CN208094899U - circuit board - Google Patents

Abstract

The utility model provides a kind of circuit board, including pad, the pin of part is fixed on circuit boards by pad solder, pad is symmetrical arranged about part encapsulation, wherein, pad includes the first pad and the second pad, and the size at least one dimension of the second pad is less than size of first pad in its respective dimensions；First pad, the second pad are encapsulated respectively about part and are symmetrical arranged.Using the utility model, can solve the problems, such as existing circuit board because part pin spacing is too small can not cabling.

Description

Circuit board

Technical field

The utility model is related to electronic technology fields, more specifically, are related to one kind and can be widely applied to BGA/LGA/CSP Etc. type packages part circuit board.

Background technology

In electronics industry, circuit board is important electronic unit, is the supporter of electronic component, is electronic component The carrier of electrical connection.Therefore, the design of circuit board is particularly important, and the quality of board design directly affects the performance of product, And board design is largely influenced by its soft copy encapsulation.

Since electronic product more does smaller, the density of circuit board is also higher and higher, and circuit board is also to miniaturization, in this way Often encounter the case where circuit board respective regions are limited by part encapsulation, cause local line that cannot meet the requirements, In embodiment shown in Fig. 3, on circuit board 1 ', it is provided with circular first pad of multiple pins for soldering part 8'.Such as：There are pin spacing smaller parts, through-hole can not be laid between pin, circuit board must use HDI plates, cost higher； Or pin spacing it is small can not cabling, obviously only need lead to side, but have to change layer repeatedly, not only substantially increase Difficulty is connected up, or even can also influence signal quality.

Therefore, to solve the above problems, the utility model provides a kind of circuit board.

Utility model content

In view of the above problems, the purpose of this utility model is to provide a kind of circuit board, to solve existing circuit board because of zero Part pin spacing too it is small can not cabling the problem of.

A kind of circuit board provided by the utility model, including pad, the pin of part are fixed on circuit by pad solder On plate, pad is symmetrical arranged about part encapsulation, wherein

Pad includes the first pad and the second pad, and the size at least one dimension of the second pad exists less than the first pad Size in its respective dimensions；

First pad, the second pad are encapsulated respectively about part and are symmetrical arranged.

Furthermore it is preferred that structure be that the quantity of pad is even number.

Furthermore it is preferred that structure be, the first pad be circular pad, the second pad be ellipse pad or class it is ellipse Circular pad.

Furthermore it is preferred that structure be the area of oval pad：The area > 0.9 of circular pad；Class ellipse The area of pad：The area > 0.9 of circular pad.

Furthermore it is preferred that structure be that the first pad is the pad of rectangular pad or rectangle, and the second pad falls for turning The pad of the rectangle of the rectangular pad or turning chamfering at angle.

Furthermore it is preferred that structure be the area of the rectangular pad of turning chamfering：The area > 0.9 of rectangular pad；It turns The area of the pad of the rectangle of angle chamfering：The area > 0.9 of the pad of rectangle.

Furthermore it is preferred that structure be that the second pad is the symmetrical unilateral rectangular pad inside contracted or symmetrical unilateral inside contracts Rectangle pad.

Furthermore it is preferred that structure be the area of the symmetrical unilateral rectangular pad inside contracted：The area > of rectangular pad 0.9；The area of the pad of the symmetrical unilateral rectangle inside contracted：The area > 0.9 of the pad of rectangle.

From technical solution above it is found that circuit board provided by the utility model, passes through pin pad on change circuit board Shape, overcoming the problems, such as that pin spacing is too small can not cabling.The design structure of this circuit board can significantly improve circuit board Convenience is connected up, signal quality, cost-effective is not only improved, moreover it is possible to have certain help to circuit board micromation, it is whole to promote product Body competitiveness.

Description of the drawings

By reference to the following description in conjunction with the accompanying drawings and the contents of the claims, and with to the utility model more Comprehensive understanding, other purposes and result of the utility model will be more clearly understood and understood.

In the accompanying drawings：

Fig. 1 is the board structure of circuit schematic diagrames one according to the utility model embodiment；

Fig. 2 is the board structure of circuit schematic diagrames two according to the utility model embodiment；

Fig. 3 is existing board structure of circuit schematic diagrames.

Reference numeral therein includes：Circuit board 1, circuit board 1 ', the second pad 2,3,4,5,6,7, the first pad 8, the One pad 8 '.

Identical label indicates similar or corresponding feature or function in all the appended drawings.

Specific implementation mode

For aforementioned proposition existing circuit board because part pin spacing too it is small can not cabling the problem of, the utility model A kind of new circuit board is provided, to solve the above problems.

Specific embodiment of the utility model is described in detail below with reference to attached drawing.

In order to illustrate the structure of circuit board provided by the utility model, Fig. 1 to Fig. 2 is respectively from different perspectives to circuit board Structure has carried out exemplary mark.Specifically, Fig. 1 shows the board structure of circuit one according to the utility model embodiment；Fig. 2 shows The board structure of circuit two according to the utility model embodiment is gone out.

As Fig. 1 and Fig. 2 jointly shown in, the pin of a kind of circuit board 1 provided by the utility model, including pad, part is logical It crosses pad solder to fix on circuit boards, pad is symmetrical arranged about part encapsulation, wherein pad includes the first pad and second Pad, the size at least one dimension of the second pad are less than size of first pad in its respective dimensions, the first pad, the Two pads are encapsulated respectively about part and are symmetrical arranged.

Wherein, the second pad is made by change of first pad in its dimension, and the area of the second pad It is more than 0.9 with the area ratio of the first pad；The shape of first pad and the second pad is different, and the shape of the second pad exists Change on the basis of the shape of first pad, i.e.,：The shape of pad is set according to the wiring of circuit board, and about part The shape for encapsulating symmetrically arranged pad is identical.

Wherein, pin is fixed on circuit boards by pad, also, ensures that the pad on circuit board encapsulates phase about part Symmetrically, cause electronic product performance bad to avoid welding pulling force unevenness.Being compared to from Fig. 1, Fig. 2 can in the embodiment of Fig. 3 To find out, wherein the center of the welding of the pad on circuit board does not change, according to the wiring of circuit board, weldering The shape of disk does variation appropriate to facilitate circuit board wiring, that is, on the basis of circular pad in its corresponding dimension Appropriate variation is done, to form ellipse or class ellipse, to facilitate the wiring of circuit board that can be easy to pass through.

Wherein, the quantity of pad is set according to actual conditions, it should be understood that, the quantity of pad is even number, is removed Non- pad is in the centre of part encapsulation, and one can be set in centre position, because there is no welding to draw for this this position The problem of power unevenness；Other than centre position, the quantity of pad is necessary for even number, and pad as depicted in figs. 1 and 2 is in electricity Layout on the plate of road.

It, will when the wiring on the small circuit board of pin spacing can not be in the case of cabling in the embodiments of the present invention In place, i.e., the position of pad is arranged：Adjustment appropriate is done into the position of pad, while being sealed about part in this pad Another pad is arranged in the position of dress, to reduce the difficulty of the wiring on circuit board 1, while can also ensure that electronic product Signal quality.It should be noted that the topology layout of the pad setting of the utility model, general to be applied to all types of circuit boards The design of the types part such as upper BGA/LGA/CSP encapsulation.

In the embodiment shown in fig. 1, on the circuit card 1, be arranged multiple pads (the first pad 8 and the second pad) and It is encapsulated with 1 mutually fixed part of circuit board, being both provided with the second pad in the position of circuit board surrounding, (shape of the second pad has Ellipse also has class oval), circuit board is welded and fixed by pad and pin, and part encapsulation is fixed on circuit by pin On plate, also, pad must be symmetrical about part encapsulation, i.e.,：Second pad of surrounding is symmetrical arranged about part encapsulation, In, the second pad 2 and the second pad 3 are symmetrical arranged about part encapsulation, and 9 intermediate circular first pads 8 are sealed about part Dress is symmetrical arranged.

In the embodiment shown in Figure 2, on the circuit card 1, the second pad 4 and the second pad 5 of setting are sealed about part Dress is symmetrical arranged, and the second pad 6 and the second pad 7 are symmetrical arranged about part encapsulation；Second pad 4 is in the second pad 5 The symmetrical position of the diagonal line of circuit board, it is diagonal symmetrical that the second pad 6 with the second pad 7 is in circuit board 1 another Position, also, the second pad 4 is identical as the shape of the second pad 5, and the second pad 6 is identical as the shape of the second pad 7, is all It is deformed on the basis of the first pad 8.

Wherein, it should be noted that the shape of pad does not limit, and can be set according to actual needs.In Fig. 1 In embodiment shown in Fig. 2, the shape of pad includes circle, and ellipse or class are oval, the pin of symmetrical setting Shape is identical.First pad is circular pad, and the second pad is the pad of ellipse or the pad of class ellipse, wherein It is that round, ellipse or class are elliptical in pad, oval, class ellipse the second pad is circular first Change formation on the basis of pad 8.In addition, pad can be rectangular or rectangle as needed, rectangular, rectangle turning is fallen Angle or certain aspect is symmetrical unilateral inside contracts.

In the embodiments of the present invention, bonding pad area is more than or equal to the face of 90% original form pad after shape changes Product.Such as：Relationship between the area and the area of circular pad of oval, class ellipse pad is as follows：The weldering of ellipse The area of disk：The area > 0.9 of circular pad；The area of the pad of class ellipse：The area > 0.9 of circular pad.

Wherein, the first pad is the pad of rectangular pad or rectangle, and the second pad is the rectangular weldering of turning chamfering If the shape of the disk either pad pad of the rectangle of turning chamfering be the rectangular of rectangular or rectangle or turning chamfering or The rectangle of turning chamfering, then the relationship between the area of rectangular pad and the area of the rectangular pad of turning chamfering is as follows： The area of the rectangular pad of turning chamfering：The area > 0.9 of rectangular pad；The area of the pad of rectangle and turning chamfering Relationship is as follows between the area of the pad of rectangle：The area of the pad of the rectangle of turning chamfering：The area > of the pad of rectangle 0.9。

In addition, in the embodiments of the present invention, the second pad is the symmetrical unilateral rectangular pad or right inside contracted The pad of the unilateral rectangle inside contracted, the shape of the second pad is claimed to be：It is symmetrical it is unilateral inside contract rectangular or symmetrical unilateral inside contract Rectangle, then the relationship between the area and rectangular bonding pad area of the symmetrical unilateral rectangular pad inside contracted is as follows：It is symmetrical unilateral The area of the rectangular pad inside contracted：The area > 0.9 of rectangular pad.The area of the pad of the symmetrical unilateral rectangle inside contracted with Relationship between the area of the pad of rectangle is as follows：The area of the pad of the symmetrical unilateral rectangle inside contracted：The face of the pad of rectangle Product > 0.9.

In conclusion the area of the pad after optimization is more than or equal to 90%, this design structure is to be able to ensure electricity The good performance of sub- product, and make welding pulling force sufficiently large, to ensure the service life of product.

By the above embodiment as can be seen that circuit board provided by the utility model, passes through pin on change circuit board The shape of pad, overcoming the problems, such as that pin spacing is too small can not cabling.The design structure of this circuit board can significantly improve electricity Road plate connects up convenience, not only improves signal quality, cost-effective, moreover it is possible to have certain help to circuit board micromation, promote production Product whole competitiveness.

Described in an illustrative manner above with reference to attached drawing according to the utility model proposes circuit board.But this field It will be appreciated by the skilled person that for the circuit board that above-mentioned the utility model is proposed, can also not depart from the utility model Various improvement are made on the basis of appearance.Therefore, the scope of protection of the utility model should be by the content of appended claims It determines.

Claims (8)

1. the pin of a kind of circuit board, including pad, part is fixed on by the pad solder on the circuit board, the weldering Disk is symmetrical arranged about part encapsulation, which is characterized in that

The pad includes the first pad and the second pad, and the size at least one dimension of the second pad is less than described the Size of one pad in its respective dimensions；

First pad, second pad are encapsulated respectively about the part and are symmetrical arranged.

2. circuit board as described in claim 1, which is characterized in that

The quantity of the pad is even number.

3. circuit board as described in claim 1, which is characterized in that

First pad is circular pad, and second pad is the pad of ellipse or the pad of class ellipse.

4. circuit board as claimed in claim 3, which is characterized in that

The area of the pad of ellipse：The area > 0.9 of circular pad；

The area of the pad of class ellipse：The area > 0.9 of circular pad.

5. circuit board as described in claim 1, which is characterized in that

First pad is the pad of rectangular pad or rectangle, and second pad is the rectangular pad of turning chamfering Or the pad of the rectangle of turning chamfering.

6. circuit board as claimed in claim 5, which is characterized in that

The area of the rectangular pad of turning chamfering：The area > 0.9 of rectangular pad；

The area of the pad of the rectangle of turning chamfering：The area > 0.9 of the pad of rectangle.

7. circuit board as claimed in claim 5, which is characterized in that

Second pad is the pad of the symmetrical unilateral rectangular pad or the symmetrical unilateral rectangle inside contracted inside contracted.

8. the circuit board as described in claim 7 any one, which is characterized in that

The area of the symmetrical unilateral rectangular pad inside contracted：The area > 0.9 of rectangular pad；

The area of the pad of the symmetrical unilateral rectangle inside contracted：The area > 0.9 of the pad of rectangle.