JP2007193598A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card for mounting a larger number of antenna lines so as to transmit and receive non-contact data between various kinds of external devices and hardly destroying the antenna lines and an IC chip even when external force caused by bending or pressing force is applied. <P>SOLUTION: An antenna substrate 1 and module substrate 11 are arranged opposite to each other so that module antenna pads 12a, 12b, 12c, and 12d projected on the module substrate 11 mounting the IC chip 15 are provided over the antenna lines 2 and 3 formed by winding without crossing on the antenna substrate 1, and antenna terminals 4a, 4b, 4c, and 4d and the module antenna pads 12a, 12b, 12c, and 12d arranged at end sections of the antenna lines 2 and 3 are respectively connected. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC card such as a non-contact type IC card or a contact / non-contact common type IC card that can perform non-contact communication using electromagnetic waves.

  An IC card mounted with an IC chip made of a semiconductor element has advantages such as a large amount of data that can be stored and a high-level security function, compared to a conventionally used magnetic card. It is rapidly spreading. The IC card is equipped with a mechanical connection terminal, contacts the connection terminal provided in the external device, contact type IC card that transmits and receives data, and contact with the external device without the connection terminal There is also a non-contact type IC card that transmits and receives data by wireless communication. In addition, there is a contact / non-contact IC card having both functions.

  An IC card that can send and receive data without contact performs data transmission and reception using an electromagnetic wave with an external device, and includes an antenna for transmitting and receiving electromagnetic waves inside. The antenna is formed by attaching an aluminum foil to one surface of a card substrate made of, for example, a polyester film or polyimide film having a thickness of several millimeters or less, and etching it. It is formed by turning. Both ends of the antenna wound in a multiple manner are connected to the connection terminals of the IC chip so that a transmission / reception circuit in the IC chip can transmit and receive data using the antenna.

  In Patent Document 1, a circuit pattern including an antenna coil pattern is formed on a substrate sheet, an IC chip is mounted on the substrate sheet so as to be connected to the circuit pattern, and a cover sheet is stacked on the substrate sheet for lamination. A non-contact IC that prevents the IC chip from sinking into the substrate sheet during lamination by forming a backup pattern that does not contact the circuit pattern with a conductive paste in the mounting range of the substrate sheet when carded A card manufacturing method has been proposed. In this non-contact IC card, the terminal of the IC chip is connected to the inner end of the coil coil pattern wound in multiple layers, and the IC chip is connected to the outer end of the antenna coil pattern via a jumper wire. The terminal is connected.

  In Patent Document 2, when a winding coil is formed by winding a resin-coated copper wire on a resin inlet sheet and both ends of the winding coil are connected to an IC module, There has been proposed a non-contact type IC card provided with a buffer portion for buffering tension generated near the connection portion between the winding coil and the IC module by forming the vicinity of the end portion of the wire coil in a wave shape. For example, when a thermal expansion difference occurs between the inlet sheet and the winding coil due to a temperature change, the non-contact type IC card is reliable because the tension generated by the thermal expansion difference is buffered by the buffer portion. Can be improved.

In Patent Document 3, an antenna coil is formed on a substrate by etching, and a non-contact IC card configured to connect IC chip connection bumps to connection terminals at both ends of the antenna coil across the antenna coil, and A method of manufacturing this non-contact type IC card has been proposed. Since this non-contact type IC card does not need to cross antenna coils, it is not necessary to use a jumper wire, and it can be manufactured at low cost and can improve reliability.
JP 2000-200332 A JP 2002-74298 A Japanese Patent No. 2814477

  In the IC cards according to Patent Document 1 and Patent Document 2, since it is necessary to connect both ends of the wound antenna coil and the connection terminal of the IC chip, it is necessary to provide a portion that intersects the coil. In order to prevent this crossing portion from being short-circuited, for example, a coil can be formed using a wiring with an insulating coating, but the wiring with an insulating coating must be removed from both ends in order to connect to the IC chip. Therefore, there is a problem that the manufacturing cost increases, and since the thickness of the intersection portion increases, the thickness of the IC card may increase, and there is a possibility that the IC card may be broken due to use or bending. There's a problem.

  In addition, when an antenna coil is formed on a substrate by etching, a jumper wire is used at the crossing portion of the coil, or a pattern of the crossing portion is formed on the opposite surface of the substrate so that the front and back surfaces of the substrate are through holes. It is possible to realize the intersecting portion by a method such as connecting with each other. However, when using a jumper wire, there is a problem similar to that when using the wiring with the insulating film described above. When a pattern of an intersection is formed on the back surface of the substrate, the through hole portion formed on the substrate Since the strength is lowered, there is a problem that the reliability of the IC card is lowered, and there is a problem that the manufacturing cost is increased.

  In the IC card according to Patent Document 3, since the antenna coil has no intersection, the above-described problem does not occur. However, since the connection bumps of the IC chip straddle the antenna coil, there is a problem that the number of antenna coil wirings that can be straddled is limited by the size of the IC chip. For this reason, in order to provide an antenna coil with a large number of turns, it is necessary to enlarge the IC chip or to make the wiring of the antenna coil thin only at the portion where the connection bumps of the IC chip straddle. When the IC chip is enlarged, there is a problem that the possibility that the IC chip is destroyed by an external force such as bending, twisting or pressing applied to the IC card is increased. Further, when the wiring of the antenna coil is made thin only at the portion where the connection bumps of the IC chip straddle, there is a problem that the wiring at this portion is likely to break and the antenna characteristics are deteriorated.

  In recent years, the technology of IC cards has come to be used in a wide range. Accordingly, the IC card does not transmit / receive data to / from only one type of external device, but a plurality of types of external devices. To send and receive data. The contact / non-contact type IC card can transmit and receive data between two types of external devices, that is, an external device that performs communication via a contact terminal and an external device that performs wireless communication. The IC card is preferably capable of non-contact communication with a plurality of types of external devices for the convenience of the user. When communicating with a plurality of types of external devices in a non-contact manner, the IC card needs to be equipped with a plurality of antennas corresponding to each frequency if the wireless frequencies used for communication by the external devices are greatly different. is there.

  When a plurality of antenna coils are provided in the same configuration as that of the IC card described in Patent Document 1 or Patent Document 2, at least as many intersections as the number of antenna coils provided in the IC card are required. Depending on the arrangement of the antenna coil, more crossing portions are required, which increases the possibility that the crossing portions are broken due to the use and bending of the IC card, and the reliability of the IC card is lowered.

  Further, when a plurality of antenna coils are provided with the same configuration as that of the IC card described in Patent Document 3, the number of wirings of the antenna coil that the connection bumps of the IC chip straddle increases, so that the IC chip is made larger. Or, it is necessary to make the wiring of the antenna coil in the portion where the connection bump of the IC chip straddles more narrowly. If the IC chip is made larger, there is a higher possibility that the IC chip will be destroyed, and if the wiring of the antenna coil in the part where the IC chip connection bumps stride is made thin, the wiring may be disconnected. There is a problem that the sex becomes higher.

  The present invention has been made in view of such circumstances, and an object of the present invention is to form a module in which a plurality of antenna wires are wound on an antenna substrate without intersecting, and an IC chip is mounted. A configuration in which a plurality of module terminals are provided so as to protrude on one surface of the board, the antenna board and the module board are arranged to face each other, and the antenna terminal and the module terminal of the antenna line are connected so as to straddle the antenna line between the module terminals. Accordingly, it is an object of the present invention to provide an IC card that can mount more antennas and that does not cause destruction of an IC chip, an antenna wire, or the like due to use, bending, or the like.

  Another object of the present invention is to transmit data in a non-contact manner with more types of external devices by installing a plurality of antenna lines and transmitting or receiving signals of different frequencies. Another object is to provide an IC card that can perform reception.

  Another object of the present invention is to increase the performance of wireless data transmission or reception by winding the antenna wire for one turn or more, and winding the antenna wire for one turn or more. Even in such a case, an IC card is provided in which no intersection is formed.

  Another object of the present invention is to provide a plurality of antenna wires in a limited arrangement area by providing a configuration in which another antenna wire is wound inside one wound antenna wire. An object of the present invention is to provide an IC card that can be arranged efficiently.

  Another object of the present invention is to provide an IC chip on the surface of the module substrate facing the antenna substrate, to form a recess in the antenna substrate, and to provide a recess in the module substrate facing the antenna substrate. It is an object of the present invention to provide an IC card that can be made thinner by accommodating an IC chip.

  Another object of the present invention is to connect the antenna terminal formed on the antenna substrate and the module terminal provided on the module substrate with a conductive adhesive, so that the antenna terminal and the module terminal are connected. It is to provide an IC card that can be easily connected.

  Another object of the present invention is to connect the IC chip to the module substrate by processing according to the flip chip bonding method, compared with the case where the IC chip is connected to the module substrate by wire bonding. An object of the present invention is to provide an IC card that can be more firmly connected.

  Another object of the present invention is to provide an IC card that can prevent the IC chip from being destroyed by providing a reinforcing plate that reinforces the surface opposite to the surface connected to the module substrate of the IC chip. Is to provide.

  Another object of the present invention is to provide a contact terminal for transmitting or receiving data in contact with an external device on the surface opposite to the surface of the module substrate facing the antenna substrate. Another object of the present invention is to provide an IC card capable of transmitting or receiving data by both contact and non-contact methods.

  An IC card according to the present invention is provided with an antenna substrate on which a wound antenna wire is disposed, and an IC chip for processing a signal transmitted or received via the antenna wire, and is disposed opposite to the antenna substrate. In an IC card comprising a module board, a plurality of the antenna lines are provided, and the plurality of antenna lines do not intersect each other, and the plurality of antenna lines do not intersect each other. The antenna board has a plurality of antenna terminals respectively provided at both ends of the antenna line, the module board protrudes from one surface of the module board, and the plurality of antenna terminals. Having a plurality of module terminals connected to each other, and straddling one or more antenna wires between the plurality of module terminals. Wherein the module substrate are disposed opposite to the antenna substrate.

  In the present invention, the antenna substrate and the module substrate are arranged to face each other so that a plurality of module terminals projecting from the module substrate straddle a plurality of antenna wires formed without winding on the antenna substrate. Then, the antenna terminal and the module terminal at both ends of the antenna line are connected. Since the antenna lines do not intersect, the strength of the antenna lines is increased. Also, when the number of antenna wires straddling between module terminals is large, the number of antenna wires can be increased without increasing the size of the IC chip by enlarging the module substrate and widening the interval between the module terminals. .

  In addition, the IC card according to the present invention is characterized in that the plurality of antenna lines respectively transmit or receive signals having different frequencies.

  In the present invention, the plurality of antenna lines provided on the antenna substrate are used for transmitting or receiving signals having different frequencies. The IC card can transmit or receive data without contact with more types of external devices.

  The IC card according to the present invention is characterized in that the antenna wire is wound for one turn or more.

  In the present invention, the antenna wire provided on the antenna substrate is formed to be wound for one turn or more. Even when the antenna wire is wound for one turn or more, the antenna wires do not cross each other, so that the strength of the antenna wire is not lowered, and the number of turns of the antenna wire is increased, so that the performance of data transmission or reception is improved.

  The IC card according to the present invention is characterized in that the antenna wire is wound around another antenna wire inside the one antenna wire.

  In the present invention, a plurality of antenna lines are provided by winding another antenna line inside the wound one antenna line. A plurality of antenna lines can be arranged efficiently in a limited area of the IC card. Further, since both end portions of each of the plurality of antenna lines can be arranged close to each other, the module substrate having module terminals connected to the antenna terminals at both ends of the antenna line can be reduced in size.

  The IC card according to the present invention is characterized in that the IC chip is disposed on a surface of the module substrate facing the antenna substrate, and the antenna substrate has a recess for accommodating the IC chip. And

  In the present invention, an IC chip is disposed on a surface of the module substrate facing the antenna substrate, a recess is formed in the antenna substrate, and the module substrate is disposed opposite to the antenna substrate so that the IC chip is accommodated in the recess. Connect the module terminal to the antenna terminal. Even when the amount of protrusion of the IC chip from the module substrate is larger than the amount of protrusion of the module terminal, the module substrate and the antenna substrate can be arranged to face each other, and the IC card can be thinned.

  The IC card according to the present invention is characterized in that the antenna terminal and the module terminal are connected via a conductive adhesive.

  In the present invention, the antenna terminals at both ends of the antenna line and the module terminals of the module substrate are connected by a conductive adhesive. For example, as compared with the connection by wire bonding, the connection can be easily performed and the connection strength can be increased.

  The IC card according to the present invention is characterized in that the IC chip is connected to the module substrate by a flip chip bonding method.

  In the present invention, the IC chip is connected to the module substrate by a process according to the flip chip bonding method. For example, as compared with the connection by wire bonding, the connection can be easily performed and the connection strength can be increased.

  The IC card according to the present invention is characterized in that the IC chip has a plate shape, one side is connected to the module substrate, and a reinforcing plate is provided to reinforce the other side of the IC chip.

  In the present invention, a reinforcing plate for reinforcing the surface opposite to the surface connected to the module substrate of the IC chip is provided. When stress due to bending is applied to the IC card, it is difficult to apply stress to the IC chip, and the IC chip can be prevented from being broken.

  Further, in the IC card according to the present invention, the module substrate has a contact terminal that contacts an external device on the surface opposite to the surface facing the antenna substrate, and transmits or receives a signal to / from the external device. Is provided.

  In the present invention, a contact terminal for transmitting or receiving data in contact with an external device is provided on the surface of the module substrate opposite to the surface facing the antenna substrate. Data can be transmitted or received using a contact terminal with an external device that cannot wirelessly transmit or receive data.

  In the case of the present invention, a plurality of antenna wires are wound and formed on the antenna substrate without intersecting, and a plurality of module terminals are provided so as to protrude on one surface of the module substrate on which the IC chip is mounted. When there is a large number of wirings of antenna lines straddling between module terminals by arranging the board facing each other and connecting the antenna terminals of the antenna lines and the module terminals so that the antenna lines straddle between the module terminals Since the number of antenna wires can be increased without increasing the size of the IC chip by enlarging the module substrate and increasing the spacing between the module terminals, more antennas can be obtained without reducing the strength of the IC chip. Lines can be provided. Further, since the antenna lines do not intersect, the strength of the antenna lines is increased. Therefore, an IC card with high convenience and high reliability can be realized.

  Further, according to the present invention, the IC card is configured to transmit or receive signals of different frequencies by mounting a plurality of antenna lines, so that the IC card can transmit or receive data without contact with more types of external devices. Therefore, the convenience of the IC card can be improved.

  Further, in the case of the present invention, since the antenna wire can be wound for one turn or more to improve the performance of transmission or reception by the antenna wire, data transmission or reception with an external device is possible. It can be done reliably. Further, even when the antenna wire is wound for one turn or more, since the intersection portion is not formed, the number of turns of the antenna wire can be increased without reducing the strength of the antenna wire. Therefore, a highly convenient IC card can be realized.

  Further, according to the present invention, a plurality of antenna wires can be efficiently provided within a limited area of the IC card by providing a configuration in which another antenna wire is wound inside the wound one antenna wire. Therefore, the performance of transmission or reception by an antenna line can be improved. Therefore, the convenience of the IC card can be improved. Further, since both end portions of each of the plurality of antenna lines can be arranged close to each other, the module substrate having module terminals connected to the antenna terminals at both ends of the antenna line can be reduced in size. Therefore, the IC card can be reduced in size or thickness.

  Also, according to the present invention, an IC chip is disposed on the surface of the module substrate facing the antenna substrate, a recess is formed in the antenna substrate, and the module substrate is disposed facing the antenna substrate so that the IC chip is accommodated in the recess. Then, by configuring the module terminal and the antenna terminal to be connected, the IC chip protruding from the module substrate can be accommodated in the recess, so that the distance between the antenna substrate and the module substrate can be shortened and the IC card can be thinned. . Therefore, the convenience of the IC card can be improved.

  In the case of the present invention, the antenna line and the module terminal are connected by connecting the antenna terminal of the antenna line formed on the antenna board and the module terminal provided on the module board with a conductive adhesive. Since the connection can be performed easily, the IC card manufacturing process can be simplified. In addition, since the connection strength between the antenna line and the module terminal can be increased, the reliability of the IC card can be increased.

  Further, in the case of the present invention, since the IC chip is connected to the module substrate by processing according to the flip chip bonding method, the IC chip and the module substrate can be easily connected. The manufacturing process can be simplified. Further, since the connection strength between the IC chip and the module substrate can be increased, the reliability of the IC card can be increased.

  Further, according to the present invention, the IC chip is provided with a reinforcing plate that reinforces the surface opposite to the surface connected to the module substrate of the IC chip, so that stress is applied to the IC chip when bending stress is applied to the IC card. Since the IC chip can be prevented from being broken and the IC chip can be prevented from being broken, the reliability of the IC card can be improved.

  Further, in the case of the present invention, wireless data is provided by providing a contact terminal for transmitting or receiving data in contact with an external device on the surface opposite to the surface of the module substrate facing the antenna substrate. Can be transmitted or received, and data can be transmitted or received using contact terminals with external devices that cannot transmit or receive data wirelessly. Convenience can be improved.

(Embodiment 1)
Hereinafter, the present invention will be specifically described with reference to the drawings showing embodiments thereof. FIG. 1 is a schematic plan view showing the configuration of an IC card according to Embodiment 1 of the present invention, and FIG. 2 is a schematic cross-sectional view taken along the line II-II in FIG. In FIG. 1, illustration of a surface sheet 35 to be described later that covers the surface of the IC card is omitted, and the internal configuration of the IC card is illustrated. In the figure, reference numeral 1 denotes an antenna substrate having a substantially rectangular plate shape. The antenna substrate 1 is, for example, a polyester film, a polyimide film, PET (polyethylene terephthalate), PETG (polyethylene terephthalate copolymer). )), PVC (Polyvinyl Chloride) or PC (PolyCarbonate)) or the like.

  On one surface of the antenna substrate 1, along the outer edge of the antenna substrate 1, the antenna wire 2 wound about 2 turns is wound, and the inside of the wound antenna wire 2 is wound about 3 turns. The antenna wire 3 is disposed. An antenna terminal 4a is provided at the outer end of the wound antenna wire 2, and an antenna terminal 4b is provided at the inner end. An antenna terminal 4d is provided at the outer end of the wound antenna wire 3, and an antenna terminal 4c is provided at the inner end. These antenna wires 2 and 3 and antenna terminals 4a, 4b, 4c and 4d are formed by attaching a metal foil such as a copper foil or an aluminum foil to one surface of the antenna substrate 1 and etching the metal foil.

  The IC card according to the present invention can transmit and receive data to and from a plurality of types of external devices having different radio wave frequencies used for communication. The antenna line 2 and the antenna line 3 receive radio waves having different frequencies. Used to do. A transmission / reception circuit that performs transmission / reception using the antenna line 2 and the antenna line 3, a memory that stores data, and a circuit such as a CPU that performs calculation are provided in the IC chip 15, and the IC chip 15 is disposed facing the antenna substrate 1. The IC module 10 is mounted. FIG. 3 is a schematic cross-sectional view showing the configuration of the IC module 10 of the IC card according to Embodiment 1 of the present invention, and FIG. 4 is a schematic plan view thereof.

  The IC module 10 includes a module substrate 11 that is disposed opposite to the antenna substrate 1 and has a substantially circular plate shape. The IC module 10 is connected to the antenna terminals 4a, 4b, 4c, and 4d of the antenna substrate 1 on one surface of the module substrate 11. Module antenna pads 12a, 12b, 12c, 12d and the above-described IC chip 15 are disposed. The module antenna pads 12a, 12b, 12c, and 12d are arranged so that the module substrate 11 faces the antenna terminals 4a, 4b, 4c, and 4d of the antenna substrate 1 when the module substrate 11 is arranged to face the antenna substrate 1. It is arrange | positioned in the appropriate position of the peripheral side.

  Further, connection terminals 16 a, 16 b, 16 c, and 16 d that are electrically connected to the antenna line 2 and the antenna line 3 are projected from one surface of the IC chip 15 having a substantially rectangular plate shape, and the module substrate 11. The module chip pads 13a, 13b, 13c, 13d connected to the connection terminals 16a, 16b, 16c, 16d of the IC chip 15 on the same surface as the surface on which the module antenna pads 12a, 12b, 12c, 12d are arranged. Is provided. The module chip pads 13a, 13b, 13c, and 13d are connected to the module antenna pads 12a, 12b, 12c, and 12d by connection lines 14a, 14b, 14c, and 14d provided on the opposite surface of the module substrate 11, respectively.

  The connection terminals 16a, 16b, 16c, 16d of the IC chip 15 and the module chip pads 13a, 13b, 13c, 13d of the module substrate 11 are connected by gold bumps 18, 18,. The connection terminals 16a, 16b, 16c, and 16d are electrically connected to the module antenna pads 12a, 12b, 12c, and 12d of the module substrate 11 so that they can be electrically connected to the antenna line 2 and the antenna line 3. Further, between the IC chip 15 and the module substrate 11, a connection fixing resin portion for fixing the connection by the connection terminals 16a, 16b, 16c, 16d and the gold bumps 18, 18 ... of the module chip pads 13a, 13b, 13c, 13d. 19 is provided to improve connection reliability.

  Further, a substantially rectangular reinforcing plate 17 slightly larger than the IC chip 15 is bonded to the surface opposite to the surface of the IC chip 15 where the connection terminals 16a, 16b, 16c, and 16d are provided by using a UV adhesive tape or a thermal adhesive tape. Thus, stress such as bending or pressing is hardly applied to the IC chip 15. Further, the IC chip 15, the connection fixing resin portion 19, and the reinforcing plate 17 provided on one surface of the module substrate 11 are covered and sealed with a sealing portion 20 made of synthetic resin, and the IC chip 15 and the gold bump 18 are sealed. , 18... Are protected from destruction. Note that the sealing portion 20 is formed in a substantially columnar shape protruding on one surface of the module substrate 11.

  The antenna substrate 1 that is disposed to face the IC module 10 is formed with a recess 5 that accommodates a substantially cylindrical sealing portion 20 that protrudes from the facing surface of the module substrate 11 of the IC module 10. By accommodating the stopper 20, the antenna substrate 1 and the module substrate 11 are opposed to each other even when the IC chip 15 and the module antenna pads 12a, 12b, 12c, and 12d are provided on the same surface of the module substrate 11. The antenna terminals 4a, 4b, 4c and 4d and the module antenna pads 12a, 12b, 12c and 12d can be connected. In addition, the recessed part 5 is formed in the substantially same shape as the sealing part 20, or is formed in the shape a little larger than the sealing part 20. FIG.

  The antenna terminals 4a, 4b, 4c, and 4d of the antenna substrate 1 and the module antenna pads 12a, 12b, 12c, and 12d of the module substrate 11 are respectively connected using a conductive connection material 31 such as solder or Ag paste. As a result, the IC chip 15 is electrically connected to the antenna line 2 and the antenna line 3, and can transmit and receive signals without contact using the antenna line 2 and the antenna line 3. Further, the IC module 10 is disposed opposite to the antenna substrate 1 across the antenna line 2 and the antenna line 3 between the module antenna pads 12a, 12b, 12c, and 12d provided so as to protrude from the module substrate 11. Thus, the antenna line 2 and the antenna line 3 can be electrically connected to the IC chip 15 without providing an intersection portion between the antenna line 2 and the antenna line 3.

  Further, the antenna substrate 1 and the IC module 10 connected by the connection material 31 include a reinforcing plate 32 provided in contact with the opposite surface of the module substrate 11 facing the antenna substrate 1, and the module of the antenna substrate 1. When the IC card 15 is sandwiched between reinforcing plates 33 that are in contact with the opposite surface of the substrate 11 and an external force such as bending or pressing is applied to the IC card, the IC chip 15, the IC chip 15, and the module substrate 11 The connection portion and the connection portion of the module substrate 11 and the antenna substrate 1 are reinforced so as not to be broken. The reinforcing plates 32 and 33 have a substantially circular plate shape that is slightly larger than the module substrate 11.

  Further, the antenna substrate 1 and the IC module 10 are sandwiched and covered by a top sheet 35 and a back sheet 36 each having a substantially rectangular plate shape that is substantially the same size as the antenna substrate 1 so as not to be exposed to the outside. is there.

  FIG. 5 is a schematic diagram showing a manufacturing process of the IC module 10 of the IC card according to the first embodiment of the present invention, in which the manufacturing processes are illustrated in chronological order from (a) to (c). First, a module antenna is obtained by attaching and etching a metal foil such as an aluminum foil or a copper foil on a module substrate 11 made of polyester film, polyimide film, PET, PETG, PVC or PC having a thickness of about 60 μm to 100 μm. Pads 12a, 12b, 12c, 12d, module chip pads 13a, 13b, 13c, 13d and the like are formed. Next, a circuit component such as a chip resistor or a chip capacitor (not shown) is soldered to the module substrate 11.

  Further, a reinforcing plate 17 having a thickness of about 50 μm is applied to the IC chip 15 having a thickness of about 50 μm to 100 μm on the surface opposite to the surface on which the connection terminals 16a, 16b, 16c, and 16d are provided. Then, gold bumps 18, 18... Having a height of about 20 μm to 30 μm are formed on the connection terminals 16 a, 16 b, 16 c, 16 d of the IC chip 15.

  Next, a resin sheet that forms the connection fixing resin portion 19 is temporarily bonded to a portion of the module substrate 11 to which the IC chip 15 is connected, and the connection terminals 16 a, 16 b, 16 c, and 16 d of the IC chip 15 and the module chip of the module substrate 11 are connected. The positions of the pads 13a, 13b, 13c, and 13d are aligned, and the IC chip 15 is pressed against the module substrate 11 while heating (see FIG. 5A). At this time, pressure is applied to the IC chip 15 so that the gold bumps 18, 18... Formed on the connection terminals 16a, 16b, 16c, and 16d of the IC chip 15 are crushed by about 2 μm to 10 μm. Thereby, the connection terminals 16a, 16b, 16c, and 16d of the IC chip 15 are connected to the module chip pads 13a, 13b, 13c, and 13d of the module substrate 11 (see FIG. 5B). The method of heating and pressurizing the IC chip 15 as described above and connecting with the gold bumps 18, 18,... Is a so-called flip chip bonding method.

  Next, the IC chip 15, the reinforcing plate 17, and the connection fixing resin portion 19 are covered with a synthetic resin and sealed, and the synthetic resin is formed into a substantially cylindrical shape to form a sealing portion 20 (see FIG. 5C). . Thereby, the connection part by the IC chip 15 and the gold bumps 18, 18,... Can be protected from external stress, and the reliability of the IC card can be improved. The IC module 10 is completed through the above steps.

  6 and 7 are schematic views showing the manufacturing process of the IC card according to the first embodiment of the present invention, in which the manufacturing processes are illustrated in chronological order from (A) to (F). First, a metal foil such as a copper foil or an aluminum foil is attached to an antenna substrate 1 formed of an insulating material such as a polyester film, a polyimide film, PET, PETG, PVC, or PC, and an antenna wire is etched by etching the metal foil. 2 and 3 and antenna terminals 4a, 4b, 4c, 4d, etc. are formed (see FIG. 6A).

  Next, the concave portion 5 that accommodates the sealing portion 20 of the IC module 10 is formed in the antenna substrate 1 (see FIG. 6B). The concave portion 5 is formed to have substantially the same size as the sealing portion 20 of the IC module 10 or a size having a margin of about 0.05 mm to 0.5 mm from the sealing portion 20.

  Next, Ag paste, which is a conductive adhesive, is applied as a connection material 31 to the antenna terminals 4a, 4b, 4c, and 4d of the antenna substrate 1, and the module antenna pads 12a, 12b, 12c, and 12d of the IC module 10 and the antenna substrate 1 are applied. The IC modules 10 are pressed against the antenna substrate 1 by aligning the positions of the antenna terminals 4a, 4b, 4c, and 4d (see FIG. 6C). Thereby, the sealing part 20 of the IC module 10 is accommodated in the recess 5 of the antenna substrate 1, and the module antenna pads 12a, 12b, 12c, 12d and the antenna terminals 4a, 4b, 4c, 4d are connected by the connecting material 31, The IC module 10 is disposed to face the antenna substrate 1 across the antenna line 2 and the antenna line 3 (see FIG. 6D).

  When solder is used as the connection material 31, the antenna substrate 1 and the module substrate 11 are formed of a material that melts at about 60 ° C. to 85 ° C. Therefore, it is preferable to use low-temperature solder that melts at a low temperature.

  Next, the reinforcing plate 32 is brought into contact with the opposite surface of the module substrate 11 facing the antenna substrate 1, and the reinforcing plate 33 is brought into contact with the opposite surface of the antenna substrate 1 facing the module substrate 11. The IC module 10 and the antenna substrate 1 are sandwiched between the plates 32 and 33 to be reinforced. Further, the surface of the antenna substrate 1 on which the antenna lines 2, the antenna wires 3 and the IC module 10 are arranged is covered with a top sheet 35, and the opposite surface is covered with a back sheet 36. The IC module 10 is sandwiched (see FIG. 7E).

  Thereafter, the top sheet 35 and the back sheet 36 are heated and pressed to laminate, and the antenna substrate 1 and the top sheet 35 and the back sheet 36 are integrated into a card to complete an IC card (FIG. 7 ( F)). At this time, it is preferable to make the card so that the thickness of the IC card is uniform. When the antenna substrate 1 and the top sheet 35 and the back sheet 36 are formed of the same material such as PETG, PVC, or PC, respectively, the top sheet 35 and the back sheet 36 are heated and pressed to be laminated. However, the antenna substrate 1 and the top sheet 35 and the back sheet 36 are formed of different materials and heated so that they do not bond to each other when they are melted. In this case, the antenna substrate 1 and the front sheet 35 and the antenna substrate 1 and the back sheet 36 may be bonded with an adhesive interposed therebetween to form a card.

  In the IC card having the above configuration, the module antenna pads 12a, 12b, 12c, and 12d are provided so as to protrude from the module substrate 11 of the IC module 10, and the antenna substrate 1 is interposed between the module antenna pads 12a, 12b, 12c, and 12d. The IC module 10 and the antenna substrate 1 are arranged to face each other so as to straddle the antenna line 2 and the antenna line 3 formed on the antenna module 12, the module antenna pads 12 a, 12 b, 12 c and 12 d of the IC module 10 and the antenna terminal of the antenna substrate 1. By connecting 4a, 4b, 4c, and 4d, the IC chip 15 can be electrically connected to the antenna line 2 and the antenna line 3 without providing a crossing portion in the antenna line 2 and the antenna line 3. . Also, even when the number of antenna wires or the number of turns of antenna wires is increased, the module substrate is enlarged accordingly to increase the spacing between the module antenna pads, and more antenna wires are straddled between the module antenna pads. Therefore, it is not necessary to enlarge the IC chip.

  By transmitting or receiving signals having different frequencies by using the plurality of antenna lines thus provided, the IC card can transmit or receive data with more types of external devices. Become. Further, by forming the recess 5 for accommodating the sealing portion 20 of the IC module 10 in the antenna substrate 1, the module antenna pads 12a, 12b, 12c, 12d connected to the antenna line 2 and the antenna line 3 and the IC chip 15 are provided. Can be arranged on the same surface of the module substrate 11, and the IC card can be thinned. Further, the strength of the IC card can be increased by the reinforcing plate 17 attached to the IC chip 15 and the reinforcing plates 32 and 33 provided so as to sandwich the IC module 10 and the antenna substrate 1. Can be increased.

  The IC card according to the present invention is, for example, an employee card, student card, bank card, credit card, commuter pass, boarding ticket, book card, hospital card, basic resident register card, national civil service card, local government card, home security Card, PC Security Card, Membership Club Card, Personal PO Box Card, Airport Card, Citizen Card, Immigration Card, Electronic Passport, Shopping Point Card, Product Warranty Card, Mail Management Card, ETC Card, Room Card It can be used for driver's license, national license, car key or mobile phone money charge card, etc., and it can send and receive data with multiple external devices with multiple antenna wires Provide one IC card with the functions of multiple cards. It can be.

  In the present embodiment, the antenna substrate 1 is provided with the two antenna lines, the antenna line 2 and the antenna line 3, but the present invention is not limited thereto, and the antenna board 1 may be configured with three or more antenna lines. Good. In addition, although the antenna wire 3 is wound around the antenna wire 2 and provided, the present invention is not limited to this, and another arrangement may be employed as long as a plurality of antenna wires do not intersect. The antenna wire 2 and the antenna wire 3 are formed by attaching a metal foil to the antenna substrate 1 and etching it. However, the present invention is not limited to this, and a metal wire such as a copper wire or an aluminum wire is wound around the antenna substrate. The antenna terminal may be formed by rotating and attaching, and in this case, a metal plate may be welded to both ends of the metal wire.

  Further, the module substrate 11 of the IC module 10 has a substantially circular shape, but is not limited thereto, and may have another shape such as a substantially rectangular shape or a substantially triangular shape. Further, although the thicknesses of the module substrate 11 and the IC chip 15 of the IC module 10 are indicated by numerical values, this is an example, and the present invention is not limited to these numerical values.

(Modification)
FIG. 8 is a schematic cross-sectional view showing the configuration of an IC card according to a modification of the first embodiment of the present invention. In the IC card shown in FIG. 2, the thickness of the surface sheet 35 is uniform and the thickness of the IC card is uniform. However, the IC card according to the modified example does not have the uniform thickness of the surface sheet 35a, and the IC module 10 is arranged. The thickness of the part that has not been made is reduced. The thickness of the IC card may not be uniform, and even in this case, the same effect as the IC card shown in FIG. 2 can be obtained.

(Embodiment 2)
FIG. 9 is a schematic plan view showing the configuration of the IC card according to Embodiment 2 of the present invention, and FIG. 10 is a schematic cross-sectional view taken along line XX of FIG. In FIG. 9, the illustration of the surface sheet 135 covering the surface of the IC card is omitted, and the internal configuration of the IC card is shown. On one surface of the antenna substrate 1 of the IC card according to the second embodiment, an antenna wire 2 wound about 2 turns along the outer edge of the antenna substrate 1 and an inner side of the wound antenna wire 2 An antenna wire 3 wound about 3 turns or less is provided. Antenna terminals 4 a and 4 b are provided at both ends of the antenna line 2, and antenna terminals 4 c and 4 d are provided at both ends of the antenna line 3, respectively. In addition, a substantially circular recess 5 is formed in the antenna substrate 1 between the antenna terminals 4a, 4b, 4c, and 4d.

  The IC card according to the second embodiment can transmit or receive non-contact data with a plurality of types of external devices using the antenna line 2 and the antenna line 3, and can be exposed to one surface of the IC card. A terminal 121 is provided so that data can be transmitted or received by contact with an external device via the contact terminal 121. A circuit for processing data transmitted or received by the antenna line 2, the antenna line 3, or the contact terminal 121 is provided in the IC chip 115, and the IC chip 115 is mounted on the IC module 110 disposed to face the antenna substrate 1. ing.

  FIG. 11 is a schematic cross-sectional view showing the configuration of the IC module 110 of the IC card according to Embodiment 2 of the present invention. The IC module 110 has a substantially rectangular plate shape and includes a module substrate 111 arranged to face the antenna substrate 1, and the antenna terminals 4 a, 4 b, 4 c, and 4 d of the antenna substrate 1 are provided on one surface of the module substrate 111. Four connected module antenna pads 112a, 112c (only two are shown in FIG. 11), the above-described IC chip 115, and the like are arranged. The module antenna pads 112a, 112c,... Are arranged around the periphery of the module board 111 so as to face the antenna terminals 4a, 4b, 4c, 4d of the antenna board 1 when the module board 111 is placed facing the antenna board 1, respectively. It is disposed at an appropriate position on the edge side.

  On the other surface side of the module substrate 111, that is, on the side opposite to the surface facing the antenna substrate 1, a contact terminal 121 for transmitting or receiving data by contact with an external device is disposed. . FIG. 12 is a schematic plan view showing the configuration of the contact terminal 121 of the IC card according to Embodiment 2 of the present invention. The contact terminal 121 includes eight metal terminals, that is, a first contact terminal 121a to an eighth contact terminal 121h, and is assigned to, for example, a power supply terminal, a ground terminal, an input terminal, and an output terminal.

  In addition, on one surface of the substantially rectangular plate-like IC chip 115, there are four connections electrically connected to the antenna terminals 4a, 4b, 4c, and 4d provided at both ends of the antenna line 2 and the antenna line 3, respectively. Terminals 16a, 16c... (Only two are shown in FIG. 11) project, and eight connection terminals 123 (1 in FIG. 11) are electrically connected to the contact terminals 121 (121a to 121h), respectively. Only one is shown. The module substrate 111 has four module chip pads 113a, 113c (shown in FIG. 11) connected to the connection terminals 16a, 16c,... Of the IC chip 115 on the same surface as the surface on which the module antenna pads 112a, 112c,. And two module chip pads 122 (only one is shown in FIG. 11) connected to the connection terminals 123 respectively.

  The module chip pads 113a, 113c,... Are connected to the module antenna pads 112a, 112c,... By four connection lines 114a, 114c, etc. (only two are shown in FIG. 11) provided on the same surface of the module substrate 111, respectively. ing. One surface of the module substrate 111 is covered with an insulating film 124. The module chip pads 113a, 113c,..., The module chip pads 122, and the module antenna pads 112a, 112c,. Is not exposed from the insulating film 124. The module chip pads 122 are connected to contact terminals 121 provided on the opposite surface of the module substrate 111 through through holes formed in the module substrate 111, respectively.

  The connection terminals 16a, 16c, etc. of the IC chip 115 and the module chip pads 113a, 113c, ..., and the module chip pad 122 of the module substrate 111 are connected by gold bumps 18, 18,. The chip 115 is electrically connected to the module antenna pads 112 a, 112 c... So that it can be electrically connected to the antenna wire 2 and the antenna wire 3, and is electrically connected to the contact terminal 121. Further, the connection between the IC chip 115 and the module substrate 111 by the connection terminals 16a, 16c,..., The connection terminal 123 and the module chip pads 113a, 113c,. The connection fixing resin part 19 is provided to improve the connection reliability.

  Further, a substantially rectangular reinforcing plate 17 slightly larger than the IC chip 115 is adhered to the surface opposite to the surface on which the connection terminals 16a, 16c,... Of the IC chip 115 are provided by UV adhesive tape, thermal adhesive tape, or the like. The IC chip 115 is hardly subjected to stress such as bending or pressing. Further, the IC chip 115, the connection fixing resin portion 19 and the reinforcing plate 17 provided on one surface of the module substrate 111 are covered and sealed with the sealing portion 20 made of synthetic resin, and the IC chip 115 and the gold bump 18 are sealed. , 18... Are protected from destruction. Note that the sealing portion 20 is formed in a substantially cylindrical shape protruding on one surface of the module substrate 111.

  The antenna substrate 1 that is disposed to face the IC module 110 is formed with a recess 5 that accommodates a substantially cylindrical sealing portion 20 that protrudes from the module substrate 111 of the IC module 110, and the sealing portion 20 is formed in the recess 5. , Even when the IC chip 115 and the module antenna pads 112a, 112c,... Are provided on the same surface of the module substrate 111, the antenna substrate 1 and the module substrate 111 are arranged to face each other, and the antenna terminal 4a. 4b, 4c, 4d and module antenna pads 112a, 112c... Can be connected. In addition, the recessed part 5 is formed in the substantially same shape as the sealing part 20, or is formed in the shape a little larger than the sealing part 20. FIG.

  The antenna terminals 4a, 4b, 4c, and 4d of the antenna substrate 1 and the module antenna pads 112a, 112c,... Of the module substrate 111 are respectively connected using a conductive connection material 31 such as solder or Ag paste. Thus, the IC chip 115 is electrically connected to the antenna line 2 and the antenna line 3 so that signals can be transmitted and received in a non-contact manner using the antenna line 2 and the antenna line 3. Further, the IC module 110 is disposed opposite to the antenna substrate 1 across the antenna line 2 and the antenna line 3 between the module antenna pads 112a, 112c... Provided so as to protrude from the module substrate 111. The antenna line 2 and the antenna line 3 can be electrically connected to the IC chip 115 without providing an intersection in the antenna line 2 and the antenna line 3.

  Further, on the surface opposite to the surface on which the antenna line 2 and the antenna line 3 etc. of the antenna substrate 1 are disposed, a substantially rectangular shape slightly larger than the module substrate 111 of the IC module 110 corresponding to the position where the IC module 110 is disposed. The reinforcing plate 133 is provided in contact with the IC chip 115, the connection portion of the IC chip 115 and the module substrate 111, and the module substrate 111 and the antenna substrate 1 when an external force such as bending or pressing is applied to the IC card. It is reinforced so that the connection part of the slab is not destroyed.

  Further, the antenna substrate 1 is sandwiched and covered by a top sheet 135 and a back sheet 36 having a substantially rectangular plate shape substantially the same size as the antenna substrate 1. Note that the contact terminal 121 provided on the surface opposite to the surface of the module substrate 111 of the IC module 110 facing the antenna substrate 1 is not covered with the surface sheet 135 but exposed on the surface of the IC card. The terminal 121 can be brought into contact with an external device. As a result, the IC card can transmit or receive data by contact with an external device.

  FIGS. 13 and 14 are schematic views showing the manufacturing process of the IC card according to the second embodiment of the present invention, and the manufacturing processes are illustrated in chronological order from (A) to (F). First, a metal foil such as a copper foil or an aluminum foil is attached to an antenna substrate 1 formed of an insulating material such as a polyester film, a polyimide film, PET, PETG, PVC, or PC, and an antenna wire is etched by etching the metal foil. 2 and 3 and antenna terminals 4a, 4b, 4c, 4d, etc. are formed (see FIG. 13A).

  Next, the reinforcing plate 133 is brought into contact with the surface opposite to the surface on which the antenna wires 2 and 3 and the antenna terminals 4a, 4b, 4c, and 4d of the antenna substrate 1 are formed, and the antenna wires 2, 3 and The surface on which the antenna terminals 4a, 4b, 4c, 4d, etc. are formed is covered with the top sheet 135, the opposite surface is covered with the back sheet 36, and the antenna substrate 1 is sandwiched between the two sheets 135 and 36 (FIG. 13B). reference).

  Thereafter, the top sheet 135 and the back sheet 36 are heated and pressed to laminate, and the antenna substrate 1 and the top sheet 135 and the back sheet 36 are integrated into a card (see FIG. 13C). At this time, it is preferable that the integrated antenna substrate 1, the front sheet 135, and the back sheet 36 be carded so that the thickness is uniform. When the antenna substrate 1 and the top sheet 135 and the back sheet 36 are formed of the same material such as PETG, PVC or PC, respectively, the top sheet 135 and the back sheet 36 are heated and pressed to be laminated. However, the antenna substrate 1 and the front sheet 135 and the back sheet 36 are formed of different materials and heated so that they do not bond to each other when they are melted. In this case, a card can be formed by adhering an adhesive between the antenna substrate 1 and the front sheet 135 and between the antenna substrate 1 and the back sheet 36.

  Next, an accommodation hole 150 capable of fitting and accommodating the IC module 110 is formed in the top sheet 135 and the antenna substrate 1 (see FIG. 14D). FIG. 15 is a schematic plan view of FIG. The accommodation hole 150 includes a recess 5 that accommodates the sealing portion 20 of the IC module 110, and the antenna terminals 4a, 4b, 4c, and 4d are exposed by making the accommodation hole 150 in the top sheet 135. I have to do it.

  Next, Ag paste, which is a conductive adhesive, is applied as a connection material 31 to the exposed antenna terminals 4a, 4b, 4c, and 4d, and the module antenna pads 112a, 112c,. 4b, 4c, and 4d are aligned, the sealing portion 20 of the IC module 110 and the concave portion 5 of the antenna substrate 1 are aligned, and the IC module 110 is pressed against the surface sheet 135 and the antenna substrate 1 (FIG. 14E). reference). As a result, the sealing portion 20 of the IC module 110 is accommodated in the recess 5 of the antenna substrate 1, the module antenna pads 112 a, 112 c... And the antenna terminals 4 a, 4 b, 4 c, 4 d are connected by the connection material 31. Is disposed opposite to the antenna substrate 1 across the antenna line 2 and the antenna line 3 (see FIG. 14F).

  When solder is used as the connection material 31, a material that melts at about 60 ° C. to 85 ° C. is used for the antenna substrate 1 and the module substrate 111. Therefore, it is preferable to use low-temperature solder that melts at a low temperature. Further, the part other than the connection part made of the connection material 31 may be bonded to the IC module 110, the surface sheet 135, the antenna substrate 1 and the like using an adhesive having no conductivity.

  The IC card according to the second embodiment having the above configuration has the same effect as the IC card according to the first embodiment, and includes the contact terminal 121. Can transmit or receive data.

  Since the other configuration of the IC card according to the second embodiment is the same as the configuration of the IC card according to the first embodiment, the corresponding portions are denoted by the same reference numerals and detailed description thereof is omitted.

1 is a schematic plan view showing a configuration of an IC card according to Embodiment 1 of the present invention. It is typical sectional drawing by the II-II line of FIG. It is typical sectional drawing which shows the structure of the IC module of the IC card which concerns on Embodiment 1 of this invention. It is a typical top view which shows the structure of the IC module of the IC card which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the manufacturing process of the IC module of the IC card which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the manufacturing process of the IC card which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the manufacturing process of the IC card which concerns on Embodiment 1 of this invention. It is typical sectional drawing which shows the structure of the IC card which concerns on the modification of Embodiment 1 of this invention. It is a schematic plan view which shows the structure of the IC card which concerns on Embodiment 2 of this invention. It is typical sectional drawing by the XX line of FIG. It is typical sectional drawing which shows the structure of the IC module of the IC card which concerns on Embodiment 2 of this invention. It is a schematic plan view which shows the structure of the contact terminal of the IC card which concerns on Embodiment 2 of this invention. It is a schematic diagram which shows the manufacturing process of the IC card concerning Embodiment 2 of this invention. It is a schematic diagram which shows the manufacturing process of the IC card concerning Embodiment 2 of this invention. FIG. 15 is a schematic plan view of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Antenna board 2, 3 Antenna wire 4a, 4b, 4c, 4d Antenna terminal 5 Recessed part 10 IC module 11 Module board 12a, 12b, 12c, 12d Module antenna pad (module terminal)
13a, 13b, 13c, 13d Module chip pad 15 IC chip 16a, 16b, 16c, 16d Connection terminal 17 Reinforcement plate 18 Gold bump 20 Sealing part 31 Connection material (conductive adhesive)
32, 33 Reinforcing plate 35, 35a Top sheet 36 Back sheet 110 IC module 111 Module substrate 112a, 112c Module antenna pad 113a, 113c Module chip pad 115 IC chip 121 Contact terminal 122 Module chip pad 123 Connection terminal 150 Housing hole

Claims (9)

An IC comprising an antenna substrate on which a winding antenna wire is disposed, and a module substrate on which an IC chip for processing a signal transmitted or received via the antenna wire is disposed, and is disposed opposite to the antenna substrate. In the card,
A plurality of antenna wires;
The plurality of antenna lines are arranged on the antenna substrate without crossing each antenna line and without crossing each other.
The antenna substrate has a plurality of antenna terminals provided at both ends of the antenna line,
The module substrate has a plurality of module terminals protruding on one surface of the module substrate and connected to the plurality of antenna terminals, respectively.
An IC card, wherein the module substrate is disposed opposite to the antenna substrate so as to straddle one or a plurality of the antenna wires between the plurality of module terminals.   2. The IC card according to claim 1, wherein the plurality of antenna lines respectively transmit or receive signals having different frequencies.   The IC card according to claim 1, wherein the antenna wire is wound for one turn or more.   The IC card according to any one of claims 1 to 3, wherein another antenna wire is wound inside the one antenna wire. The IC chip is disposed on a surface of the module substrate facing the antenna substrate,
The IC card according to any one of claims 1 to 4, wherein the antenna substrate has a recess for accommodating the IC chip.   The IC card according to any one of claims 1 to 5, wherein the antenna terminal and the module terminal are connected via a conductive adhesive.   The IC card according to any one of claims 1 to 6, wherein the IC chip is connected to the module substrate by a flip chip bonding method. The IC chip has a plate shape, one surface side is connected to the module substrate,
The IC card according to any one of claims 1 to 7, further comprising a reinforcing plate that reinforces the other surface side of the IC chip.   2. The module board is provided with a contact terminal that contacts an external device and transmits or receives a signal to / from an external device on a surface opposite to the surface facing the antenna substrate. 8. The IC card according to any one of 8.

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