrisch leitend verbunden sind. 15. Chip card according to one of claims 1 to 10, characterized in that the pads (21) of the chip module (7) and the pads (6) of the transmission module (3) are electrically conductively connected only by a resiliently supported, mechanical physical contact.
  16. 16. Chipkarte nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, daß die Anschlußflächen ( 21 ) des Chipmoduls ( 7 ) und die Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) über einen elastisch deformierbaren Körper ( 18 ), dessen Oberfläche eine leitende Beschichtung ( 19 ) aufweist, miteinander verbunden sind. 16. Chip card according to one of claims 1 to 10, characterized in that the pads (21) of the chip module (7) and the pads (6) of the transmission module (3) via an elastically deformable body (18) whose surface a conductive coating (19) which are connected together.
  17. 17. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß auf dem Chipmodul ( 7 ) Kontaktflächen ( 20 ) für eine kontaktbehaftete Datenübertragung vorgesehen sind. 17. Chip card according to one of the preceding claims, characterized in that on the chip module (7) contact surfaces (20) are provided for a contact-type data transmission.
  18. 18. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß das Chipmodul ( 7 ) einen nicht leitenden Substratfilm ( 22 ) aufweist, auf dem der Chip ( 8 ) und die metallischen Anschlußflächen ( 21 ) angeordnet sind, wobei der Chip ( 8 ) über Bonddrähte ( 23 ) mit den Anschlußflächen ( 21 ) verbunden ist, und der Chip ( 8 ) und die Bonddrähte ( 23 ) verkapselt sind. 18. Chip card according to one of the preceding claims, characterized in that the chip module (7) comprises a non-conductive substrate film (22) on which the chip (8) and the metallic pads (21) are arranged, wherein the chip (8) is connected via bonding wires (23) to the pads (21) and are encapsulated the chip (8) and the bonding wires (23).
  19. 19. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß das Chipmodul ( 7 ) einen nicht leitenden Substratfilm ( 22 ) aufweist, wobei auf der einen Seite des Substratfilms ( 22 ) der Chip ( 7 ) und die metallischen Anschlußflächen ( 21 ) angeordnet sind und auf der anderen Seite die Kontaktflächen ( 20 ) für einen kontaktbehafteten Datenaustausch der Chipkarte ( 1 ) angeordnet sind, und im Substratfilm ( 22 ) Zugangsöffnungen ( 25 ) zu den Kontaktflächen ( 20 ) ausgespart sind, und der Chip ( 8 ) über Bonddrähte ( 23 ) mit den Kontaktflächen ( 20 ) und den Anschlußflächen ( 21 ) verbunden ist, und der Chip ( 8 ) und die Bonddrähte ( 23 ) verkapselt sind. 19. Chip card according to one of the preceding claims, characterized in that the chip module (7) comprises a non-conductive substrate film (22), arranged on one side of the substrate film (22) of the chip (7) and the metallic pads (21) are, and on the other hand, the contact surfaces (20) for a contact-type data exchange of the chip card (1) are arranged, and in the substrate film (22) access openings (25) are recessed to the contact surfaces (20) and the chip (8) via bonding wires (23) is connected to the contact surfaces (20) and the pads (21) and the chip (8) and the bonding wires (23) are encapsulated.
  20. 20. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß das Chipmodul ( 7 ) einen nicht leitenden Substratfilm ( 22 ) aufweist, wobei auf der einen Seite des Substratfilms ( 22 ) der Chip ( 8 ) und die metallischen Anschlußflächen ( 21 ) angeordnet sind und auf der anderen Seite die Kontaktflächen ( 20 ) für einen kontaktbehafteten Datenaustausch der Chipkarte ( 1 ) angeordnet sind, und der Chip ( 8 ) in einer Aussparung des Substratfilms ( 22 ) auf den Kontaktflächen ( 20 ) angeordnet ist, und der Chip ( 8 ) über Bonddrähte ( 23 ) mit den Kontaktflächen ( 20 ) und den Anschlußflächen ( 21 ) verbunden ist, und der Chip ( 8 ) und die Bonddrähte ( 23 ) verkapselt sind. 20. Chip card according to one of the preceding claims, characterized in that the chip module (7) comprises a non-conductive substrate film (22), arranged on one side of the substrate film (22) of the chip (8) and the metallic pads (21) are, and on the other hand, the contact surfaces (20) for a contact-type data exchange of the chip card (1) are arranged, and the chip (8) in a recess of the substrate film (22) on the contact surfaces (20) is arranged, and the chip ( 8) via bonding wires (23) with the contact surfaces (20) and the pads (21) and the chip (8) and the bonding wires (23) are encapsulated.
  21. 21. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß das Chipmodul ( 7 ) einen Substratfilm ( 22 ) mit einer zweiseitig durchkontaktierten Schaltung aufweist, und der Chip ( 8 ) mittels Flip-Chip Kontaktierung auf der Schaltung elektrisch leitend fixiert ist. 21. Chip card according to one of the preceding claims, characterized in that the chip module (7) comprising a substrate film (22) having a two-sided through-hole circuit, and the chip (8) by means of flip-chip bonding to the circuit is electrically conductively fixed.
  22. 22. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Anschlußflächen ( 21 ) des Chipmoduls ( 7 ) elektrisch leitende Stützfüße ( 27 ) aufweisen, die sich auf den Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) abstützen, und der Chip ( 8 ) und die Bonddrähte ( 23 ) verkapselt sind. 22. Chip card according to one of the preceding claims, characterized in that the pads (21) of the chip module (7) comprise electrically conductive support feet (27), which are supported on the pads (6) of the transmission module (3) and the chip ( 8) and the bonding wires (23) are encapsulated.
  23. 23. Chipkarte nach Anspruch 22, dadurch gekennzeichnet, daß die Stützfüße ( 27 ) die Verkapselung überragen. 23. Chip card according to claim 22, characterized in that the supporting feet (27) project beyond the encapsulation.
  24. 24. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß das Chipmodul ( 7 ) von einen im Querschnitt U-förmigen Keramik- und/oder Kunststoffblock ( 29 ) mit einer dreidimensionalen, die Anschlußflächen ( 21 ) und die Kontaktflächen ( 20 ) aufweisenden Metallisierung gebildet ist, wobei der Chip ( 8 ) im Inneren des Blocks ( 29 ) angeordnet ist und über Bonddrähte ( 23 ) mit den entsprechenden Anschlußflächen ( 21 ) und Kontaktflächen ( 20 ) verbunden ist, und der Chip ( 8 ) und die Bonddrähte ( 23 ) verkapselt sind. 24. Chip card according to one of the preceding claims, characterized in that the chip module (7) comprising of a cross-sectionally U-shaped ceramic and / or plastic block (29) having a three-dimensional, the pads (21) and the contact surfaces (20) metallization is formed, wherein the chip (8) inside the block (29) and bonding wires (23) with the corresponding connecting areas (21) and contact surfaces (20) and the chip (8) and the bonding wires ( 23) are encapsulated.
  25. 25. Chipkarte nach einem der Ansprüche 1 bis 17, dadurch gekennzeichnet, daß das Chipmodul ( 7 ) ein die Kontakt- und Anschlußflächen ( 20,21 ) bildendes Stanz- oder Ätzteil ( 28 ) aufweist, auf dem der Chip ( 8 ) angeordnet ist. 25. Chip card according to one of claims 1 to 17, characterized in that the chip module (7) and the contact pads (20,21) comprises forming punching or etching part (28) is arranged on which the chip (8) ,
  26. 26. Chipkarte nach Anspruch 25, dadurch gekennzeichnet, daß der Chip ( 8 ) mit seinen Anschlußstellen mittels Flip-Chip Kontaktierung direkt auf den entsprechenden Kontaktflächen ( 20 ) und den Anschlußflächen ( 21 ) elektrisch leitend fixiert ist. 26. Chip card according to claim 25, characterized in that the chip (8) with its connection points by means of flip chip contacting directly on the corresponding contact surfaces (20) and the pads (21) is electrically conductively fixed.
  27. 27. Chipkarte nach Anspruch 25, dadurch gekennzeichnet, daß der Chip ( 8 ) über Bonddrähte ( 23 ) mit den Kontaktflächen ( 20 ) und den Anschlußflächen ( 21 ) verbunden ist, wobei der Chip ( 8 ) und die Bonddrähte ( 23 ) verkapselt sind. 27. Chip card according to claim 25, characterized in that the chip (8) via bonding wires (23) with the contact surfaces (20) and the pads (21), wherein the chip (8) and the bonding wires (23) are encapsulated ,
  28. 28. Chipkarte nach Anspruch 9, dadurch gekennzeichnet, daß die gestanzte oder geätzte Antenne ( 4 , 5 ) mit den Anschlußflächen ( 6 ) in einem gespritzten Kartenkörper eingeformt ist, wobei die Anschlußflächen ( 6 ) auf dem Boden einer Kavität zur Aufnahme des Chipmoduls ( 7 ) liegen. 28. Chip card according to claim 9, characterized in that the punched or etched antenna (4, 5) with the contact pads (6) is molded into an injection molded card body, wherein the pads (6) on the bottom of a cavity for receiving the chip module ( 7).
  29. 29. Chipkarte nach Anspruch 9, dadurch gekennzeichnet, daß die gestanzte oder geätzte Antenne ( 4 , 5 ) mit den Anschlußflächen ( 6 ) in einem gespritzten Kartenkörper eingeformt ist, wobei die Anschlußflächen ( 6 ) auf den Schultern einer zweistufigen Kavität zur Aufnahme des Chipmoduls ( 7 ) liegen, und das Chipmodul ( 7 ) zumindest teilweise zwischen den die Anschlußflächen ( 6 ) tragenden Schultern eingebettet ist. 29. Chip card according to claim 9, characterized in that the punched or etched antenna (4, 5) with the contact pads (6) is molded into an injection molded card body, wherein the pads (6) on the shoulders of a two-step cavity for receiving the chip module are (7), and the chip module (7) at least partially between the pads (6) shoulders bearing is embedded.
  30. 30. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß der Kartenkörper ( 2 ) von mehreren durch Lamination miteinander verbundenen Schichten ( 2 A) gebildet ist. 30. Chip card according to one of the preceding claims, characterized in that the card body (2) of several interconnected by laminating layers (A 2) is formed.
  31. 31. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Trägerschicht ( 9 ) mit dem Übertragungsmodul ( 3 ) zwischen zwei Deckschichten ( 2 A) einlaminiert ist, wobei die eine Schicht eine Öffnung zur Aufnahme des Chipmoduls ( 7 ) aufweist, und über diese Schicht eine das Chipmodul ( 7 ) abdeckende Deckschicht laminiert ist. 31. Chip card according to one of the preceding claims, characterized in that the support layer (9) to the transmission module (3) between two cover layers (2 A) is laminated, wherein the one layer has an opening for receiving the chip module (7), and this layer has a chip module (7) covering outer layer is laminated.
  32. 32. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Verbindung zwischen den Anschlußflächen ( 21 ) des Chipmoduls ( 7 ) und den Anschlußflächen ( 6 ) des Übertragungsmoduls ( 3 ) zusätzlich zur elektrischen Kontaktierung eine mechanisch stabilisierende Verbindung der beiden Module ( 3 , 7 ) bewirkt. 32. Chip card according to one of the preceding claims, characterized in that the connection between the connecting surfaces (21) of the chip module (7) and the pads (6) of the transmission module (3) in addition to making electrical contact with a mechanically stabilizing connection of the two modules (3 , 7) effected.
  33. 33. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die elektrische Ankopplung zwischen dem Chipmodul ( 7 ) und dem Übertragungsmodul ( 3 ) über eine kapazitive Einkopplung durch eine dielektrische Schicht zwischen den Anschlußflächen ( 6 , 21 ) erfolgt. 33. Chip card according to one of the preceding claims, characterized in that the electrical coupling between the chip module (7) and the transmission module (3) via a capacitive coupling by a dielectric layer between the pads (6, 21).
  34. 34. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß das Übertragungsmodul ( 3 ) mehrere, unterschiedlich dimensionierte Spulen ( 4 ) mit entsprechenden Anschlußflächen ( 6 ) aufweist, die wahlweise verwendbar sind. Having 34. Chip card according to one of the preceding claims, characterized in that the transmission module (3) a plurality of differently-sized coils (4) with corresponding pads (6), which are selectively usable.
  35. 35. Chipkarte nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß der Chips ( 8 ) und die Bonddrähte ( 23 ) zur Verkapselung von einer schützenden Vergußmasse ( 24 ) umgeben sind. 35. Chip card according to one of the preceding claims, characterized in that the chip (8) and the bonding wires (23) for encapsulating a protective encapsulant (24) are surrounded.
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