JPH04249164A - Manufacture of thermal head - Google Patents

Abstract

PURPOSE:To make a resistor layer forming a resistant heat generator or an electric conductor layer forming the resistor layer and an electrode terminal separated electrically and aligned when the resistant heat generator and the electrode terminal are to be formed by photolithography on a heat resistant insulating substrate having a glaze layer. CONSTITUTION:Before a resistor layer 13 forming a resistant heat generator or an electric conductor layer 14 forming the resistor layer 13 and an electrode terminal is formed, a process for forming a step difference 6 on a glaze layer 2 and a process for forming the resistor layer 13 or the resistor layer 13 and the electric conductor layer 14 on the glaze layer 2 having the step difference 6 formed thereon are to be performed.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] The present invention relates to a thermal head for a thermal recording device in which a plurality of resistive heating parts are arranged in an array, and in particular, the present invention relates to a thermal head for a thermal recording device in which a plurality of resistive heating parts are arranged, and in particular, current is supplied to a resistor layer constituting the resistive heating part and the resistive heating part. On the heat-resistant insulating substrate on which the conductor layer constituting the electrode terminal is formed, a step is provided in advance to correspond to the arrangement of the resistance heating parts, and this step allows the accurate arrangement of the resistance heating part and the electrode terminal. The present invention relates to a method for manufacturing a thermal head that provides electrical isolation from adjacent parts and eliminates deterioration of resistor characteristics caused by patterning the resistor layer using photolithography.

0002

[Prior Art] In thermal recording, a resistance heating section and an electrode terminal for supplying current to the resistance heating section are provided on a heat-resistant insulating substrate.
Recording is performed by applying Joule heat generated in response to a recording signal current supplied through an electrode terminal to heat-sensitive coloring paper, a melt-type ink sheet, or a sublimation-type ink donor film.

FIGS. 18A and 18B are partial perspective views (a) and (a) of an individually opposed thermal head showing an example of this type of thermal head.
b) is a sectional view taken along line AA in (a). In the same figure, 1
is a heat-resistant insulating substrate made of materials such as ceramics, 2 is a glaze layer made of glass material, etc., 3 is a resistance heating layer (resistance heating part), 4 and 4' are electrode terminals, 4 is a common electrode, and 4' is an individual electrode. , 5 is an abrasion resistant layer. In manufacturing this thermal head, a glaze layer 2 is formed on the upper surface of a heat-resistant insulating substrate 1, and a resistor layer that becomes a resistance heating section 3 and a conductor layer that becomes an electrode terminal 4, 4' are formed on the glaze layer 2 using a known method. The resistor layer and conductor layer are patterned using a photolithography technique. There are two known conventional methods for manufacturing the thermal head.

FIGS. 19 to 23 are process diagrams illustrating an example of a method for manufacturing a thermal head according to the prior art,
(a) is a top view, and (b) is a sectional view. In this manufacturing method, first, a glaze layer 2 is provided on the surface of a heat-resistant insulating substrate 1.
A resistor layer 13 serving as a resistance heating layer is formed thereon.
(FIG. 19) A conductor layer 14 made of gold or the like is formed to cover the entire surface of the glaze layer 2 on which the resistor layer 13 is formed.

(FIG. 20) A photoresist (not shown) is applied to the entire upper surface of the conductor layer 14, and the photoresist is exposed through a photomask (not shown) provided with a desired opening pattern. , developed, and the portion of the conductor layer exposed by removing the photoresist is etched and removed to expose the resistor layer 13 in that portion.・
(FIG. 21) After removing the photoresist, the exposed resistor layer 13 is etched using the conductor layer as an etching mask, and the resistor layer in the corresponding portion is removed. (FIG. 22) For etching the resistor layer 13, fluoronitric acid (HF4 +
HNO3) etc. are used as an etching solution, but since the resistor layer hardly reacts to this etching solution, the glaze layer 2 at the bottom of the resistor layer to be removed is dissolved with the etching solution, and the resistor is etched by applying ultrasonic waves. The layer is peeled off and removed. Therefore, recesses 6' are formed on the surface of the glaze layer 2 from which the resistor layer has been removed.

Next, photoresist is applied again to the entire surface, exposed to light through a photomask with the required openings, and developed to expose the conductor layer 14 above the resistor layer portion that will become the resistance heating section. let The exposed portion of the conductor layer is removed by a patterning process using etching to form a resistance heating portion 3 in the resistor layer. Thereby, electrode terminals for power feeding (common electrode 4, individual electrodes 4') connected to both ends of the resistance heating section 3 are obtained.
(FIG. 23) After that, a wear-resistant layer 5 is formed on the entire surface to obtain a thermal head.

FIGS. 24 to 27 are process diagrams illustrating another example of a method for manufacturing a thermal head according to the prior art,
(a) is a top view, and (b) is a sectional view. First, a resistor layer 1 is placed on a glaze layer 2 provided on the surface of a heat-resistant insulating substrate 1.
3 is formed into a film. ...(Figure 24) This resistor layer 1
A photoresist (not shown) is applied to the entire surface of the glaze layer 2 on which 3 has been formed, and a photomask (not shown) with the required openings is applied.
The resistor layer is exposed to light through a resistor (not shown) and developed, and the resistor layer except for the portion where the resistive heat generating part is to be formed is removed by a patterning process using etching, thereby forming the resistive heat generating part 3.
(Fig. 25) This resistor layer removal process is carried out using an etching solution (fluorinated nitric acid (HF4 + HNO3).
) etc.) and peeled off by applying ultrasonic waves, the surface of the glaze layer 2 other than the resistive heating part 3 is slightly removed to form a recess 6''.Next, A conductor layer 14 of gold or the like is formed on the entire surface of the glaze layer 2 including the resistance heating portion 3 to form an electrode terminal.
(FIG. 26) A photoresist (not shown) is applied to the entire surface of the conductive layer 14 that has been formed, exposed to light through a photomask (not shown) provided with required openings, and developed. , the conductor layer of the resistor layer portion where the electrode separation portion and the resistance heating portion are to be formed is exposed. The exposed portion of the conductor layer is removed by a patterning process using etching to expose the resistive heat generating portion 3 and to form the common electrode 4 and the individual electrodes 4'.・・・・・・
(FIG. 27) After that, a wear-resistant layer 5 is formed on the entire surface. Conventionally, the required thermal head has been obtained by such a method. Incidentally, Japanese Patent Application Laid-open No. 59-22675 can be cited as an example of a prior art technique for manufacturing this type of thermal head.

[0007]

[Problems to be Solved by the Invention] In any of the methods for manufacturing a thermal head according to the prior art described above, etching of the resistor layer 13 (as described above, since the resistor layer hardly reacts to the etching solution, By etching the glaze layer 2 under the body layer, the resistor layer in the relevant part is peeled off and removed by applying ultrasonic waves). There were problems such as a decrease in the linearity of the pattern, a decrease in the linearity of the pattern, a shortened lifespan, an increase in variation in resistance value, and a decrease in print quality (recorded image quality). In the former method, the patterned conductor layer 1 is used as an etching mask when etching the resistor layer 13.
Since the pattern No. 4 is used, the linearity of the resistance heating part pattern is inferior to that of the latter method. SUMMARY OF THE INVENTION An object of the present invention is to form steps in advance in correspondence with the alignment of the resistance heating parts on a substrate on which a resistor layer constituting the resistance heating parts is to be formed, in order to eliminate the above-mentioned drawbacks of the conventional technology. By aligning and arranging the resistance heating parts using this level difference, "Fluoronitric acid (HF4
An object of the present invention is to provide a method for manufacturing a thermal head that suppresses damage to each layer and deterioration of the linearity of an etching pattern caused by ``+HNO3, etc.)+ultrasonic waves''.

[0008]

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a method for forming a resistor layer on the surface of a glaze layer formed on a heat-resistant insulating substrate, and by patterning the resistor layer. A resistive heating section, electrode terminals connected to both ends of each of the resistive heating sections by forming and patterning a conductor layer, and an abrasion resistant film formed to cover at least the plurality of resistive heating sections. In the method for manufacturing a thermal head having a layer, a step is formed in advance on a surface of the glaze layer adjacent to a portion forming the resistive heat generating portion, and the resistive layer forming the resistive heat generating portion is formed by forming the resistive layer on the surface of the resistive layer forming the resistive heat generating portion. Accordingly, one or more adjacent resistance heating parts are electrically isolated.

That is, the present invention provides a heat-resistant insulating substrate (1)
A resistor layer (1) is placed on the surface of the glaze layer (2) formed above.
A plurality of resistive heat generating parts (3) arranged in an array by the film formation and patterning of 3) are connected to both ends of each of the resistive heat generating parts (3) by the film formation and patterning of the conductor layer (14). In the method for manufacturing a thermal head, the thermal head has electrode terminals (4, 4') provided as a single layer, and an abrasion-resistant layer (5) formed to cover at least the plurality of resistive heating parts, the above-mentioned grace layer (2) A step (6) is formed in advance on the surface where the part forming the resistance heating part (3) and the part forming the electrode terminal (4, 4') are adjacent to each other, thereby forming the resistance heating part (3). The resistor layer (13) or the resistor layer (13) and the conductor layer (14) constituting the electrode terminals (4, 4') are connected to each other by the step (6) when they are formed. It is characterized by electrically separating one or more resistance heating parts.

0010

[Operation] The part forming the resistance heating part (3) on the glaze layer (2) formed on the surface of the heat-resistant insulating substrate (1), or the part forming the resistance heating part (3) and the electrode terminals (4, 4) '
) is formed in advance on the surface of the adjacent surface of the resistive layer (1) constituting the resistive heating section (3).
3) or this resistor layer (13) and the electrode terminal (4,
When forming the conductive layer (14) constituting the conductive layer (4'), the resistive heating part (3) is attached to each adjacent one or more resistive heating parts.
Alternatively, the resistance heating section (3) and the electrode terminals (4, 4') are electrically separated. This improves the linearity of the shape of the resistance heating portion (3). Furthermore, when patterning the resistor layer (13) and the conductor layer (14) by photolithography, it is possible to apply ultrasonic waves and fluoro-nitric acid (HF4 + HNO3, etc.), which is an etching solution for etching each of the above layers. Because it is performed before the film, damage to each film caused by etching solution and ultrasonic waves can be eliminated, and pattern linearity does not deteriorate.This improves the life of the thermal head, reduces variation in resistance value, In addition, printing quality can be improved because there is no reduction in resistance value variations.Furthermore, since there is no positional shift between the resistance heating element and the electrode terminal, it is possible to suppress variation in characteristic values between thermal heads to a small level.

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 5 are process diagrams illustrating a first embodiment of a method for manufacturing a thermal head according to the present invention. First, a photoresist 7 is applied to the entire surface of a glaze layer 2 made of a glass-based material formed on the surface of a heat-resistant insulating substrate 1 made of a material such as alumina ceramics, except for the areas where etching is to be performed to form steps. The resist is exposed to light through a photomask (not shown) having an opening pattern for masking, and developed to form a predetermined resist opening pattern 71 in which the glaze layer 2 is exposed at the location where the etching process for forming the step is to be performed. . ...
(FIG. 1) Then, the exposed portion of the glaze layer 2 is subjected to a chemical treatment using an etching solution such as fluoro-nitric acid to form a recess on the surface of the glaze layer 2 and obtain the required step 6.
・・・・・・
(FIG. 2) After that, the photoresist is peeled off, and a resistor layer 13 is placed on the glaze layer 2 with the step 6 formed so as to cross the step 6.
Deposit a film. ...(Figure 3
) When forming the resistor layer 13, the existence of the step 6 separates the resistor layer into individual resistance heating parts, and alignment of the resistance heating parts can be achieved.

Next, a conductive layer 14 of a conductive material such as gold is formed on the entire surface of the grace layer 2 including the resistor layer 13.

(FIG. 4) A photoresist (not shown) is coated on the conductive layer 14, exposed through a photomask (not shown) having an electrode formation pattern, and developed to form the conductive layer 14. is exposed to the electrode pattern. The exposed conductor layer portion is etched to form a predetermined electrode pattern (common electrode 4, individual electrode 4').
) and peel off the photoresist. (FIG. 5) As a result, the resistance heating section 3 and the electrode terminals 4, 4' which are electrically separated by the step 6 are obtained. Finally, a wear-resistant layer made of an insulating material is formed to cover the resistance heating section 3 and the electrode terminals.

FIG. 6 is an explanatory view of steps formed in the glaze layer, showing an enlarged cross-section of part A in FIG. 3(a). ) 21 is thinner than the resistive heating section forming section 22, and a step 6 is formed at the boundary between the resistive heating section forming section 21 and the section 22. The resistor layer 13 to be formed is electrically isolated by the vertical walls of the step 6 during its formation.

FIG. 7 shows the "pattern open rate", that is, the separation ratio of the resistor layer at the edge of the step, with respect to the height H of the vertical wall of the "glaze step", that is, the step, by varying the thickness of the resistor layer. It is an explanatory diagram showing a result. The figure shows data regarding the "pattern open rate" with respect to the glaze step and the four "thicknesses of the resistor layer."

FIG. 8 is a schematic diagram of the object obtained in FIG. 7, that is, the glaze layer, the step formed in the glaze (glaze step), and the resistor layer portion, 13 is the resistor layer in the area where the resistance heating element is formed, and 13' is the resistor layer. The resistor layer 20 in the step portion is a vertical wall portion of the step 6.

FIGS. 9, 10, and 11 show the thicknesses of the resistor layers of 0.42 μm, 0.28 μm, and 0.0 μm when the height H of the glaze step (dimension of the vertical wall portion) is 1.8 μm.
．． FIG. 4 is an explanatory diagram of a state in which a film formation pattern is separated by a vertical wall portion of the step when the step is 15 μm. As shown in Figure 7A, when the thickness of the resistor layer (resistance heating element) is 0.55 μm, the pattern open rate is 0% regardless of the height of the glaze step (that is, the resistor layer is (See Figure 9).Also, when the thickness of the formed resistor layer is 0.42 μm, the pattern open rate is 0% as shown in the curve B in Figure 7, and the glaze step difference If the height of the resistor layer is not 4.0 μm or more, the pattern open rate will not be 100%, that is, the resistor layer will not be completely separated.If the thickness of the resistor layer formed is 0.28 μm, As shown in the curve, when the height of the glaze step is 1.8 μm, the pattern open rate is about 50%, and the layer film cannot be separated by the vertical wall of the step (
(See Figure 10). Resistor layer 0.15 shown in curve D of Figure 7
In μm, the pattern open rate is 100% when the height of the glaze step is 1.8 μm (FIG. 11).

FIGS. 12 to 16 are process diagrams illustrating a second embodiment of the method for manufacturing a thermal head according to the present invention.
(a) is a plan view, and (b) is a cross-sectional view. First, a photoresist 7 is applied on the glaze layer 2 of the heat-resistant insulating substrate 1,
Exposure using a photomask with a pattern of steps,
It is developed to expose the glaze layer 2 in the step formation portion. . . . FIG. 12 A chemical treatment (etching treatment) is performed on the exposed portion of the glaze layer 2 to form a step 6. . . . Fig. 13 The height of the vertical wall of the step formed in the step shown in Fig. 13 is set to be large enough to electrically separate both the resistor layer and the conductor layer formed in the subsequent step. After forming the step, the photoresist 7 is removed, and a resistor layer 13 is formed in a strip shape across the step. The formed resistor layer 13 has a step 6
The resistor layer 13 and the resistor layer 13' are completely electrically separated by the vertical wall of the step 6. ...Figure 14

Next, a conductor layer 1 made of a conductive material such as gold is formed on the entire surface of the glaze layer including the resistor layers 13 and 13'.
4 is formed into a film.
..... Figure 15 The conductor layer 14 is the resistor layer 13' formed on the step 6
The upper layer becomes a conductor layer 14', and this conductor layer 14 and 14
' is also completely electrically isolated by the vertical wall of the step 6. A photoresist (not shown) is applied to the entire surface on which the conductor layer 14 is formed, exposed to light through a photomask (not shown) having a pattern for forming common electrodes and individual electrodes, and developed to form a resist pattern. Then, the conductive layer 14 is etched using this resist pattern to form a common electrode 4 and individual electrodes 4' connected to the resistance heating section 3 constituted by the heating element 13.
. . . FIG. 16 Then, the photoresist pattern is removed and a wear-resistant layer is formed covering the resistance heating portion 3 and the electrode terminals 4, 4' to obtain a thermal head.

FIG. 17 is an enlarged cross-sectional view of part B in FIG. Both body layers 14, 14' are completely electrically separated by the vertical walls of the step 6. As described above, the step 6 formed in the glaze layer 2 allows the resistor layer 13 and the conductor layer 14 to
It is possible to achieve electrical isolation during the deposition of these films, and
By accurately patterning the shape of the resistance heating section 3, the linearity of the adjacent edges can be improved and shape variations can be eliminated. Next, a method for manufacturing a thermal head according to the present invention will be explained using specific numerical examples. Here, the thickness of the resistor layer is set to 0.3 μm based on the target resistance value and printing dot size.
A case (corresponding to the first embodiment) in which the glaze step is set to about 2.5 μm in order to electrically isolate the resistor layer will be described. In FIG. 1, the opening pattern 71 of the opening of the photoresist 7 has a longitudinal direction extending beyond the formation range of the resistance heating parts 3, and a width direction of ("distance between resistance heating parts 3" - 2. 5 μm x 2). Fluoronitric acid (HF4 +
The glaze layer 2 exposed in the photoresist opening is etched using an etching solution such as HNO3). The etching process is approximately 2.5μ in height (depth direction)
Aim for more than m. In the case of glass, since the photoresist wraps around to the lower layer to the same extent, a glaze layer of approximately a predetermined resistor width (formation width of the resistance heating portion) remains in a convex shape. In other words, a concave groove having a step 6 between the convex portions is formed (see FIG. 2).

After that, the photoresist is removed and the step 6 is removed.
A resistor paste is applied by printing onto the formed glaze layer 2, dried and fired to form a resistor layer (see FIG. 3). As a resistor paste, the viscosity is 10 to 20 Kc.
The thickness of the resistor layer depends on the content of the resistor material in the resistor paste, but if the required thickness cannot be achieved with one layer, multiple layers may be used. Repeat times. The formed resistor layer is separated into individual layers by steps, resulting in an array of precisely aligned resistive heating elements. A conductor paste is applied by printing to the entire surface of the above-mentioned grace layer 2, including this resistor layer, and is dried and fired to form a conductor layer. As a conductor paste, the viscosity is 10-20K.
The thickness of the conductor layer is approximately 0.5 to 0.6μ by using gold paste using an organic solvent paste of cps level.
m (Fig. 4). A predetermined pattern is formed using photoresist on the conductor layer, and the conductor layer exposed by this pattern is removed by an etching process to form an electrode terminal.Then, the photoresist is peeled off and the entire surface is polished. A thermal head is obtained by forming a wear layer (see FIG. 5).

In addition, in an example corresponding to the second embodiment, the resistor layer,
Since the conductor layers must be separated individually by steps, it is necessary to "increase the glaze step" or "make the resistor layer and conductor layer thinner" or both. At present, if the layer thickness is 0.55 μm or more, the glaze step must be considerably large.
As a process, it is difficult to manage. Therefore, it is desirable to adopt a method in which the thickness of each layer is reduced so that the glaze level difference does not become relatively large. In the above example,
Although an individually facing thermal head has been described, the present invention is not limited to this, and any thermal head that forms resistive heating parts separately for each dot may be used.
It can be applied to any type of thermal head. Furthermore, the present invention is applicable not only to thermal heads but also to the manufacture of electronic components such as ICs.

[0022]

[Effects of the Invention] As explained above, according to the present invention,
A resistor layer is formed on the glaze layer formed on the heat-resistant insulating substrate, and electrode terminals made of a conductor are formed at both ends of the resistive heating section formed by the resistor layer, so that at least the above-mentioned resistive heating section is formed. When forming a wear-resistant layer covering the
By forming a step between one or more adjacent resistance heating parts in advance on the surface of the glaze layer on which the resistor layer is formed, steps can be used in the etching process applied in patterning by photolithography technique. Since "fluorinated nitric acid (HF4 + HNO3) + ultrasonic waves" is performed before the resistor layer and conductor layer are formed, damage to these films can be eliminated, and pattern linearity does not deteriorate. . As a result, the life of the thermal head is improved, the variation in resistance value is reduced, and the printing quality can be improved by reducing the variation in resistance value. Furthermore, when electrode terminal patterns are formed individually using steps in the glaze layer, there is no misalignment between the resistance heating parts and the electrode terminals, which reduces the variation in characteristic values between individual resistance heating parts (dots). It can be suppressed.

[Brief explanation of the drawing]

FIG. 1: First method of manufacturing a thermal head according to the present invention.
It is a partial diagram of the process explaining an Example.

FIG. 2: First method of manufacturing a thermal head according to the present invention.
It is a partial diagram of the process explaining an Example.

FIG. 3: First method of manufacturing a thermal head according to the present invention.
It is a partial diagram of the process explaining an Example.

FIG. 4: First method of manufacturing a thermal head according to the present invention.
It is a partial diagram of the process explaining an Example.

FIG. 5: First method of manufacturing a thermal head according to the present invention.
It is a partial diagram of the process explaining an Example.

FIG. 6 is an explanatory diagram of steps formed in a glaze layer, showing an enlarged cross section of part A in FIG. 3(a);

[Figure 7] “Glaze step”, that is, the height H of the vertical wall of the step
FIG. 4 is an explanatory diagram showing the results of verifying the "pattern open rate", that is, the separation rate of the resistor layer at the edge of the step, by changing the thickness of the resistor layer.

8 is a schematic diagram of an object for verifying FIG. 7, that is, a glaze layer, a step formed in the glaze (glaze step), and a resistor layer portion.

[Figure 9] The height of the glaze step (dimension of the vertical wall part) H is 1
．． FIG. 4 is an explanatory diagram of a separation state of a film pattern formed by the vertical wall portion of the step when the thickness of the resistor layer is 0.42 μm when the thickness is 8 μm.

[Figure 10] The thickness of the resistor layer is 0.28 μm when the height of the glaze step (dimension of the vertical wall portion) H is 1.8 μm.
FIG. 4 is an explanatory diagram of a state in which a film formation pattern is separated by a vertical wall portion of the step.

[Figure 11] The thickness of the resistor layer is 0.15 μm when the height of the glaze step (dimension of the vertical wall portion) H is 1.8 μm.
FIG. 4 is an explanatory diagram of a state in which a film formation pattern is separated by a vertical wall portion of the step.

FIG. 12 is a partial diagram illustrating a second embodiment of the method for manufacturing a thermal head according to the present invention.

FIG. 13 is a partial diagram illustrating a second embodiment of the method for manufacturing a thermal head according to the present invention.

FIG. 14 is a partial diagram illustrating a second embodiment of the method for manufacturing a thermal head according to the present invention.

FIG. 15 is a partial diagram illustrating a second embodiment of the method for manufacturing a thermal head according to the present invention.

FIG. 16 is a partial diagram illustrating a second embodiment of the method for manufacturing a thermal head according to the present invention.

17 is an enlarged cross-sectional view of portion B in FIG. 15. FIG.

18(a) is a partial perspective view of an individually facing thermal head showing an example of a thermal head; FIG. 18(b) is a partial perspective view of A-
It is an A sectional view.

FIG. 19 is a partial diagram illustrating an example of a method for manufacturing a thermal head according to the prior art.

FIG. 20 is a partial diagram illustrating an example of a method for manufacturing a thermal head according to the prior art.

FIG. 21 is a partial diagram illustrating an example of a method for manufacturing a thermal head according to the prior art.

FIG. 22 is a partial diagram illustrating an example of a method for manufacturing a thermal head according to the prior art.

FIG. 23 is a partial diagram illustrating an example of a method for manufacturing a thermal head according to the prior art.

24A and 24B are partial views illustrating another example of a method for manufacturing a thermal head according to the prior art, in which FIG. 24A is a top view and FIG. 24B is a cross-sectional view.

25A and 25B are partial views illustrating another example of a conventional method for manufacturing a thermal head, in which FIG. 25A is a top view and FIG. 25B is a cross-sectional view.

26A and 26B are partial views illustrating another example of a conventional method for manufacturing a thermal head, in which FIG. 26A is a top view and FIG. 26B is a cross-sectional view.

27A and 27B are partial views illustrating another example of a conventional method for manufacturing a thermal head, in which FIG. 27A is a top view and FIG. 27B is a cross-sectional view.

[Explanation of symbols]

1 Heat-resistant insulated substrate 2 Glaze layer 3 Resistance heating part 4 Common electrode 4’ Individual electrode 5 Abrasion resistant layer 6 Steps 7 Photoresist

Claims (2)

[Claims] [Claim 1] A plurality of resistive heating parts arranged in alignment by forming a resistor layer by patterning on the surface of a glaze layer formed on a heat-resistant insulating substrate, and a conductor layer by forming by patterning. In the method for manufacturing a thermal head, the thermal head has electrode terminals connected to both ends of each of the resistive heating parts, and an abrasion resistant layer formed to cover at least the plurality of resistive heating parts. A step is formed in advance on the surface where the portion forming the resistance heating portion adjoins, and the step allows the resistor layer constituting the resistance heating portion to be formed between the adjacent resistance heating portions when forming the resistor layer. A method for manufacturing a thermal head characterized by electrical isolation. 2. A plurality of resistive heating parts arranged in alignment by forming a resistor layer by patterning on the surface of the glaze layer formed on the heat-resistant insulating substrate, and a conductor layer by forming by patterning. In the method for manufacturing a thermal head, the thermal head has electrode terminals connected to both ends of each of the resistive heating parts, and an abrasion resistant layer formed to cover at least the plurality of resistive heating parts. A step is formed in advance on the surface where the portion forming the resistance heating portion and the portion forming the electrode terminal are adjacent to each other, and the step forms a resistor layer forming the resistance heating portion and a conductor forming the electrode terminal. 1. A method for manufacturing a thermal head, which comprises electrically separating layers between adjacent resistive heating parts and electrode terminals during their film formation.