CN108205081B - Device for measuring return loss of microscale solder balls - Google Patents
Device for measuring return loss of microscale solder balls Download PDFInfo
- Publication number
- CN108205081B CN108205081B CN201810055406.8A CN201810055406A CN108205081B CN 108205081 B CN108205081 B CN 108205081B CN 201810055406 A CN201810055406 A CN 201810055406A CN 108205081 B CN108205081 B CN 108205081B
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- China
- Prior art keywords
- printed circuit
- circuit board
- sma
- microscale
- solder balls
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 48
- 238000005259 measurement Methods 0.000 claims abstract description 9
- 230000005611 electricity Effects 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 24
- 238000010586 diagram Methods 0.000 description 4
- 210000001503 joint Anatomy 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a device for measuring return loss of microscale solder balls, which comprises a first printed circuit board and a second printed circuit board which is completely consistent with the structure and arrangement of the first printed circuit board, wherein the first printed circuit board is provided with pin mounting holes with the same number as that of SMA pins, SMA contact pin mounting holes and SMA alignment points which are positioned according to the pin mounting holes, the SMA contact pin mounting holes and the SMA alignment points can conduct electricity, the front surface of the first printed circuit board is provided with a bonding pad, the bonding pad is provided with microscale solder balls, a connecting lead is arranged between the bonding pad and the SMA alignment points, the SMA pins and the contact pins are inserted from the back surface of the first printed circuit board, and the edge of the first printed circuit board is also provided with positioning holes; the front face of the first printed circuit board is abutted with the front face of the second printed circuit board. The device has low cost and easy realization, and can realize the measurement of the return loss of the microscale solder balls.
Description
Technical Field
The invention relates to the technology of electronic packaging elements, in particular to a device for measuring return loss of microscale solder balls.
Background
With the continuous development of miniaturization, multifunction and high integration of electronic products, the demand for new packaging technologies is increasing, and the new packaging technologies are required to have more I/O pin counts, smaller pin pitches, smaller dimensions, higher electrical and thermal properties, higher reliability and lower cost. The microscale ball grid array microscale solder ball which is one of the novel packaging technologies has excellent balls with small size, high integration density, improved product performance, improved chip running speed and the like, and can meet the requirements of electronic products on small volume and light weight.
Because the parasitic capacitance which is not ignored is generated inside the micro-scale solder ball under the high-frequency condition, the parasitic capacitance slows down the rising edge of a signal, the signal transmission speed is reduced, and the micro-scale solder ball has self-inductance under the high-frequency condition, when the frequency is increased, the resistance in the micro-scale solder ball is increased due to the high-frequency skin effect, so that the impedance is increased, and the return loss in the micro-scale solder ball is increased due to the changes, so that the signal integrity of the micro-scale solder ball is poor. The measurement of return loss of the microscale solder balls is always a difficult problem, and the microscale solder balls are very small in size and difficult to operate.
Disclosure of Invention
The invention aims at overcoming the defects of the prior art and provides a device for measuring return loss of microscale solder balls. The device has low cost and easy realization, and can realize the measurement of the return loss of the microscale solder balls.
The technical scheme for realizing the aim of the invention is as follows:
an apparatus for measuring return loss of microscale solder balls comprises
The circuit comprises a first printed circuit board, wherein the first printed circuit board is provided with pin mounting holes with the same number as that of pins of a microwave high-frequency connector (Sub-Miniture-A, for short, SMA), SMA pin mounting holes and SMA alignment points, the positions of the SMA pin mounting holes are determined according to the SMA pin mounting holes, the SMA pin mounting holes and the SMA alignment points can conduct electricity, the front surface of the first printed circuit board is provided with a bonding pad, the bonding pad is provided with a microscale solder ball, a connecting lead is arranged between the bonding pad and the SMA alignment points, the SMA pins and the pins are inserted from the back surface of the first printed circuit board, and the edge of the first printed circuit board is also provided with a positioning hole;
the second printed circuit board is provided with other structures and settings which are completely consistent with those of the first printed circuit board except that no micro-scale solder balls are arranged on the second printed circuit board;
the front surface of the first printed circuit board is in butt joint with the front surface of the second printed circuit board, wherein the end heads of the SMA contact pins on the first printed circuit board are in butt joint with the SMA alignment points on the second printed circuit board, the microscale solder balls on the first printed circuit board are communicated with the connecting leads on the second printed circuit board, the end heads of the SMA contact pins on the second printed circuit board are in butt joint with the SMA alignment points on the first printed circuit board, and the positioning holes on the first printed circuit board are in butt joint with the corresponding positioning holes on the second printed circuit board.
The height of the microscale solder balls is adjustable.
The microscale solder balls are not in direct contact with pins of the SMA, but rather are connected by forming loops between the pins.
The diameter of the microscale solder balls is not greater than 0.3 mm.
The microscale solder ball is positioned between the front surface of the first printed circuit board and the front surface of the second printed circuit board, and the height of the microscale solder ball can be accurately controlled by arranging the feeler gauge between the two circuit boards in the welding process. The device is connected to a vector network instrument through a low-loss cable, two ends of the device are connected with the vector network analyzer through two SMAs on a test sample piece, the vector network analyzer is used for measuring return loss values of welding spots, the adopted vector network analyzer is produced by KEYSIGHT, the model is N5221A, and the working frequency band is 10MHz-13.5GHZ.
The device has low cost and easy realization, and can realize the measurement of the return loss of the microscale solder balls.
Drawings
FIG. 1 is a schematic diagram of an embodiment;
fig. 2 is a schematic structural diagram of a first printed circuit board 101-1 according to an embodiment;
FIG. 3 is a diagram of a solder joint return loss test system connection in an embodiment.
In the figure, 101-1, first printed circuit board 101-2, second printed circuit board 102, sma pin mounting holes 103, sma pin mounting holes 104, sma alignment points 105, bonding pads 106, positioning holes 107, micro-scale solder balls 108, sma 109, leads 111, low loss cables 112, and vector network.
Detailed Description
The present invention will now be further illustrated with reference to the drawings and examples, but is not limited thereto.
Examples:
referring to fig. 1 and 2, an apparatus for microscale solder ball return loss measurement includes
The first printed circuit board 101-1, the first printed circuit board 101-1 is provided with pin mounting holes 102 with the same number as that of pins of SMA108, SMA contact pin mounting holes 103 and SMA alignment points 104 which are positioned according to the pin mounting holes 102, the SMA contact pin mounting holes 103 and the SMA alignment points 104 can conduct electricity, the front surface of the first printed circuit board 101-1 is provided with a bonding pad 105, the bonding pad 105 is provided with a microscale solder ball 107, a connecting lead 109 is arranged between the bonding pad 105 and the SMA alignment points 104, pins of SMA108 and contact pins are inserted from the back surface of the first printed circuit board 101-1, and the edge of the first printed circuit board 101-1 is also provided with a positioning hole 106;
the second printed circuit board 101-2, wherein the structure and arrangement of the second printed circuit board 101-2 are completely identical to those of the first printed circuit board 101-1 except that no micro-scale solder balls are arranged on the second printed circuit board 101-2;
the front surface of the first printed circuit board 101-1 is abutted against the front surface of the second printed circuit board 101-2, wherein the end of the SMA108 pin on the first printed circuit board 101-1 is in opposite contact with the SMA alignment point on the second printed circuit board 101-2, the micro-scale solder ball 107 on the first printed circuit board 101-1 is communicated with the connecting lead on the second printed circuit board 101-2, the end of the SMA pin on the second printed circuit board 101-2 is in opposite contact with the SMA alignment point 104 on the first printed circuit board 101-1, and the positioning hole 106 on the first printed circuit board 101-1 is in opposite contact with the corresponding positioning hole on the second printed circuit board 101-2 to fix the two printed circuit boards.
The height of the micro-scale solder balls 107 is adjustable.
The microscale solder balls 107 do not make direct contact with pins of the SMA108, but rather the connection is made by forming loops between the pins.
The diameter of the micro-scale solder balls 107 is not greater than 0.3 mm.
The microscale solder ball 107 is located between the front surface of the first printed circuit board 101-1 and the front surface of the second printed circuit board 101-2, and by placing the feeler gauge between the two circuit boards during the soldering process, the highly accurate control of the microscale solder ball can be realized. The device is connected to a vector network analyzer 112 through a low-loss cable 111, two ends of the device are connected with the vector network analyzer 112 through two SMAs on a test sample piece, the vector network analyzer 112 is used for measuring the return loss value of a welding spot, the adopted vector network analyzer is produced by KEYSIGHT, the model is N5221A, the working frequency band is 10MHz-13.5GHz, and a connection diagram of a signal integrity test experiment measurement system of a microscale BGA welding spot is shown in figure 3.
Claims (4)
1. An apparatus for measuring return loss of microscale solder balls, comprising
The circuit comprises a first printed circuit board, wherein the first printed circuit board is provided with pin mounting holes with the same number as the SMA pins, SMA contact pin mounting holes and SMA alignment points, the positions of the SMA contact pin mounting holes and the SMA alignment points are determined according to the pin mounting holes, the SMA contact pin mounting holes and the SMA alignment points can conduct electricity, the front surface of the first printed circuit board is provided with a bonding pad, a microscale solder ball is arranged on the bonding pad, a connecting lead is arranged between the bonding pad and the SMA alignment points, the SMA pins and the contact pins are inserted from the back surface of the first printed circuit board, and the edge of the first printed circuit board is also provided with positioning holes;
the second printed circuit board is provided with other structures and settings which are completely consistent with those of the first printed circuit board except that no micro-scale solder balls are arranged on the second printed circuit board;
the front surface of the first printed circuit board is abutted with the front surface of the second printed circuit board, wherein the end heads of the SMA contact pins on the first printed circuit board are in opposite contact with the SMA alignment points on the second printed circuit board, the microscale solder balls on the first printed circuit board are communicated with the connecting leads on the second printed circuit board, the end heads of the SMA contact pins on the second printed circuit board are in opposite contact with the SMA alignment points on the first printed circuit board, the positioning holes on the first printed circuit board are in opposite contact with the corresponding positioning holes on the second printed circuit board, the two printed circuit boards are fixed to be abutted, and the accurate control of the height of the microscale solder balls is realized by arranging the feelers between the two circuit boards in the welding process.
2. The apparatus for microscale solder ball return loss measurement according to claim 1, wherein the height of the microscale solder ball is adjustable.
3. An apparatus for microscale solder ball return loss measurement according to claim 1, wherein the microscale solder balls are not in direct contact with pins of the SMA, but are connected by forming loops between the pins.
4. An apparatus for microscale solder ball return loss measurement according to claim 1, wherein,
the diameter of the microscale solder balls is not greater than 0.3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810055406.8A CN108205081B (en) | 2018-01-19 | 2018-01-19 | Device for measuring return loss of microscale solder balls |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810055406.8A CN108205081B (en) | 2018-01-19 | 2018-01-19 | Device for measuring return loss of microscale solder balls |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108205081A CN108205081A (en) | 2018-06-26 |
| CN108205081B true CN108205081B (en) | 2024-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810055406.8A Active CN108205081B (en) | 2018-01-19 | 2018-01-19 | Device for measuring return loss of microscale solder balls |
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| CN (1) | CN108205081B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109408844B (en) * | 2018-07-11 | 2022-12-09 | 桂林电子科技大学 | Method for optimizing random vibration stress and return loss of chip packaging welding spot |
| CN109298320B (en) * | 2018-11-19 | 2021-06-11 | 郑州云海信息技术有限公司 | Detection method, device and equipment for BGA packaged product and storage medium |
| CN117665528A (en) * | 2022-08-25 | 2024-03-08 | 加特兰微电子科技(上海)有限公司 | Solder ball detection device, printed circuit board, radio frequency chip and electronic equipment |
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| US6411113B1 (en) * | 1999-11-19 | 2002-06-25 | Telefonaktiebolaget Lm Ericsson (Publ) | Radio frequency test fixture |
| US7525299B1 (en) * | 2008-06-27 | 2009-04-28 | International Business Machines Corporation | Apparatus for accessing and probing the connections between a chip package and a printed circuit board |
| CN201819971U (en) * | 2010-09-15 | 2011-05-04 | 晶诚（郑州）科技有限公司 | Metal welding ball grid array package testing device |
| CN105990296A (en) * | 2015-02-15 | 2016-10-05 | 展讯通信（上海）有限公司 | Chip connecting structure and manufacturing process |
| CN106028641A (en) * | 2016-06-15 | 2016-10-12 | 中国电子科技集团公司第二十九研究所 | High-frequency transmission based LTCC and PCB perpendicular interconnecting structure and method |
| KR101744015B1 (en) * | 2016-03-18 | 2017-06-07 | 주식회사 오킨스전자 | Method for manufacturing test socket preventing vertical deviation of solder ball |
| CN207662969U (en) * | 2018-01-19 | 2018-07-27 | 桂林电子科技大学 | A kind of device measured for minute yardstick soldered ball return loss |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7063542B2 (en) * | 2002-06-13 | 2006-06-20 | Paricon Technologies Corporation | Compliant electrical probe device incorporating anisotropically conductive elastomer and flexible circuits |
| US9329227B2 (en) * | 2012-10-24 | 2016-05-03 | Nvidia Corporation | Method and apparatus for testing interconnection reliability of a ball grid array on a testing printed circuit board |
-
2018
- 2018-01-19 CN CN201810055406.8A patent/CN108205081B/en active Active
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|---|---|---|---|---|
| US6411113B1 (en) * | 1999-11-19 | 2002-06-25 | Telefonaktiebolaget Lm Ericsson (Publ) | Radio frequency test fixture |
| US7525299B1 (en) * | 2008-06-27 | 2009-04-28 | International Business Machines Corporation | Apparatus for accessing and probing the connections between a chip package and a printed circuit board |
| CN201819971U (en) * | 2010-09-15 | 2011-05-04 | 晶诚（郑州）科技有限公司 | Metal welding ball grid array package testing device |
| CN105990296A (en) * | 2015-02-15 | 2016-10-05 | 展讯通信（上海）有限公司 | Chip connecting structure and manufacturing process |
| KR101744015B1 (en) * | 2016-03-18 | 2017-06-07 | 주식회사 오킨스전자 | Method for manufacturing test socket preventing vertical deviation of solder ball |
| CN106028641A (en) * | 2016-06-15 | 2016-10-12 | 中国电子科技集团公司第二十九研究所 | High-frequency transmission based LTCC and PCB perpendicular interconnecting structure and method |
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| Publication number | Publication date |
|---|---|
| CN108205081A (en) | 2018-06-26 |
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