TWI754335B - Detection device - Google Patents
Detection device Download PDFInfo
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- TWI754335B TWI754335B TW109125427A TW109125427A TWI754335B TW I754335 B TWI754335 B TW I754335B TW 109125427 A TW109125427 A TW 109125427A TW 109125427 A TW109125427 A TW 109125427A TW I754335 B TWI754335 B TW I754335B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B17/00—Monitoring; Testing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
本發明係有關一種檢測裝置,尤指一種作為探針卡之檢測裝置。 The present invention relates to a detection device, especially a detection device used as a probe card.
隨著無線通信發展迅速及網路資源流量日趨龐大,所需的無線傳輸頻寬也越來越大,故封測端所進行之天線測試作業極為重要。 With the rapid development of wireless communication and the ever-increasing flow of network resources, the required wireless transmission bandwidth is also increasing. Therefore, the antenna test operation performed by the packaging and testing end is extremely important.
如圖1所示,習知測試天線訊號用之探針卡1係包括一電路板10及一藉由外接纜線13電性連接該電路板10之探針組12。於進行天線測試作業時,將探針組12接合一天線測試物,以令該天線測試物將其射頻(RF)訊號傳遞至該電路板10,使該電路板10將該射頻訊號轉傳至測試機上。
As shown in FIG. 1 , a
惟,習知探針卡1於天線測試作業中,需連接一冗長之外接纜線13,使該射頻(RF)訊號傳遞至該電路板10之傳輸路徑過長,因而容易造成訊號衰減,致使測試結果不準確。
However, in the antenna test operation of the
因此,如何克服上述習知技術之缺失,已成目前亟欲解決的課題。 Therefore, how to overcome the above-mentioned deficiencies in the prior art has become an urgent problem to be solved.
鑑於上述習知技術之缺失,本發明係提供一種檢測裝置,係包括:承載件,係具有相對之第一側與第二側並配置有複數導電佈線;基板,係設於該 承載件之第一側上;作用件,係設於該基板上且具有複數導電端子,以接合一目標測試物;以及傳輸線,係設於該基板上且電性連接該導電佈線與部分該複數導電端子。 In view of the above-mentioned deficiencies in the prior art, the present invention provides a detection device, which includes: a carrier, which has opposite first and second sides and is provided with a plurality of conductive wirings; a substrate, which is arranged on the on the first side of the carrier; the acting part is arranged on the substrate and has a plurality of conductive terminals for bonding a target test object; and a transmission line is arranged on the substrate and electrically connects the conductive wiring and a part of the plurality of conductive terminals.
前述之檢測裝置中,該承載件係為電路板,且該導電佈線係為電路佈線。 In the aforementioned detection device, the carrier is a circuit board, and the conductive wiring is a circuit wiring.
前述之檢測裝置中,該承載件之第二側係配置有至少一電性連接該導電佈線之外接埠口。 In the aforementioned detection device, the second side of the carrier is configured with at least one external port that is electrically connected to the conductive wiring.
前述之檢測裝置中,該基板係具有複數電性連接該導電佈線與另一部分該複數導電端子之線路層。 In the aforementioned detection device, the substrate has a plurality of circuit layers electrically connecting the conductive wiring and another part of the plurality of conductive terminals.
前述之檢測裝置中,該作用件係為測試頭。 In the aforementioned detection device, the acting member is a test head.
前述之檢測裝置中,該導電端子係為探針結構。 In the aforementioned detection device, the conductive terminal is a probe structure.
前述之檢測裝置中,該作用件係藉由支撐件堆疊於該承載件之第一側上,以於該作用件與該承載件之第一側之間形成容置空間,使該基板位於該容置空間中。 In the aforementioned detection device, the acting element is stacked on the first side of the carrier by a support element, so as to form a accommodating space between the acting element and the first side of the carrier, so that the substrate is located on the first side of the carrier. in the accommodation space.
前述之檢測裝置中,該傳輸線係以可拆裝之方式設置於該基板之外表面上。例如,該可拆裝之方式係為黏貼方式。 In the aforementioned detection device, the transmission line is detachably disposed on the outer surface of the substrate. For example, the removable method is a sticking method.
前述之檢測裝置中,該導電佈線係連通該第一側與第二側,以令該目標測試物之訊號依序經由該導電端子、傳輸線及該導電佈線進行傳輸。 In the aforementioned detection device, the conductive wiring is connected to the first side and the second side, so that the signal of the target test object is transmitted through the conductive terminal, the transmission line and the conductive wiring in sequence.
由上可知,本發明之檢測裝置中,主要藉由該傳輸線配置於該基板上,以縮短訊號傳遞路徑,故相較於習知技術,本發明之檢測裝置於天線檢測作業時能有效減少射頻訊號之衰減,以提升測試結果之準確度。 As can be seen from the above, in the detection device of the present invention, the transmission line is mainly disposed on the substrate to shorten the signal transmission path. Therefore, compared with the prior art, the detection device of the present invention can effectively reduce the radio frequency during the antenna detection operation. Signal attenuation to improve the accuracy of test results.
1:探針卡 1: Probe card
10:電路板 10: circuit board
12:探針組 12: Probe Set
13:外接纜線 13: External cable
2:檢測裝置 2: Detection device
20:承載件 20: Carrier
20a:第一側 20a: First side
20b:第二側 20b: Second side
200,200’:導電佈線 200,200': Conductive wiring
201:外接埠口 201: External port
201’:轉接埠口 201’: transfer port
21:基板 21: Substrate
210:線路層 210: circuit layer
211:導電凸塊 211: Conductive bumps
22:作用件 22: Action piece
220,221:導電端子 220, 221: Conductive terminals
23:傳輸線 23: Transmission line
24:支撐件 24: Supports
9:目標測試物 9: Target test object
S:容置空間 S: accommodating space
圖1係為習知探針卡之示意圖。 FIG. 1 is a schematic diagram of a conventional probe card.
圖2係為本發明之檢測裝置之剖視示意圖。 FIG. 2 is a schematic cross-sectional view of the detection device of the present invention.
以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The following specific embodiments are used to illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。 It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those who are familiar with the art, and are not intended to limit the implementation of the present invention. Therefore, it has no technical significance, and any modification of the structure, change of the proportional relationship or adjustment of the size should still fall within the scope of the The technical content disclosed by the invention can be covered within the scope. At the same time, the terms such as "above" and "a" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the present invention. Substantially changed technical content should also be regarded as the scope of the present invention.
圖2係為本發明之檢測裝置之剖面示意圖。於本實施例中,該檢測裝置2係為探針卡(probe card)。
FIG. 2 is a schematic cross-sectional view of the detection device of the present invention. In this embodiment, the
如圖2所示,所述之檢測裝置2係包括:一承載件20、一基板(substrate)21、一作用件22以及至少一傳輸線23。
As shown in FIG. 2 , the
所述之承載件20係具有相對之第一側20a與第二側20b,且該承載件20中係配置有至少一連通該第一側20a與第二側20b之導電佈線200,200’。
The
於本實施例中,該承載件20係為電路板,例如,該承載件20係大致呈圓盤狀。
In the present embodiment, the
再者,該承載件20復配置有至少一電性連接該導電佈線200之外接埠口201,如接頭,其配置於該承載件20之第二側20b,以電性接合一如測試機之電子裝置(圖略)。
Furthermore, the
所述之基板21係設於該承載件20之第一側20a上且電性連接該承載件20。
The
於本實施例中,該基板21係為線路板,例如具有核心層之線路板結構或無核心層(coreless)之線路板結構,其包含有介電材及結合該介電材之至少一線路層210。應可理解地,該基板21亦可為其它線路板形式,如導線架(lead frame)、重分佈線路(RDL),並不限於上述。
In this embodiment, the
再者,該基板21係藉由複數如銲錫材料之導電凸塊211結合至該承載件20之導電佈線200’上,使該基板21電性連接該承載件20。
Furthermore, the
所述之作用件22係架設於該承載件20之第一側20a上,且該作用件22具有複數電性連接該線路層210之導電端子220,221。
The
於本實施例中,該作用件22係如介電材之非金屬材塊體,以作為測試頭,且該導電端子220,221係為探針結構,如彈簧針(pogo pin)、插塞(bullet)、雙頭探針或其它型式等,其可相對該作用件22上、下彈性移動。例如,該導電端子220,221係可彈性移動地穿設該作用件22,以令該導電端子220,221之其中一端部接觸該基板21之線路層210之電性接觸墊,而另一端部接觸一目標測試物9之接點。具體地,該目標測試物9係為包含天線結構之電子封裝件,其電子元件可具有毫米波(mmWave)功能,但有關該目標測試物9之態樣並無特別限制。
In this embodiment, the acting
再者,該作用件22係藉由支撐件24堆疊於該承載件20之第一側20a上,以於該作用件22與該承載件20之第一側20a之間形成一容置空間S,使該基板21位於該容置空間S中。例如,該支撐件24係為螺絲、螺桿或可用於承靠作
用件22的框體,以螺接該作用件22與該承載件20,使該作用件22固定於該承載件20上。
Furthermore, the acting
所述之傳輸線23係配置於該基板21上且電性連接該導電佈線200(或該外接埠口201)與該導電端子221。
The
於本實施例中,該傳輸線23係以可拆裝之方式設置於該基板21之外表面上,如黏貼、嵌卡、圈套或其它等固定方式。於其他實施例中,傳輸線23亦可是基板製程的方式所製作的線路層。應可理解地,有關可拆裝方式之種類繁多,並無特別限制。
In this embodiment, the
於使用該檢測裝置2時,將該些導電端子220,221接合該目標測試物9之接點,以完成有效的電性連接動作。接著,於進行天線檢測作業時,該目標測試物9之天線結構會將射頻(RF)訊號經由該導電端子221、傳輸線23與導電佈線200傳送至該外接埠口201,再藉由該外接埠口201將該射頻(RF)訊號傳遞至一如測試機之電子裝置(圖略)。
When using the
另一方面,若進行其它功能檢測作業時,該目標測試物9之功能電極墊會將功能訊號經由該導電端子220、線路層210(導電凸塊211)與導電佈線200’傳送至該承載件20之轉接埠口201’,再藉由該轉接埠口201’將該功能訊號傳遞至如測試機之電子裝置(圖略)。
On the other hand, when other functional testing operations are performed, the functional electrode pads of the
因此,本發明之檢測裝置2,主要藉由該傳輸線23配置於該基板21上,以縮短該RF訊號之傳遞路徑,故相較於習知技術,本發明之檢測裝置2於天線檢測作業時能有效減少該RF訊號之衰減,以提升測試結果之準確度。
Therefore, the
上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。 The above embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the right of the present invention should be listed in the scope of the patent application described later.
2:檢測裝置 2: Detection device
20:承載件 20: Carrier
20a:第一側 20a: First side
20b:第二側 20b: Second side
200,200’:導電佈線 200,200': Conductive wiring
201:外接埠口 201: External port
201’:轉接埠口 201’: transfer port
21:基板 21: Substrate
210:線路層 210: circuit layer
211:導電凸塊 211: Conductive bumps
22:作用件 22: Action piece
220,221:導電端子 220, 221: Conductive terminals
23:傳輸線 23: Transmission line
24:支撐件 24: Supports
9:目標測試物 9: Target test object
S:容置空間 S: accommodating space
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW515898B (en) * | 2000-12-29 | 2003-01-01 | Samsung Electronics Co Ltd | Test coupon having multiple pattern layers and method for measuring dielectric constant of a memory module board using such a test coupon |
TW595277B (en) * | 2003-04-30 | 2004-06-21 | Cybertan Technology Inc | RF PCB having pads for extracting signal, and tooling for testing the same |
TWI420114B (en) * | 2011-03-22 | 2013-12-21 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI20022028A0 (en) * | 2002-11-14 | 2002-11-14 | Nokia Corp | Improved RF Transmitter-Receiver Device, Device Utilizing Terminal, and Method of Manufacturing a Terminal According to Device |
CN2715341Y (en) * | 2004-07-09 | 2005-08-03 | 威盛电子股份有限公司 | Probe card |
CN201207715Y (en) * | 2008-03-07 | 2009-03-11 | 鸿富锦精密工业(深圳)有限公司 | RF test system and RF test circuit thereof |
CN102103149A (en) * | 2009-12-16 | 2011-06-22 | 深圳富泰宏精密工业有限公司 | Test circuit board |
CN102736007A (en) * | 2011-04-07 | 2012-10-17 | 旺矽科技股份有限公司 | Adjusting method and testing device of high-frequency coupling signals |
CN104297536B (en) * | 2013-07-15 | 2017-11-28 | 旺矽科技股份有限公司 | probe module with feedback test function |
TWI611523B (en) * | 2014-09-05 | 2018-01-11 | 矽品精密工業股份有限公司 | Method for fabricating semiconductor package |
TWI513986B (en) * | 2014-10-13 | 2015-12-21 | 矽品精密工業股份有限公司 | Radiofrequency testing device |
US10666538B2 (en) * | 2015-05-26 | 2020-05-26 | Litepoint Corporation | Method for testing a radio frequency (RF) data packet signal transceiver via a wireless signal path |
US10680727B2 (en) * | 2017-08-29 | 2020-06-09 | Mediatek Inc. | Over the air wireless test system for testing microelectronic devices integrated with antenna |
CN111183554B (en) * | 2017-10-03 | 2021-09-17 | 株式会社村田制作所 | Antenna module and method for inspecting antenna module |
CN108847899A (en) * | 2018-06-19 | 2018-11-20 | Oppo广东移动通信有限公司 | Electronic equipment radio communication Performance Test System, method, device and equipment |
JP6886449B2 (en) * | 2018-11-29 | 2021-06-16 | アンリツ株式会社 | Antenna device and measurement method |
TWI689731B (en) * | 2019-03-18 | 2020-04-01 | 中華精測科技股份有限公司 | Probe card testing device and signal switching module thereof |
-
2020
- 2020-07-28 TW TW109125427A patent/TWI754335B/en active
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW515898B (en) * | 2000-12-29 | 2003-01-01 | Samsung Electronics Co Ltd | Test coupon having multiple pattern layers and method for measuring dielectric constant of a memory module board using such a test coupon |
TW595277B (en) * | 2003-04-30 | 2004-06-21 | Cybertan Technology Inc | RF PCB having pads for extracting signal, and tooling for testing the same |
TWI420114B (en) * | 2011-03-22 | 2013-12-21 |
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