WO1988009598A1 - Application of the ink jet process for manufacturing hybrid and printed electronic circuits - Google Patents

Application of the ink jet process for manufacturing hybrid and printed electronic circuits Download PDF

Info

Publication number
WO1988009598A1
WO1988009598A1 PCT/CH1988/000090 CH8800090W WO8809598A1 WO 1988009598 A1 WO1988009598 A1 WO 1988009598A1 CH 8800090 W CH8800090 W CH 8800090W WO 8809598 A1 WO8809598 A1 WO 8809598A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic circuits
application
ink jet
circuits according
manufacturing electronic
Prior art date
Application number
PCT/CH1988/000090
Other languages
French (fr)
Inventor
Rino Doriguzzi
Original Assignee
Rino Doriguzzi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rino Doriguzzi filed Critical Rino Doriguzzi
Publication of WO1988009598A1 publication Critical patent/WO1988009598A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential

Definitions

  • development consists in the development of a lay-out and then a photo-graphic film on a 1/1 scale which will be used for the production of screen-printing screens, the manufacturing being done by serigraphy on ceramic substrate, one per layer; the layers are then baked in an oven.
  • development consists in developing a lay-out and then a photographic plate on a 1/1 scale, one for each layer of different materials, the manufacturing being done by evaporation under vacuum on a ceramic substrate, one per layer followed by a selective chemical attack on each layer after having exposed a sensitive photo layer serving as a mask.
  • the development consists in the elaboration of a lay-out then of a photographic plate on the scale 1/1 which will be used in the manufacturing to expose a sensitive photo layer deposited on the support in gold material ⁇ ganique followed by a selective chemical attack.
  • Figure 1 gives the principle of manufacturing electronic circuits by ink jet according to the invention.
  • a pump 1 sends a very fine ink jet 2 which, while passing through the electro ⁇ of 3, is charged with static electricity. It then passes between two pairs of deflection electrodes VI and V2 for the vertical deflection, Hl and H2 for the horizontal deflection to finish on the substrate 4 which will constitute the electronic circuit.
  • the deflection of the ink jet by the deflection plates VI, V2, Hl and H2 is controlled by a computer 5.
  • inks necessary for the manufacture of hybrid electronic circuits printed by the method described above will be of several categories which depend on the support. For example, inks for hybrid circuits made on ceramic support are baked at high temperature: about 800 to 900 K, inks for hybrid circuits made on porcelain support are baked at medium temperature: about 600 ° K, inks for circuits prints made on organic support such as epoxy are cooked at low temperature: about 125 to 150 ° K,
  • the circuits can be made on substrates of any shape and large dimensions.
  • an inkjet device is less expensive than an automatic screen printer, a vacuum evaporator or a mask aligner.

Abstract

Electronic circuits are manufactured by means of an ink jet (2) ejected from a pump (1). The ink jet passes into an electrode (3) where it receives a static electric charge which enables it to be deflected by deflection plates (V1, V2, H1, H2) controlled by a computer (5) in order to reach the substrate (4).

Description

Application du procédé par jet d'encre pour la fabrication Application of the inkjet process for manufacturing
de circuits électroniques hybrides et impriméshybrid and printed electronic circuits
'1'1
La fabrication des circuits électroniques hybrides et imprimés ainsi que leur développement se font actuellement de la maniè¬ re suivante :The manufacture of hybrid and printed electronic circuits and their development are currently carried out in the following manner:
- Pour les circuits hybrides couches épaisses, le développement consiste dans l'élaboration d'un lay-out puis d'un film photo¬ graphique à l'échelle 1/1 qui servira à la réalisation des écrans de sérigraphie, la fabrication se faisant par sérigra¬ phie sur substrat céramique, une par couche; les couches sont ensuite cuites dans un four.- For thick-film hybrid circuits, development consists in the development of a lay-out and then a photo-graphic film on a 1/1 scale which will be used for the production of screen-printing screens, the manufacturing being done by serigraphy on ceramic substrate, one per layer; the layers are then baked in an oven.
- Pour les circuits hybrides couches minces, le développement consiste dans l'élaboration d'un lay-out puis d'une plaque photographique à l'échelle 1/1, une pour chaque couche de ma¬ tériaux différents, la fabrication se faisant par évaporation sous vide sur substrat céramique, une par couche suivie d'une attaque chimique sélective de chaque couche après avoir ex¬ posé une couche photo sensible servant de masque.- For thin-film hybrid circuits, development consists in developing a lay-out and then a photographic plate on a 1/1 scale, one for each layer of different materials, the manufacturing being done by evaporation under vacuum on a ceramic substrate, one per layer followed by a selective chemical attack on each layer after having exposed a sensitive photo layer serving as a mask.
- Pour les circuits imprimés, le développement consiste dans l'élaboration d'un lay-out puis d'une plaque photographique à l'échelle 1/1 qui servira dans la fabrication à exposer une couche photo sensible déposée sur le support en matière or¬ ganique suivie d'une attaque chimique sélective.- For the printed circuits, the development consists in the elaboration of a lay-out then of a photographic plate on the scale 1/1 which will be used in the manufacturing to expose a sensitive photo layer deposited on the support in gold material ¬ ganique followed by a selective chemical attack.
Tous les travaux de développement coûtent chers et manquent de souplesse car la moindre correction ou modification du circuit oblige à tout refaire depuis le début. La fabrication elle-même demande des investissements .impor¬ tants et les procédés sont longs et coûteux. Le but de l'in¬ vention est de pallier aux inconvénients cités.All development work is expensive and lacks flexibility because the slightest correction or modification of the circuit means having to redo everything from the start. Manufacturing itself requires significant investments and the processes are long and expensive. The purpose of the invention is to overcome the drawbacks mentioned.
A cet effet, l'application du procédé par jet d'encre pour la fabrication de circuits électroniques hybrides et imprimés selon l'invention fonctionne tel que décrit par la revendica¬ tion 1.To this end, the application of the ink jet method for the manufacture of hybrid and printed electronic circuits according to the invention operates as described by the claims 1.
Les appareils à jet d'encre commandés par ordinateur existent déjà comme imprimantes de textes ou de dessins sur papier ou autre support. Pour la fabrication de circuits électroniques du type hybrides et imprimés suivant l'invention, on utilise le même procédé, seules les encres diffèrent.Computer-controlled inkjet devices already exist as text or design printers on paper or other media. For the manufacture of electronic circuits of the hybrid and printed type according to the invention, the same process is used, only the inks differ.
La figure 1 donne le principe de fabrication de circuits élec¬ troniques par jet d'encre suivant l'invention. Une pompe 1 envoie un jet d'encre très fin 2 qui, en traversant l'électro¬ de 3, se charge d!électricité statique. Il passe ensuite entre deux paires d'électrodes de déviation VI et V2 pour la dévia¬ tion verticale, Hl et H2 pour la déviation horizontale pour finir sur le substrat 4 qui constituera le circuit électroni¬ que. La déviation du jet d'encre par les plaques de déviation VI, V2, Hl et H2 est commandée par un ordinateur 5.Figure 1 gives the principle of manufacturing electronic circuits by ink jet according to the invention. A pump 1 sends a very fine ink jet 2 which, while passing through the electro¬ of 3, is charged with static electricity. It then passes between two pairs of deflection electrodes VI and V2 for the vertical deflection, Hl and H2 for the horizontal deflection to finish on the substrate 4 which will constitute the electronic circuit. The deflection of the ink jet by the deflection plates VI, V2, Hl and H2 is controlled by a computer 5.
Les encres nécessaires à la fabrication de circuits électroni¬ ques hybrides et imprimés par le procédé décrit plus haut seront de plusieurs catégories qui dépendent du support. Par exemple, les encres pour circuits hybrides faits sur support céramique sont à cuisson à haute température : environ 800 à 900 K, les encres pour circuits hybrides faits sur support porcelaine sont à cuisson à moyenne température : environ 600°K, les encres pour circuits imprimés faits sur support or¬ ganique tel qu'époxy sont à cuisson à basse température : environ 125 à 150°K,The inks necessary for the manufacture of hybrid electronic circuits printed by the method described above will be of several categories which depend on the support. For example, inks for hybrid circuits made on ceramic support are baked at high temperature: about 800 to 900 K, inks for hybrid circuits made on porcelain support are baked at medium temperature: about 600 ° K, inks for circuits prints made on organic support such as epoxy are cooked at low temperature: about 125 to 150 ° K,
De plus, dans chaque catégorie, il y a trois types d'encre bien définis, à savoir :In addition, in each category, there are three well-defined types of ink, namely:
- des encres en matériaux électriquement conducteurs qui, après cuisson, formeront les conducteurs du circuit élec¬ tronique.- Inks made of electrically conductive materials which, after firing, will form the conductors of the electronic circuit.
- des encres en matériaux électriquement résistants qui, après cuisson, formeront les résistances du circuit élec¬ tronique.- Inks made of electrically resistant materials which, after firing, will form the resistors of the electronic circuit.
- des encres en matériaux électriquement isolants qui, après cuisson, formeront les couches de protection ainsi que les couches d'isolation entre les différentes couches conduc¬ trices.- Inks made of electrically insulating materials which, after firing, will form the protective layers as well as the insulation layers between the different conductive layers.
Les avantages de la présente invention sont les suivants :The advantages of the present invention are as follows:
- le design du circuit se résume à l'écriture des programmes d'ordinateur pour chaque type d'encre.- the circuit design comes down to writing computer programs for each type of ink.
- une correction ou modification du circuit se résume par une modification du ou des programmes de l'ordinateur.- a correction or modification of the circuit is summed up by a modification of the computer program (s).
- diminution du nombre de cuissons des encres car plusieurs couches peuvent être cuites en même temps.- reduction in the number of inks firing because several layers can be fired at the same time.
- les circuits peuvent être faits sur des substrats de formes quelconques et de dimensions importantes.- The circuits can be made on substrates of any shape and large dimensions.
- gain de temps dans la réalisation des circuits. rendement élevé car les défauts peuvent être corrigés faci¬ lement.- time saving in the realization of circuits. high efficiency because faults can be corrected easily.
investissements peu élevés car un appareil à jet d'encre est moins coûteux qu'une serigraphieuse automatique, qu'un évaporateur sous vide ou qu'un aligneur de masques. low investment because an inkjet device is less expensive than an automatic screen printer, a vacuum evaporator or a mask aligner.

Claims

R e v e n d i c a t i o n s Claims
1. Application d'un procédé pour la fabrication de circuits électroniques caractérisée par le fait que l'on utilise un jet d'encre (2) issu d'une pompe (1) lequel passant dans une électrode (3) se charge d'électricité statique pouvant ainsi être dévié par des plaques de déviation * (VI, V2, Hl, H2) commandées par ordinateur (5) pour at¬ teindre le substrat (4).1. Application of a process for the manufacture of electronic circuits characterized in that an ink jet (2) from a pump (1) is used, which passing through an electrode (3) is responsible for static electricity can thus be deflected by deflection plates * (VI, V2, Hl, H2) controlled by computer (5) to reach the substrate (4).
2. Application d'un procédé pour la fabrication de circuits électroniques suivant revendication 1 caractérisée par le fait que l'encre utilisée est en matériaux électrique¬ ment conducteurs.2. Application of a method for manufacturing electronic circuits according to claim 1 characterized in that the ink used is made of electrically conductive materials.
3. Application d'un procédé pour la fabrication de circuits électroniques suivant revendication 1 caractérisée par le fait que l'encre utilisée est en matériaux électrique¬ ment résistants.3. Application of a method for manufacturing electronic circuits according to claim 1 characterized in that the ink used is made of electrically resistant materials.
4. Application d'un procédé pour la fabrication de circuits électroniques suivant revendication 1 caractérisée par le fait que l'encre utilisée est en matériaux isolants.4. Application of a method for manufacturing electronic circuits according to claim 1 characterized in that the ink used is made of insulating materials.
5. Application d'un procédé pour la fabrication de circuits électroniques suivant revendication 1 caractérisée par le fait que la déviation du jet d'encre (2) se fait par champ électrique.5. Application of a method for manufacturing electronic circuits according to claim 1 characterized in that the deflection of the ink jet (2) is done by electric field.
6. Application d'un procédé pour la fabrication de circuits électroniques suivant revendication 1 caractérisée par le fait que la déviation du jet d'encre (2) se fait par champ magnétique. 6. Application of a method for manufacturing electronic circuits according to claim 1 characterized in that the deflection of the ink jet (2) is by magnetic field.
7. Application d'un procédé pour la fabrication de circuits électroniques suivant revendication 1 caractérisée par le fait que le substrat (4) est en matériaux céramiques, or¬ ganiques chargés ou non, anorganiques ou métalliques.7. Application of a method for the manufacture of electronic circuits according to claim 1 characterized in that the substrate (4) is made of ceramic materials, or¬ organic charged or not, inorganic or metallic.
8. Application d'un procédé pour la fabrication de circuits électroniques suivant revendication 1 caractérisée par le fait que le substrat (4) peut être de forme quelconque.8. Application of a method for manufacturing electronic circuits according to claim 1 characterized in that the substrate (4) can be of any shape.
9. Application d'un procédé pour la fabrication de circuits électroniques suivant revendication 1 caractérisée par le fait que la commande du procédé se fait par ordinateur (5). 9. Application of a method for manufacturing electronic circuits according to claim 1 characterized in that the control of the process is done by computer (5).
PCT/CH1988/000090 1987-05-19 1988-05-17 Application of the ink jet process for manufacturing hybrid and printed electronic circuits WO1988009598A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH191287A CH673920A5 (en) 1987-05-19 1987-05-19
CH1912/87-3 1987-05-19

Publications (1)

Publication Number Publication Date
WO1988009598A1 true WO1988009598A1 (en) 1988-12-01

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2718142A1 (en) * 1994-03-31 1995-10-06 Toxot Science & Appl Ink for jet projection esp. for printed or integrated electronic circuits
WO1999053738A1 (en) * 1998-04-09 1999-10-21 Institut für Diagnostikforschung GmbH an der Freien Universität Berlin Method and device for producing thin-layer structures
WO2001015504A1 (en) * 1999-08-25 2001-03-01 Gemplus Method for making hybrid smart cards and smart cards obtained by said method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4003273B2 (en) 1998-01-19 2007-11-07 セイコーエプソン株式会社 Pattern forming method and substrate manufacturing apparatus
GB2360489A (en) 2000-03-23 2001-09-26 Seiko Epson Corp Deposition of soluble materials
GB0030095D0 (en) * 2000-12-09 2001-01-24 Xaar Technology Ltd Method of ink jet printing
US20040224541A1 (en) * 2003-05-09 2004-11-11 Murata Co., Ltd. Apparatus and method for forming solder wicking prevention zone and electronic part
US20060286301A1 (en) * 2003-09-12 2006-12-21 National Institute Of Advanced Industrial Science Substrates and method of manufacturing same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986003366A1 (en) * 1984-11-24 1986-06-05 Plessey Overseas Limited Improvements relating to protectively coating electrical equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986003366A1 (en) * 1984-11-24 1986-06-05 Plessey Overseas Limited Improvements relating to protectively coating electrical equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM Technical Disclosure Bulletin, vol. 15, no. 9, fevrier 1973, E.P. Damm, Jr.: "Forming metallized patterns on ceramic substrates", pages 2841, 2842 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2718142A1 (en) * 1994-03-31 1995-10-06 Toxot Science & Appl Ink for jet projection esp. for printed or integrated electronic circuits
WO1999053738A1 (en) * 1998-04-09 1999-10-21 Institut für Diagnostikforschung GmbH an der Freien Universität Berlin Method and device for producing thin-layer structures
WO2001015504A1 (en) * 1999-08-25 2001-03-01 Gemplus Method for making hybrid smart cards and smart cards obtained by said method
FR2797976A1 (en) * 1999-08-25 2001-03-02 Gemplus Card Int METHOD OF MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED THEREBY

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