WO2022056680A1 - Radio frequency chip having pressure balance pin short-circuit line - Google Patents

Radio frequency chip having pressure balance pin short-circuit line Download PDF

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Publication number
WO2022056680A1
WO2022056680A1 PCT/CN2020/115362 CN2020115362W WO2022056680A1 WO 2022056680 A1 WO2022056680 A1 WO 2022056680A1 CN 2020115362 W CN2020115362 W CN 2020115362W WO 2022056680 A1 WO2022056680 A1 WO 2022056680A1
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Prior art keywords
pressure balance
radio frequency
frequency chip
short
lead
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PCT/CN2020/115362
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French (fr)
Chinese (zh)
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焦林
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焦林
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Priority to PCT/CN2020/115362 priority Critical patent/WO2022056680A1/en
Publication of WO2022056680A1 publication Critical patent/WO2022056680A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the utility model relates to the technical field of radio frequency, and more particularly, to a radio frequency chip with a pressure-balanced column foot short-circuit line.
  • a radio frequency chip refers to an electronic component that converts radio signal communication into a certain radio signal waveform and sends it out through antenna resonance. It is regarded as one of the core components of radio frequency technology and is widely used in various industries.
  • the bottom of the traditional radio frequency chip is provided with a pressure balance pin, which has nothing to do with the chip circuit.
  • the pressure balance pin supports the chip and maintains the balance of the chip together with the lead pin.
  • the traditional RF chip pin layout has the following defects:
  • the contact resistance on-line measurement cannot be performed on the bottom pin layout. Since the RF chip is fixed on the RF antenna by flip-packaging with thermally cured anisotropic conductive resin, the coating amount of the anisotropic conductive resin, packaging pressure, The packaging temperature and the cleanliness of the surface of the aluminum foil antenna will affect the contact resistance between the lead pins and the aluminum foil antenna. Failure to measure the contact resistance will make it difficult to monitor the packaging quality and affect production efficiency.
  • the present invention provides a radio frequency chip with a pressure-balanced pin short circuit.
  • a radio frequency chip with a pressure balance column foot short circuit the bottom of the radio frequency chip is provided with a lead column foot and a pressure balance column foot, a short circuit line is arranged between the pressure balance column foot, and the thickness of the short circuit line is smaller than the lead column foot the height of.
  • the short-circuit lines are conductive lines made of silver or gold.
  • the thickness of the short-circuit lines is less than 2 microns.
  • the lead pins and the pressure balance pins are symmetrically distributed in the center.
  • the pressure balance column foot includes a first pressure balance column foot and a second pressure balance column foot, the first pressure balance column foot and the second pressure balance column foot
  • the balance pins are connected through the short-circuit line.
  • the number of the lead pins and the pressure balance pins are both two, and the lead pins are respectively arranged at the opposite corners of the bottom of the radio frequency chip.
  • the pressure balance pillars are respectively arranged at the other two diagonal corners of the bottom of the radio frequency chip.
  • the beneficial effect is that the utility model adds a short-circuit line between the pressure balancing legs, and when making a radio frequency antenna with inner and outer loop antennas connected in series, the lead legs pass through the pressure balancing legs and the short circuit.
  • Route connection instead of connecting through slender inner and outer coil connecting lines, simplifies the production process, greatly reduces the production scrap rate, and is conducive to the promotion of miniature RF sensors with two-circle RF antennas, and at the same time, it can measure the RF chip and the aluminum foil antenna package online. Contact resistance when fixed, monitor the chip packaging process, and improve the quality of chip packaging.
  • FIG. 1 is a schematic structural diagram 1 of the present utility model.
  • FIG. 2 is a second structural schematic diagram of the utility model.
  • FIG. 3 is a schematic diagram of the connection structure between the utility model and the aluminum foil antenna.
  • FIG. 4 is a schematic diagram of the structure of adding a contact resistance aluminum foil measuring disc when the RF chip is packaged.
  • a radio frequency chip with a pressure balance column foot short circuit as shown in FIG. 1 , the bottom of the radio frequency chip 1 is provided with a lead column foot 11 and a pressure balance column foot 12, and a short circuit 13 is arranged between the pressure balance column foot 12, and the short circuit 13
  • the thickness is smaller than the height of the lead pins 11 .
  • the pressure balance column foot 12 includes a first pressure balance column foot 121 and a second pressure balance column foot 122 .
  • the first pressure balance column foot 121 and the second pressure balance column foot 122 are connected by a short-circuit line 13 . or short-circuit connection.
  • the lead pin 11 includes a first lead pin 111 and a second lead pin 112 .
  • the first pressure balance pins 121 and the second pressure balance pins 122 are arranged diagonally, and the first lead pins 111 and the second lead pins 112 are arranged diagonally.
  • the four pillars are symmetrically arranged at the four corners of the bottom of the chip to obtain a more stable equilibrium state.
  • the lead pins 11 are hemispherical, and the lead pins 11 are connected to the aluminum foil antenna.
  • the pressure balance column foot 12 is conical or hemispherical, and is in contact with the short-circuit line 13, and forms a balanced state at the bottom of the radio frequency chip 1, and plays the role of supporting and balancing the radio frequency chip 1.
  • the short-circuit line 13 is a conductive line made of silver or gold.
  • the lead pins on the radio frequency chip 1 are connected to the aluminum foil antenna.
  • the first lead pin 111 is connected with the first pressure balance pin 121 through the aluminum foil antenna to form a passage of the inner loop antenna 2
  • the first lead pin 111 is the starting end of the inner loop antenna 2
  • the first pressure balance pin 121 is The terminal of the inner loop antenna 2.
  • the first pressure balance column 121 is connected to the second pressure balance column 122 through the short circuit 13 .
  • the second pressure balance column 122 is connected with the second lead column 112 through the aluminum foil antenna to form a passage of the outer loop antenna 3 , the second lead column 112 is the starting end of the outer loop antenna 3 , and the second pressure balance column 122 is the outer loop antenna 3 . Terminal of loop antenna 3.
  • the inner loop antenna 2 and the outer loop antenna 3 are connected in series through the short-circuit line 13, and the path is the first lead pin 111—the inner loop antenna 2—the first pressure balance pin 121—the short-circuit line 13— — the second pressure balance pin 122 — the outer loop antenna 3 — the second lead pin 112 .
  • the utility model connects the inner loop antenna 2 and the outer loop antenna 3 through the short-circuit line 13 to form a series radio frequency antenna. Due to the setting of the short-circuit line 13, the inner loop antenna 2 can be connected to the outer loop antenna 3 through the pressure balance column 12. There is no need to use a laser to engrave a 0.1 mm wide aluminum foil line segment to connect the inner loop antenna 2 and the outer loop antenna.
  • the antenna 3 is independent and produced separately, which simplifies the production process of the aluminum foil antenna, thereby improving the product qualification rate and production efficiency, and making it possible to popularize the miniature radio frequency sensor with two aluminum foil antennas.
  • the thickness of the shorting line 13 is much smaller than the height of the pins of the RF chip 1 . In one embodiment, the thickness of the shorting line 13 is less than 2 micrometers, and the heights of the lead pins 11 and the pressure balance pins 12 are 15-18 micrometers. Therefore, the short-circuit line 13 does not affect the packaging and fixation of the radio frequency chip 1 .
  • the contact resistance aluminum foil test pad is added to test the packaging.
  • the two contacts on the resistance measuring instrument are respectively contacted and connected with the contact resistance aluminum foil measuring disc 4 to obtain the resistance value between the first pressure balance pin 121 and the second pressure balance pin 122 to determine the first pressure balance pin 121.
  • the packaging of the lead pins 111, the second lead pins 112 and the aluminum foil antenna adjust the coating amount of the guiding conductive resin in time, change the packaging temperature and packaging pressure, and keep the measured resistance value as low as possible. Encapsulation quality, improve the stability of RFID tags.
  • a short circuit 13 is added between the pressure balance legs 12, and the lead legs 11 are connected by the pressure balance legs 12 and the short circuit 13, instead of being connected by a slender inner and outer coil connecting wire, which separates the inner and outer coils into two parts.
  • An independent aluminum foil antenna simplifies the production process, greatly reduces the production scrap rate, and is conducive to the promotion of miniature radio frequency sensors with two inner and outer circles of radio frequency antennas in series.
  • the packaging process improves the quality of chip packaging.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

A radio frequency chip (1) that has a pressure balance pin short-circuit line (13), wherein the bottom part of the radio frequency chip (1) is provided with a lead pin (11) and pressure balance pins (12), the short-circuit line (13) is provided between the pressure balance pins (12), and the short-circuit line (13) is smaller than the height of the lead pin (11). When a radio frequency antenna that has an inner loop antenna (2) and an outer loop antenna (3) that are connected in series is made, the inner loop antenna (2) and the outer loop antenna (3) are connected by means of the lead pin (11), the pressure balance pins (12) and the short-circuit line (13), instead of by means of being connected by means of a slender connecting line, so that the inner loop antenna (2) and the outer loop antenna (3) are separated into two independent aluminum foil antennas. The design of the radio frequency chip (1) simplifies the fabrication process and reduces the production waste rate, while performing on-line measurement of the contact resistance of the radio frequency chip (1) and the aluminum foil antennas when same are packaged and fixed, monitoring the packaging process, and improving the packaging quality.

Description

一种具有压力平衡柱脚短路线的射频芯片A radio frequency chip with pressure-balanced pin short circuit 技术领域technical field
本实用新型涉及射频技术领域,更具体地说,是涉及一种具有压力平衡柱脚短路线的射频芯片。The utility model relates to the technical field of radio frequency, and more particularly, to a radio frequency chip with a pressure-balanced column foot short-circuit line.
背景技术Background technique
射频芯片指的就是将无线电信号通信转换成一定的无线电信号波形,并通过天线谐振发送出去的一个电子元器件,被视作射频技术的核心部件之一,广泛用于各行业中。A radio frequency chip refers to an electronic component that converts radio signal communication into a certain radio signal waveform and sends it out through antenna resonance. It is regarded as one of the core components of radio frequency technology and is widely used in various industries.
传统的射频芯片底部设置有压力平衡柱脚,该压力平衡柱脚与芯片电路无关联,用于芯片封装时与引线柱脚一同起到支撑芯片、保持芯片平衡的作用。传统的射频芯片柱脚布局具有如下缺陷:The bottom of the traditional radio frequency chip is provided with a pressure balance pin, which has nothing to do with the chip circuit. When used for chip packaging, the pressure balance pin supports the chip and maintains the balance of the chip together with the lead pin. The traditional RF chip pin layout has the following defects:
1.在制作具有内外双环的两圈铝箔射频天线时,为了令内环天线与外环天线连接的同时还连接射频芯片的引线柱脚,需要在芯片柱脚之间制作一条极细的铝箔线条作为内环天线与外环天线的连接线,通常为内环天线与外环天线一体化制作,因该铝箔线条工艺复杂,在生产过程中易造成铝箔天线废品率提高,影响生产效率与生产数量。1. When making a two-ring aluminum foil RF antenna with inner and outer double loops, in order to connect the inner loop antenna to the outer loop antenna and also connect the lead pins of the RF chip, it is necessary to make a very thin aluminum foil line between the chip pins As the connecting line between the inner loop antenna and the outer loop antenna, the inner loop antenna and the outer loop antenna are usually made integrally. Due to the complex process of the aluminum foil line, it is easy to increase the scrap rate of the aluminum foil antenna during the production process, which affects the production efficiency and production quantity. .
2.在封装时,该底部柱脚布局无法实施接触电阻在线测量,由于射频芯片是通过热固化异向导电树脂倒封装固定在射频天线上,故而异向导电树脂的涂布量、封装压力、封装温度及铝箔天线表面的洁净度都会影响引线柱脚与铝箔天线的接 触电阻,无法测量接触接触电阻会导致难以监控封装质量,影响生产效率。2. During packaging, the contact resistance on-line measurement cannot be performed on the bottom pin layout. Since the RF chip is fixed on the RF antenna by flip-packaging with thermally cured anisotropic conductive resin, the coating amount of the anisotropic conductive resin, packaging pressure, The packaging temperature and the cleanliness of the surface of the aluminum foil antenna will affect the contact resistance between the lead pins and the aluminum foil antenna. Failure to measure the contact resistance will make it difficult to monitor the packaging quality and affect production efficiency.
以上不足,有待改进。The above is insufficient and needs to be improved.
发明内容SUMMARY OF THE INVENTION
为了克服现有的技术的不足,本实用新型提供一种具有压力平衡柱脚短路线的射频芯片。In order to overcome the deficiencies of the prior art, the present invention provides a radio frequency chip with a pressure-balanced pin short circuit.
本实用新型技术方案如下所述:The technical scheme of the present utility model is as follows:
一种具有压力平衡柱脚短路线的射频芯片,射频芯片底部设置引线柱脚与压力平衡柱脚,所述压力平衡柱脚之间设置短路线,所述短路线的厚度小于所述引线柱脚的高度。A radio frequency chip with a pressure balance column foot short circuit, the bottom of the radio frequency chip is provided with a lead column foot and a pressure balance column foot, a short circuit line is arranged between the pressure balance column foot, and the thickness of the short circuit line is smaller than the lead column foot the height of.
上述的一种具有压力平衡柱脚短路线的射频芯片,所述短路线为银或金制成的导电线条。In the above-mentioned radio frequency chip with pressure-balanced short-circuit lines, the short-circuit lines are conductive lines made of silver or gold.
上述的一种具有压力平衡柱脚短路线的射频芯片,所述短路线的厚度小于2微米。In the above-mentioned radio frequency chip with pressure-balanced short-circuit lines, the thickness of the short-circuit lines is less than 2 microns.
上述的一种具有压力平衡柱脚短路线的射频芯片,所述引线柱脚与所述压力平衡柱脚呈中心对称分布。In the above-mentioned radio frequency chip with short-circuit lines of pressure balance pins, the lead pins and the pressure balance pins are symmetrically distributed in the center.
上述的一种具有压力平衡柱脚短路线的射频芯片,所述压力平衡柱脚包括第一压力平衡柱脚与第二压力平衡柱脚,所述第一压力平衡柱脚与所述第二压力平衡柱脚通过所述短路线连接。The above-mentioned radio frequency chip with a pressure balance column foot short circuit, the pressure balance column foot includes a first pressure balance column foot and a second pressure balance column foot, the first pressure balance column foot and the second pressure balance column foot The balance pins are connected through the short-circuit line.
上述的一种具有压力平衡柱脚短路线的射频芯片,所述引线柱脚与所述压力平衡柱脚的数量均为二,所述引线柱脚分别设置在所述射频芯片底部的对角处,所述压力平衡柱脚分别设置在所述射频芯片底部的另外两个对角处。In the above-mentioned radio frequency chip with short-circuiting lines of pressure balance pins, the number of the lead pins and the pressure balance pins are both two, and the lead pins are respectively arranged at the opposite corners of the bottom of the radio frequency chip. , the pressure balance pillars are respectively arranged at the other two diagonal corners of the bottom of the radio frequency chip.
根据上述方案的本实用新型,其有益效果在于,本实用新型在压力平衡柱脚之间增加短路线,制作具有内外环天线串联在一起的射频天线时,引线柱脚通过压力平衡柱脚及短路线连接,而非通过细长的内外线圈连接线连接,简化制作工艺,极大地降低生产废品率,有利于推广含两圈式射频天线的微型射频传感器,同时能够在线测量射频芯片与铝箔天线封装固定时的接触电阻,监控芯片封装过程,提高芯片封装质量。According to the utility model of the above scheme, the beneficial effect is that the utility model adds a short-circuit line between the pressure balancing legs, and when making a radio frequency antenna with inner and outer loop antennas connected in series, the lead legs pass through the pressure balancing legs and the short circuit. Route connection, instead of connecting through slender inner and outer coil connecting lines, simplifies the production process, greatly reduces the production scrap rate, and is conducive to the promotion of miniature RF sensors with two-circle RF antennas, and at the same time, it can measure the RF chip and the aluminum foil antenna package online. Contact resistance when fixed, monitor the chip packaging process, and improve the quality of chip packaging.
附图说明Description of drawings
为了更清楚地说明本实用新型实施例中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本实用新型的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for the present utility model. For some new embodiments, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.
图1为本实用新型的结构示意图一。FIG. 1 is a schematic structural diagram 1 of the present utility model.
图2为本实用新型的结构示意图二。FIG. 2 is a second structural schematic diagram of the utility model.
图3为本实用新型与铝箔天线的连接结构示意图。FIG. 3 is a schematic diagram of the connection structure between the utility model and the aluminum foil antenna.
图4为射频芯片封装时添加接触电阻铝箔测量盘的结构示意图。FIG. 4 is a schematic diagram of the structure of adding a contact resistance aluminum foil measuring disc when the RF chip is packaged.
其中,图中各附图标记:Among them, each reference sign in the figure:
1.射频芯片;11.引线柱脚;111.第一引线柱脚;112.第二引线柱脚;12.压力平衡柱脚;121.第一压力平衡柱脚;122.第二压力平衡柱脚;13.短路线;1. RF chip; 11. Lead pin; 111. First lead pin; 112. Second lead pin; 12. Pressure balance pin; 121. First pressure balance pin; 122. Second pressure balance pin feet; 13. Short circuit;
2.内环天线;2. Inner loop antenna;
3.外环天线;3. Outer loop antenna;
4.接触电阻铝箔测量盘。4. Contact resistance aluminum foil measuring disc.
具体实施方式detailed description
为了使本实用新型所要解决的技术问题、技术方案及有益效果更加清楚明白,以下结合附图及实施例,对本实用新型进行进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本实用新型,并不用于限定本实用新型。In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.
需要说明的是,当部件被称为“固定”或“设置”或“连接”另一个部件,它可以直接或者间接位于该另一个部件上。术语“内”、“外”等指示的方位或位置为基于附图所示的方位或位置,仅是为了便于描述,不能理解为对本技术方案的限制。术语“第一”、“第二”等仅用于便于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明技术特征的数量。It should be noted that when a component is referred to as being "fixed" or "disposed" or "connected" to another component, it can be directly or indirectly located on the other component. The positions or positions indicated by the terms "inside", "outside", etc. are based on the positions or positions shown in the drawings, which are only for the convenience of description and should not be construed as a limitation on the technical solution. The terms "first", "second", etc. are only used for the purpose of description, and should not be construed as indicating or implying relative importance or implying indicating the number of technical features.
一种具有压力平衡柱脚短路线的射频芯片,如图1所示,射频芯片1底部设置引线柱脚11与压力平衡柱脚12,压力平衡柱脚12之间设置短路线13,短路线13的厚度小于引线柱脚11的高度。A radio frequency chip with a pressure balance column foot short circuit, as shown in FIG. 1 , the bottom of the radio frequency chip 1 is provided with a lead column foot 11 and a pressure balance column foot 12, and a short circuit 13 is arranged between the pressure balance column foot 12, and the short circuit 13 The thickness is smaller than the height of the lead pins 11 .
如图1所示,压力平衡柱脚12包括第一压力平衡柱脚121与第二压力平衡柱脚122,第一压力平衡柱脚121与第二压力平衡柱脚122通过短路线13连接,二者短路连接。引线柱脚11包括第一引线柱脚111与第二引线柱脚112。第一压力平衡柱脚121与第二压力平衡柱脚122呈对角线设置,第一引线柱脚111与第二引线柱脚112呈对角线设置。As shown in FIG. 1 , the pressure balance column foot 12 includes a first pressure balance column foot 121 and a second pressure balance column foot 122 . The first pressure balance column foot 121 and the second pressure balance column foot 122 are connected by a short-circuit line 13 . or short-circuit connection. The lead pin 11 includes a first lead pin 111 and a second lead pin 112 . The first pressure balance pins 121 and the second pressure balance pins 122 are arranged diagonally, and the first lead pins 111 and the second lead pins 112 are arranged diagonally.
在一种实施例中,四个柱脚呈中心对称状设置在芯片底部四角,以获得更稳定的平衡状态。In one embodiment, the four pillars are symmetrically arranged at the four corners of the bottom of the chip to obtain a more stable equilibrium state.
如图2所示,引线柱脚11呈半球形,引线柱脚11与铝箔天线连接。压力平衡柱脚12呈圆锥形或半球形,均与短路线13接触连接,并在射频芯片1底部形 成平衡状态,起到支撑与平衡射频芯片1的作用。As shown in FIG. 2 , the lead pins 11 are hemispherical, and the lead pins 11 are connected to the aluminum foil antenna. The pressure balance column foot 12 is conical or hemispherical, and is in contact with the short-circuit line 13, and forms a balanced state at the bottom of the radio frequency chip 1, and plays the role of supporting and balancing the radio frequency chip 1.
优选的,短路线13为银或金制成的导电线条。Preferably, the short-circuit line 13 is a conductive line made of silver or gold.
如图3所示,制作内外环天线串联在一起的射频天线时,射频芯片1与铝箔天线封装完毕后,射频芯片1上的引线柱脚连接铝箔天线。第一引线柱脚111通过铝箔天线与第一压力平衡柱脚121连接,形成内环天线2的通路,第一引线柱脚111为内环天线2的起始端,第一压力平衡柱脚121为内环天线2的终端。第一压力平衡柱脚121通过短路线13与第二压力平衡柱脚122连接。第二压力平衡柱122脚通过铝箔天线与第二引线柱脚112连接形成外环天线3的通路,第二引线柱脚112为外环天线3的起始端,第二压力平衡柱脚122为外环天线3的终端。As shown in FIG. 3 , when making a radio frequency antenna with inner and outer loop antennas connected in series, after the radio frequency chip 1 and the aluminum foil antenna are packaged, the lead pins on the radio frequency chip 1 are connected to the aluminum foil antenna. The first lead pin 111 is connected with the first pressure balance pin 121 through the aluminum foil antenna to form a passage of the inner loop antenna 2 , the first lead pin 111 is the starting end of the inner loop antenna 2 , and the first pressure balance pin 121 is The terminal of the inner loop antenna 2. The first pressure balance column 121 is connected to the second pressure balance column 122 through the short circuit 13 . The second pressure balance column 122 is connected with the second lead column 112 through the aluminum foil antenna to form a passage of the outer loop antenna 3 , the second lead column 112 is the starting end of the outer loop antenna 3 , and the second pressure balance column 122 is the outer loop antenna 3 . Terminal of loop antenna 3.
如此,通过短路线13将内环天线2与外环天线3串联在一起,其通路为第一引线柱脚111——内环天线2——第一压力平衡柱脚121——短路线13——第二压力平衡柱脚122——外环天线3——第二引线柱脚112。In this way, the inner loop antenna 2 and the outer loop antenna 3 are connected in series through the short-circuit line 13, and the path is the first lead pin 111—the inner loop antenna 2—the first pressure balance pin 121—the short-circuit line 13— — the second pressure balance pin 122 — the outer loop antenna 3 — the second lead pin 112 .
本实用新型通过短路线13连接内环天线2与外环天线3,形成串联式的射频天线。由于短路线13的设置,内环天线2可以通过压力平衡柱脚12连接外环天线3,无需用激光刻制一段0.1毫米宽的铝箔线段连接内外环天线,可将内环天线2与外环天线3独立,分开制作,简化铝箔天线的制作工艺,从而提高产品合格率,提高生产效率,为含两圈铝箔天线的微型射频传感器的推广提供可能。The utility model connects the inner loop antenna 2 and the outer loop antenna 3 through the short-circuit line 13 to form a series radio frequency antenna. Due to the setting of the short-circuit line 13, the inner loop antenna 2 can be connected to the outer loop antenna 3 through the pressure balance column 12. There is no need to use a laser to engrave a 0.1 mm wide aluminum foil line segment to connect the inner loop antenna 2 and the outer loop antenna. The antenna 3 is independent and produced separately, which simplifies the production process of the aluminum foil antenna, thereby improving the product qualification rate and production efficiency, and making it possible to popularize the miniature radio frequency sensor with two aluminum foil antennas.
短路线13的厚度远小于射频芯片1柱脚的高度,在一种实施例中,短路线13的厚度小于2微米,引线柱脚11与压力平衡柱脚12的高度为15-18微米。因此,短路线13并不会影响射频芯片1的封装固定。The thickness of the shorting line 13 is much smaller than the height of the pins of the RF chip 1 . In one embodiment, the thickness of the shorting line 13 is less than 2 micrometers, and the heights of the lead pins 11 and the pressure balance pins 12 are 15-18 micrometers. Therefore, the short-circuit line 13 does not affect the packaging and fixation of the radio frequency chip 1 .
如图4所示,在进行射频芯片1与铝箔天线封装时,增加接触电阻铝箔测试 盘测试封装情况。封装过程中,电阻测量仪上的两个触点分别与接触电阻铝箔测量盘4接触连接,获得第一压力平衡柱脚121与第二压力平衡柱脚122之间的电阻值,以判断第一引线柱脚111、第二引线柱脚112及铝箔天线的封装情况,及时调节导向导电树脂的涂布量,改变封装温度、封装压力,尽可能令测量电阻值保持低阻值的范围,从而提高封装质量,提高射频标签的稳定性。As shown in Figure 4, when the RF chip 1 and the aluminum foil antenna are packaged, the contact resistance aluminum foil test pad is added to test the packaging. During the packaging process, the two contacts on the resistance measuring instrument are respectively contacted and connected with the contact resistance aluminum foil measuring disc 4 to obtain the resistance value between the first pressure balance pin 121 and the second pressure balance pin 122 to determine the first pressure balance pin 121. The packaging of the lead pins 111, the second lead pins 112 and the aluminum foil antenna, adjust the coating amount of the guiding conductive resin in time, change the packaging temperature and packaging pressure, and keep the measured resistance value as low as possible. Encapsulation quality, improve the stability of RFID tags.
本实用新型在压力平衡柱脚12之间增加短路线13,引线柱脚11通过压力平衡柱脚12及短路线13连接,而非通过细长的内外线圈连接线连接,将内外线圈分开为两条独立的铝箔天线,简化制作工艺,极大地降低生产废品率,有利于推广内外两圈串联射频天线的微型射频传感器,同时能够在线测量射频芯片1与铝箔天线封装固定时的接触电阻,监控芯片封装过程,提高芯片封装质量。In the present invention, a short circuit 13 is added between the pressure balance legs 12, and the lead legs 11 are connected by the pressure balance legs 12 and the short circuit 13, instead of being connected by a slender inner and outer coil connecting wire, which separates the inner and outer coils into two parts. An independent aluminum foil antenna simplifies the production process, greatly reduces the production scrap rate, and is conducive to the promotion of miniature radio frequency sensors with two inner and outer circles of radio frequency antennas in series. The packaging process improves the quality of chip packaging.
以上所述仅为本实用新型的较佳实施例而已,并不用以限制本实用新型,凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本实用新型的保护范围之内。The above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the present invention. within the scope of protection of the utility model.

Claims (7)

  1. 一种具有压力平衡柱脚短路线的射频芯片,其特征在于,射频芯片底部设置引线柱脚与压力平衡柱脚,所述压力平衡柱脚之间设置短路线,所述短路线小于所述引线柱脚的高度。A radio frequency chip with a pressure balance column foot short-circuit line, characterized in that a lead column foot and a pressure balance column foot are arranged at the bottom of the radio frequency chip, and a short circuit line is arranged between the pressure balance column feet, and the short circuit line is smaller than the lead wire The height of the column base.
  2. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片,其特征在于,所述短路线为银或金制成的导电线条。A radio frequency chip with pressure-balanced pin short-circuit lines according to claim 1, wherein the short-circuit lines are conductive lines made of silver or gold.
  3. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片,其特征在于,所述引线柱脚与所述压力平衡柱脚呈中心对称分布。The radio frequency chip with short-circuit lines of pressure balance pins according to claim 1, characterized in that, the lead pins and the pressure balance pins are symmetrically distributed in the center.
  4. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片,其特征在于,所述引线柱脚包括第一引线柱脚与第二引线柱脚,所述第一引线柱脚经内环天线连接所述压力平衡柱脚,所述压力平衡柱脚经外环天线连接所述第二引线柱脚。The radio frequency chip with a pressure-balanced pin short circuit according to claim 1, wherein the lead pin comprises a first lead pin and a second lead pin, the first lead pin The pressure balance column is connected through the inner loop antenna, and the pressure balance column is connected with the second lead column through the outer loop antenna.
  5. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片,其特征在于,所述压力平衡柱脚包括第一压力平衡柱脚与第二压力平衡柱脚,所述第一压力平衡柱脚与所述第二压力平衡柱脚通过所述短路线连接。A radio frequency chip with a short circuit of a pressure balance column foot according to claim 1, wherein the pressure balance column foot comprises a first pressure balance column foot and a second pressure balance column foot, the first pressure balance column foot The pressure balance column foot and the second pressure balance column foot are connected through the short-circuit line.
  6. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片,其特征在于,所述引线柱脚与所述压力平衡柱脚的数量均为二,所述引线柱脚分别设置在所述射频芯片底部的两角处,所述压力平衡柱脚分别设置在所述射频芯片底部的另外两角处。The radio frequency chip with a pressure balance pin short circuit according to claim 1, wherein the number of the lead pins and the pressure balance pins are both two, and the lead pins are respectively provided with At the two corners of the bottom of the radio frequency chip, the pressure balance pillars are respectively arranged at the other two corners of the bottom of the radio frequency chip.
  7. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片,其特征在于,所述短路线的厚度小于2微米。The radio frequency chip with a pressure-balanced pin short circuit according to claim 1, wherein the thickness of the short circuit is less than 2 microns.
PCT/CN2020/115362 2020-09-15 2020-09-15 Radio frequency chip having pressure balance pin short-circuit line WO2022056680A1 (en)

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CN203721708U (en) * 2014-03-11 2014-07-16 深圳市骄冠科技实业有限公司 Radio frequency chip connection sheet assembly
CN203951011U (en) * 2014-07-15 2014-11-19 深圳市骄冠科技实业有限公司 A kind of I shape RFID radio frequency chip brace
CN109063809A (en) * 2018-08-02 2018-12-21 上海祯显电子科技有限公司 A kind of small-sized RFID tag of stud
CN209766617U (en) * 2019-06-04 2019-12-10 深圳市骄冠科技实业有限公司 Radio frequency resonant cavity assembly with antenna and chip crossed in plane

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140103120A1 (en) * 2003-08-29 2014-04-17 National Semiconductor Corporation Methods for manufacturing a radio frequency identification tag without aligning the chip and antenna
US20070139285A1 (en) * 2004-09-22 2007-06-21 Matsushita Electric Industrial Co., Ltd. Loop antenna unit and radio communication medium processor
JP2007193598A (en) * 2006-01-19 2007-08-02 Sharp Corp Ic card
CN203721708U (en) * 2014-03-11 2014-07-16 深圳市骄冠科技实业有限公司 Radio frequency chip connection sheet assembly
CN203951011U (en) * 2014-07-15 2014-11-19 深圳市骄冠科技实业有限公司 A kind of I shape RFID radio frequency chip brace
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