JP4518921B2 - IC card and manufacturing method thereof - Google Patents

Description

  The present invention relates to an IC card such as a non-contact type IC card or a contact / non-contact common type IC card that can perform non-contact communication using electromagnetic waves, and a method for manufacturing the same. In particular, in an IC card including an IC chip which is a semiconductor integrated circuit device and a communication antenna line, the antenna line and the IC chip can be easily connected and the reliability can be improved, and a method for manufacturing the IC card. It is about.

  2. Description of the Related Art In recent years, due to advances in semiconductor technology, portable communication devices and data processing devices represented by mobile phones and portable information terminals have been significantly reduced in size and power consumption. On the other hand, network technology and its environment for information transmission media represented by the Internet are rapidly being developed. Accordingly, there is an increasing demand for improving convenience as a mobile information terminal for portable devices, and as a communication technology between such portable devices and a physical network. The range of application of wireless communication technology, that is, contactless communication technology, is expanding. The convenience of the information terminal device having such a contactless communication function is not only a communication system having a base station that covers a wide area on a large scale, but also a close contact represented by a contactless IC (Integrated Circuit) card. This also applies to communication between distances.

  In general, an IC card has a contact type having a mechanical connection terminal, a non-contact type having no connection terminal, and a contact / non-contact type having both interfaces depending on the form of an information interface with a reader / writer device. It is classified as a contact common type (combination type). Among these, the non-contact type IC card and the contact / non-contact type IC card are subjected to data processing by holding the reader / writer device over data processing or instantaneously contacting the reader / writer device for data processing. It has a non-contact communication function capable of touch-and-go processing. For this reason, non-contact type IC cards and contact / non-contact shared type IC cards can be used in a form that is extremely convenient compared to contact type IC cards. As it has begun to be adopted in the system, its application and market are expected to expand rapidly in the future.

  An IC card having a non-contact communication function as described above uses electromagnetic waves for data transmission / reception and includes an antenna for transmitting / receiving electromagnetic waves. Unless otherwise specified, in the following description, an IC card including a contact / contactless IC card and having a contactless communication function is referred to as a contactless IC card.

  FIG. 6 is a schematic plan view of a conventional non-contact type IC card, and FIG. 7 is a schematic cross-sectional view taken along line VII-VII in FIG. An example of such a non-contact type IC card is disclosed in Patent Document 1. As shown in the figure, a conventional non-contact type IC card 40 includes an IC module 45 on which an IC card semiconductor integrated circuit device and passive components are mounted on an antenna substrate 41, and an antenna line as electromagnetic wave transmitting / receiving means. And 42 are formed.

  The IC module 45 has an IC chip 44 mounted on an insulating module substrate 46. The module substrate 46 includes input / output pads (input / output terminals) 44a and 44b (44b is omitted in FIG. 7) of the IC chip 44 and antenna substrate terminals 43a and 43b formed at both ends of the antenna wire 42. Two module antenna pads 47a and 47b for electrical connection are formed. That is, the input / output pad 44a and the antenna board terminal 43a are connected via the module antenna pad 47a, and the input / output pad 44b and the antenna board terminal 43b are connected via the module antenna pad 47b.

  The input / output pads 44a and 44b of the IC chip 44 and the module antenna pads 47a and 47b are electrically connected by gold wires 49a and 49b, respectively. That is, the input / output pad 44a and the module antenna pad 47a are connected by a gold wire 49a, and the input / output pad 44b and the module antenna pad 47b are connected by a gold wire 49b. The IC chip 44 including the gold wires 49a and 49b is sealed with a resin portion 53, whereby an IC module 45 is formed.

The antenna line 42 is formed so as to form a double loop around the IC module 45, and the antenna substrate terminals 43a and 43b formed at both ends thereof are connected to the module via the conductive connection members 48a and 48b. The module antenna pads 47a and 47b formed on the substrate 46 are electrically connected to each other. Further, an intermediate sheet 52 is formed together with the IC module 45 on the formation surface (the upper surface in FIG. 7) on which the antenna line 42 of the antenna substrate 41 is formed, and the surface on the back side of the formation surface of the antenna line 42 A back printed sheet 51 is formed on the lower surface in FIG. Further, a surface printing sheet 50 is formed on the back surface of the intermediate sheet 52 on which the antenna substrate 41 is formed (the upper surface in FIG. 7). As described above, the IC module 45 and the antenna line 42 are formed between the front surface printing sheet 50 and the back surface printing sheet 51 to constitute the non-contact type IC card 40.
JP 2003-203944 A

  In the conventional non-contact type IC card 40, as described above, the antenna line 42 is formed so as to form a loop of double or more, so that an intersection 42a is formed in the antenna line 42 as shown in FIG. The In such an intersecting portion 42a, since the intersecting antenna wires 42 are in contact with or close to each other, stress is applied to the respective antenna wires 42 from the outside, the antenna wires 42 are disconnected, or the insulating back surface coating film is peeled off. It is easy for problems to occur. Therefore, there is a problem that the reliability of the non-contact type IC card is lowered.

  As shown in FIG. 7, when the IC module 45 is mounted on the antenna substrate 41, the IC module 45 is mounted so that the resin portion 53 side on which the IC chip 44 is mounted does not face the antenna substrate 41. In the structure, since the thickness of the non-contact type IC card 40 is determined by the thicknesses of the antenna substrate 41, the IC module 45, the front surface printing sheet 50, the back surface printing sheet 51, and the like, the layer thickness reduction in the non-contact type IC card 40 Is difficult. However, in recent years, there has been a great demand for further thinning of the non-contact type IC card 40, and a concave portion is formed in the antenna substrate 41 by countersink processing, and the resin portion 53 is fitted into the formed concave portion to install the IC module 45. A structure for reducing the thickness of the non-contact type IC card 40 by mounting is also proposed. However, even in such a structure, there is no change in the formation of the intersecting portion 42a in the antenna line 42, and there is a problem that the problems occurring in the intersecting portion 42a as described above cannot be solved.

  On the other hand, it is conceivable to use an enameled wire in which the antenna wire 42 is covered with an insulating film in order to eliminate the above-described problems at the intersection 42a of the antenna wire 42 as much as possible. However, in order to form such an enameled wire on the antenna substrate 41, it is necessary to use a mechanical antenna winding method. However, the formation process of the antenna wire 42 by this antenna winding method is compared with the process of forming a copper foil as the antenna wire 42 by the etching method or the process of forming the aluminum foil as the antenna wire 42 by the aluminum foil vapor deposition method. There is a problem that the cost becomes high. Further, when an enameled wire covered with an insulating film is used for the antenna wire 42, it is difficult to improve the accuracy of the formation position of the antenna wire 42 formed on the antenna substrate 41, and the antenna substrate terminals 43a and 43b. There is a problem that the process of forming the module antenna pads 47a and 47b to be connected to the module substrate 46 becomes complicated.

  The present invention has been made in view of the above circumstances, and solves various problems that may occur at intersections of antenna lines by forming the antenna lines forming multiple loops without intersecting them. It is an object to provide a highly reliable IC card and a method for manufacturing the same.

  Another object of the present invention is to mount the module substrate on the antenna substrate by causing the IC chip mounted on the module substrate to face the antenna substrate and fitting the IC chip into the recess provided on the antenna substrate. It is an object to provide a thin IC card and a manufacturing method thereof.

An IC card according to the present invention is an IC card comprising an antenna substrate on which antenna lines forming multiple loops are formed, and a module substrate on which an IC chip for processing signals transmitted and received via the antenna wires is mounted. The antenna line is divided into a plurality of antenna members each having an open portion at a part of the loop and not intersecting each other, and the antenna substrate is provided at one end of the innermost antenna member. A first antenna terminal; a first relay terminal provided at one end of the antenna member excluding the innermost side; a second antenna terminal provided at the other end of the outermost antenna member; and an antenna member excluding the outermost side and a second relay terminal provided on the other end of the module substrate, on its lower surface, a first module terminal connected to the first antenna terminal, before Symbol first A third module terminal connected to the connection terminal, a fourth module terminal connected to the second relay terminal, and the first relay terminal of the outer antenna member of the two adjacent antenna members. It includes a third module terminal, and a relay wiring portion for connecting between the fourth module terminal to which the inner antenna member is connected to the second relay terminal of the two antenna member adjacent said module The substrate includes a second module terminal connected to the second antenna terminal on an upper surface thereof.

  In the case of the present invention, each of the multiple loops formed by the antenna lines formed on the antenna substrate has a part of the open portions and is divided into a plurality of antenna members that do not cross each other. The antenna board has a first antenna terminal formed at one end of the innermost antenna member, a first relay terminal formed at one end of the antenna member excluding the innermost, and the other end of the outermost antenna member. A second antenna terminal is formed at the portion, and a second relay terminal is formed at the other end of the antenna member excluding the outermost side. On the other hand, the module substrate on which the IC chip is mounted is connected to the first module terminal connected to the first antenna terminal, the second module terminal connected to the second antenna terminal, and the first relay terminal. The third module terminal to be connected and the fourth module terminal connected to the second relay terminal are formed.

  The module substrate includes a third module terminal connected to the first relay terminal provided at one end of the outer antenna member of the two adjacent antenna members, and the two of the two adjacent antenna members. A relay wiring portion is formed to connect the fourth module terminal connected to the second relay terminal provided at the other end portion of the inner antenna member. Therefore, between the two adjacent antenna members, the first relay terminal provided on the outer antenna member and the second relay terminal provided on the inner antenna member are connected via the relay wiring portion formed on the module substrate. Therefore, the antenna lines do not cross directly.

  In the IC card according to the present invention, the antenna substrate has a recess in which an IC chip mounted on the module substrate is fitted, and the module substrate is configured to fit the IC chip in the recess. The antenna substrate with the first module terminal, the second module terminal, the third module terminal, and the fourth module terminal opposed to the first antenna terminal, the second antenna terminal, the first relay terminal, and the second relay terminal, respectively. It is mounted on.

  In the case of the present invention, the antenna substrate is provided with a recess for fitting the IC chip mounted on the module substrate, the IC chip is fitted into the recess, and the first module terminal and the second module formed on the module substrate. The module substrate is placed on the antenna substrate so that the terminal, the third module terminal, and the fourth module terminal face the first antenna terminal, the second antenna terminal, the first relay terminal, and the second relay terminal formed on the antenna substrate, respectively. By mounting on the terminal, it is not necessary to connect the terminals to be connected by extending a conducting wire or the like, and it is possible to connect directly.

  The IC card according to the present invention includes the first module terminal and the first antenna terminal, the second module terminal and the second antenna terminal, the third module terminal and the first relay terminal, the fourth module terminal and the second relay. The terminals are connected to each other via a conductive connecting member.

  In the case of the present invention, the first module terminal, the second module terminal, the third module terminal, and the fourth module terminal formed on the module substrate are connected to the first antenna terminal, the second antenna terminal, and the second module terminal formed on the antenna substrate. By connecting each of the 1 relay terminal and the 2nd relay terminal via a conductive connecting member, it is not necessary to connect the terminals to be connected by extending a conducting wire or the like, and each terminal is securely connected. It becomes possible.

  The IC card according to the present invention is characterized in that the IC chip is mounted on the module substrate by a flip chip bonding method.

  In the case of the present invention, since the IC chip is mounted on the module substrate by processing according to the flip chip bonding method, the IC chip and the module substrate are connected by bumps instead of wires. This makes the IC module stronger and more resistant to externally applied stress.

An IC card manufacturing method according to the present invention includes an antenna substrate on which antenna lines forming multiple loops are formed, and a module substrate on which an IC chip for processing signals transmitted and received via the antenna wires is mounted. In the method for manufacturing an IC card, the antenna substrate includes a first step of forming a recess in which an IC chip mounted on the module substrate is fitted, and the antenna substrate has an open portion at a part of the loop. An antenna line that is divided into a plurality of antenna members that do not cross each other, a first antenna terminal provided at one end of the innermost antenna member, and a first antenna terminal provided at one end of the antenna member excluding the innermost side A relay terminal, a second antenna terminal provided at the other end of the outermost antenna member, and a second relay terminal provided at the other end of the antenna member excluding the outermost A second step of forming, on the lower surface of the module substrate, connecting a first module terminal connected to the first antenna terminal, a third module terminal connected before Symbol first relay terminal to the second relay terminal A fourth module terminal, and an inner antenna member of the two antenna members adjacent to the third module terminal connected to the first relay terminal of the outer antenna member of the two adjacent antenna members Forming a relay wiring portion for connecting to the fourth module terminal connected to the second relay terminal, and forming a second module terminal connected to the second antenna terminal on an upper surface of the module substrate. A module in which a third step, the first module terminal, the second module terminal, the third module terminal, the fourth module terminal, and the relay wiring portion are formed; A fourth step of mounting the IC chip on a substrate; and an IC chip mounted on the module substrate is fitted into a recess formed in the antenna substrate; the first module terminal is connected to the first antenna terminal; And a fifth step of connecting the second module terminal to the second antenna terminal, the third module terminal to the first relay terminal, and the fourth module terminal to the second relay terminal, respectively. To do.

  The IC card manufacturing method according to the present invention is characterized in that the IC chip is mounted on the module substrate by a flip chip bonding method.

  In the case of the present invention, by mounting an IC chip on a module substrate by a process according to the flip chip bonding method, it is possible to realize not only a thin layer but also a highly flexible IC module. Therefore, when a highly flexible IC module is mounted inside a thin and soft card, the IC module bends smoothly following the card, and the elongation rate of the card base itself is small. For this reason, there is less risk of damage to the card, and a highly reliable IC card can be realized.

  According to the present invention, in the antenna member constituting the antenna line, the first antenna terminal formed on the innermost antenna member is connected to the first module terminal provided on the module substrate on which the IC chip is mounted, The second antenna terminal formed on the antenna member is connected to the second module terminal provided on the module substrate. Further, in two adjacent antenna members, the third module terminal of the module substrate connected to the first relay terminal formed on the outer antenna member and the second relay terminal formed on the inner antenna member are connected. By forming a relay wiring portion for connecting the fourth module terminal of the module substrate to the module substrate, two adjacent antenna members are connected via the relay wiring portion, so that the antenna lines do not intersect directly. Various problems resulting from the crossing of the antenna lines, such as the disconnection of the antenna line due to externally applied stress and the deterioration of the antenna characteristics, can be solved, and a highly reliable IC card can be realized.

  In addition, in an antenna substrate on which antenna lines that do not intersect are formed, it is not necessary to insulate the intersecting portions of the antenna wires when the substrate is formed. Therefore, it is necessary to use an enameled wire that covers the intersecting portions of the antenna wires with an insulating film. The antenna substrate can be manufactured by an inexpensive method. Therefore, the antenna wire can be realized by a copper foil formed using an etching method or an aluminum foil formed using an aluminum vapor deposition method. Can be improved. Further, since the antenna terminal connected to the module terminal formed on the module substrate can form an antenna connection pad having a wider area than the antenna connection pad formed by the antenna wire, the module terminal and the antenna terminal The stability in connection with the external power is improved, and the reliability against external stress is also improved.

  According to the present invention, the first module terminal, the second module terminal, the third module terminal, and the fourth module terminal formed on the module substrate are connected to the first antenna terminal, the second antenna terminal, By connecting the 1 relay terminal and the second relay terminal so as to face each other, it becomes possible to directly connect the terminals. For example, each terminal generated when the terminals are connected by a conductive wire such as a gold wire. The disconnection of the conducting wire can be prevented, and the strength of the connection between the module substrate and the antenna wire can be improved.

  According to the present invention, the module terminals formed on the module substrate and the antenna substrate formed on the antenna substrate are connected to each other through the connection member having conductivity, so that each terminal to be connected is a conductive wire such as a gold wire. As compared with the case of connecting by the above, the connection of each terminal can be strengthened. Therefore, even when the IC card is bent or twisted due to external stress, the module substrate is difficult to peel off from the antenna substrate, and a highly reliable IC card can be realized.

  According to the present invention, since the IC chip is mounted on the module substrate by a process according to the flip chip bonding method, the IC chip and the module substrate are connected by the bump, so that the connection between the IC chip and the module substrate is stronger. Thus, it is possible to construct an IC module that is strong against stress applied from the outside and in which the IC chip is difficult to peel off from the module substrate. In addition, since the connection terminals of the IC chip and the module substrate can be opposed to each other, the thickness is smaller than that in the case of connecting the IC chip and the module substrate with a wire in the process according to the wire bonding method. An IC module can be configured.

Hereinafter, an IC card according to the present invention will be described in detail with reference to the drawings showing embodiments thereof.
(Embodiment 1)
Hereinafter, an embodiment in which an IC card according to the present invention is applied to a non-contact type IC card will be described. 1 is a schematic plan view of a non-contact type IC card according to Embodiment 1, and FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. FIG. 1 shows a state where the intermediate sheet 12 is not formed on the antenna substrate 1 on which the IC module 5 is mounted.

  As shown in FIG. 1, in the non-contact type IC card 10 according to the first embodiment, the antenna wire 2 as the electromagnetic wave transmitting / receiving means forms a double (multiple) loop on the insulating antenna substrate 1. Is formed. Note that the antenna wire 2 in the non-contact type IC card 10 according to the present invention has two (plural) antenna members 20 each having an open portion at a part of the loop and arranged so as not to cross each other. , 21. Further, the non-contact type IC card 10 according to the present invention can constitute the antenna line 2 not only by the two antenna members 20 and 21 but also by a large number of antenna members.

  On the antenna substrate 1, a first antenna substrate terminal 3a as a first antenna terminal is formed at one end (lower end in FIG. 1) of the inner (innermost) antenna member 20, and the outer (outermost) A third antenna substrate terminal 3c serving as a first relay terminal is formed at one end (lower end in FIG. 1) of the antenna member 21 except for the inside. On the antenna substrate 1, a second antenna substrate terminal 3b as a second antenna terminal is formed on the other end portion (upper end portion in FIG. 1) of the outer (outermost) antenna member 21. A fourth antenna substrate terminal 3d as a second relay terminal is formed at the other end (upper end in FIG. 1) of the antenna member 21 on the inner side (excluding the outermost side). By mounting the IC module 5 so as to cover the first antenna substrate terminal 3a, the second antenna substrate terminal 3b, the third antenna substrate terminal 3c, and the fourth antenna substrate terminal 3d formed on the antenna substrate 1 in this way. A non-contact type IC card 10 is configured.

  In the non-contact type IC card 10 described above, the IC module 5 has a configuration in which an IC chip 4 for processing a signal transmitted / received via the antenna line 2 is mounted on the lower surface of the insulating module substrate 6. Yes. The module substrate 6 has a first module antenna pad 7a serving as a first module terminal electrically connected to the input / output pad 4b of the IC chip 4 on the surface facing the antenna substrate 1, and the IC chip 4 being inserted into the module substrate 6. A second module antenna pad 7b as a second module terminal electrically connected to the output pad 4a is formed at an appropriate location.

  Further, when the module substrate 6 is mounted on the antenna substrate 1 in order to connect the inner antenna member 20 and the outer antenna member 21, the third antenna substrate terminal 3 c ( The third module antenna pad 7c as the third module terminal and the fourth module antenna pad 7d as the fourth module terminal are connected to the first relay terminal) and the fourth antenna substrate terminal 3d (second relay terminal), respectively. Is formed. Further, a relay wiring portion 2a for connecting the third module antenna pad 7c and the fourth module antenna pad 7d is formed on the lower surface of the module substrate 6 in order to connect the antenna member 20 and the antenna member 21. .

  In the first embodiment, the antenna members 20 and 21 are formed in a double loop, and one relay wiring portion that connects the inner antenna member 20 and the outer antenna member 21 to the module substrate 6. It is sufficient to form 2a. However, in the case where the antenna wire 2 constituting a triple or more loop is formed on the antenna substrate 1, in the two adjacent antenna members, the relay terminals provided on the outer antenna member ( The module terminal (third module terminal) formed on the module substrate 6 to be connected to the first relay terminal) and the two antenna members adjacent to each other, the relay terminal (second relay) provided on the inner antenna member In order to be connected to the terminals, relay wiring portions are formed to connect between the module terminals (fourth module terminals) formed on the module substrate 6. There is required.

  Here, the first module antenna pad 7 a provided on the module substrate 6 is connected to the input / output pad 4 b of the IC chip 4 and the first antenna substrate terminal 3 a provided on the antenna substrate 1 to connect the lower surface of the module substrate 6. Are disposed at appropriate positions. The second module antenna pad 7b includes an input / output pad 4a of the IC chip 4 and a second antenna substrate terminal 3b provided on the antenna substrate 1, and a third antenna substrate terminal 3c and a fourth antenna substrate terminal 3d. In order to connect so as not to directly intersect with the connecting relay wiring portion 2a, the relay wiring portion 2a is disposed at an appropriate position on the upper surface of the module substrate 6.

  Further, the IC module 5 has one end portion of the first module antenna pad 7a provided on the module substrate 6 opposed to the first antenna substrate terminal 3a provided on the antenna substrate 1, and one end of the second module antenna pad 7b. The third module antenna pad 7c is opposed to the third antenna substrate terminal 3c on the antenna substrate 1, and the fourth module antenna pad 7d is disposed on the antenna substrate. 1 is mounted on the antenna substrate 1 so as to face the fourth antenna substrate terminal 3d on the substrate 1. The antenna substrate 1 is provided with a recess for embedding the resin portion 13 encapsulating the IC chip 4 mounted on the module substrate 6 at an appropriate position by countersinking.

  Therefore, the IC module 5 is mounted on the antenna substrate 1 by fitting the resin portion 13 into a recess provided in the antenna substrate 1. Further, the first module antenna pad 7a provided in the IC module 5 is electrically connected to the first antenna substrate terminal 3a via the conductive connection member 8a, and the second module antenna pad 7b is electrically connected to the conductive connection member. 8b is electrically connected to the second antenna substrate terminal 3b, the third module antenna pad 7c is electrically connected to the third antenna substrate terminal 3c via the conductive connection member 8c, The 4-module antenna pad 7d is connected to the fourth antenna substrate terminal 3d via a conductive connection member 8d (overlapping with 8c in FIG. 2).

  In addition, as described above, the antenna substrate 1 on which the IC module 5 is mounted has the intermediate sheet 12 formed on the surface on which the IC module 5 is mounted, as shown in FIG. Thus, the non-contact type IC card 10 is configured.

  Here, as shown in FIG. 2, the IC chip 4 mounted on the IC module 5 is provided with gold bumps 14a and 14b on the input / output pads 4a and 4b, respectively. The gold bump 14a provided on the input / output pad 4a is connected to one end of the second module antenna pad 7b provided on the module substrate 6 and is connected to the other end of the second module antenna pad 7b. To the second antenna substrate terminal 3b. Further, the gold bump 14b provided on the input / output pad 4b is connected to one end of the first module antenna pad 7a provided on the module substrate 6 and is connected to the other end of the first module antenna pad 7a. It is connected to the first antenna substrate terminal 3a through the member 8a.

  Further, a reinforcing plate 16 for protecting the IC chip 4 is disposed on the back side (lower side in FIG. 2) of the formation surface of the input / output pads 4a and 4b of the IC chip 4. Such an IC chip 4 is sealed together with the reinforcing plate 16 by the resin portion 13, thereby forming the IC module 5.

  As described above, in the non-contact type IC card 10 according to the present embodiment, the first antenna substrate terminal 3a on the antenna substrate 1 is connected to the input / output pad 4b of the IC chip 4 mounted on the IC module 5. A one-module antenna pad 7 a is connected, and a second module antenna pad 7 b connected to the input / output pad 4 a of the IC chip 4 is connected to the second antenna substrate terminal 3 b on the antenna substrate 1. Further, a third module antenna pad 7c provided in the IC module 5 is connected to a third antenna board terminal 3c formed in the outer antenna member 21, and a fourth antenna substrate terminal 3d formed in the inner antenna member 20 is connected. A fourth module antenna pad 7d provided in the IC module 5 is connected to the IC module 5. This makes it possible to form a two-turn loop on the antenna substrate 1 without directly intersecting the two antenna members 20 and 21, and disconnecting the antenna wire 2 caused by the antenna members 20 and 21 intersecting directly or A decrease in performance in the antenna line 2 can be prevented.

  Conventionally, in the case where the antenna lines are formed so as to form multiple loops, the antenna board is used to reduce the probability of occurrence of disconnection of the antenna lines that may have occurred near the intersection where the antenna lines intersect. It is necessary to increase the thickness of the intermediate sheet for protecting the IC module 5 on the No. 1, and as a result, the thickness of the non-contact type IC card is increased.

  On the other hand, in the non-contact type IC card 10 according to the present invention, the antenna members 20 and 21 formed on the antenna substrate 1 do not intersect directly, so there is no risk of the antenna wire 2 being cut at the intersection. Moreover, the thickness of the intermediate sheet 12 covering the IC module 5 can be reduced, and as a result, the non-contact type IC card 10 can be made thinner. Furthermore, the IC module 5 is embedded in the antenna substrate 1 by fitting the resin portion 13 for sealing the IC chip 4 into the recess formed in the antenna substrate 1 and mounting the IC module 5 on the antenna substrate 1. Therefore, the contactless IC card 10 can be further thinned. In the non-contact type IC card 10 of the present embodiment, the surface printed sheet 50 (see FIG. 7) formed in the conventional non-contact type IC card 40 is not formed, so that the non-contact type is thinner and more reliable. The IC card 10 can be provided.

  Below, the manufacturing method of the non-contact type IC card 10 of the structure mentioned above is demonstrated. When manufacturing the non-contact type IC card 10, first, a copper foil or an aluminum foil is attached to one side of the insulating antenna substrate 1, and the surface of the copper foil or the aluminum foil attached is etched to make each of the loops. Two antenna members 20 and 21 having an open portion in part and not crossing each other are formed. The antenna substrate 1 is provided with a recess into which the resin portion 13 of the IC module 5 is fitted. The first antenna substrate terminal 3a is provided at one end of the inner antenna member 20, and the fourth antenna substrate is provided at the other end. The terminal 3d, the second antenna substrate terminal 3b at one end of the outer antenna member 21, and the third antenna substrate terminal 3c at the other end are formed.

  Next, the first module antenna pad 7a, the second module antenna pad 7b, the third module antenna pad 7c, and the fourth module antenna pad of the IC module 5 on which the IC chip 4 which is a semiconductor integrated circuit device for an IC card is mounted. 7d is connected to the first antenna substrate terminal 3a, the second antenna substrate terminal 3b, the third antenna substrate terminal 3c, and the fourth antenna substrate terminal 3d formed on the antenna substrate 1 as described above. , 8b, 8c, and 8d, respectively.

  At this time, the fourth module antenna pad 7d and the third module antenna pad 7c for connecting the inner antenna member 20 and the outer antenna member 21 are connected by the relay wiring portion 2a formed on the module substrate 6. Therefore, not only the two antenna members 20 and 21 do not directly intersect, but also the second antenna substrate terminal 3 b provided at one end portion of the outer antenna member 21 can be disposed in the vicinity of the IC chip 4. Further, the non-contact type IC card 10 is manufactured by sandwiching and laminating both sides of the antenna substrate 1 on which the IC module 5 is mounted with the intermediate sheet 12 or the back printed sheet 11 to form a card state.

  The non-contact type IC card 10 manufactured as described above can use an inexpensive non-contact type IC since an inexpensive antenna substrate 1 in which two-turn antenna wires 2 that do not directly intersect can be patterned on one surface can be used. The card 10 can be realized. In addition, since the IC module 5 obtained by modularizing the IC chip 4 is mounted on the antenna substrate 1, it is possible to realize a highly reliable non-contact type IC card 10 in which physical strength and environmental resistance are ensured. Furthermore, when the IC module 5 is mounted on the antenna substrate 1, it is possible to connect the respective terminals via the conductive connection members 8a, 8b, 8c, and 8d such as solder and Ag paste, which are existing technologies. . In the non-contact type IC card 10 according to the present invention, each constituent member is a sheet material, and a manufacturing process in a high temperature state used in a normal semiconductor process cannot be used. As 8a, 8b, 8c, and 8d, it is desirable to use a low-temperature solder that melts at a low temperature.

  Hereinafter, a more specific manufacturing method of the non-contact type IC card 10 will be described. First, a concave portion is formed on one surface of the antenna substrate 1 made of an insulating material such as a polyester film, a polyimide film, a PET material, or a PET-G material by countersink processing, and a copper foil or an aluminum foil is attached to this surface. . Further, the antenna member 20, 21 having two loops is formed by etching the surface of the antenna substrate 1 to which the copper foil or aluminum foil is attached, and the first antenna substrate is formed at one end of the inner antenna member 20. The terminal 3a, the fourth antenna substrate terminal 3d at the other end, the second antenna substrate terminal 3b at one end of the outer antenna member 21, and the third antenna substrate terminal 3c at the other end are formed.

  Next, the first module antenna pad 7a, the second module antenna pad 7b, and the two antenna members 20 that are electrically connected to the input / output pads 4a and 4b of the IC chip 4 to be mounted on the insulating module substrate 6. , 21 are connected to form an IC module 5 by mounting the IC chip 4 and peripheral components of the IC chip 4.

  Here, a method of manufacturing the IC module 5 by mounting the IC chip 4 on the module substrate 6 by the flip chip method will be described. First, peripheral components of the IC chip 4 are mounted on the module substrate 6 having a thickness of 70 μm by soldering. Next, the reinforcing plate 16 having a thickness of 50 μm is attached to the back surface of the surface on which the input / output pads 4 a and 4 b of the IC chip 4 having a thickness of 50 μm are formed, and the height is set to the input and output pads 4 a and 4 b of the IC chip 4. 20 μm gold bumps 14 a and 14 b are respectively formed. Furthermore, an IC chip in which an anisotropic conductive sheet and a non-contact film are temporarily bonded to the mounting portion of the IC chip 4 of the module substrate 6 manufactured as described above, and gold bumps 14 a and 14 b are formed on the module substrate 6. 4 is subjected to flip chip bonding by applying temperature and pressure.

  Here, by applying a pressure such that the gold bumps 14a and 14b of the IC chip 4 are crushed by 2 to 10 μm, the thin non-contact type IC card 10 having a thickness of about 180 to 200 μm including the thickness of the module substrate 6 itself. IC module 5 can be produced. Further, peripheral components of the IC chip 4 are mounted on the module substrate 6 by soldering, and the IC chip 4 and peripheral components mounted on the module substrate 6 are sealed by the resin portion 13.

  On the other hand, a solder paste, an Ag paste, or the like is applied to the first antenna substrate terminal 3a, the second antenna substrate terminal 3b, the third antenna substrate terminal 3c, and the fourth antenna substrate terminal 3d formed on the antenna substrate 1 manufactured in the above-described process. Conductive connection members 8a, 8b, 8c, and 8d made of are respectively applied. Further, the first module antenna pad 7a, the second module antenna pad 7b, the third module antenna pad 7c, and the fourth module antenna pad 7d of the IC module 5 are opposed to the conductive connecting members 8a, 8b, 8c, and 8d, respectively. Then, heat and pressure are applied from both sides to soften the conductive connection members 8a, 8b, 8c and 8d. The IC module 5 is mounted on the antenna substrate 1 so that the surface on which the IC chip 4 is mounted faces the antenna substrate 1 and the resin portion 13 fits into the recess formed in the antenna substrate 1. The

  In the antenna substrate 1 on which the IC module 5 is mounted in this way, the intermediate sheet 12 is stacked on the mounting surface of the IC module 5 and the back printed sheet 11 is stacked on the back surface. Further, the back surface printing sheet 11, the intermediate sheet 12, and the antenna substrate 1 are melted by applying temperature and pressure from both sides to the antenna substrate 1 on which the back surface printing sheet 11 and the intermediate sheet 12 are laminated. Then, the intermediate sheet 12 is bonded to the antenna substrate 1. Further, the non-contact type IC card 10 is manufactured by lowering the temperature to room temperature while adjusting the pressure in this state.

  In addition, when the back surface printed sheet 11 and the intermediate sheet 12 are comprised with the PET-G raw material including the antenna board | substrate 1, it can laminate by applying a heat | fever and a pressure in the state which laminated | stacked each sheet | seat as an existing technique. It is possible to form a thin card shape. Further, when the antenna substrate 1, the back surface printed sheet 11, and the intermediate sheet 12 are laminated with materials other than PET-G material such as polyimide or PET material that are not bonded to each other in a molten state, the antenna substrate 1 and the back surface printed sheet 11 are used. It becomes possible to form a card shape by inserting an adhesive between the antenna substrate 1 and the intermediate sheet 12.

(Embodiment 2)
Hereinafter, an embodiment in which the IC card according to the present invention is applied to a contact / non-contact shared IC card will be described. 3 is a schematic plan view of a contact / non-contact IC card according to Embodiment 2, and FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. FIG. 3 shows a state in which the contact / non-contact IC card 60 is viewed from the surface of the surface print sheet 72.

  The contact / non-contact shared IC card 60 according to the second embodiment has two antenna wires 70 as electromagnetic wave transmission / reception means on an insulating antenna substrate 61, like the non-contact IC card 10 of the first embodiment. It is formed so as to form a double (multiple) loop. It should be noted that the antenna wires 70 in the contact / non-contact shared IC card 60 of the second embodiment also have two (plural) each having an open portion at a part of the loop so as not to cross each other. Antenna members 70a and 70b. In addition, the contact / non-contact type IC card 60 can constitute the antenna line 70 not only by the two antenna members 70a and 70b but also by a large number of antenna members.

  On the antenna substrate 61, a first antenna substrate terminal 63a as a first antenna terminal is formed at one end portion (lower end portion in FIG. 3) of the inner (innermost) antenna member 70a. A third antenna substrate terminal 63c serving as a first relay terminal is formed at one end portion (lower end portion in FIG. 3) of the antenna member 70b on the inner side except the inside. On the antenna substrate 61, a second antenna substrate terminal 63b as a second antenna terminal is formed at the other end (upper end in FIG. 3) of the outer (outermost) antenna member 70b. A fourth antenna board terminal 63d as a second relay terminal is formed at the other end (upper end in FIG. 3) of the antenna member 70a on the inner side (excluding the outermost side). By mounting the IC module 65 so as to cover the first antenna substrate terminal 63a, the second antenna substrate terminal 63b, the third antenna substrate terminal 63c, and the fourth antenna substrate terminal 63d formed on the antenna substrate 61 in this way. A contact / non-contact IC card 60 is configured.

  In the contact / non-contact type IC card 60 described above, the IC module 65 has a configuration in which an IC chip 64 for processing a signal transmitted / received via the antenna line 70 is mounted on the lower surface of the insulating module substrate 66. Have. The module substrate 66 has a first module antenna pad 67a serving as a first module terminal electrically connected to the input / output pad 64b of the IC chip 64 on the surface facing the antenna substrate 61, and the IC chip 64 inserted therein. A second module antenna pad 67b as a second module terminal electrically connected to the output pad 64a is formed at an appropriate location.

  In addition, the module substrate 66 has a third antenna substrate terminal 63c (formed on the antenna substrate 61) when mounted on the antenna substrate 61 in order to connect the inner antenna member 70a and the outer antenna member 70b. A third module antenna pad 67c as a third module terminal and a fourth module antenna pad 67d as a fourth module terminal are respectively connected to the first relay terminal) and the fourth antenna board terminal 63d (second relay terminal). Is formed. Further, a relay wiring portion 62a for connecting the third module antenna pad 67c and the fourth module antenna pad 67d is formed on the lower surface of the module substrate 66 in order to connect the antenna member 70a and the antenna member 70b. .

  In the second embodiment, the antenna members 70a and 70b are formed in a double loop, and one relay wiring portion connecting the inner antenna member 70a and the outer antenna member 70b to the module substrate 66. It is sufficient to form 62a. However, in the case where the antenna wire 70 constituting a triple or more loop is formed on the antenna substrate 61, the relay terminals (on the outer antenna member) of the two adjacent antenna members ( The module terminal (third module terminal) formed on the module substrate 66 to be connected to the first relay terminal) and the two antenna members adjacent to each other, the relay terminal (second relay) provided on the inner antenna member To connect the module terminal (fourth module terminal) formed on the module substrate 66 to be connected to the terminal). It is necessary to respectively form a line portion.

  Here, the first module antenna pad 67 a provided on the module board 66 is connected to the input / output pad 64 b of the IC chip 64 and the first antenna board terminal 63 a provided on the antenna board 61 to connect the lower surface of the module board 66. Are disposed at appropriate positions. The second module antenna pad 67b includes an input / output pad 64a of the IC chip 64, a second antenna substrate terminal 63b provided on the antenna substrate 61, a third antenna substrate terminal 63c, and a fourth antenna substrate terminal 63d. In order to make a connection so as not to directly cross the relay wiring portion 62a to be connected, the relay wiring portion 62a is disposed at an appropriate position on the upper surface of the module substrate 66 while penetrating the module substrate 66.

  A contact type terminal for reading data by bringing the contact / non-contact type IC card 60 into contact with the reader / writer device is formed on the surface opposite to the surface on which the IC chip 64 of the IC module 65 is mounted. ing. In addition, the second module antenna pad 67b connected to the input / output pad 64a of the IC chip 64 is disposed on the upper surface of the module substrate 66, so that the second module is connected to the contact type terminal of the contact / non-contact type IC card 60. The antenna pad 67b can be connected, and data can be read from and written to the memory in the IC chip 64.

  The IC module 65 has one end of the first module antenna pad 67a provided on the module substrate 66 opposed to the first antenna substrate terminal 63a provided on the antenna substrate 61, and one end of the second module antenna pad 67b. And the third module antenna pad 67c is opposed to the third antenna substrate terminal 63c on the antenna substrate 61, and the fourth module antenna pad 67d is disposed on the antenna substrate. The antenna board 61 is mounted on the antenna board 61 so as to face the fourth antenna board terminal 63 d on the board 61. The antenna substrate 61 is provided with a recess for embedding the resin portion 73 encapsulating the IC chip 64 mounted on the module substrate 66 at an appropriate position by countersinking.

  Therefore, the IC module 65 is mounted on the antenna substrate 61 via the module bottom surface adhesive 77 and the module adhesive 78 with the resin portion 73 fitted into the recess provided in the antenna substrate 61. Further, the first module antenna pad 67a provided in the IC module 65 is electrically connected to the first antenna substrate terminal 63a via the conductive connection member 68a, and the second module antenna pad 67b is electrically connected to the conductive connection member. 68b is electrically connected to the second antenna substrate terminal 63b, and the third module antenna pad 67c is electrically connected to the third antenna substrate terminal 63c via the conductive connection member 68c. The 4-module antenna pad 67d is connected to the fourth antenna substrate terminal 63d via a conductive connection member 68d (overlapping 68c in FIG. 4).

  Further, as described above, the antenna substrate 61 on which the IC module 65 is mounted has a surface printed sheet 72 formed on the surface on which the IC module 65 is mounted, as shown in FIG. 71 is formed, and thereby, a contact / non-contact shared type IC card 60 is configured.

  Here, as shown in FIG. 4, the IC chip 64 mounted on the IC module 65 is provided with gold bumps 74a and 74b on the input / output pads 64a and 64b, respectively. The gold bump 74a provided on the input / output pad 64a is connected to one end of the second module antenna pad 67b provided on the module substrate 66, and is connected to the other end of the second module antenna pad 67b. To the second antenna substrate terminal 63b. The gold bump 74b provided on the input / output pad 64b is connected to one end of the first module antenna pad 67a provided on the module substrate 66, and is connected to the other end of the first module antenna pad 67a. It is connected to the first antenna substrate terminal 63a via the member 68a.

  Further, a reinforcing plate 76 for protecting the IC chip 64 is disposed on the back side (the lower side in FIG. 4) of the surface where the input / output pads 64a and 64b of the IC chip 64 are formed. Such an IC chip 64 is sealed by the resin portion 73 together with the reinforcing plate 76, thereby forming an IC module 65.

  As described above, in the contact / non-contact type IC card 60 according to this embodiment, the first antenna substrate terminal 63a on the antenna substrate 61 is connected to the input / output pad 64b of the IC chip 64 mounted on the IC module 65. The first module antenna pad 67a is connected, and the second module antenna pad 67b connected to the input / output pad 64a of the IC chip 64 is connected to the second antenna board terminal 63b on the antenna board 61. Further, a third module antenna pad 67c provided in the IC module 65 is connected to a third antenna board terminal 63c formed in the outer antenna member 70b, and a fourth antenna board terminal 63d formed in the inner antenna member 70a. A fourth module antenna pad 67d provided in the IC module 65 is connected to the IC module 65. This makes it possible to form a two-turn loop on the antenna substrate 61 without directly intersecting the two antenna members 70a and 70b, and the disconnection of the antenna line 70 caused by the antenna members 70a and 70b intersecting directly or A decrease in the performance of the antenna wire 70 can be prevented.

  Conventionally, when the antenna line is formed so as to form a multiple loop, there is a possibility that the antenna line may break due to the appearance of the antenna line on the card surface near the intersection where the antenna lines intersect. In order to reduce the probability of occurrence, it is necessary to increase the thickness of the surface printing sheet 72 formed on the surface of the antenna substrate 61. As a result, the thickness of the contact / non-contact type IC card 60 is increased. On the other hand, in the contact / non-contact type IC card 60 according to the present invention, the antenna members 70a and 70b formed on the antenna substrate 61 do not intersect directly, so the antenna wire 70 is connected to the card surface at the intersection. Therefore, the antenna line can be prevented from being cut.

  Below, the manufacturing method of the contact / non-contact shared type IC card 60 of the structure mentioned above is demonstrated. FIG. 5 is a schematic view for explaining a method of manufacturing the contact / non-contact shared IC card 60 of the second embodiment. When manufacturing the contact / non-contact type IC card 60, first, a copper foil or an aluminum foil is attached to one side of the insulating antenna substrate 61, and the surface on which the copper foil or the aluminum foil is attached is etched, respectively. Has an open portion at a part of the loop, and forms two antenna members 70a and 70b that do not cross each other.

  More specifically, a copper foil or an aluminum foil is attached to one surface of the antenna substrate 61 made of an insulating material such as a polyester film, a polyimide film, a PET material, or a PET-G material. Further, the antenna member 70a, 70b having two loops is formed by etching the surface of the antenna substrate 61 to which the copper foil or the aluminum foil is attached, and the first antenna substrate is formed at one end of the inner antenna member 70a. The terminal 63a, the fourth antenna substrate terminal 63d at the other end, the second antenna substrate terminal 63b at one end of the outer antenna member 70b, and the third antenna substrate terminal 63c at the other end are formed.

  Next, the surface printing sheet 72 is laminated on the surface of the antenna substrate 61 where the antenna line 70 is formed, and the back surface printing sheet 71 is laminated on the surface opposite to the surface of the antenna substrate 61 where the antenna line 70 is formed. It is sandwiched from both sides and laminated to form a card state. At that time, temperature and pressure are applied to the antenna substrate 61 from both sides to melt the front surface print sheet 72, the back surface print sheet 71, and the antenna substrate 61, and the front surface print sheet 72 and the back surface print sheet 71 are attached to the antenna substrate 61. Adhere. Further, by reducing the temperature to room temperature while adjusting the pressure in this state, the contact / non-contact type IC card 60 shown in FIG. 5A is manufactured.

  In addition, when each of the front surface printed sheet 72 and the back surface printed sheet 71 includes the antenna substrate 61 and is configured by a PET-G material, a PC material, and a PVC material, heat and It is possible to laminate by applying pressure, thereby forming a thin card shape. Further, when the antenna substrate 61, the front surface printing sheet 72, and the back surface printing sheet 71 are laminated with a material other than the PET-G material such as polyimide or PET material that is not bonded to each other in a molten state, the antenna substrate 61 and the surface printing material are printed. By inserting an adhesive between the sheet 72, the antenna substrate 61, and the back printed sheet 71, a card shape can be formed.

  On the other hand, the first module antenna pad 67a, the second module antenna pad 67b, and the two antenna members 70a electrically connected to the input / output pads 64a and 64b of the IC chip 64 to be mounted on the insulating module substrate 66. , 70b are formed, and a third module antenna pad 67c and a fourth module antenna pad 67d are formed, and an IC chip 64 and peripheral components of the IC chip 64 are further mounted to produce an IC module 65.

  Here, a method of manufacturing the IC module 65 by mounting the IC chip 64 on the module substrate 66 by the flip chip method will be described. First, peripheral components of the IC chip 64 are mounted on the module substrate 66 having a thickness of 70 μm by soldering. Next, a reinforcing plate 76 having a thickness of 50 μm is attached to the back surface of the input / output pads 64a and 64b of the IC chip 64 having a thickness of 50 μm, and the height is set to the input / output pads 64a and 64b of the IC chip 64. 20 μm gold bumps 74a and 74b are respectively formed. Further, an IC chip in which an anisotropic conductive sheet and a non-contact film are temporarily bonded to the mounting portion of the IC chip 64 of the module substrate 66 manufactured as described above, and gold bumps 74a and 74b are formed on the module substrate 66. Apply temperature and pressure to 64 and flip chip bond.

  At this time, a thin contact / non-contact common type having a thickness of about 180 to 200 μm including the thickness of the module substrate 66 itself by applying a pressure such that the gold bumps 74a and 74b of the IC chip 64 are crushed by 2 to 10 μm. An IC module 65 for the IC card 60 can be manufactured. Further, peripheral components of the IC chip 64 are mounted on the module substrate 66 by soldering, and the IC chip 64 and peripheral components mounted on the module substrate 66 are sealed with the resin portion 73.

  Next, as shown in FIG. 5A, a recess 60a for fitting the IC module 65 manufactured as described above into the contact / non-contact type IC card 60 formed in a card shape is countersunk. The first antenna board terminal 63a, the second antenna board terminal 63b, the third antenna board terminal 63c, and the fourth antenna board terminal 63d formed on the antenna board 61 are exposed (FIG. 5B). reference). At this time, in order to sufficiently expose the respective antenna substrate terminals 63a, 63b, 63c, and 63d, for example, when the thickness of the copper foil of the antenna substrate terminals 63a, 63b, 63c, and 63d is 180 μm, it is cut by 10 to 100 μm. Mill like so.

  Since the antenna substrate terminals 63a, 63b, 63c, 63d of the copper foil that have been shaved oxidize with the passage of time, the conductive connecting member within 10 hours after shaving if left in a normal room. 68a, 68b, 68c, 68d are applied to connect the module antenna pads 67a, 67b, 67c, 67d of the IC module 65, or they are oxidized into the copper foil antenna substrate terminals 63a, 63b, 63c, 63d exposed by shaving. It is necessary to suppress the oxidation of the copper foil by applying an inhibitor, and to reduce the decrease in connection reliability due to the influence of the oxide film.

  Therefore, as described above, each of the first antenna substrate terminal 63a, the second antenna substrate terminal 63b, the third antenna substrate terminal 63c, and the fourth antenna substrate terminal 63d on the antenna substrate 61 that is exposed while forming the recess 60a. A module bottom adhesive 77 and a module adhesive for applying conductive connecting members 68a, 68b, 68c, 68d made of solder paste, Ag paste, etc. to the IC module 65 at appropriate locations on the bottom of the recess 60a. Agent 78 is applied.

  Furthermore, the first module antenna pad 67a, the second module antenna pad 67b, the third module antenna pad 67c, and the fourth module antenna pad 67d of the IC module 65 are opposed to the conductive connection members 68a, 68b, 68c, and 68d, respectively. Then, heat and pressure are applied from both sides to soften the conductive connection members 68a, 68b, 68c and 68d. As shown in FIG. 5C, the IC module 65 is arranged so that the surface on which the IC chip 64 is mounted faces the antenna substrate 61, and the resin portion 73 is formed in the recess 60 a formed in the antenna substrate 61. It is mounted on the antenna substrate 61 so as to be fitted.

  Accordingly, the first module antenna pad 67a, the second module antenna pad 67b, the third module antenna pad 67c, and the fourth module antenna pad of the IC module 65 on which the IC chip 64, which is a semiconductor integrated circuit device for an IC card, is mounted. Each of 67d is connected to the first antenna substrate terminal 63a, the second antenna substrate terminal 63b, the third antenna substrate terminal 63c, and the fourth antenna substrate terminal 63d formed on the antenna substrate 61 as described above. , 8b, 8c, 8d can be connected to each other.

  At this time, the fourth module antenna pad 67d and the third module antenna pad 67c for connecting the inner antenna member 70a and the outer antenna member 70b are connected by a relay wiring portion 62a formed on the module substrate 66. Thus, not only the two antenna members 70a and 70b do not directly intersect, but also the second antenna substrate terminal 63b provided at one end of the outer antenna member 70b can be disposed in the vicinity of the IC chip 64.

  When applying solder as the conductive connection members 68a, 68b, 68c, 68d, heat of 180 to 250 ° C. and pressure of 20 to 45 N are applied from 1.5 to 4 from the surface of the IC module 65 mounted on the antenna substrate 61. Since it is applied for 2 seconds, the module antenna pads 67a, 67b, 67c, and 67c of the IC module 65 are more than the case where the conductive connection members 68a, 68b, 68c, and 68d are applied to the antenna substrate terminals 63a, 63b, 63c, and 63d of the antenna substrate 61. When the conductive connecting members 68a, 68b, 68c, and 68d are applied to 67d, the solder is easily melted, and the softening point is 60 to 80 ° C., which reduces damage due to heat applied to the card base having low heat resistance. be able to.

  On the other hand, when Ag paste is applied as the conductive connection members 68a, 68b, 68c, and 68d, the exposed portions of the antenna board terminals 63a, 63b, 63c, and 63d exposed by the countersink processing have a concave shape. By applying the conductive connection members 68a, 68b, 68c, and 68d to the shape portions, the conductive connection members 68a, 68b, 68c, and 68d are difficult to flow in addition to the connection portions with the antenna substrate terminals 63a, 63b, 63c, and 63d. can do. Therefore, it is not intended to completely soften the conductive connection members 68a, 68b, 68c, and 68d. Therefore, heat of 130 to 250 ° C. and pressure of 20 to 45 N are applied from the surface of the IC module 65 mounted on the antenna substrate 61. It may be added for 1.5 to 8 seconds, and it is easier to manufacture by applying the conductive connection members 68a, 68b, 68c, and 68d to the antenna substrate terminals 63a, 63b, 63c, and 63d.

  The contact / non-contact type IC card 60 manufactured as described above can use an inexpensive antenna substrate 61 in which a two-turn antenna line 70 that does not directly intersect is patterned on one surface, so that an inexpensive contact can be used. A non-contact shared IC card 60 can be realized. Further, since the IC module 65 obtained by modularizing the IC chip 64 is mounted on the antenna substrate 61, it is possible to realize a highly reliable contact / non-contact type IC card 60 in which physical strength and environmental resistance are ensured. it can. Furthermore, when the IC module 65 is mounted on the antenna substrate 61, the respective terminals can be connected via the conductive connection members 68a, 68b, 68c, 68d such as solder and Ag paste, which are existing technologies. . In the contact / non-contact type IC card 60 according to the present invention, each constituent member is a sheet material, and a manufacturing process in a high temperature state used in a normal semiconductor process cannot be used. As the conductive connecting members 68a, 68b, 68c, 68d, it is desirable to use a low-temperature solder that melts at a low temperature.

  By the way, an IC module manufactured by a conventional wire bonding method needs to be configured by a member having relatively high rigidity because there is a possibility that a wire connecting the IC chip and the module substrate may be cut. In addition, when a rigid IC module manufactured in this way is mounted inside a flexible card, the module part inside the card becomes a bent part, and when the card is bent, the elongation rate on the outermost surface side of the card is There was a risk that the card itself would be damaged.

  On the other hand, as shown in the first and second embodiments, when the IC chips 4 and 64 are mounted on the module substrates 6 and 66 by the processing according to the flip chip bonding method, the IC modules 5 and 65 are manufactured. Thin and flexible IC modules 5 and 65 can be manufactured. Therefore, the flexible contactless IC card 10 and the contact / contactless shared IC card 60 in which the flexible IC modules 5 and 65 are mounted follow the IC cards 10 and 60 even when bent. Since the IC modules 5 and 65 are smoothly curved and the elongation rate on the outermost surface side of the IC cards 10 and 60 is small, there is no fear of breakage and the contactless IC card 10 is highly reliable and can be contacted / contactlessly shared. The type IC card 60 can be realized.

  In the first and second embodiments described above, the second module antenna pads 7b and 67b are disposed on the back side of the wiring surface of the relay wiring portions 2a and 62a, but directly intersect the relay wiring portion 2a. The relay wiring portions 2a and 62a may be bypassed on the same surface.

1 is a schematic plan view of a non-contact type IC card according to Embodiment 1. FIG. It is typical sectional drawing by the II-II line of FIG. 6 is a schematic plan view of a contact / non-contact shared IC card according to Embodiment 2. FIG. It is typical sectional drawing by the IV-IV line of FIG. It is a schematic diagram for demonstrating the manufacturing method of a contact / non-contact shared type IC card. It is a schematic plan view of a conventional non-contact type IC card. It is typical sectional drawing by the VII-VII line of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Antenna substrate 2 Antenna wire 2a Relay wiring part 3a 1st antenna substrate terminal (1st antenna terminal)
3b Second antenna substrate terminal (second antenna terminal)
3c Third antenna board terminal (first relay terminal)
3d Fourth antenna board terminal (second relay terminal)
4 IC chip 4a, 4b Input / output pad 5 IC module 6 Module substrate 7a First module antenna pad (first module terminal)
7b Second module antenna pad (second module terminal)
7c Third module antenna pad (third module terminal)
7d 4th module antenna pad (4th module terminal)
8a, 8b, 8c, 8d Conductive connecting member 10 Non-contact type IC card 11 Back side printed sheet 12 Intermediate sheet 13 Resin part 14a, 14b Gold bump 15 Module back side wiring board 16 Reinforcing plate

Claims (6)

In an IC card comprising an antenna substrate on which antenna lines forming multiple loops are formed, and a module substrate on which an IC chip for processing signals transmitted and received via the antenna wires is mounted.
Each of the antenna lines is divided into a plurality of antenna members each having an open portion at a part of the loop and not intersecting each other,
The antenna substrate is
A first antenna terminal provided at one end of the innermost antenna member;
A first relay terminal provided at one end of the antenna member excluding the innermost side;
A second antenna terminal provided at the other end of the outermost antenna member;
A second relay terminal provided at the other end of the antenna member excluding the outermost side,
The module substrate has a lower surface,
A first module terminal connected to the first antenna terminal ;
A third module terminal connected before Symbol first relay terminal,
A fourth module terminal connected to the second relay terminal;
The third module terminal connected to the first relay terminal of the outer antenna member of the two adjacent antenna members and the second relay terminal of the inner antenna member of the two adjacent antenna members A relay wiring part for connecting between the fourth module terminals to be connected ,
The module substrate has an upper surface,
Second module terminal connected to the second antenna terminal
IC card characterized in that it comprises. The antenna substrate has a recess into which an IC chip mounted on the module substrate is fitted,
The module substrate has the IC chip fitted in the recess, and the first module terminal, the second module terminal, the third module terminal, and the fourth module terminal are connected to the first antenna terminal, the second antenna terminal, the second antenna terminal, 2. The IC card according to claim 1, wherein the IC card is mounted on the antenna substrate so as to oppose each of the first relay terminal and the second relay terminal.   The first module terminal and the first antenna terminal, the second module terminal and the second antenna terminal, the third module terminal and the first relay terminal, the fourth module terminal and the second relay terminal are electrically connected. The IC card according to claim 1, wherein the IC card is connected via a member.   The IC card according to any one of claims 1 to 3, wherein the IC chip is mounted on the module substrate by a flip chip bonding method. In a method of manufacturing an IC card comprising an antenna substrate on which antenna lines forming multiple loops are formed and a module substrate on which an IC chip for processing signals transmitted and received via the antenna wires is mounted.
A first step of forming a recess into which the IC chip mounted on the module substrate is fitted in the antenna substrate;
The antenna substrate has an open part at a part of the loop, and is divided into a plurality of antenna members that do not cross each other, a first antenna terminal provided at one end of the innermost antenna member, A first relay terminal provided at one end of the antenna member excluding the innermost side, a second antenna terminal provided at the other end of the outermost antenna member, and provided at the other end of the antenna member excluding the outermost side. A second step of forming a second relay terminal;
Wherein the lower surface of the module substrate, wherein the first module terminal first connected to the antenna terminal, before Symbol third module terminal coupled to the first relay terminal, a fourth module terminal connected to the second relay terminal, And the second relay terminal of the inner antenna member of the two antenna members adjacent to the third module terminal connected to the first relay terminal of the outer antenna member of the two adjacent antenna members. Forming a relay wiring portion that connects the fourth module terminal to be connected, and forming a second module terminal connected to the second antenna terminal on an upper surface of the module substrate ;
A fourth step of mounting the IC chip on the module substrate on which the first module terminal, the second module terminal, the third module terminal, the fourth module terminal, and the relay wiring portion are formed;
An IC chip mounted on the module substrate is fitted into a recess formed in the antenna substrate, the first module terminal is the first antenna terminal, the second module terminal is the second antenna terminal, And a fifth step of connecting a third module terminal to the first relay terminal and a fourth module terminal to the second relay terminal, respectively.   6. The IC card manufacturing method according to claim 5, wherein the IC chip is mounted on the module substrate by a flip chip bonding method.

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