CN204578898U - Printed circuit board (PCB) - Google Patents
Printed circuit board (PCB) Download PDFInfo
- Publication number
- CN204578898U CN204578898U CN201520287388.8U CN201520287388U CN204578898U CN 204578898 U CN204578898 U CN 204578898U CN 201520287388 U CN201520287388 U CN 201520287388U CN 204578898 U CN204578898 U CN 204578898U
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- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- pad
- stealing
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Abstract
A kind of printed circuit board (PCB) includes solder side, described solder side is provided with the pad group for welding component pin, one outboard pad of described pad group is for stealing soldering dish, and described to steal soldering dish be laminated structure, and described soldering rim of stealing the direction that itself and scolding tin departs from and inside contracts.Above-mentioned printed circuit board (PCB) is by being designed to an outboard pad of pad group and the different laminated structure of pad in other pad groups, enhance the holder tin ability of pad group, effectively reduce rosin joint, the even bad phenomenon such as tin, short circuit that printed circuit board (PCB) occurs in welding processing procedure.
Description
Technical field
The utility model relates to printed circuit board (PCB), particularly relates to a kind of printed circuit board (PCB) of wave-soldering.
Background technology
In printed circuit board (PCB) welding processing procedure, printed circuit board (PCB) realizes automatic welding by special welding equipment, but, closeer printed circuit board (PCB) is arranged for some components and parts, or component's feet is numerous and cause the spacing between adjacent leads too small, and then make in welding processing procedure, more easily to occur missing solder, connect the phenomenon such as tin, short circuit, greatly waste manpower and materials.Therefore, need to design a kind of printed circuit board (PCB) to overcome the problems referred to above, to improve the yields of welding equipment.
Summary of the invention
In view of this, be necessary to provide a kind of printed circuit board (PCB), rosin joint, the even bad phenomenon such as tin, short circuit that printed circuit board (PCB) occurs in welding processing procedure can be reduced.
The utility model provides a kind of printed circuit board (PCB), includes solder side.Described solder side is provided with the pad group for welding component pin, and an outboard pad of described pad group is for stealing soldering dish, and described to steal soldering dish be laminated structure, and described soldering rim of stealing the direction that itself and scolding tin departs from and inside contracts.
Preferably, described steal in soldering dish be condensed to triangle, trapezoidal, blade-shaped, water-drop-shaped any one.
Preferably, described stealing in soldering dish shortens isosceles triangle or isosceles trapezoid into.
Preferably, the transmission direction when perpendicular bisector of described isosceles triangle welds with described printed circuit board (PCB) is parallel.
Preferably, comprise printed circuit board circuitry layer, printed circuit board (PCB) solder mask and printed circuit board (PCB) character, described printed circuit board circuitry layer arranges the conductive test region of at least two mutual conductings outside circuitous pattern region, and described printed circuit board (PCB) solder mask is positioned on described printed circuit board circuitry layer; Described printed circuit board (PCB) solder mask is provided with the windowed regions of whether biting for detecting printed circuit board (PCB) character; Described printed circuit board (PCB) character is positioned on described printed circuit board circuitry layer, and described character is megohmite insulant.
The utility model is by being designed to an outboard pad of pad group and the different laminated structure of pad in other pad groups, and set up dummy pad in the side of this sheet pad and absorb unnecessary melting scolding tin further, enhance the holder tin ability of pad group, effectively reduce rosin joint, the even bad phenomenon such as tin, short circuit that printed circuit board (PCB) occurs in welding processing procedure.
Accompanying drawing explanation
Fig. 1 is the plane graph in the utility model printed circuit board (PCB) one execution mode.
Fig. 2 is the plane graph in another execution mode of the utility model printed circuit board (PCB).
Embodiment
For further setting forth the technological means and effect thereof that the utility model takes, be described in detail below in conjunction with preferred embodiment of the present utility model and accompanying drawing thereof.
Fig. 1 is the plane graph of printed circuit board (PCB) 100 in the utility model one execution mode.In the present embodiment, printed circuit board (PCB) 100 transmits along direction shown by arrow X when welding, the solder side 100a of printed circuit board (PCB) 100 is provided with multiple pad group 1,2,3, multiple pad group 1,2,3 welds multiple components and parts (not shown) for one_to_one corresponding, in other words, if there are three pad groups, then corresponding welding three components and parts.In the present embodiment, take components and parts as rectangular patch formula encapsulation components and parts and number of pins is 6 is described for example, components and parts comprise two symmetrically arranged first pins, two symmetrically arranged second pins and two symmetrically arranged 3rd pins.In order to realize coupling welding, the pad number that each pad group 1,2,3 comprises is 6.First pin of each components and parts and the pad corresponding to the second pin can be strip, and can be also the bond pad shapes of other conventional pin welding, the utility model seldom explains.Shape, the size of the first pin and the pad corresponding to the second pin are all identical.The shape of pad corresponding to the 3rd pin of each components and parts and its first pin, pad that the second pin is corresponding is different.Pad corresponding to the 3rd pin is for stealing soldering dish, and stealing soldering dish is laminated structure, steals soldering rim and the direction that itself and scolding tin departs from and inside contract.Such as, stealing the shape of soldering dish can be triangle, trapezoidal, blade-shaped, water-drop-shaped etc., when steal soldering dish be isosceles triangle or isosceles trapezoid time, its welding effect is best.What the 3rd pin was corresponding steal, and soldering dish enhances pad group 1,2,3 drags tin ability, and what also extend each components and parts spends the tin time simultaneously, effectively avoids printed circuit board (PCB) 100 in welding processing procedure, to occur rosin joint, connect the bad phenomenon such as tin, short circuit.
In an execution mode of the present utility model, the side of stealing soldering dish that 3rd pin of each components and parts is corresponding is also provided with a dummy pad 10, dummy pad 210 can be strip pad, dummy pad 10 is surrounded by two arc minor faces and two straight parallel line length limits, and the opening of two arc minor faces is relative.Dummy pad 10 is arranged with the pads parallel of pad group 1,2,3, and the height of dummy pad 10 is equal with the height of the pad that pad group 1,2,3 comprises.Dummy pad 10 for assembling components and parts first, second, third pin superfluous molten solder contacted in welding process, thus can reduce printed circuit board (PCB) 100 further and in welding processing procedure, occurs rosin joint, connects the bad phenomenon such as tin, short circuit.
It should be noted that, components and parts model to be welded on printed circuit board (PCB) 100, number of pins can be different, the utility model is not to component's feet Limited Number system, and only the bond pad shapes that need change outside components and parts can reach effect of the present utility model.
It should be noted that, due in the present embodiment, the transmission direction X of printed circuit board (PCB) 100 is the directions away from components and parts the 3rd pin, therefore, the pad 1c that 3rd pin of each components and parts is corresponding steals soldering dish, and arranges a dummy pad 10 in the side of stealing soldering dish that the 3rd pin is corresponding.In other execution modes of the present utility model, if the transmission direction X of printed circuit board (PCB) 100 is the directions away from components and parts first pin, the pad that then the first pin of each components and parts is corresponding for stealing soldering dish, and arranges a dummy pad 10 in the side of stealing soldering dish 1a that the first pin is corresponding.
When printed circuit board (PCB) 100 transmits along transmission direction X, first pin of components and parts, second pin, 3rd pin is soldered successively, because dummy pad 10 is arranged at the rear portion of stealing soldering dish corresponding to the 3rd pin, thus make dummy pad 10 will can not be welded to the first pin, second pin, superfluous molten scolding tin on 3rd pin absorbs, simultaneously because the pad that the 3rd pin is corresponding is steal soldering dish, further enhancing pad group 1, 2, 3 drag tin ability, what also extend components and parts spends the tin time, effectively avoid the rosin joint in pin welding process, connect tin, the phenomenons such as short circuit.
Fig. 2 is the plane graph of printed circuit board (PCB) 100 in another execution mode of the utility model.In the present embodiment, each components and parts all comprises four at two long side and stretches out pin.Printed circuit board (PCB) 100 shown in its operation principle with Fig. 1 is substantially identical, so no longer describe in detail.
Use in a novel preferred implementation at this, this printed circuit board (PCB) also comprises printed circuit board circuitry layer, printed circuit board (PCB) solder mask and printed circuit board (PCB) character, described printed circuit board circuitry layer arranges the conductive test region of at least two mutual conductings outside circuitous pattern region, and described printed circuit board (PCB) solder mask is positioned on described printed circuit board circuitry layer; Described printed circuit board (PCB) solder mask is provided with the windowed regions of whether biting for detecting printed circuit board (PCB) character; Described printed circuit board (PCB) character is positioned on described printed circuit board circuitry layer, and described character is megohmite insulant.The conductive region of mutual conduction is set at printed circuit board circuitry layer, and over a conductive region just windowed regions is set, so that this conductive region reveals when making printed circuit board (PCB) solder mask.Because printed circuit board (PCB) character layer is made up of the legend ink insulated, on printed circuit board (PCB) solder mask, make printed circuit board (PCB) character layer if follow-up, then test not conducting between this conductive test region; Otherwise, if when missing printed circuit board (PCB) character layer, conducting between this conductive test region.Can facilitate like this, judge character of whether having bitten accurately, avoid printed circuit board (PCB) to occur biting with character the relevant issues caused in actual use.
The utility model is by being designed to an outboard pad of pad group and the different laminated structure of pad in other pad groups, and set up dummy pad in the side of this sheet pad and absorb unnecessary melting scolding tin further, enhance the holder tin ability of pad group, effectively reduce rosin joint, the even bad phenomenon such as tin, short circuit that printed circuit board (PCB) occurs in welding processing procedure.And effectively solve the problem that character bites.
Above-described embodiment of the present invention, does not form limiting the scope of the present invention.Any amendment done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within claims of the present invention.
Claims (5)
1. a printed circuit board (PCB), include solder side, described solder side is provided with the pad group for welding component pin, one outboard pad of described pad group is for stealing soldering dish, it is characterized in that, described to steal soldering dish be laminated structure, and described soldering rim of stealing the direction that itself and scolding tin departs from and inside contracts.
2. printed circuit board (PCB) as claimed in claim 1, is characterized in that, described steal in soldering dish be condensed to triangle, trapezoidal, blade-shaped, water-drop-shaped any one.
3. printed circuit board (PCB) as claimed in claim 2, is characterized in that, described stealing in soldering dish shortens isosceles triangle or isosceles trapezoid into.
4. printed circuit board (PCB) as claimed in claim 3, it is characterized in that, the transmission direction when perpendicular bisector of described isosceles triangle welds with described printed circuit board (PCB) is parallel.
5. printed circuit board (PCB) as claimed in claim 4, it is characterized in that, comprise printed circuit board circuitry layer, printed circuit board (PCB) solder mask and printed circuit board (PCB) character, described printed circuit board circuitry layer arranges the conductive test region of at least two mutual conductings outside circuitous pattern region, and described printed circuit board (PCB) solder mask is positioned on described printed circuit board circuitry layer; Described printed circuit board (PCB) solder mask is provided with the windowed regions of whether biting for detecting printed circuit board (PCB) character; Described printed circuit board (PCB) character is positioned on described printed circuit board circuitry layer, and described character is megohmite insulant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520287388.8U CN204578898U (en) | 2015-05-06 | 2015-05-06 | Printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520287388.8U CN204578898U (en) | 2015-05-06 | 2015-05-06 | Printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204578898U true CN204578898U (en) | 2015-08-19 |
Family
ID=53871481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520287388.8U Expired - Fee Related CN204578898U (en) | 2015-05-06 | 2015-05-06 | Printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204578898U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108551722A (en) * | 2018-06-05 | 2018-09-18 | 肖国选 | Unit pcb board |
| CN109644550A (en) * | 2016-08-18 | 2019-04-16 | 斯天克有限公司 | Flexible circuit board |
-
2015
- 2015-05-06 CN CN201520287388.8U patent/CN204578898U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109644550A (en) * | 2016-08-18 | 2019-04-16 | 斯天克有限公司 | Flexible circuit board |
| CN109644550B (en) * | 2016-08-18 | 2022-03-15 | 斯天克有限公司 | Flexible printed circuit board |
| CN108551722A (en) * | 2018-06-05 | 2018-09-18 | 肖国选 | Unit pcb board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 Termination date: 20210506 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |