CN105990296A - Chip connecting structure and manufacturing process - Google Patents
Chip connecting structure and manufacturing process Download PDFInfo
- Publication number
- CN105990296A CN105990296A CN201510083046.9A CN201510083046A CN105990296A CN 105990296 A CN105990296 A CN 105990296A CN 201510083046 A CN201510083046 A CN 201510083046A CN 105990296 A CN105990296 A CN 105990296A
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- CN
- China
- Prior art keywords
- chip
- pin
- circuit board
- printed circuit
- connecting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to the field of the electronic technology, particularly to a chip connecting structure for realizing connection between a chip and a printed circuit board. A plurality of bonding pads are distributed on the chip; and first type pins are arranged on the bonding pads at first set positions and second type pins are welded to the bonding pads at second set positions, wherein the heights of the second type pins are larger than the sum of the heights of the first type pins and the heights of the printed circuit board. Through holes corresponding to the second set positions are formed in the printed circuit board. When the chip is connected to the printed circuit board, the second type pins pass through the through holes and extend out of the lower surface of the printed circuit board, thereby realizing circuit connection with the lower surface of the printed circuit board. According to the invention, the first type pins and the second type pins that are arranged at intervals with different heights are arranged on the chip, so that the three-dimensional effect of the pins of the chip is realized; during connection with the printed circuit board, the front side and the back side of the printed circuit board are welded with the pins of the chip directly, so that the circuit connection becomes reliable and thus the circuit performance can be improved.
Description
Technical field
The present invention relates to electronic technology field, be specifically related to a kind of chip connecting structure.
Background technology
Along with the development of microelectronic packaging technology, chip package constantly towards high integration, at high speed,
The trend development of high reliability, successively develops multiple packing forms, is continuously increased input and output to meet
Number of pins and the requirement of fine pitch, BGA (Ball Grid Array, BGA) encapsulation is current electricity
The wide variety of a kind of surface mount package form of sub-encapsulation field, as it is shown in figure 1, use soldered ball 2 conduct
Pin, not only increases packaging density, also improves encapsulation performance, has adapted to the Developing Tendency of chip package
Gesture, but, existing bga structure due in unit are pin number be on the increase so that draw
The density of foot constantly increases, when the chip 1 of bga structure is connected on printed circuit board 3, to even
Connect reliability of structure and constitute challenge.
Summary of the invention
It is an object of the invention to, it is provided that a kind of chip connecting structure, solve above technical problem.
It is an object of the invention to, it is provided that the processing technology of a kind of chip connecting structure, solve above technology
Problem.
Technical problem solved by the invention can realize by the following technical solutions:
A kind of chip connecting structure, for the connection of chip Yu printed circuit board, wherein, on described chip
It is distributed multiple pad, the described pad of the first setting position arranges first kind pin, the second setting position
Described pad on weld Equations of The Second Kind pin, the height of described Equations of The Second Kind pin be more than described first kind pin
Height sum with described printed circuit board；On described printed circuit board relative with described second setting position
The position answered is provided with through hole, and when described chip is connected to described printed circuit board, described Equations of The Second Kind pin is worn
Cross described through hole and stretch out in the lower surface of described printed circuit board, in order to under described printed circuit board
Surface circuit connects.
The present invention, by arranging the spaced first kind pin of height and Equations of The Second Kind pin on chip, makes
Obtain the pin three-dimensional of chip, it is simple to be connected with printed circuit board.
The chip connecting structure of the present invention, described first kind pin is ball-like pins.
The chip connecting structure of the present invention, described Equations of The Second Kind pin is needle-like pin.
The chip connecting structure of the present invention, described first kind pin and described Equations of The Second Kind pin are staggered.
The chip connecting structure of the present invention, the bottom margin of described Equations of The Second Kind pin is provided with chamfering.
The chip connecting structure of the present invention, the diameter of described first kind pin is straight with described Equations of The Second Kind pin
Footpath is equal.
The chip connecting structure of the present invention, described Equations of The Second Kind pin passes through solder connection in the weldering of described chip
On dish.
The present invention also provides for the processing technology of a kind of chip connecting structure, connects for making above-mentioned chip
Structure, comprises the following steps:
Step 1, applies scaling powder on the pad face of chip；
Step 2, is respectively provided with soldered ball on the described pad of the first setting position on described pad face；
Step 3, carries out Reflow Soldering for the first time, makes described soldered ball be fixed on described pad the formation first kind
Pin；
Step 4, arranges needle-like pin on the described pad of second setting position in described pad face；
Step 5, carries out Reflow Soldering, makes described needle-like pin be fixed on described pad formation Equations of The Second Kind and draws
Foot.
The processing technology of the chip connecting structure of the present invention, also includes step 6, on described printed circuit board
The position corresponding with described Equations of The Second Kind pin arranges through hole, and described chip is connected to described printed circuit board
Time, described Equations of The Second Kind pin passes described through hole and stretches out in the lower surface of described printed circuit board.
The processing technology of the chip connecting structure of the present invention, needle-like pin described in step 4 is by solder even
Connect corresponding pad.
Beneficial effect: owing to using above technical scheme, the present invention is by arranging height interval on chip
The first kind pin arranged and Equations of The Second Kind pin so that the pin three-dimensional of chip, with printed circuit board even
When connecing, the tow sides of printed circuit board directly can weld with chip pin so that circuit connects more
For reliably, the beneficially improvement of circuit performance.
Accompanying drawing explanation
Fig. 1 is the attachment structure schematic diagram of prior art；
Fig. 2 is the pin schematic diagram of three-dimensional shape on the chip of the present invention；
Fig. 3 is the chip connecting structure schematic diagram of the present invention.
Fig. 4 is the preparation technology schematic flow sheet of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the present invention, and
It is not all, of embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art are not making
The every other embodiment obtained on the premise of going out creative work, broadly falls into the scope of protection of the invention.
It should be noted that in the case of not conflicting, the embodiment in the present invention and the spy in embodiment
Levy and can be mutually combined.
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, but not as the present invention's
Limit.
With reference to Fig. 2, Fig. 3, a kind of chip connecting structure, for the company of chip 1a Yu printed circuit board 3a
Connect, wherein, chip 1a is distributed multiple pads, the pad of the first setting position arranges first kind pin
2a, the pad of the second setting position welds Equations of The Second Kind pin 2b, and the height of Equations of The Second Kind pin 2b is more than
The height sum of first kind pin 2a and printed circuit board 3a；Position is set with second on printed circuit board 3a
Put corresponding position and be provided with through hole, when chip 1a is connected to printed circuit board 3a, Equations of The Second Kind pin 2b
Through through hole the lower surface that stretches out in printed circuit board 3a, in order to the lower surface of printed circuit board 3a
Circuit connects.
The present invention draws by arranging the spaced first kind pin 2a of height and Equations of The Second Kind on chip 1a
Foot 2b so that the pin three-dimensional of chip 1a, it is simple to be connected with printed circuit board 3a.
The chip connecting structure of the present invention, first kind pin 2a is ball-like pins.Can use existing
The soldered ball of bga structure is as ball-like pins.
The chip connecting structure of the present invention, Equations of The Second Kind pin 2b is needle-like pin.Can use strip or
Cylindric contact pin forms needle-like pin, in order to have difference in height with first kind pin 2a, forms three-dimensional
Pin.
The chip connecting structure of the present invention, first kind pin 2a and Equations of The Second Kind pin 2b is staggered.The
One class pin 2a and Equations of The Second Kind pin 2b can interlock to be spaced and arrange, and can reduce pin to a certain extent
Density.
The chip connecting structure of the present invention, the bottom margin of Equations of The Second Kind pin 2b is provided with chamfering.Bottom margin
When chamfering is set so that chip 1a is connected with printed circuit board 3a, it is simple to leading to through printed circuit board 3a
Hole.
The diameter of the chip connecting structure of the present invention, the diameter of first kind pin 2a and Equations of The Second Kind pin 2b
Equal.The pad that can keep existing bga structure is constant, only changes work during planting ball
Skill, it is achieved the change of attachment structure, realizes the present invention on the basis of change cost is relatively low.
The chip connecting structure of the present invention, Equations of The Second Kind pin 2b passes through solder connection in the corresponding pad of chip
On.
The present invention also provides for the processing technology of a kind of chip connecting structure, connects for making above-mentioned chip
Structure, comprises the following steps:
Step 1, applies scaling powder on the pad face of chip；
Step 2, is respectively provided with soldered ball on the pad of the first setting position on pad face；
Step 3, carries out Reflow Soldering for the first time, makes soldered ball be fixed on pad formation first kind pin；
Step 4, arranges needle-like pin on the pad of second setting position in pad face；
Step 5, carries out second time Reflow Soldering, makes needle-like pin be fixed on pad formation Equations of The Second Kind pin.
The present invention can also use other welding procedures well known in the art to realize the connection of needle-like pin,
This does not repeats.
The processing technology of the chip connecting structure of the present invention, also includes step 6, with on printed circuit board
The corresponding position of two class pins arranges through hole, and when chip is connected to printed circuit board, Equations of The Second Kind pin is worn
Cross through hole and stretch out in the lower surface of printed circuit board.
A kind of process flow diagram of specific embodiment as shown in step S1 to S8 in Fig. 4, step S7
In by positioner by the soldered ball face of chip just on relevant position to printed circuit board；In step S8,
By chip and printed circuit board are heated simultaneously, it is achieved chip and printed circuit board interconnection.The present invention makes
The tow sides obtaining printed circuit board directly can weld with chip pin so that circuit connects more may be used
Lean on, beneficially the improvement of circuit performance.
The foregoing is only preferred embodiment of the present invention, not thereby limit embodiments of the present invention and
Protection domain, to those skilled in the art, it should can appreciate that all utilization description of the invention
And the equivalent done by diagramatic content and the scheme obtained by obvious change, all should comprise
Within the scope of the present invention.
Claims (10)
1. a chip connecting structure, for the connection of chip Yu printed circuit board, it is characterised in that institute
State and on chip, be distributed multiple pad, the described pad of the first setting position arranges first kind pin, second
Welding Equations of The Second Kind pin on the described pad of setting position, the height of described Equations of The Second Kind pin is more than described the
The height of one class pin and the height sum of described printed circuit board；With described on described printed circuit board
Corresponding position, two setting positions is provided with through hole, when described chip is connected to described printed circuit board, and institute
State Equations of The Second Kind pin pass described through hole and stretch out in the lower surface of described printed circuit board, in order to described
The lower surface circuit of printed circuit board connects.
Chip connecting structure the most according to claim 1, it is characterised in that described first kind pin
For ball-like pins.
Chip connecting structure the most according to claim 1, it is characterised in that described Equations of The Second Kind pin
For needle-like pin.
Chip connecting structure the most according to claim 1, it is characterised in that described first kind pin
Staggered with described Equations of The Second Kind pin.
Chip connecting structure the most according to claim 1, it is characterised in that described Equations of The Second Kind pin
Bottom margin be provided with chamfering.
Chip connecting structure the most according to claim 1, it is characterised in that described first kind pin
The equal diameters of diameter and described Equations of The Second Kind pin.
Chip connecting structure the most according to claim 1, it is characterised in that described Equations of The Second Kind pin
By solder connection on the pad of described chip.
8. the processing technology of a chip connecting structure, it is characterised in that be used for making claim 1 institute
The chip connecting structure stated, comprises the following steps:
Step 1, applies scaling powder on the pad face of chip；
Step 2, is respectively provided with soldered ball on the described pad of the first setting position on described pad face；
Step 3, carries out Reflow Soldering for the first time, makes described soldered ball be fixed on described pad the formation first kind
Pin；
Step 4, arranges needle-like pin on the described pad of second setting position in described pad face；
Step 5, carries out second time Reflow Soldering, makes described needle-like pin be fixed on described pad formation the
Two class pins.
The processing technology of chip connecting structure the most according to claim 8, it is characterised in that also wrap
Including step 6, position corresponding with described Equations of The Second Kind pin on described printed circuit board arranges through hole, institute
Stating chip when being connected to described printed circuit board, described Equations of The Second Kind pin is through described through hole and stretches out in institute
State the lower surface of printed circuit board.
The processing technology of chip connecting structure the most according to claim 8, it is characterised in that step
Needle-like pin described in rapid 4 passes through the pad that solder connection is corresponding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510083046.9A CN105990296A (en) | 2015-02-15 | 2015-02-15 | Chip connecting structure and manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510083046.9A CN105990296A (en) | 2015-02-15 | 2015-02-15 | Chip connecting structure and manufacturing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105990296A true CN105990296A (en) | 2016-10-05 |
Family
ID=57042548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510083046.9A Pending CN105990296A (en) | 2015-02-15 | 2015-02-15 | Chip connecting structure and manufacturing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105990296A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108205081A (en) * | 2018-01-19 | 2018-06-26 | 桂林电子科技大学 | A kind of device measured for minute yardstick soldered ball return loss |
| CN115132100A (en) * | 2022-07-19 | 2022-09-30 | 京东方科技集团股份有限公司 | Display module and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230264A (en) * | 1988-03-10 | 1989-09-13 | Nec Corp | Lsi package |
| JPH04199556A (en) * | 1990-10-30 | 1992-07-20 | Mitsubishi Electric Corp | Pin grid array type ic package |
| US20030127721A1 (en) * | 2002-01-04 | 2003-07-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
-
2015
- 2015-02-15 CN CN201510083046.9A patent/CN105990296A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230264A (en) * | 1988-03-10 | 1989-09-13 | Nec Corp | Lsi package |
| JPH04199556A (en) * | 1990-10-30 | 1992-07-20 | Mitsubishi Electric Corp | Pin grid array type ic package |
| US20030127721A1 (en) * | 2002-01-04 | 2003-07-10 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108205081A (en) * | 2018-01-19 | 2018-06-26 | 桂林电子科技大学 | A kind of device measured for minute yardstick soldered ball return loss |
| CN108205081B (en) * | 2018-01-19 | 2024-04-02 | 桂林电子科技大学 | Device for measuring return loss of microscale solder balls |
| CN115132100A (en) * | 2022-07-19 | 2022-09-30 | 京东方科技集团股份有限公司 | Display module and display device |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161005 |