CN210405774U

CN210405774U - PCB board

Info

Publication number: CN210405774U
Application number: CN201920128219.8U
Authority: CN
Inventors: 赵云峰; 苏彦铭
Original assignee: Wuxi Sumnergy Technology Co ltd
Current assignee: Wuxi Sumnergy Technology Co ltd
Priority date: 2019-01-25
Filing date: 2019-01-25
Publication date: 2020-04-24
Anticipated expiration: 2029-01-25

Abstract

The utility model relates to a PCB board, including pad, copper foil piece, substrate, connector, plug-in components device, the pad be the pad that through-hole pad or table were pasted, the copper foil piece be used for increasing the adhesive force between substrate and the hole copper, the copper foil piece sets up on PCB, the connector is beaten the connector via hole that increases adhesion strength around the copper line of drawing forth, has solved the separation phenomenon of reflow soldering back pad and substrate, has improved PCB's quality, has guaranteed PCB's normal use, improves PCB welded qualification rate, has reduced the cost of maintenance that the defective products brought, the cost of scrapping, human cost etc..

Description

PCB board

Technical Field

The utility model relates to a PCB welding field especially relates to a PCB board.

Background

In the process of high-speed development of the electronic industry, the PCBA has become an important component of hardware in a server architecture, and the PCB, as a basic carrier board of the PCBA, determines the quality of the PCBA to a great extent.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a PCB board can effectively solve the problem among the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a PCB board, includes pad, copper foil, substrate, connector, plug-in components device, the pad be the pad of through-hole pad or surface mounting, the copper foil be used for increasing the adhesive force between substrate and the hole copper, the copper foil sets up on PCB, the connector is beaten the connector via hole that increases adhesion strength around the copper line of drawing forth.

Preferably, via holes are punched on the periphery of the bonding pad, the center of each via hole is located on the edge of the bonding pad, the aperture is 10-12 mils, and the pitch is larger than 40 mils.

Compared with the prior art, the utility model discloses following beneficial effect has: a PCB board comprises a bonding pad, a copper foil, a substrate, a connector and a plug-in device, wherein the adhesion force between the substrate and hole copper is increased by connecting the copper foil, the separation phenomenon of the bonding pad and the substrate after reflow soldering is avoided, the quality of the PCB is improved, the normal use of the PCB is ensured, the qualified rate of PCB soldering is improved, and the maintenance cost, the scrapping cost, the labor cost and the like caused by defective products are reduced.

Drawings

Fig. 1 is a structural diagram of an isolated through-hole pad of a PCB of the present invention.

Fig. 2 is a structural diagram of a pad of a surface mount of a PCB board of the present invention.

Fig. 3 is a structural diagram of a connector of a PCB according to the present invention.

Fig. 4 is a structural diagram of a plug-in device of a PCB board according to the present invention.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1, a PCB board requires copper foil on each layer of the PCB for isolated via pads.

As shown in fig. 2, for a surface-mounted pad, a PCB needs to add copper foil on a corresponding device layer.

As shown in fig. 3, for some connectors, such as a chip connector, which need to be frequently inserted and pulled, if only a copper foil is added and the condition cannot be met, vias can be formed around the led-out copper wires to increase the adhesion strength, and the vias cannot be formed on the bonding pads.

As shown in FIG. 4, for some plug-in devices, when the plug-in devices are large in size and large in mass, via holes can be punched around the bonding pads, the centers of the via holes are located at the edges of the bonding pads, the aperture is 10-12 mils in size, and the hole pitch is greater than 40 mils, so that tin leakage caused by too large via holes can be prevented, the reliability of welding is influenced, and the integrity of connection between the bonding pads and the substrate can be influenced due to too small hole pitch.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A PCB board, includes pad, copper foil, substrate, connector, plug-in components device, its characterized in that: the bonding pad be the through-hole bonding pad or the bonding pad of surface subsides, copper foil be used for increasing the adhesive force between substrate and the hole copper, copper foil sets up on PCB, the connector via hole of increase adhesion strength is beaten around the copper line of drawing forth to the connector.

2. A PCB board according to claim 1, wherein: through holes are punched on the periphery of the bonding pad, the center of each through hole is located on the edge of the bonding pad, the aperture is 10-12 mil in size, and the hole distance is larger than 40 mil.