CN207148888U - smart card - Google Patents
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- CN207148888U CN207148888U CN201721043354.XU CN201721043354U CN207148888U CN 207148888 U CN207148888 U CN 207148888U CN 201721043354 U CN201721043354 U CN 201721043354U CN 207148888 U CN207148888 U CN 207148888U
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- substrate
- center
- circuit board
- hole
- smart card
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Abstract
The utility model provides a kind of smart card, first substrate, center and circuit board are sequentially placed, and the pad that is sticked in the periphery of circuit board, carry out encapsulating lamination to the inside of center, and through hole is processed using being machined on first substrate and extension board, and expose contact zone；Contact module is fixed on contact zone, and carries out punching shaping.Smart card provided by the utility model, by setting a center between first substrate and circuit board, because the thickness of first substrate and center is fixed, and contact zone is arranged on inside the extension board of center, when machining is processed to through hole, the depth for machining through hole is set again according to first substrate and center thickness sum, can accurately process through hole, exposes contact zone and avoids machining infringement to caused by circuit board.
Description
Technical field
The utility model belongs to technical field of intelligent card, is to be related to a kind of smart card more specifically.
Background technology
In existing IC (Integrated Circuit) card manufacture craft, encapsulating lamination manufacture IC-card is first passed through
Matrix, then the through hole for chip placement, 7816 chips and FPC plates are processed by mach mode on the matrix of IC-card
On pad (either antenna) high-temperature soldering or first first pick out the antenna inside card welded again with 7816 chips.But
Using IC-card manufacture craft of the prior art, during due to encapsulating laminates IC-card matrix, FPC plates (Flexible
Printed Circuit, flexible PCB) position can be extruded by glue, cause FPC plates and IC-card outer surface of matrix it
Between distance can not be accurately positioned, so, cause to be separated with glue between the bottom of through hole and FPC plates, i.e. 7816 chips and FPC
Being separated with glue between the junction meeting of plate causes loose contact；Or the surface of FPC plates can be damaged in machining, cause FPC
Plate damages.High temperature can damage card surface, and antenna first picks out again that welding production is cumbersome, and production fraction defective compares inside card
It is high.
Utility model content
The purpose of this utility model is to provide a kind of smart card, to solve to have encapsulating laminates IC in the prior art
During card matrix, the position of FPC plates can be extruded by glue, cause the distance between FPC plates and IC-card outer surface of matrix can not
Pinpoint technical problem.
To achieve the above object, the technical solution adopted in the utility model is：A kind of smart card, including：First substrate；Connect
Touch block；Located at the center of the first substrate side, an inner side of the center is extended with extension board, first base for stacking
Through hole is offered on plate and the extension board, the contact module is contained in the through hole；And located at the center with
The first substrate mutually has contact zone, the contact back to the circuit board of side, circuit board place relative with the through hole
Area contacts module electrical connection with described.
Further, in addition to located at circuit board outside and the pad being fixedly connected with the center；And it is located at
The pad and the first substrate mutually back to side second substrate.
Further, there is gap between the pad and the circuit board, and it is the first substrate, the center, described
Circuit board, the pad and the second substrate are bonded by encapsulating.
Further, the depth of the through hole is equal to the thickness of the first substrate and the thickness sum of center.
Further, it is fixedly connected between the contact module and the contact zone by conducting resinl.
Further, the size of the through hole is more than or equal to the size of the contact module.
Further, the outer rim shape of the center is adapted with the outer rim shape of the first substrate.
Further, the outer rim shape of the pad is adapted with the outer rim shape of the center.
Further, it is be bonded between the circuit board and the first substrate, between the center and the first substrate
Bonding.
The beneficial effect of smart card provided by the utility model is：Compared with prior art, the utility model by
One center is set between first substrate and circuit board, and because the thickness of first substrate and center is fixed, and contact zone is set
Inside the extension board of center, when machining is processed to through hole, according to first substrate and center thickness sum again to machine
The depth of processing through hole is set, and can accurately process through hole, is exposed contact zone and is avoided machining from making circuit board
Into infringement.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description be only the present invention some
Embodiment, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 is the main structure diagram of smart card provided in an embodiment of the present invention；
Fig. 2 is the sectional structure chart of the line A-A along Fig. 1；
Fig. 3 is the main structure diagram of smart card provided in an embodiment of the present invention.
Wherein, each reference in figure：
1- first substrates；2- centers；3- second substrates；4- circuit boards；5- pads；6- through holes；7- contacts module；8- is conductive
Glue；9- glue；21- extension boards；41- contact zones.
Embodiment
In order that technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Drawings and Examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, it is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the invention, " multiple " are meant that two or more,
Unless otherwise specifically defined.
Also referring to Fig. 1 to Fig. 3, now the manufacture method of smart card provided by the invention is illustrated.Smart card
Manufacture method, following steps：
S1 the bottom side of first substrate 1) is fixed in the stacking of center 2, an inner side of center 2 is extended with extension board 21；
S2 circuit board 4) is located at the bottom side of center 2, the position for being right against extension board 21 on circuit board 4 has contact zone 41,
And the pad 5 that is sticked in the periphery of circuit board 4；
S3) there is gap between pad 5 and circuit board 4, by gap to encapsulating is carried out inside center 2, to the inside of center 2
After carrying out encapsulating, second substrate 3 is then laminated the bottom side located at circuit board 4 and pad 5, and uses laminating technology by the first base
Plate 1, center 2, circuit board 4, pad 5 are fixedly connected with second substrate 3；
S4) use to be machined on first substrate 1 and extension board 21 and process through hole 6, the depth of through hole 6 is equal to the first base
The thickness of plate 1 and the thickness sum of center 2, and the bottom of through hole 6 is exposed contact zone 41；
S5) contact module 7 to be fixedly connected by conducting resinl 8 in through hole 6 and with contact zone 41, make contact module 7 viscous
It is affixed on contact zone 41, and carries out punching shaping.
The manufacture method of smart card provided by the invention, compared with prior art, by first substrate 1 and circuit board 4
Between a center 2 is set, because the thickness of first substrate 1 and center 2 is fixed, and contact zone 41 is arranged on prolonging for center 2
Stretch inside plate 21, it is logical to machining again according to first substrate 1 and the thickness sum of center 2 when machining is processed to through hole 6
The depth in hole 6 is set, and can accurately process through hole 6, is exposed contact zone 41 and is avoided machining from causing circuit board 4
Infringement.
Specifically, extension board 21 is arranged on the inside of center 2, and extension board 21 be arranged on center 2 side and with center 2
It is integrally formed, the length and width of extension board 21 is respectively less than the length and width of center 2, the upper surface of extension board 21 and the first base
The lower surface of plate 1 abuts against, therefore processes through hole 6, the depth of through hole 6 by mach mode in the upper surface of first substrate 1
Degree is that the thickness of first substrate 1 adds the thickness sum of center 2, what the thickness of first substrate 1 and center 2 determined, you can with
The working depth of through hole 6 is determined by this thickness, can accurately process through hole 6, exposes contact zone 41 and avoids machining
To infringement caused by circuit board 4.
Contact between module 7 and contact zone 41 by 8 bonding fixation of conducting resinl, and contact mould is realized by conducting resinl 8
Electrical connection and conducting between block 7 and contact zone 41, occurred by conducting resinl 8 to avoid contact between module 7 and contact zone 41
Relative displacement.Wherein, conducting resinl 8 is electrically conductive colloid, is based on conducting particles generally with matrix resin and conductive filler
Constituent is wanted, is not limited uniquely herein.
Contact module 7 can be 7816 chip modules comprising carrier band unit and 7816 chips or individually carry
Tape cell, and 7816 chips are fixed on circuit boards.Contact module is placed on through hole 6 by module 7 is contacted, and is directly welded at electricity
On the conducting medium of the contact zone 41 of road plate 4, a circle aerial coil can be set on circuit board 4 with ring, and contact module 7 and antenna line
Circle connection is fabricated to smart card.The smart card production efficiency is high, and production cost is relatively low, and security is higher, and customers' approval degree is higher.
Contact module 7 is the contact module of the chip of band 7816 or other chips, contacts leading for module 7 and aerial coil both ends lead terminal
Dielectric is welded, and contact module 7 is connected with the aerial coil on circuit board 4 can be fabricated to double-interface smart card.Contact
Area 41 is that the position of contact zone 41 is corresponding with the position of through hole 6 close to the naked copper area of the side of first substrate 1 positioned at circuit board 4,
Extension board 21 is arranged on the upside of contact zone 41, and it is machined after contact zone 41 is exposed, contact module 7 is sticked in the contact
In area 41, and the pin of contact module 7 and naked copper area are conductively connected.
Further, also referring to 2, a kind of specific embodiment party as the manufacture method of smart card provided by the invention
Formula, the size of through hole 6 are more than or equal to the size of contact module 7.Specifically, through hole 6 grow and be wider than or equal to contact mould
The length and width of block 7, contact module 7 simply can be placed in the inside of through hole 6, and the position for docking touch block 7 is fixed,
The upper surface that the height of through hole 6 can avoid contact with module 7 more than or equal to the height of contact module 7 produces abrasion.Certainly, root
According to actual conditions and real needs, in other embodiments of the invention, the height of through hole 6 is also less than contacting module 7
Highly, do not limit uniquely herein.
Further, Fig. 1 to Fig. 3 is referred to, a kind of specific reality as the manufacture method of smart card provided by the invention
Mode is applied, the outer rim shape of center 2 is adapted with the outer rim shape of first substrate 1.Specifically, the shape of first substrate 1, second
The shape of substrate 3 is the shape of standard card, rectangular.Circuit board 4 is rectangular, and the outer rim of center 2 is rectangular, the receiving of center 2
Slot cross-section is rectangular.The outer rim shape of circuit board 4 is adapted with the receiving slot cross-section of center 2, compact-sized.Certainly, according to reality
Border situation and real needs, smart card in other embodiments of the invention are alternatively nonstandard card, without limiting first substrate
1st, center 2, circuit board 4, second substrate 3 are rectangle, can freely customize its shape, not limit uniquely herein.
Further, refering to Fig. 1 to Fig. 3, a kind of specific implementation as the manufacture method of smart card provided by the invention
Mode, the outer rim shape of pad 5 are adapted with the outer rim shape of center 2.Specifically, the pad 5 deviates from the first base located at center 2
The side of plate 1, pad 5 is what loop circuit plate 4 was set, and the thickness of pad 5 is equal with the thickness of circuit board 4, the dress of pad 5
With simple, and effectively circuit board 4 can be positioned and protected, while can also be facilitated in encapsulating and laminating technology
One substrate 1, center 2, circuit board 4, pad 5 are fixedly connected with second substrate 3.
Further, as smart card provided by the invention manufacture method a kind of embodiment, circuit board 4 with
It is bonded between first substrate 1, it is be bonded between center 2 and first substrate 1.Specifically, the mode of sampling bonding is easily worked, connect
Reliably.In practical solution, circuit board 4 and center 2 are pasted on first substrate 1 by brush coating before encapsulating.Circuit board 4 and
Connection is realized by encapsulating between two substrates 3, between center 2 and second substrate 3.Certainly, according to actual conditions and real needs,
In other embodiments of the invention, between circuit board 4 and first substrate 1, between center 2 and first substrate 1, circuit board 4 with
Between second substrate 3, welding or other existing connected modes can also be used between center 2 and second substrate 3, is not made herein only
One limits.
Refer to Fig. 1 to Fig. 3, the smart card that first embodiment of the invention provides, first substrate 1；With 7816 chips
Contact module 7；Located at the center 2 of the side of first substrate 1, an inner side of center 2 is extended with extension board 21, first substrate 1 for stacking
With offer through hole 6 on extension board 21, contact module 7 is contained in through hole 6；Located at center 2 and the opposite side of first substrate 1
Circuit board 4, the relative place of circuit board 4 and through hole 6 has contact zone 41, and contact zone 41 electrically connects with contacting module 7.
Smart card provided by the invention, compared with prior art, by setting one between first substrate 1 and circuit board 4
Center 2, because the thickness of first substrate 1 and center 2 is fixed, and contact zone 41 is arranged on inside the extension board 21 of center 2,
When machining is processed to through hole 6, the depth for machining through hole 6 is entered again according to first substrate 1 and the thickness sum of center 2
Row setting, can accurately process through hole 6, expose contact zone 41 and avoid machining to infringement caused by circuit board 4.
Specifically, extension board 21 is arranged on the inside of center 2, and extension board 21 be arranged on center 2 side and with center 2
It is integrally formed, the length and width of extension board 21 is respectively less than the length and width of center 2, the upper surface of extension board 21 and the first base
The lower surface of plate 1 abuts against, therefore processes through hole 6, the depth of through hole 6 by mach mode in the upper surface of first substrate 1
Degree is that the thickness of first substrate 1 adds the thickness sum of center 2, what the thickness of first substrate 1 and center 2 determined, you can with
The working depth of through hole 6 is determined by this thickness, can accurately process through hole 6, exposes contact zone 41 and avoids machining
To infringement caused by circuit board 4
Preferably, circuit board 4 uses flexible PCB 4, and it has a height reliability, excellent pliability and its also have
The advantages of Distribution density is high, in light weight, thickness of thin, good bending property, it is suitable for using in smart card.
Further, referring to Fig. 2, a kind of embodiment as smart card provided by the invention, smart card is also
Including located at the outside of circuit board 4 and the pad 5 being fixedly connected with center 2；And located at pad 5 it is relative with first substrate 1 one
The second substrate 3 of side.Specifically, pad 5 is enclosed in the outside of circuit board 5, and for being protected to circuit board 5, second substrate 3
It is oppositely arranged with first substrate 1, circuit board 4 is fixed between first substrate 1 and second substrate 3, first substrate 1 and second
There is spacing between substrate 3, the both sides for being separately positioned on circuit board 4 are protected to circuit board 4.Certainly, according to actual conditions and
Real needs, in other embodiments of the invention, first substrate 1 and second substrate 3 can also only set one of those, this
Place does not limit uniquely.
Further, referring to Fig. 2, a kind of embodiment as smart card provided by the invention, pad 5 and electricity
There is gap between road plate 4, and first substrate 1, center 2, circuit board 4, pad 5 and second substrate 3 are bonded by encapsulating.Specifically
, the gap between pad 5 and circuit board 4 can be used for carrying out encapsulating operation, and glue 9 is filled in the base of first substrate 1 and second
Between plate 3, so as to be defined to the position of first substrate 1, center 2, circuit board 4, pad 5 and second substrate 3, and pad 5
Encapsulating operation between circuit board 4 will can also be mutually bonded between pad 5 and circuit board 4.Certainly, according to actual conditions and tool
Body demand, in other embodiments of the invention, can also be between only side, both sides or three sides be left between pad 5 and circuit board 4
Gap, remaining side pad 5 and circuit board 4 are abutted against, not limited uniquely herein.
Further, Fig. 1 to Fig. 3 is referred to, as a kind of embodiment of smart card provided by the invention, through hole
6 depth is equal to the thickness of first substrate 1 and the thickness sum of center 2 specifically, passing through machine in the upper surface of first substrate 1
The mode of processing processes through hole 6, and the depth of through hole 6 is that the thickness of first substrate 1 adds the thickness sum of center 2, first substrate 1
Determined with the thickness of center 2, you can to determine the working depth of through hole 6 by this thickness, can accurately process logical
Hole 6, expose contact zone 41 and avoid machining to infringement caused by circuit board 4.
Further, Fig. 1 to Fig. 3 is referred to, as a kind of embodiment of smart card provided by the invention, contact
It is fixedly connected between module 7 and contact zone 41 by conducting resinl 8.Specifically, pass through conduction between contact module 7 and contact zone 41
8 bonding fixation of glue, and the electrical connection and conducting between contact module 7 and contact zone 41 are realized by conducting resinl 8, pass through conduction
To avoid contact between module 7 and contact zone 41 relative displacement occurs for glue 8.Wherein, conducting resinl 8 is electrically conductive colloid, is led to
Often using matrix resin and conductive filler be conducting particles as main constituents, do not limit uniquely herein.
Further, also referring to Fig. 1 to Fig. 3, as a kind of embodiment of smart card provided by the invention,
The size of through hole 6 is more than or equal to the size of contact module 7.Specifically, through hole 6 grow and be wider than or equal to contact module 7
Length and width, contact module 7 simply can be placed in the inside of through hole 6, and the position for docking touch block 7 is fixed, and leads to
The upper surface that the height in hole 6 can avoid contact with module 7 more than or equal to the height of contact module 7 produces abrasion.Certainly, according to
Actual conditions and real needs, in other embodiments of the invention, the height of through hole 6 are also less than contacting the height of module 7
Degree, is not limited uniquely herein.
Further, Fig. 1 to Fig. 3 is referred to, as a kind of embodiment of smart card provided by the invention, center
2 outer rim shape is adapted with the outer rim shape of first substrate 1.Specifically, the shape of the first substrate 1, the shape of second substrate 3
Shape is the shape of standard card, rectangular.Circuit board 4 is rectangular, and the outer rim of center 2 is rectangular, and the receiving slot cross-section of center 2 is in square
Shape.The outer rim shape of circuit board 4 is adapted with the receiving slot cross-section of center 2, compact-sized.Certainly, according to actual conditions and tool
Body demand, smart card in other embodiments of the invention are alternatively nonstandard card, without limiting first substrate 1, center 2, electricity
Road plate 4, second substrate 3 are rectangle, can freely customize its shape, not limit uniquely herein.
Further, refering to Fig. 1 to Fig. 3, as a kind of embodiment of smart card provided by the invention, pad 5
Outer rim shape is adapted with the outer rim shape of center 2.Specifically, pad 5 deviates from the side of first substrate 1, pad located at center 2
5 be what loop circuit plate 4 was set, and the thickness of pad 5 is equal with the thickness of circuit board 4, and the assembling of pad 5 is simple, Neng Gouyou
Effect circuit board 4 is positioned and protected, while can also facilitate in encapsulating and laminating technology by first substrate 1, center 2,
Circuit board 4, pad 5 are fixedly connected with second substrate 3.
Further, Fig. 1 to Fig. 3 is referred to, as a kind of embodiment of smart card provided by the invention, circuit
It is be bonded between plate 4 and first substrate 1, it is be bonded between center 2 and first substrate 1.Specifically, the mode of sampling bonding easily adds
Work, connection are reliable.In practical solution, circuit board 4 and center 2 are pasted on first substrate 1 by brush coating before encapsulating.Should
Connection is realized by encapsulating between circuit board 4 and second substrate 3, between center 2 and second substrate 3.Certainly, according to actual conditions
And real needs, in other embodiments of the invention, between circuit board 4 and first substrate 1, center 2 and first substrate 1 it
Between, between circuit board 4 and second substrate 3, welding or other existing connection sides can also be used between center 2 and second substrate 3
Formula, do not limit uniquely herein.
These are only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
All any modification, equivalent and improvement made within principle etc., should be included in the scope of the protection.
Claims (9)
1. smart card, it is characterised in that including：
First substrate；
Contact module；
Located at the center of the first substrate side, an inner side of the center is extended with extension board, the first substrate for stacking
With offer through hole on the extension board, the contact module is contained in the through hole；And
Located at the center with the first substrate mutually back to the circuit board of side, the circuit board is relative with the through hole to be located to have
There is contact zone, the contact zone contacts module electrical connection with described.
2. smart card as claimed in claim 1, it is characterised in that also include on the outside of the circuit board and with the center
The pad being fixedly connected；And located at the pad and the first substrate mutually back to side second substrate.
3. smart card as claimed in claim 2, it is characterised in that have gap, and institute between the pad and the circuit board
First substrate, the center, the circuit board, the pad and the second substrate is stated to be bonded by encapsulating.
4. smart card as claimed in claim 1, it is characterised in that the depth of the through hole is equal to the thickness of the first substrate
With the thickness sum of center.
5. smart card as claimed in claim 2, it is characterised in that pass through conduction between the contact module and the contact zone
Glue is fixedly connected.
6. smart card as claimed in claim 1, it is characterised in that the size of the through hole is more than or equal to the contact module
Size.
7. smart card as claimed in claim 1, it is characterised in that the outer rim shape of the center is outer with the first substrate
Edge shape is adapted.
8. smart card as claimed in claim 2, it is characterised in that the outer rim shape of the pad and the outer rim shape of the center
Shape is adapted.
9. the smart card as described in any one of claim 1 to 8, it is characterised in that the circuit board and the first substrate it
Between be bonded, it is be bonded between the center and the first substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721043354.XU CN207148888U (en) | 2017-08-18 | 2017-08-18 | smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721043354.XU CN207148888U (en) | 2017-08-18 | 2017-08-18 | smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207148888U true CN207148888U (en) | 2018-03-27 |
Family
ID=61665894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721043354.XU Withdrawn - After Issue CN207148888U (en) | 2017-08-18 | 2017-08-18 | smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207148888U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107578083A (en) * | 2017-08-18 | 2018-01-12 | 深圳市文鼎创数据科技有限公司 | Smart card and its manufacture method |
-
2017
- 2017-08-18 CN CN201721043354.XU patent/CN207148888U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107578083A (en) * | 2017-08-18 | 2018-01-12 | 深圳市文鼎创数据科技有限公司 | Smart card and its manufacture method |
| WO2019033907A1 (en) * | 2017-08-18 | 2019-02-21 | 深圳市文鼎创数据科技有限公司 | Smart card and manufacturing method therefor |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20180327 Effective date of abandoning: 20191025 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20180327 Effective date of abandoning: 20191025 |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |