GB2239744A - Testing L.C.D. displays; flexible test circuit contacts - Google Patents

Testing L.C.D. displays; flexible test circuit contacts Download PDF

Info

Publication number
GB2239744A
GB2239744A GB9024225A GB9024225A GB2239744A GB 2239744 A GB2239744 A GB 2239744A GB 9024225 A GB9024225 A GB 9024225A GB 9024225 A GB9024225 A GB 9024225A GB 2239744 A GB2239744 A GB 2239744A
Authority
GB
United Kingdom
Prior art keywords
substrate
protrusions
conductive
terminals
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9024225A
Other versions
GB9024225D0 (en
GB2239744B (en
Inventor
Masao Tanaka
Hideyuki Inugai
Kazuya Kaida
Kimihiko Kajimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of GB9024225D0 publication Critical patent/GB9024225D0/en
Publication of GB2239744A publication Critical patent/GB2239744A/en
Application granted granted Critical
Publication of GB2239744B publication Critical patent/GB2239744B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A test head includes a flexible insulating substrate 111, a plurality of conductive protrusions 121 provided on the substrate and disposed corresponding to positions of a plurality of electric terminals 210 an Icd display 200, and conductive patterns 120 on the substrate, leading from the conductive protrusions 121 to output terminals of a tester 314. The protrusions 121 are firmly pressed onto terminals 210 by a rubber pad 312 of a test head 310. Protrusions 121 may have a variety of different shapes and may extend through the substrate 111 (figs 4, 6 to 11 not shown). <IMAGE>

Description

TITLE OF THE INVENTION Tester Head BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a tester head, and more particularly, it relates to a tester head employed for electrically checking a high density packaging pattern like a pattern of a face mount type substrate to which an LSI chip is directly bonded.
Description of the Prior Art In recent years, high density packaging and miniaturization are advanced in chips of LSI circuits and the like, and accordingly, it is likely that electric terminals are also miniaturized and increased in number. In many cases, such chips are directly mounted on a substrate according to a face bonding method.
In accord with densification and miniaturization of the chips of LSI circuits and the like, the substrate on which those chips are mounted in a manner of face bonding has been also increasingly densified and miniaturized. Thus, it is necessary to check a wiring pattern of the substrate before the bonding of the chips.
On checking the wiring pattern, a probe card 400 as shown in Fig. 5 connects the substrate, or a test object, with a measuring device. The probe card 400 is composed of a substrate 410 having an opening 420 and a plurality of probes 430 radially disposed in the opening 420, where the probes 430 bent at their respective ends like hooks are pressed against electric terminals of the test object to connect the test object with the measuring device (See Japanese Unexamined Patent Publication No. 119544/1988).
However, densification, miniaturization and complication of the wiring pattern lead to a difficulty in checking with a probe card in the mode as mentioned above.
SUMMARY OF THE INVENTION The present invention provides a tester head comprising a flexible insulating substrate, a plurality of conductive protrusions provided on the substrate and disposed corresponding to positions of a plurality of electric terminals of a test object, and conductive patterns provided on the substrate, one ends of the conductive patterns being electrically connected to the conductive protrusions while the other ends are connected to output terminals of a tester, the electric terminals being electrically connected to the output terminals of the tester by uniformly pressing the conductive protrusions against the electric terminals of the test object with an elastic insulating board.
Preferably, the flexible insulating substrate has a plurality of through holes formed corresponding to positions of the electric terminals of the test object, the conductive patterns are formed on the rear face of the substrate, the bottom portions of the conductive protrusions are connected to the conductive patterns on the rear face of the substrate, and the tops of the conductive protrusions shoot out above the surface of the substrate through the through holes.
Pressing protrusions may extend from the bottom faces of the conductive protrusions.
Also preferably, the through holes are formed so that the holes on the surface of the substrate are larger in diameter than the holes on the rear face of the substrate, cross sections of the through holes are stepwise, and the outer diameters of the tops of the conductive protrusions are smaller than the diameters of the holes on the surface of the substrate and larger than the diameters of the holes on the rear face of the substrate.
Thus, the present invention provides a tester head which can measure various electrical characteristics of a test object even if it has more densified and miniaturized patterns.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view showing a tester head of an embodiment according to the present invention; Fig. 2 is a schematic view showing a manner in which the tester head is used to measure various electrical characteristics; Fig. 3 is a schematic plan view showing a measuring device throughout; Fig. 4 is a perspective view showing conductive protrusions of a modified tester head of the embodiment according to the present invention; Fig. 5 is a perspective view showing a prior art probe employed for the measuring; Fig. 6 is a schematic, perspective, partially cutaway view showing a tester head of another embodiment according to the present invention; Fig. 7 is a sectional view showing conductive protrusions of a modified tester head of the embodiment according to the present invention;; Fig. 8 is a schematic, perspective, partially cutaway view showing a tester head of still another embodiment according to the present invention; Fig. 9 is a side view showing the tester head in Fig. 8; Fig. 10 is a schematic, perspective, partially cutaway view showing a tester head of yet another embodiment according to the present invention; and Fig. 11 is aside view showing the tester head in Fig.
10.
DESCRIPTION OF TI1E PREFERRED EMBODIMENTS The present invention will now be described in conjunction with embodiments 1 through 4 shown in the accompanying drawings.
(Embodiment 1 Fig. 1 is a schematic perspective view showing a tester head of an embodiment according to the present invention, Fig. 2 is a schematic view showing a manner in which the tester head is used to measure various electrical characteristics, Fig. 3 is a schematic plan view showing a measuring device throughout, and Fig. 4 is a perspective view showing conductive protrusions of a modified tester head of the embodiment according to the present invention. In this embodiment, a liquid crystal display 200 is employed as an exemplary test object.
A tester head 100 of this embodiment, which is employed for measuring various electrical characteristics of the liquid crystal display 200, is made of a flexible film 110 which is formed with conductive patterns 120 on its rear face 111, which are, in turn, provided with conductive protrusions 121 at the respective ends; and the conductive protrusions 121 are pressed against electric terminals 210.
The flexible film 110 is made of a flexible material such as polyimide film and the like and formed with predetermined conductive patterns 120 on its surface. The conductive patterns 120 are designed depending upon the liquid crystal display 200.
The conductive protrusions 121 are semi-spherical in shape and positioned at the ends of the conductive patterns 120. The conductive protrusions 121 are pressed against the electric terminals 210 of the liquid crystal display 200.
The conductive protrusions 121 are formed by etching copper film which is formed on the surface 11.1 of the flexible film 110 or by plating the surface 111 of the flexible film 110 with copper. Simultaneously, the conductive patterns 120 are formed.
Then, the measuring of electrical characteristics of the liquid crystal display 200 employing the tester head 100 of this embodiment will be described with reference to Figs. 2 and 3.
A test device 300 is, as shown in Fig. 3, composed of a contact portion 310 in which the liquid crystal display 200 and the tester head 100 are aligned with and pressed against each other between the electric terminals 210 of the liquid crystal display 200 and the conductive protrusions 121 of the tester head 100, a test unit 320 for checking the liquid crystal display 200, a control unit 330 for controlling the test device 300 throughout, and the like.
The contact portion 310 comprises a plate 311 for pressing the tester head 100 on its rear face against the liquid crystal display 200, pressure rubber 312 interposed between the plate 311 and the tester head 100 to divergently applying the pressure to the conductive protrusions 121, a connector 314 connecting the test unit 320 to the tester head 100, and a wiring board 313.
Thus, simply pressing the conductive protrusions 121 of the tester head 100 against the electric terminals 210 of the liquid crystal display 200, the tester head 100 can be connected to the test unit 320 to measure the electrical characteristics of the liquid crystal display 200.
The shape of each of the conductive protrusions 121 are not limited to a semi-sphere as shown in Fig. 1, but may be a short cylinder, for example, as shown in Fig. 4.
A tester head of this embodiment has conductive patterns formed on a surface of a flexible film and having conductive protrusions which are pressed against electric terminals of a test object, so that it can test the test object having more densified and miniaturized electric terminals.
(Embodiment 2 Fig. 6 is a schematic, perspective, partially cutaway view showing a tester head of another embodiment according to the present invention, while Fig. 7 is a sectional view showing a conductive protrusion of a modified tester head of the embodiment. Similar to the previous embodiment, in this embodiment, a liquid crystal display 200 is employed as an exemplary test object.
A tester head 100 of this embodiment, which is employed for measuring various electrical characteristics of the liquid crystal display 200, is made of a flexible film 110 which is provided with through holes 113 corresponding to electric terminals 210 of the liquid crystal display 200 and which has predetermined conductive patterns 120 on its rear face 111. Conductive protrusions 121 extend from the ends of the conductive patterns 120 and shoot out through the through holes 113 above a surface 112.
The flexible film 110 is made of a flexible material~ such as polyimide film and the like and formed with predetermined conductive patterns 120 on its rear surface 111. The conductive patterns 120 are designed depending upon the liquid crystal display 200. The flexible film 110 is provided with the circular through holes 113 corresponding to the electric terminals 210 of the liquid crystal display 200 and to the ends of the conductive patterns 120 as well.
In the ends of the conductive patterns 120, the semispherical conductive protrusions 121 are formed. Thus, the conductive protrusions 121 shoot out through the through holes 113 above the surface 112 of the flexible film 110.
The conductive protrusions 121 are pressed against the electric terminals 210 of the liquid crystal display 200.
The conductive protrusions 121 are formed by plating the ends of the conductive patterns 120 through the through holes 113.
The measuring of electrical characteristics of the liquid crystal display 200 with the tester head 100 of this embodiment is performed in the same manner as in the previous embodiment.
Although it has been stated that the conductive protrusions 121 are semi-spherical in shape, the present invention is not limited to the precise form of the previous statement. For example, the conductive protrusions may have shapes of truncated pyramids as shown in Fig. 7 so long as they shoot out above the surface 112 through the through holes 113 of the flexible film 110.
A tester head of this embodiment, which is employed for measuring various electrical characteristics of a test object, is made of a flexible film which is provided with through holes corresponding to electric terminals of the test object and which has predetermined conductive patterns in its rear face, where conductive protrusions formed in the ends of the conductive patterns shoot out above a surface of the flexible film through the through holes, and the conductive protrusions are pressed against the electric terminals of the test object to connect a measuring device with the test object. In this way, a test object having more densified and miniaturized electric terminals can be tested.
(Embodiment 3 Fig. 8 is a schematic, perspective, partially cutaway view showing a tester head of still another embodiment according to the present invention, while Fig. 9 is a side view showing the tester head. Similar to the previous embodiments, in this embodiment, a liquid crystal display 200 is employed as an exemplary test object.
The tester head 100 of this embodiment, which is employed for measuring various electrical characteristics of the liquid crystal display 200, is made of a flexible film 110 which is provided with through holes 113 corresponding to electric terminals 210 of the liquid crystal display 200 and which has predetermined conductive patterns 120 on its rear face 111. Semi-spherical conductive protrusions 121 extend from the ends of the conductive patterns 120 and shoot out through the through holes 113 above a surface 112, and pressing protrusions 122 are further formed on the rear face 111.
The flexible film 110 is made of a flexible material such as polyimide film and the like and formed with predetermined conductive patterns 120 on its rear surface 111 by etching or the like. The conductive patterns 120 are designed depending upon the liquid crystal display 200. The flexible film 110 is also provided with circular through holes 113 corresponding to the electric terminals 210 of the liquid crystal display 200 and to the ends of the conductive patterns 120 as well.
The conductive protrusions 121 are semi-spherical in shape, which are smaller in diameter than the through holes 113, and are positioned in the ends of the conductive patterns 120. Thus, the conductive protrusions 121 shoot out through the through holes 113 above the surface 112 of the flexible film 110. The conductive protrusions 121 are pressed against the electric terminals 210 of the liquid crystal display 200. The conductive protrusions 121 are formed by plating the ends of the conductive patterns 120 through the through holes 113.
On the rear face 111 of the flexible film 110, almost semi-spherical pressing protrusions 122, which are larger in diameter than the conductive protrusions 121 and the through holes 113, are formed. The pressing protrusions 122 are designed to close the through holes 113 at the rear face 111.
The pressing protrusions 122 are formed by plating, similar to the conductive protrusions 121. In other words, the conductive protrusions 121 and the pressing protrusions 122 are formed as unities.
The measurement of electrical characteristics of the liquid crystal display 200 with the tester head 100 of this embodiment is. performed in the same manner as in the previous embodiments. At this time, when the conductive protrusions 121 are pressed against the electric terminals 210 of the liquid crystal display 200, the pressing protrusions 122 are thrust into pressure rubber 312, so that the pressure of a plate 311 is assuredly transmitted to the conductive protrusions 121. In other words, the conductive protrusions 121 assuredly come into contact with the electric terminals 210 with a certain pressing force.
Although it has been stated that the conductive protrusions 121 are almost semi-spherical in shape, the present invention is not limited to the precise form of the previous statement. Other shapes are possible so long as the conductive protrusions 121 shoot out above the surface 112 of the flexible film 110 and the pressing protrusions 122 shoot out below the rear face 111.
A tester head of this embodiment, which is employed for measuring various electrical characteristics of a test object, is made of a flexible film which is provided with through holes corresponding to electric terminals of the test object and which has predetermined conductive patterns in its rear face, where conductive protrusions formed in the ends of the conductive patterns shoot out above the surface of the flexible film through the through holes, and pressing protrusions are also formed on the rear face. In this way, a test object having more densified and miniaturized electric terminals can be tested, and the electric terminals of the test object and the conductive protrusions can be in contact with each other with a certain pressing force. Thus, the electrical characteristics can be more assuredly measured.
Embodiment 41 Fig. 10 is a schematic, perspective, partially cutaway view showing a tester head of yet another embodiment according to the present invention, while Fig. 11 is a side view of the tester head.
The tester head 100 of this embodiment, which is employed for measuring various electrical characteristics of the liquid crystal display 200, is made of a flexible film 110 which is provided with through holes 113 at two levels corresponding to electric terminals 210 of the liquid crystal display 200 and which has predetermined conductive patterns 120 on its rear face 111. Semi-spherical conductive protrusions 121 extend from the ends of the conductive patterns 120 and shoot out through the through holes 113 above a surface 112.
The flexible film 110 is made of a flexible material such as polyimide film and the like, and formed with the predetermined conductive patterns 120 on its rear surface 111 by etching or the like. The conductive patterns 120 are designed depending upon the liquid crystal display 200. The flexible film 110 is also provided with the circular through holes 113 at two levels corresponding to the electric terminals 210 of the liquid crystal display 200 and to the ends of the conductive patterns 120 as well.
The conductive protrusions 121 are semi-spherical in shape, which are smaller in diameter than the through holes 113, and are positioned at the ends of the conductive patterns 120. Thus, the conductive protrusions 121 shoot out through the through holes 113 above the surface 112 of the flexible film 110. The conductive protrusions 121 are pressed against the electric terminals 210 of the liquid crystal display 200. The conductive protrusions 121 are formed by plating the ends oE the conductive patterns 120 through the through holes 113.
The measurement of electrical characteristics of the liquid crystal display 200 with the tester head 100 of this embodiment is performed in the same manner as in the previous embodiments.
Thus, simply pressing the conductive protrusions 121 of the tester head 100 against the electric terminals 210 of the liquid crystal display 200, the tester head 100 is connected to a test unit to measure the electrical characteristics.
Although it has been stated that the conductive protrusions 121 are almost semi-spherical in shape, the present invention is not limited to the precise form of the previous statement. Other shapes are possible so long as the conductive protrusions 121 shoot out above the surface 112 of the flexible film 110.
Also, although it has been stated that the through holes 113 are formed at two levels, the present invention is not limited to the precise form of the previous statement. Other forms are possible so long as the bottom portions of the conductive protrusions 121 are smaller in diameter than their top portions.
A tester head of this embodiment, which is employed for measuring various electrical characteristics of a test object, is made of a flexible film which has predetermined conductive patterns on its rear face, where conductive protrusions formed in the ends of the conductive patterns shoot out above the surface of the flexible film through through holes formed corresponding to electric terminals of the test object. In the tester head, the through holes are disposed at two levels, and hence, the bottom portions of the conductive protrusions are electrically isolated but the conductive patterns are not. In this way, the conductive pattern can be formed indifferent of the shape of the conductive protrusions, a test object having more densified and miniaturized electric terminals can be tested, and the electric terminals of the test object and the conductive protrusions can be in contact with each other with a certain pressing force. Thus, the electrical characteristics can be more assuredly measured.
The invention being thus described, it will be obvious that the same may be varied in many ways.
Such variations are not to be regarded as a departure from the scope of the invention.
There are described above novel features which the skilled man will appreciate give rise to advantages. These are each independent aspects of the invention to be covered by the present application, irrespective of whether or not they are included within the scope of the following claims.

Claims (13)

CLAIMS:
1. A tester head comprising: a flexible insulating substrate; a plurality of conductive protrusions provided on said substrate and disposed corresponding to positions of a plurality of electric terminals of a test object; and conductive patterns provided on said substrate, one ends of said conductive patterns being electrically connected to said conductive protrusions while the other ends are connected to output terminals of a tester; said electric terminals being electrically connected to said output terminals of the tester by uniformly pressing said conductive protrusions against said electric terminals of the test object with an elastic insulating board.
2. A tester head according to claim 1, wherein said flexible insulating substrate has a plurality of through holes formed corresponding to positions of said electric terminals of the test object, said conductive patterns are formed on the rear face of said substrate, the bottom portions of said conductive protrusions are connected to said conductive patterns on the rear face of said substrate, and the tops of said conductive protrusions shoot out above the surface of said substrate through said through holes.
3. A tester head according to claim 2, wherein pressing protrusions extend from the bottom faces of said conductive protrusions.
4. A tester head according to claim 2, wherein said through holes are formed so that the holes on the surface of said substrate are larger in diameter than the holes on the rear face of said substrate, cross. sections of said through holes are stepwise, and the outer diameters of the tops of said conductive protrusions are smaller than the diameters of the holes on the surface of said substrate and larger than the diameters of the holes on the rear face of said substrate.
5. A tester head of claim 1 which is adopted to measure electrical characteristics of a liquid crystal display.
6. A connector for connecting terminals of a test circuit to a tester comprising: a flexible insulating substrate; a plurality of conductive protrusions carried by the substrate and connectable to respective output terminals of the tester, the protrusions protruding beyond the plane of the substrate in an arrangement corresponding to the arrangement of the terminals of the test circuit; whereby the flexing of the substrate can facilitate the bringing into contact of the protrusions with the test circuit terminals.
7. A method for connecting terminals of a test circuit to a tester, utilising a flexible insulating layer and a connector, the connector comprising a flexible insulating substrate, a plurality of conductive protrusions carried by the substrate and connectable to respective output terminals of the tester, the protrusions protruding beyond the plane of the substrate in an arrangement corresponding to the arrangement of the terminals of the test circuit, whereby flexing of the substrate can facilitate the bringing into contact of the protrusions with the test circuit terminals, the method comprising the steps: aligning the conductive protrusions with the terminals of the test circuit; and effecting electrical contact between the protrusions and the terminals through the application of pressure to the insulating board disposed adjacent the side of the substrate opposite to that beyond which the protrusions protrude.
8. A connector substantially as hereinbefore described with reference to Figures 1 and 2 of the drawings.
9. A connector substantially as hereinbefore described with reference to Figures 4 of the drawings.
10. A connector substantially as hereinbefore described with reference to Figures 6 of the drawings.
11. A connector substantially as hereinbefore described with reference to Figure 7 of the drawings.
12. A connector substantially as hereinbefore described with reference to Figures 8 and 9 of the drawings.
13. A connector substantially as hereinbefore described with reference to Figures 10 and 11 of the drawings.
GB9024225A 1989-11-07 1990-11-07 Tester head Expired - Fee Related GB2239744B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28979389 1989-11-07
JP29063689 1989-11-08
JP30003389 1989-11-17

Publications (3)

Publication Number Publication Date
GB9024225D0 GB9024225D0 (en) 1990-12-19
GB2239744A true GB2239744A (en) 1991-07-10
GB2239744B GB2239744B (en) 1994-03-16

Family

ID=27337533

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9024225A Expired - Fee Related GB2239744B (en) 1989-11-07 1990-11-07 Tester head

Country Status (1)

Country Link
GB (1) GB2239744B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0468491A2 (en) * 1990-07-25 1992-01-29 Canon Kabushiki Kaisha Method for checking parts to be measured
EP0613014A1 (en) * 1993-02-25 1994-08-31 Hughes Aircraft Company Test probe for liquid crystal display panel
US5933018A (en) * 1995-08-29 1999-08-03 Shin-Etsu Polymer Co., Ltd. Liquid crystal display panel inspection device and method for manufacturing same
EP1418436A3 (en) * 1999-08-17 2005-07-06 Formfactor, Inc. Electrical contactor, especially wafer level contactor, using fluid pressure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0226995A2 (en) * 1985-12-23 1987-07-01 Tektronix, Inc. Multiple lead probe for integrated circuits
WO1988005544A1 (en) * 1987-01-20 1988-07-28 Hughes Aircraft Company Test connector for electrical devices
EP0294936A1 (en) * 1987-05-06 1988-12-14 Reflex Promotion A/S A method and a transfer for decorating textiles
EP0304868A2 (en) * 1987-08-28 1989-03-01 Tektronix Inc. Multiple lead probe for integrated circuits in wafer form
EP0331282A1 (en) * 1988-03-01 1989-09-06 Hewlett-Packard Company Membrane-based IC test probe with precisely positioned contacts
EP0361779A1 (en) * 1988-09-26 1990-04-04 Hewlett-Packard Company Micro-strip architecture for membrane test probe

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0226995A2 (en) * 1985-12-23 1987-07-01 Tektronix, Inc. Multiple lead probe for integrated circuits
WO1988005544A1 (en) * 1987-01-20 1988-07-28 Hughes Aircraft Company Test connector for electrical devices
EP0294936A1 (en) * 1987-05-06 1988-12-14 Reflex Promotion A/S A method and a transfer for decorating textiles
EP0304868A2 (en) * 1987-08-28 1989-03-01 Tektronix Inc. Multiple lead probe for integrated circuits in wafer form
EP0331282A1 (en) * 1988-03-01 1989-09-06 Hewlett-Packard Company Membrane-based IC test probe with precisely positioned contacts
EP0361779A1 (en) * 1988-09-26 1990-04-04 Hewlett-Packard Company Micro-strip architecture for membrane test probe

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0468491A2 (en) * 1990-07-25 1992-01-29 Canon Kabushiki Kaisha Method for checking parts to be measured
EP0468491A3 (en) * 1990-07-25 1994-06-15 Canon Kk Method for checking parts to be measured
US5521520A (en) * 1990-07-25 1996-05-28 Canon Kabushiki Kaisha Method and apparatus for checking parts to be measured using a belt-like connection member
EP0613014A1 (en) * 1993-02-25 1994-08-31 Hughes Aircraft Company Test probe for liquid crystal display panel
US5378982A (en) * 1993-02-25 1995-01-03 Hughes Aircraft Company Test probe for panel having an overlying protective member adjacent panel contacts
US5933018A (en) * 1995-08-29 1999-08-03 Shin-Etsu Polymer Co., Ltd. Liquid crystal display panel inspection device and method for manufacturing same
EP1418436A3 (en) * 1999-08-17 2005-07-06 Formfactor, Inc. Electrical contactor, especially wafer level contactor, using fluid pressure

Also Published As

Publication number Publication date
GB9024225D0 (en) 1990-12-19
GB2239744B (en) 1994-03-16

Similar Documents

Publication Publication Date Title
US6476626B2 (en) Probe contact system having planarity adjustment mechanism
US5949246A (en) Test head for applying signals in a burn-in test of an integrated circuit
US6091250A (en) Discrete die burn-in for nonpackaged die
US5986460A (en) BGA package semiconductor device and inspection method therefor
KR100309889B1 (en) Probe Device
US5892245A (en) Ball grid array package emulator
US6062873A (en) Socket for chip package test
US5949242A (en) Method and apparatus for testing unpackaged semiconductor dice
US20070123082A1 (en) Interconnect Assemblies And Methods
KR20010085477A (en) IC socket for surface-mounting semiconductor device
JP7198127B2 (en) Interposers, sockets, socket assemblies and wiring board assemblies
US6429516B1 (en) Structure for mounting a bare chip using an interposer
KR20010070133A (en) Contact structure having silicon finger contactors and total stack-up structure using same
US20010040464A1 (en) Electric contact device for testing semiconductor device
US5977784A (en) Method of performing an operation on an integrated circuit
JPH07109840B2 (en) Semiconductor IC test apparatus and test method
US5497103A (en) Test apparatus for circuitized substrate
GB2239744A (en) Testing L.C.D. displays; flexible test circuit contacts
KR200383947Y1 (en) connector for chip test
US20040257096A1 (en) Back side probing method and assembly
KR100356823B1 (en) Probe card
KR20010076322A (en) Contact structure having contact bumps
KR940009571B1 (en) Burn in socket
US6469257B2 (en) Integrated circuit packages
JP2000227443A (en) Probe card

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20051107