JP2010097459A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC (Integrated Circuit) card which is improved in connectivity between an external connection terminal and an IC board, and reduced in appearance change of a surface of the external connection terminal. <P>SOLUTION: The IC card has: the IC board which has an IC chip and a connection circuit which is electrically connected to the IC chip; a card substrate; and an external connecting terminal board which is provided with the external connection terminal on the surface of an insulating board and equipped with a conduction part which is connected to the external connection terminal and penetrates the insulating board. The external connection terminal and the IC chip are electrically connected through the conduction part and the connecting circuit, and a connecting circuit side ground contact area is larger than an external connection terminal side footprint in the conduction part. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an IC card in which an external connection terminal board and a connection circuit are connected by a conduction part.

  In the IC card, personal information is recorded in the IC chip, and the IC card itself has an arithmetic processing function, thereby giving high security to the information medium.

  Contact IC cards are internationally standardized by ISO. Generally, ICs such as semiconductor memory are built in a card body based on plastic, etc., and metal is used on the card surface for connection with a reader / writer. An external connection terminal is provided.

  On the other hand, the non-contact type IC card has an antenna coil built in, and a current flows through the antenna coil by a magnetic field formed by the reader / writer, and power is supplied to the non-contact IC chip. The non-contact IC card and the reader / writer transmit / receive information in a magnetic field, and read / write information on the non-contact IC chip.

  In addition, composite IC cards with both contact and non-contact functions have been developed, and credit cards, employee ID cards, train tickets, etc. have been converted into IC cards, and the IC card market is expanding greatly.

  In the IC card, there is a problem that the IC chip is damaged by a load caused by contact or an external stress. This is not only a contact IC card, but also a non-contact IC card and a composite IC card.

  As one measure for preventing damage to the IC chip in the IC card, the external connection terminal for the contact communication function and the IC chip are arranged apart from each other in the plane direction of the card body without being superimposed in the thickness direction of the card body, By electrically connecting the external connection terminal and the IC chip by a connection circuit, it is possible to give a degree of freedom to the arrangement position of the IC chip in the card substrate, and to provide the card substrate. There has been developed a composite IC card in which any shape antenna pattern can be arranged (see, for example, Patent Document 1).

  The manufacturing method of this IC card varies depending on the form of the module. As shown in FIG. 11A, an external connection terminal 9 is provided on the insulating substrate 10, and a predetermined number corresponding to each external connection terminal 9 is provided. A through hole for connection with the connection circuit 13 is provided at the position. Then, the through hole is filled with a conductive material to form a conduction portion 11. The external connection terminal 9 and the connection circuit 13 ensure energization through the conduction portion 11 and the connection land 7.

  However, in the conventional technique, the shape of the through hole provided in the insulating substrate is a cylindrical structure in which the external connection terminal side ground area and the connection terminal substrate side ground area are the same size, and the conductive portion 11 is filled. The insulating substrate 10 uses an insulating material, while the material to be conductive is conductive. For this reason, since the conductive portion 11 and the insulating substrate are not chemically bonded, the conductive portion is not sufficiently fixed.

Therefore, when an external force such as bending is applied from the back side of the card, the conductive part 11 pushes up the external connection terminal 9 as shown in FIG. Further, there is a problem that the external connection terminal 9 is bulged or deformed on the surface, which is not preferable in appearance.
JP 2004-220305 A

  An object of the present invention is to provide an IC card that solves the problems of the above prior art, improves the connectivity between the external connection terminal board and the IC board, and reduces the external appearance change of the external connection terminal surface.

The present invention has been made to solve the above-mentioned problems, and the invention according to claim 1 of the present invention includes an IC substrate having an IC chip and a connection circuit electrically connected to the IC chip. An IC card having a card base and an external connection terminal board provided with an external connection terminal on the surface of the insulating substrate and provided with a conductive portion connected to the external connection terminal and penetrating the insulating board; The external connection terminal and the IC chip are electrically connected via the conduction part and the connection circuit, and the conduction part has a connection circuit side ground area larger than an external connection terminal side installation area. It is an IC card characterized.

  The invention according to claim 2 of the present invention is the IC card according to claim 1, wherein a cross section of the conductive portion formed on the external connection terminal substrate is tapered.

  The invention according to claim 3 of the present invention is the IC card according to claim 1, wherein the cross section of the conductive portion formed on the external connection terminal substrate is multi-stage.

  According to a fourth aspect of the present invention, the IC chip has both a contact communication function and a non-contact communication function, and the IC chip is connected to an antenna circuit. Item 4. The IC card according to any one of Items 3.

  The invention according to claim 5 of the present invention is characterized in that the IC substrate further includes a second IC chip and an antenna circuit connected to the second IC chip. The IC card according to any one of the above.

According to the present invention, the following effects can be obtained.
According to the first aspect of the present invention, the external connection terminal is provided on the surface of the IC substrate having the IC chip and the connection circuit electrically connected to the IC chip, the card base, and the insulating substrate. An IC card having an external connection terminal board that is connected to a connection terminal and penetrates the insulating substrate, and the external connection terminal and the IC chip are connected via the conduction part and the connection circuit. Since the connection portion is an IC card characterized in that the ground area on the connection circuit side is larger than the installation area on the external connection terminal side, the conduction portion moves toward the external connection terminal side. Thus, it is possible to reduce poor connection of the conductive portion, swelling on the external connection terminal side, and changes in the appearance of the electrode surface.

  According to a second aspect of the present invention, since the cross section of the conductive portion formed on the insulating substrate is tapered, the conductive portion is an external connection terminal. It is possible to prevent the connection portion and the connection circuit from being poorly connected, expansion of the external connection terminal side, and change in the appearance of the electrode surface.

  According to a third aspect of the present invention, since the cross section of the conductive portion formed on the insulating substrate is a multistage shape, the conductive portion is an external connection terminal. It is possible to prevent the connection portion and the connection circuit from being poorly connected, expansion of the external connection terminal side, and change in the appearance of the electrode surface.

  According to a fourth aspect of the present invention, the IC chip has both a contact communication function and a non-contact communication function, and the IC chip is connected to an antenna circuit. 3. Because of the IC card described in 3, the IC card that has both contact communication and non-contact communication functions can also prevent the conduction part from moving to the external connection terminal side. It becomes possible to reduce the swelling on the terminal side and the appearance change of the electrode surface.

  According to the invention of claim 5, the IC card according to any one of claims 1 to 3, comprising an IC substrate in which the second IC chip is connected to the antenna circuit. Even for an IC card having an IC substrate in which the second IC chip is connected to the antenna circuit, the conduction part can be prevented from moving to the external connection terminal side, connection failure between the conduction part and the connection circuit, and swelling on the external connection terminal side It becomes possible to reduce the change in the appearance of the electrode surface.

The present invention provides a composite IC card having both a contact communication function and a non-contact communication function on an IC chip and having an antenna circuit connected thereto, and an IC substrate having a second IC chip connected to the antenna circuit. It can also be used for IC cards.
As a result, even in the composite IC card, it is possible to reduce poor connection between the conductive portion and the connection circuit, swelling on the external connection terminal side, and change in the appearance of the electrode surface.

  The purpose of the present invention is to provide an IC card in which the connection failure of the conduction part formed on the external connection terminal board, the swelling to the external connection terminal side, and the appearance change of the electrode surface are reduced, and the shape of the conduction part is specified. Realized by forming in the shape of.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an explanatory diagram showing an example of the structure of an IC card according to the present invention. FIG. 2 is a cross-sectional view of FIG.

As shown in FIGS. 1 and 2, the IC card includes a card body 1 including a card base 31, a card base 32, an IC chip 21, and an IC substrate 2 electrically connected to a connection circuit 13. The external connection terminal board 6 is configured.
The card substrates 31 and 32 are made of, for example, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyimide (PI), acrylonitrile-butadiene-styrene copolymer (ABS), acrylic resin, polycarbonate (PC), poly An insulating sheet (film) such as vinyl chloride (PVC) can be used alone or in combination. The thickness of the card base materials 31 and 32 is preferably in the range of 0.1 to 0.3 mm. The IC chip has a contact type function.

A method for manufacturing the external connection terminal board 6 will be described. The external connection terminal board 6 corresponds to the position of the external connection terminal 9 defined by ISO / JIS on an insulating board 10 using an insulating material such as glass epoxy or polyimide having a thickness of 0.1 to 0.5 mm. Create a through hole at the location using an end mill.
Subsequently, a conductor to be the external connection terminal 9 is formed on one surface of the insulating substrate 10. The external connection terminal 9 is affixed on the insulating substrate 10 with a copper foil having a thickness of 0.02 to 0.05 mm adhered with an adhesive. Thereafter, a resist is applied to the copper foil side of the pattern of the external connection terminals 9 defined by ISO / JIS by a resist coater or screen printing, and a desired electrode pattern is formed using a photolithography method or the like.
Thereafter, nickel plating and gold plating are applied to the electrode pattern to form the external connection terminals 9. Note that nickel plating and gold plating are also applied to the through hole side of the external connection terminal 9. Thereafter, the conductive portion 11 is formed by filling the through-hole portion with an appropriate amount of a conductor such as cream solder or silver-based conductive resin.
Further, the hot melt sheet 12 is temporarily fixed at a predetermined position of the external connection terminal board 6 in contact with the connection circuit side.

  As shown in FIGS. 3A and 3B, the feature of the present invention is that the shape of the conductive portion 11 formed on the insulating substrate 10 is such that the connection circuit side ground area B is the external connection terminal side ground. It is to form so that it may become larger than the area U. An example of the shape is a tapered shape.

Hereinafter, a method for forming a tapered shape will be described. In the taper shape, a through hole is processed by a reamer or end mill having a desired taper. In the case of the taper shape, as shown in FIG. 3B, it is desirable that the external connection terminal side grounding area U is a circular shape having a diameter of 0.7 to 1.5 mm, and the taper angle of the cross section is “3 °. <Θ ≦ 10 ° ”is desirable.
The opening is preferably circular but is not particularly limited. Further, as an example of the tapered shape, the side surface of the conductive portion 11 may have a curved shape other than the linear shape as shown in FIGS. 8A and 8B.

  Another example of the shape of the conductive portion is a multistage shape. Hereinafter, a two-stage manufacturing method will be described.

  As shown in FIGS. 4A and 4B, the two-stage shape is processed so that the opening having a small external connection terminal side opening area U is smaller than the opening having a wide connection circuit side opening area B. . When making a level | step difference in the conduction | electrical_connection part 11, two end mills from which a diameter differs are used. Through holes are formed at predetermined positions on the insulating substrate 10 by an end mill. Thereafter, a stepped shape is created at the same position using an end mill in which the diameter on the connection circuit side is larger than the diameter on the external connection terminal side. Alternatively, first, a plurality of holes having a diameter U are simultaneously pressed, and then a stepped shape is created using an end mill having a diameter B.

In the case of a two-stage shape, as shown in FIG. 4B, the ratio of the external connection terminal side installation area U to the connection circuit side installation area B is preferably “1 <B / U ≦ 2”. The ratio of the height Uh of the opening on the connection terminal side to the height Bh of the opening on the connection circuit side, Uh / Bh, is preferably “1 <Uh / Bh ≦ 3”.
Further, it is desirable that the external connection terminal side ground area U is a circle having a diameter of 0.7 to 1.5 mm and the connection circuit side ground area B is a circle having a diameter of 0.9 to 3.0 mm.

The multi-stage shape consists of two or more stages, ie, an opening with a narrow opening area U on the external connection terminal side and an opening with a wide opening area B on the connection circuit side. The process is repeated so that the diameter of the end mill is larger than the previous diameter.
9A and 9B, the multistage shape is not limited to a shape other than a circular shape, and the side surface of the conducting portion 11 may be a curved shape other than a linear shape.

Next, a method for manufacturing the connection circuit 13 will be described. The connection circuit 13 is a conductive pattern for electrically joining the IC chip 21 and the external connection terminal 6. As shown in FIG. 1 (a), the connection circuit 13 includes, for example, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyimide (PI), acrylonitrile-butadiene-styrene copolymer (ABS), acrylic, and the like. A conductive material such as copper foil or aluminum foil having a thickness of 15 to 50 μm is pasted on an insulating sheet (film) such as resin, polycarbonate (PC), polyvinyl chloride (PVC), etc., and photolithography or etching. Etc. to form a pattern. In the connection circuit 13, connection lands 7 and 8 are provided at positions corresponding to the conduction portions 11 of the external connection terminals 6. The connection lands 7 and 8 are plated with tin, silver, gold or the like.
Thereafter, the connection circuit 13 and the contact communication function IC chip 21 are electrically connected by wire bonding, flip chip, or the like to form the IC substrate 2.

  As for the arrangement of the contact communication function IC chip 21, the connection land 8 may be provided on the back surface of the connection circuit 13 to be electrically connected to the contact function IC chip 21, or on the surface of the connection circuit 13. The connection land 8 may be provided and bonded to the contact function IC chip 21.

Next, the IC substrate 2 is sandwiched between two card base materials 31 and 32, and the card body 1 is formed by laminating.
At that time, as shown in FIG. 10, the card base 31 is provided with a mounting hole 14 for the external connection terminal board 6 provided by an end mill, countersinking, or the like at a predetermined position defined by ISO / JIS. .
At this time, the connection land 7 is exposed inside the mounting hole 14 for mounting the external connection terminal 6 of the card body 1. After the conductive portion 11 of the external connection terminal 6 is installed in the mounting hole 14 so as to overlap the connection circuit 13, heat and pressure are applied to melt and cure the hot melt sheet 12 and the solder paste. And the connection land 7 are combined to complete the mounting.

  According to the above embodiment, in the conductive part 11 formed on the insulating substrate 10, the connection part side ground area B is set on the external connection terminal side by forming the conductive part 11 in a tapered shape or a multistage shape. By making it larger than the area U, it is possible to prevent the conduction portion 11 from moving to the external connection terminal side. For this reason, it is possible to reduce poor connection of the conductive portion 11, swelling on the external connection terminal side, and change in appearance of the electrode surface.

  As another embodiment of the present invention, there is a composite IC card as shown in FIGS. The IC card includes a card body 31 including a card base 31, an antenna sheet 4, and a card base 32, an IC substrate 2 to which the contact communication function IC chip 21 and the connection circuit 13 are connected, and an external connection terminal substrate 6. Consists of. On the antenna sheet 4, an antenna pattern 5 for non-contact communication is provided, and an IC chip 22 for non-contact communication function connected to the antenna pattern 5 is provided.

  The antenna sheet 4 can be made of the same material as the card base materials 31 and 32 described above, for example, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyimide (PI), acrylonitrile-butadiene-styrene copolymer. (ABS), acrylic resin, polycarbonate (PC), polyvinyl chloride (PVC) and other insulating sheets (films) can be used alone or in combination. The antenna sheet (film) 4 preferably has a thickness of 15 to 200 μm.

  Further, the antenna pattern 5 for non-contact communication is formed by etching using a photolithography method after bonding a copper foil or aluminum foil having a thickness in the range of 15 to 50 μm to the antenna sheet 4. .

  The antenna sheet 4 in a state where the antenna pattern 5 and the IC chip 22 for non-contact communication function are electrically connected, the IC chip 21 for contact communication function, and the IC substrate 2 include two cards. It is sandwiched between the base materials 31 and 32 and laminated.

As for the arrangement of the contact function IC chip, as shown in FIGS. 6A and 6B, a connection land 8 is provided on the surface of the connection circuit 13 to electrically connect with the contact communication function IC chip 21. The connection land 8 may be provided on the back surface of the connection circuit 13 to be electrically connected to the contact communication function IC chip 21. However, at this time, the contact communication function IC chip 21 and the non-contact communication function IC chip 22 need to be arranged so as not to overlap.
Thus, a composite IC card having a non-contact communication function and a contact communication function can be provided.

As other embodiment of this invention, the shape of the antenna pattern 5, the arrangement position of the antenna pattern 5, the form of the IC chip, and the arrangement position of the IC chip are not particularly limited.
For example, FIG. 5C shows another embodiment of the present invention, which is an IC card having a circular antenna pattern 15.

Furthermore, as another embodiment of the present invention, there is a composite IC card as shown in FIG. 7A includes an antenna pattern 5 and an IC chip 23 having both a contact communication function and a non-contact communication function, and the IC chip 23 is connected to the connection circuit 13 and the antenna pattern 5 of the antenna sheet 4, respectively. This is a composite IC card of the present invention.
FIG. 7B shows a composite IC card of the present invention provided with a circular antenna pattern 15 and the IC chip 23.

  In addition, as another embodiment of the present invention, the material of the antenna pattern 5 and the material of the antenna sheet 4 are not particularly limited. In addition to an IC chip having both contact communication functions, the present invention can also be applied to an IC card having only the respective functions. The present invention is not limited to the embodiments described above, and various modifications and changes are possible, and these are also within the equivalent scope of the present invention.

Explanatory drawing which shows the structure of the IC card of this invention. FIG. 2 is a cross-sectional view of FIG. 1 showing a laminated structure of the IC card of the present invention. Sectional drawing of the external connection terminal board | substrate which showed the conduction | electrical_connection part shape of the IC card of this invention. Sectional drawing of the external connection terminal board | substrate which showed the conduction | electrical_connection part shape of the IC card of this invention. Explanatory drawing which shows the application example of IC card of this invention. Sectional drawing of FIG. 5 which shows the application example of the IC card of this invention. Explanatory drawing which shows the application example of IC card of this invention. Sectional drawing of the external connection terminal board | substrate which showed the application example of the conduction | electrical_connection part shape to which this invention is applied. Sectional drawing of the external connection terminal board | substrate which showed the application example of the conduction | electrical_connection part shape to which this invention is applied. Explanatory drawing which shows the method of attaching the external connection terminal board | substrate of the IC card of this invention. Sectional drawing of the external connection terminal board which showed the conventional conduction | electrical_connection part shape.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 41 ... Card body 2, 42 ... IC board 31, 32 ... Card base material 4 ... Antenna sheet 5, 15 ... Antenna pattern 6 ... External connection terminal board 7, 8 ... Connection land 9 ... External connection terminal 10 ... Insulating substrate 11 ... Conducting part 12 ... Hot melt sheet 13 ... Wiring circuit 14 ... Mounting hole 15 ... Circular antenna Pattern 21 ... IC chip for contact communication function 22 ... IC chip for non-contact communication function 23 ... IC chip having both contact communication function and non-contact communication function

Claims (5)

An IC substrate having an IC chip and a connection circuit electrically connected to the IC chip, a card base, and an external connection terminal is provided on the surface of the insulating substrate, and the insulating substrate is connected to the external connection terminal. An IC card having an external connection terminal board provided with a conductive portion penetrating;
The external connection terminal and the IC chip are electrically connected via the conduction part and the connection circuit,
The IC card, wherein the conductive portion has a ground area on the connection circuit side larger than an installation area on the external connection terminal side.   The IC card according to claim 1, wherein a cross section of the conducting portion formed on the insulating substrate is tapered.   2. The IC card according to claim 1, wherein a cross section of the conductive portion formed on the insulating substrate has a multi-stage shape.   The IC card according to any one of claims 1 to 3, wherein the IC chip has both a contact communication function and a non-contact communication function, and the IC chip is connected to an antenna circuit.   4. The IC card according to claim 1, further comprising a second IC chip and an antenna circuit connected to the second IC chip on the IC substrate.

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