CN209994630U - Prevent that many pins DIP component from crossing wave-soldering tin-connecting's tin stealing soldering dish - Google Patents
Prevent that many pins DIP component from crossing wave-soldering tin-connecting's tin stealing soldering dish Download PDFInfo
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- CN209994630U CN209994630U CN201920382127.2U CN201920382127U CN209994630U CN 209994630 U CN209994630 U CN 209994630U CN 201920382127 U CN201920382127 U CN 201920382127U CN 209994630 U CN209994630 U CN 209994630U
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Abstract
The utility model discloses a prevent that many pins DIP component from crossing tin pad of stealing of wave-soldering even tin, at PCB's bottom routing layer additional tin pad of stealing, it sets up in one side of PCB pad to steal tin pad to cross the opposite of board direction with the wave-soldering. The distance between the tin-stealing bonding PAD and the edge of the PCB bonding PAD is 0.8mm, the width of the tin-stealing bonding PAD along the wave-soldering direction is 4mm, and the length of the tin-stealing bonding PAD is equal to the width of the PAD. The utility model discloses the design of stealing tin PAD through adding on the BOT layer of PCB has solved the problem of even tin, short circuit behind the stove, has solved because of the limited unable preparation white oil piece of many pins DIP component PAD interval is little, PCB producer processing procedure ability leads to even tin, short circuit phenomenon's problem.
Description
Technical Field
The utility model relates to a wave-soldering technical field, specific theory, prevent that many pins DIP component from crossing tin pad of stealing of wave-soldering even tin.
Background
Various welding defects such as missing welding, insufficient welding, welding spot tin connection or short circuit and the like sometimes occur in the PCBA wave soldering process of electronic products, wherein the welding spot tin connection or short circuit mainly occurs in multi-pin DIP elements such as single/double row connectors, Dip USB, BOSA and the like.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a prevent that many pins DIP component from crossing wave-soldering even tin steal tin PAD for to the little component in pin PAD interval among the solution prior art, can't make the white oil piece on the BOT layer of component PAD, can't solve the problem of even tin behind the wave-soldering.
The utility model discloses a following technical scheme solves above-mentioned problem:
a tin stealing bonding pad for preventing a multi-pin DIP element from passing through wave soldering tin connection is characterized in that a tin stealing bonding pad is additionally arranged on a bottom routing layer of a PCB and is arranged on one side of the PCB bonding pad and opposite to the direction of passing through the wave soldering tin connection.
The design of tin-stealing soldering pads is added on the BOT layer of the PCB, the design principle of the tin-stealing soldering pads is to pull and melt tin, the phenomena of tin connection and open circuit are avoided, and the problem that white oil blocks cannot be manufactured due to the limited manufacturing process capability of PCB manufacturers with small space between component soldering pads is solved.
Further, the distance between the tin-stealing bonding pad and the edge of the PCB bonding pad is 0.8mm, the width of the tin-stealing bonding pad along the wave soldering direction is 4mm, and the length of the tin-stealing bonding pad is as follows:
when the PCB pads are in a single row and the arrangement direction is consistent with the wave soldering direction, the length of the tin-stealing soldering pad is the diameter of the pad;
when the PCB pads are in a single row and the arrangement direction is vertical to the wave soldering direction, the length of the tin-stealing pads is the maximum value of the edge distance of the pads;
when the PCB pads are in double rows and the arrangement direction is consistent with the wave soldering direction, the length of the tin-stealing soldering pad is equal to the width of the two rows of pads;
when the PCB pads are in double rows and the arrangement direction is vertical to the wave soldering direction, the length of the tin-stealing pads is the length of the row of pads which is close to the tin-stealing pads.
Compared with the prior art, the utility model, following advantage and beneficial effect have:
the utility model discloses the design of stealing tin PAD through adding on the BOT layer of PCB has solved the problem of even tin, short circuit behind the stove, has solved because of the limited unable preparation white oil piece of many pins DIP component PAD interval is little, PCB producer processing procedure ability leads to even tin, short circuit phenomenon's problem.
Drawings
Fig. 1 is a first schematic structural diagram of the present invention;
FIG. 2 is a second schematic structural view of the present invention;
FIG. 3 is a third schematic structural diagram of the present invention;
fig. 4 is a fourth structural diagram of the present invention;
among them, 1-solder stealing pads.
Detailed Description
The present invention will be described in further detail with reference to examples, but the present invention is not limited thereto.
Example 1:
a tin stealing bonding pad for preventing a multi-pin DIP element from passing through wave soldering tin connection is characterized in that a tin stealing bonding pad is additionally arranged on a bottom routing layer of a PCB and is arranged on one side of the PCB bonding pad and opposite to the direction of passing through the wave soldering tin connection.
The utility model discloses white oil piece design (except RJ45, elements that need spread copper Keepout such as DIP network transformer) between cancellation component PAD, and adopt many pins DIP component to pass through the PAD rear of wave-soldering direction on PCB's BOT layer through the design of additional tin PAD of stealing, during wave-soldering, it utilizes smooth the siphoning away unnecessary liquid tin of tension to steal tin PAD, prevents unnecessary liquid tin from flowing back to the component pin, has prevented the emergence of continuous tin phenomenon.
Example 2:
on the basis of embodiment 1, the distance between the solder stealing PAD 1 and the edge of the PCB PAD is 0.8mm, the width of the solder stealing PAD 1 along the wave soldering direction is 4mm, and the length of the solder stealing PAD 1 is equal to the width of the PAD of the PCB, which specifically includes the following:
when the PCB pads are arranged in a single row and the arrangement direction is consistent with the wave soldering direction, the length of the tin-stealing soldering pad 1 is the diameter of the pad, as shown in figure 1, and at the moment, the shape of the tin-stealing soldering pad 1 is rectangular;
when the PCB pads are arranged in a single row and the arrangement direction is perpendicular to the wave soldering direction, the length of the tin-stealing soldering pads 1 is the maximum value of the edge distance of the pads, as shown in figure 2, at the moment, the tin-stealing soldering pads 1 are rectangular;
when the PCB pads are in double rows and the arrangement direction is consistent with the wave soldering direction, the length of the tin-stealing pads 1 is the width of the two rows of pads, as shown in figure 3, at the moment, the tin-stealing pads 1 are in a shape of a'; when the DIP direction is opposite, the tin-stealing welding pad 1 is on the left side, and the shape of the tin-stealing welding pad 1 is in a' shape;
when the PCB pads are in double rows and the arrangement direction is perpendicular to the wave soldering direction, the length of the tin-stealing pads 1 is the length of a row of pads which are closer to the tin-stealing pads 1, as shown in figure 4, at this time, the tin-stealing pads 1 are rectangular.
The tin stealing welding disk can be arranged in various shapes according to the multi-pin element and the wave soldering plate passing direction, and the application range is wider.
Although the present invention has been described herein with reference to the illustrated embodiments thereof, which are merely preferred embodiments of the present invention, it is to be understood that the present invention is not limited thereto, and that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure.
Claims (2)
1. A tin stealing bonding pad for preventing a multi-pin DIP element from connecting tin through wave soldering is characterized in that a tin stealing bonding pad is additionally arranged on a bottom routing layer of a PCB, and the tin stealing bonding pad is arranged on one side of the PCB bonding pad and is opposite to the direction of passing the wave soldering board.
2. The tin stealing pad for preventing the multi-pin DIP element from connecting tin by wave soldering as claimed in claim 1, wherein the distance between the tin stealing pad and the edge of the PCB pad is 0.8mm, the width of the tin stealing pad along the wave soldering direction is 4mm, and the length of the tin stealing pad is as follows:
when the PCB pads are in a single row and the arrangement direction is consistent with the wave soldering direction, the length of the tin-stealing soldering pad is the diameter of the pad;
when the PCB pads are in a single row and the arrangement direction is vertical to the wave soldering direction, the length of the tin-stealing pads is the maximum value of the edge distance of the pads;
when the PCB pads are in double rows and the arrangement direction is consistent with the wave soldering direction, the length of the tin-stealing soldering pad is equal to the width of the two rows of pads;
when the PCB pads are in double rows and the arrangement direction is vertical to the wave soldering direction, the length of the tin-stealing pads is the length of the row of pads which is close to the tin-stealing pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920382127.2U CN209994630U (en) | 2019-03-25 | 2019-03-25 | Prevent that many pins DIP component from crossing wave-soldering tin-connecting's tin stealing soldering dish |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920382127.2U CN209994630U (en) | 2019-03-25 | 2019-03-25 | Prevent that many pins DIP component from crossing wave-soldering tin-connecting's tin stealing soldering dish |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209994630U true CN209994630U (en) | 2020-01-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920382127.2U Active CN209994630U (en) | 2019-03-25 | 2019-03-25 | Prevent that many pins DIP component from crossing wave-soldering tin-connecting's tin stealing soldering dish |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209994630U (en) |
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2019
- 2019-03-25 CN CN201920382127.2U patent/CN209994630U/en active Active
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