CN207939835U - A kind of circuit board of continuous tin prevention, board and touch screen - Google Patents

A kind of circuit board of continuous tin prevention, board and touch screen Download PDF

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Publication number
CN207939835U
CN207939835U CN201820229832.4U CN201820229832U CN207939835U CN 207939835 U CN207939835 U CN 207939835U CN 201820229832 U CN201820229832 U CN 201820229832U CN 207939835 U CN207939835 U CN 207939835U
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China
Prior art keywords
circuit board
component
pad
tin
stitch
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CN201820229832.4U
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Chinese (zh)
Inventor
彭小坤
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Guangzhou Shiyuan Electronics Thecnology Co Ltd
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Guangzhou Shiyuan Electronics Thecnology Co Ltd
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Priority to CN201820229832.4U priority Critical patent/CN207939835U/en
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Abstract

The utility model is related to electronic technology fields, disclose a kind of circuit board of continuous tin prevention, board and touch screen, the top of the circuit board of continuous tin prevention is equipped with component side, and component side is equipped with multiple the first pads for being connect with component, and the first pad is equipped with welding hole;The gap for making scolding tin flow through is formed when the stitch of component passes through welding hole, between the stitch of component and the madial wall of welding hole.By the way that the first pad is arranged on component side, and make to form the gap for making scolding tin flow through between the stitch of component and the madial wall of welding hole, so that when circuit board is by tin on tin stove, liquid solder can be along the stitch of component from being flowed in gap on the first pad, to reduce the tin amount being connect with the first pad for the stitch of component, to efficiently avoid connecting tin between pad, so that solving the problems, such as to connect tin between pad without stealing soldering disk and artificial detin position by setting, and then improve the production efficiency of circuit board, reduce the production cost of circuit board.

Description

A kind of circuit board of continuous tin prevention, board and touch screen
Technical field
The utility model is related to electronic technology fields, more particularly to a kind of circuit board of continuous tin prevention, board and touch screen.
Background technology
Circuit board is not only the supporter and electronics member device of electronic component as important one of electronic unit The carrier of part electrical connection.Since circuit board has densification, high reliability, composability, designability and testability Characteristic, thus be widely used in electronic product.
In order to which dual inline type component is welded on circuit boards, to realize the dual-in-line of dual inline type component Formula encapsulates (DIP encapsulation), it will usually using pad is arranged on the welding surface of circuit board, by tin on tin stove, to realize biserial The connection of the stitch and pad of direct insertion component, to realize the connection of dual inline type component and other devices.In electricity Road plate on tin stove by when tin, since the gap between the pad on welding surface is smaller, being easy to cause adjacent pad and connecting It is connected together, so as to cause short circuit between the unlike signal on circuit board.Currently, just in order to ensure circuit board It is often used, soldering disk steathily is arranged in generally use on circuit boards, so that extra Xi Ji is together on soldering disk steathily, still, in electricity The waste that soldering disk steathily often causes tin is added on the plate of road, and there are still connect tin between pad, it is also necessary to increase Add artificial detin position to carry out disengagement processing to even tin position, therefore cause the production efficiency of circuit board relatively low, so as to cause circuit board Production cost it is higher.
Utility model content
The purpose of this utility model is to provide a kind of circuit board of continuous tin prevention, board and touch screen, to solve existing electricity Road plate is imitated due to avoiding connecting tin between pad by adding soldering disk steathily and artificial detin position so as to cause the production of circuit board The relatively low technical problem of rate, to reduce the production cost of circuit board.
In order to solve the above-mentioned technical problem, the utility model provides a kind of circuit board of continuous tin prevention, the electricity of the continuous tin prevention The top of road plate is equipped with component side, and the component side is equipped with multiple the first pads for being connect with component, and described the One pad is equipped with welding hole;When the stitch of the component passes through the welding hole, the stitch of the component and the welding hole Madial wall between form gap for making scolding tin flow through.
Preferably, the gap is 0.3mm-0.5mm.
Preferably, the distance between the edge of the welding hole and the edge of first pad are 0.15mm- 0.17mm。
Preferably, rectangular array on the top of circuit board of multiple first pads in the continuous tin prevention.
Preferably, the distance at the center of two adjacent welding holes is 1.27mm.
Preferably, the bottom of the circuit board of the continuous tin prevention is equipped with welding surface, the welding surface and described the One pad is covered with green oil on opposite position.
Preferably, the cross-sectional shape of first pad is circle.
Preferably, the cross-sectional shape of the welding hole is circle.
In order to solve identical technical problem, the utility model also provides a kind of board, including component and above-mentioned The stitch of the circuit board of continuous tin prevention, the component is welded on first pad.
In order to solve identical technical problem, the utility model also provides a kind of touch screen, including shell and above-mentioned Board, the board are connected in the shell.
The utility model provides a kind of circuit board of continuous tin prevention, board and touch screen, wherein the top of the circuit board of continuous tin prevention Portion is equipped with component side, and component side is equipped with multiple the first pads for being connect with component, and the first pad is equipped with welding hole; When the stitch of component passes through welding hole, between being formed between the stitch of component and the madial wall of welding hole for making scolding tin flow through Gap.By the way that the first pad is arranged on the component side of the circuit board of continuous tin prevention, and make the stitch of component and the madial wall of welding hole Between formed make the gap that scolding tin flows through so that when circuit board is by tin on tin stove, liquid solder can be along component Stitch is connect for the stitch of component with the first pad from first pad at the top for flowing to circuit board in gap with reducing Tin amount, to efficiently avoid connecting tin between pad so that solved without stealing soldering disk and artificial detin position by setting The problem of certainly connecting tin between pad, and then the production efficiency of circuit board is improved, reduce the production cost of circuit board.
Description of the drawings
Fig. 1 is the structural schematic diagram of the circuit board of the continuous tin prevention in the utility model embodiment.
Wherein, the 1, first pad;11, welding hole.
Specific implementation mode
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below Embodiment is not intended to limit the scope of the present invention for illustrating the utility model.
As shown in Figure 1, a kind of circuit board of continuous tin prevention of the preferred embodiment in the utility model, the circuit board of the continuous tin prevention Top be equipped with component side, the component side be equipped with multiple the first pads 1 for being connect with component, it is described first weld Disk 1 is equipped with welding hole 11;When the stitch of the component passes through the welding hole 11, the stitch of the component and the welding hole The gap for making scolding tin flow through is formed between 11 madial wall.
In the utility model embodiment, by the way that the first pad 1 is arranged on the component side of the circuit board of continuous tin prevention, and make Being formed between the stitch and the madial wall of welding hole 11 of component makes the gap that scolding tin flows through so that passes through tin on tin stove in circuit board When, liquid solder can be along the stitch of component from first pad 1 at the top for flowing to circuit board in gap, to reduce use In the tin amount that the stitch of component and the first pad 1 connect, to efficiently avoid connecting tin between pad so that without passing through Setting steals soldering disk and artificial detin position to solve the problems, such as to connect tin between pad, and then improves the production efficiency of circuit board, Reduce the production cost of circuit board.
Specifically, in the utility model embodiment, the circuit board of the continuous tin prevention is by the process of tin on tin stove, specifically It shows as:The stitch of the component passes through the welding hole 11 from the component side, passes through in the circuit board of the continuous tin prevention On tin stove when tin, the welding surface of the circuit board of the continuous tin prevention is contacted with liquid solder, at this point, passing through the component The gap formed between stitch and the welding hole 11 so that liquid solder can flow to institute along the stitch of the component It states on first pad 1 of component side, to realize that the stitch of the component is connect with first pad 1.Liquid solder It is flowed on the component side from the welding surface by the gap, reduces the tin amount eventually flowed on first pad 1, To reduce the tin amount that is connect with the first pad 1 of stitch for component, thus the stitch for ensuring the component can be with While first pad 1 connects, the problem of efficiently avoiding that even tin occurs between first pad 1.
In the utility model embodiment, in order to ensure liquid solder can be along the stitch of the component between described It is flowed in gap on first pad 1, gap described in the present embodiment is 0.3mm-0.5mm.By by the needle of the component Gap setting between foot and the madial wall of the welding hole 11 is 0.3mm-0.5mm, ensures that and passes through tin stove in circuit board When upper tin, liquid solder can be along the stitch of the component from being flowed in the gap on first pad 1, to realize The connection of the stitch of the component and first pad 1, so guarantee reduce for the component stitch with The tin amount that first pad 1 connects, the problem of to avoid tin is connected between pad.
In the utility model embodiment, it is connect with first pad 1 in order to ensure the stitch of the component, this reality It is 0.15mm-0.17mm to apply the distance between the edge of welding hole 11 described in example and the edge of first pad 1.Passing through will The distance between the edge of the edge of the welding hole 11 and first pad 1 is set as 0.15mm-0.17mm, with ensure from The liquid solder flowed in the gap on first pad 1 can ensure the stitch of the component and first pad Connection between 1, to ensure that the component can be connect with other devices.In addition, by by the edge of the welding hole 11 with The distance between the edge of first pad 1 is set as 0.15mm-0.17mm, to ensure first weldering of adjacent two Gap between disk 1 will not be too small, thus the problem of connecting tin between effectively further avoiding pad.
In the utility model embodiment, for the ease of direct insertion component to be welded on to the circuit board of the continuous tin prevention On, rectangular array on the top of circuit board of multiple first pads 1 in the continuous tin prevention, more by making in the present embodiment On the component side for the circuit board that a first pad, 1 rectangular array is distributed in the continuous tin prevention, in order to described straight The stitch of the formula of plugging in component is connect across the welding hole 11 with first pad 1, consequently facilitating by the direct insertion component It is welded on the circuit board of the continuous tin prevention.
In the utility model embodiment, the distance at the center of adjacent two welding holes 11 can be according to first device The distance between two adjacent stitch of part are arranged, in the present embodiment between two adjacent stitch of the component Distance is 1.27mm, and correspondingly, the distance at the center of adjacent two welding holes 11 is 1.27mm.
In the utility model embodiment, between further ensuring that the circuit board of the continuous tin prevention can avoid pad Even tin occurs, the bottom of the circuit board of continuous tin prevention described in the present embodiment is equipped with welding surface, the welding surface and described first Pad 1 is covered with green oil on opposite position.It is green by being covered on the welding surface position opposite with first pad 1 Oil, to play the role of welding resistance, to be effectively prevented from when the welding surface and the liquid solder contact, the welding surface The problem of company's tin occurs on the position opposite with first pad 1, and then further avoid generation company tin between pad.
In the utility model embodiment, the cross-sectional shape of first pad 1 can be set according to actual use situation It sets, the gap that need to only meet between the stitch of the component and the welding hole 11 can be such that scolding tin flows through, and the component Stitch can be connect with first pad 1.In order to make design and simplify the structure, to reduce cost, it is preferable that this The cross-sectional shape of first pad 1 described in embodiment is circle.
In addition, in the utility model embodiment, the cross-sectional shape of the welding hole 11 can also be according to actual use feelings Condition is arranged, and the gap that need to only meet between the stitch of the component and the welding hole 11 can be such that scolding tin flows through, and the member The stitch of device can be connect with first pad 1.In order to make design and simplify the structure, to further decrease into This, it is preferable that the cross-sectional shape of welding hole 11 described in the present embodiment is circle.
In order to solve identical technical problem, the utility model also provides a kind of board, including component and above-mentioned The stitch of the circuit board of continuous tin prevention, the component is welded on first pad 1.
In order to solve identical technical problem, the utility model also provides a kind of touch screen, including shell and above-mentioned Board, the board are connected in the shell.
To sum up, the utility model provides a kind of circuit board of continuous tin prevention, board and touch screen, the top of the circuit board of continuous tin prevention Portion is equipped with component side, and component side is equipped with multiple the first pads 1 for being connect with component, and the first pad 1 is equipped with weldering Hole 11;When the stitch of component passes through welding hole 11, formed between the stitch and the madial wall of welding hole 11 of component for making weldering The gap that tin flows through.By the way that the first pad 1 is arranged on component side, and make between the stitch of component and the madial wall of welding hole 11 Formation makes the gap that scolding tin flows through so that when circuit board is by tin on tin stove, liquid solder can be along the stitch of component From first pad 1 at the top for flowing to circuit board in gap, it is connect with the first pad 1 for the stitch of component with reduction Tin amount, to efficiently avoid connecting tin between pad so that solved without stealing soldering disk and artificial detin position by setting The problem of connecting tin between pad, and then the production efficiency of circuit board is improved, reduce the production cost of circuit board.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art For art personnel, without deviating from the technical principle of the utility model, several improvement and replacement can also be made, these change The scope of protection of the utility model is also should be regarded as into replacement.

Claims (10)

1. a kind of circuit board of continuous tin prevention, which is characterized in that the top of the circuit board of the continuous tin prevention is equipped with component side, described Component side is equipped with multiple the first pads for being connect with component, and first pad is equipped with welding hole;In first device When the stitch of part passes through the welding hole, formed between the stitch of the component and the madial wall of the welding hole for making scolding tin stream The gap crossed.
2. the circuit board of continuous tin prevention as described in claim 1, which is characterized in that the gap is 0.3mm-0.5mm.
3. the circuit board of continuous tin prevention as described in claim 1, which is characterized in that the edge of the welding hole and first pad The distance between edge be 0.15mm-0.17mm.
4. the circuit board of continuous tin prevention as described in claim 1, which is characterized in that multiple first pads are in the continuous tin prevention Circuit board top on rectangular array.
5. the circuit board of continuous tin prevention as described in claim 1, which is characterized in that the center of two adjacent welding holes away from From for 1.27mm.
6. the circuit board of continuous tin prevention as described in any one in claim 1-5, which is characterized in that the circuit board of the continuous tin prevention Bottom be equipped with welding surface, the welding surface is covered with green oil on the position opposite with first pad.
7. the circuit board of continuous tin prevention as described in any one in claim 1-5, which is characterized in that first pad it is transversal Face shape is circle.
8. the circuit board of continuous tin prevention as described in any one in claim 1-5, which is characterized in that the cross section shape of the welding hole Shape is circle.
9. a kind of board, which is characterized in that the electricity including component and such as claim 1-8 any one of them continuous tin preventions The stitch of road plate, the component is welded on first pad.
10. a kind of touch screen, which is characterized in that including shell and board as claimed in claim 9, the board is connected to In the shell.
CN201820229832.4U 2018-02-08 2018-02-08 A kind of circuit board of continuous tin prevention, board and touch screen Active CN207939835U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820229832.4U CN207939835U (en) 2018-02-08 2018-02-08 A kind of circuit board of continuous tin prevention, board and touch screen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820229832.4U CN207939835U (en) 2018-02-08 2018-02-08 A kind of circuit board of continuous tin prevention, board and touch screen

Publications (1)

Publication Number Publication Date
CN207939835U true CN207939835U (en) 2018-10-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820229832.4U Active CN207939835U (en) 2018-02-08 2018-02-08 A kind of circuit board of continuous tin prevention, board and touch screen

Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113766765A (en) * 2021-08-18 2021-12-07 惠州雷曼光电科技有限公司 Circuit board and soldering assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113766765A (en) * 2021-08-18 2021-12-07 惠州雷曼光电科技有限公司 Circuit board and soldering assembly

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