CN208623993U - A kind of printing stencil structure - Google Patents
A kind of printing stencil structure Download PDFInfo
- Publication number
- CN208623993U CN208623993U CN201821060688.2U CN201821060688U CN208623993U CN 208623993 U CN208623993 U CN 208623993U CN 201821060688 U CN201821060688 U CN 201821060688U CN 208623993 U CN208623993 U CN 208623993U
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- Prior art keywords
- steel mesh
- open
- area
- pad
- rectangle
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Plates And Materials Therefor (AREA)
Abstract
The utility model discloses a kind of printing stencil structures, including connector, steel mesh, the steel mesh is arranged above connector pad, and the shape of pad is rectangle, rectangular area corresponding with pad is to open area on steel mesh, and steel mesh opening is arranged to open area；It is less than the rectangle non-open areas to open area using the geometric center to open area as the geometric center setting area of non-open areas, two sides of rectangle non-open areas are conllinear with two long sides to open area, using the midpoint on other two side of rectangle non-open areas as the center of circle, semicircle non-open areas is done to the direction far from rectangle non-open areas respectively, the region of steel mesh opening is the remaining region after removing rectangle non-open areas, semicircle non-open areas in open area.Utility model has the advantages that reducing the tin sweat(ing) phenomenon occurred when the welding of surface mount elements by changing steel mesh opening mode, reduce the damage of circuit board, improves yield rate and product quality.
Description
Technical field
The utility model relates to electronic printing field, in particular to a kind of printing stencil structure.
Background technique
In the manufacturing process of electronic product, need to use surface mounting technology (SMT, Surfac e
MountTechnology various components) are welded to printed circuit board.Surface mount process process generally includes: in PCB
Coated on one side tin cream to be welded completes component then by the component attachment to the corresponding position of PCB for needing to weld
Attachment after carry out reflow soldering, this completes the attachments of the PCB wherein component of one side, can be completed after the assay was approved
Surface mount.
In PCB substrate be coated with tin cream process, the tin amount of coating be influence welding quality key factor, tin amount be by
What the shapes and sizes that the opening of steel mesh is related to determined.Excellent steel mesh opening design, it is ensured that good demoulding effect, it will not
Cause solder shorts, open circuit or generate tin ball, and guarantees good hardware connection and soldering reliability.
Enterprise in the actual production process, it is found that burning out occurs short circuit and cause circuit board in certain a batch of printed circuit board
Scene, through detection be the discovery that since short circuit caused by tin sweat(ing) occur in surface mount elements in production process, it is therefore desirable to needle
Existing printing module structure is improved.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of printing stencil structures, it is possible to reduce is pasting
Occurs the phenomenon that tin sweat(ing) when piece element is mounted on PCB.
To achieve the goals above, the technical solution adopted by the present invention are as follows: a kind of printing stencil structure, including connector,
Steel mesh, the steel mesh are arranged above connector pad, and the shape of pad is rectangle, the rectangle region corresponding with pad on steel mesh
Domain is to open area, and steel mesh opening is arranged to open area；Using the geometric center to open area as non-open areas
Geometric center setting area is less than the rectangle non-open areas to open area, two sides of rectangle non-open areas and to open region
Two long sides in domain are conllinear, using the midpoint on other two side of rectangle non-open areas as the center of circle, respectively to opening far from rectangle is non-
Semicircle non-open areas is done in the direction in mouth region domain, and the region of steel mesh opening is to remove the non-open region of rectangle in open area
Remaining region after domain, semicircle non-open areas.
The pad includes multiple the first pads being laid on PCB trace and be directly laid on pcb board face second
Pad, steel mesh opening corresponding with first pad are the first steel mesh opening, steel mesh corresponding with second pad
Opening is the second steel mesh opening, and the area of first steel mesh opening is greater than the area of second steel mesh opening.
Occur when the welding of surface mount elements utility model has the advantages that being reduced by changing steel mesh opening mode
Tin sweat(ing) phenomenon reduces the damage of circuit board, improves yield rate and product quality.
Detailed description of the invention
Below to each width attached drawing of description of the invention expression content and figure in label be briefly described:
Fig. 1 is the utility model steel mesh opening schematic diagram.
Label in above-mentioned figure is equal are as follows: 1, to open area；2, semicircle non-open areas；3, steel mesh opening；4, rectangle
Non-open areas.
Specific embodiment
A specific embodiment of the invention is made further detailed below against attached drawing by the description to optimum embodiment
Thin explanation.
As shown, printing stencil structure, including connector, steel mesh, steel mesh are arranged above connector pad, pad
Shape is rectangle, and rectangular area corresponding with pad is to open area on steel mesh, and steel mesh opening is arranged to open area；
Existing technology is easy to appear tin sweat(ing) with 100% opening mode, and the application is to improve this state not with 100% opening mode.
It is less than using the geometric center to open area as the geometric center setting area of non-open areas and non-is opened to the rectangle of open area
Mouth region domain, two sides of rectangle non-open areas are conllinear with two long sides to open area, in addition with rectangle non-open areas
The midpoint on two sides is the center of circle, does semicircle non-open areas, steel mesh opening to the direction far from rectangle non-open areas respectively
Region be the remaining region after removing rectangle non-open areas, semicircle non-open areas in open area.By above-mentioned
Steel mesh opening mode, can effectively solve the tin sweat(ing) generated in actual production process, improve the welding quality of the elements such as resistance,
Reduce short circuit caused by tin sweat(ing).
Pad includes multiple the first pads being laid on PCB trace and the second pad being directly laid on pcb board face,
Steel mesh opening corresponding with the first pad is the first steel mesh opening, and steel mesh opening corresponding with second pad is second
Steel mesh opening, the area of first steel mesh opening are greater than the area of second steel mesh opening.By the pad of connector according to
The difference that position is arranged is divided into the first steel mesh opening, the second steel mesh opening, by the second steel mesh opening area less than the first steel mesh
The area of opening can effectively reduce due to coating tin amount is excessive so that the tin cream being printed on the second pad is reduced accordingly
Caused by connect tin, ensure that PCB using effect, improve PCB welding quality.
Obviously present invention specific implementation is not subject to the restrictions described above, as long as using method concept and skill of the invention
The improvement for the various unsubstantialities that art scheme carries out, it is within the scope of the present invention.
Claims (2)
1. a kind of printing stencil structure, including connector, steel mesh, the steel mesh is arranged above connector pad, and feature exists
In: the shape of pad be rectangle, on steel mesh rectangular area corresponding with pad be to open area, steel mesh opening setting to
Open area；It is less than by the geometric center setting area of non-open areas of the geometric center to open area to open area
Rectangle non-open areas, two sides of rectangle non-open areas are conllinear with two long sides to open area, with the non-open region of rectangle
The midpoint on other two side in domain is the center of circle, does semicircle non-open areas to the direction far from rectangle non-open areas respectively,
The region of steel mesh opening is the remaining region after removing rectangle non-open areas, semicircle non-open areas in open area.
2. a kind of printing stencil structure as described in claim 1, it is characterised in that: the pad includes multiple being laid in PCB
The first pad on cabling and the second pad being directly laid on pcb board face, steel mesh corresponding with first pad are opened
Mouth is the first steel mesh opening, and steel mesh opening corresponding with second pad is the second steel mesh opening, and first steel mesh is opened
The area of mouth is greater than the area of second steel mesh opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821060688.2U CN208623993U (en) | 2018-07-05 | 2018-07-05 | A kind of printing stencil structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821060688.2U CN208623993U (en) | 2018-07-05 | 2018-07-05 | A kind of printing stencil structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208623993U true CN208623993U (en) | 2019-03-19 |
Family
ID=65704904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821060688.2U Active CN208623993U (en) | 2018-07-05 | 2018-07-05 | A kind of printing stencil structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208623993U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114928938A (en) * | 2022-05-12 | 2022-08-19 | 浙江亚太机电股份有限公司 | Packaging structure and packaging method of PCB fuse |
-
2018
- 2018-07-05 CN CN201821060688.2U patent/CN208623993U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114928938A (en) * | 2022-05-12 | 2022-08-19 | 浙江亚太机电股份有限公司 | Packaging structure and packaging method of PCB fuse |
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