CN202907341U - Welding structure of through-hole reflow welding device - Google Patents
Welding structure of through-hole reflow welding device Download PDFInfo
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- CN202907341U CN202907341U CN 201220326887 CN201220326887U CN202907341U CN 202907341 U CN202907341 U CN 202907341U CN 201220326887 CN201220326887 CN 201220326887 CN 201220326887 U CN201220326887 U CN 201220326887U CN 202907341 U CN202907341 U CN 202907341U
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Abstract
The embodiment of the utility model discloses a welding structure of a through-hole reflow welding device, which relates to the technical field of machinery and can effectively improve the weld strength of THR devices. The welding structure includes a through-hole reflow welding device, a printed circuit board, and a sheet metal provided with a plurality of first through holes and arranged on the back side of the printed circuit board, wherein the first through holes of the metal sheet coincide with the weld leg holes of the printed circuit board, weld legs of the through-hole reflow welding device, which are arranged on the front side of the printed circuit board, pass through the weld leg holes on the printed circuit board and the first through holes on the metal sheet, and the through-hole reflow welding device, the printed circuit board and the metal sheet are welded together.
Description
Technical field
The utility model relates to mechanical field, relates in particular to the Welding Structure that a kind of Through-hole reflow connects device.
Background technology
Electronic product uses Through-hole reflow to meet (Through-hole Reflow more and more, be called for short THR) device, and the THR device is generally interface device, for example USB (Universal Serial BUS, the logical USB that is called for short) connector, earphone base connector etc.
THR device commonly used generally is provided with several legs at its back side, is welded in by the leg with the THR device on the Through-hole reflow pin porose disc of correspondence of printed circuit board (PCB) (Printed Circuit Board is called for short PCB), and the THR device is arranged on the PCB.Usually, it is positive setting the one side that the THR device is set on the PCB, is called again the T face; Corresponding, the another side of PCB is the back side, is also referred to as the B face.
The inventor finds in realizing process of the present utility model, and in the use procedure of electronic product, when carrying out plug between external equipment and the THR device and operate, the THR device often will be subject to External Force Acting.For example, when inserting the USB cable, can bring external impacts to USB connector.This just requires the weld strength of THR device higher, otherwise the adverse consequences that the THR device comes off from PCB will appear, in addition, PCB also may appear in the adverse consequences near the fracture of THR device place, affect the result of use of electronic product, shorten the useful life of electronic product, can't provide good experience to the user.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of Through-hole reflow to connect the Welding Structure of device, can effectively improve the weld strength of THR device.
For solving the problems of the technologies described above, the Welding Structure that the utility model Through-hole reflow connects device adopts following technical scheme:
A kind of Through-hole reflow connects the Welding Structure of device, comprises that printed circuit board (PCB) and the Through-hole reflow that is arranged at the front of described printed circuit board (PCB) connect device, also comprise:
Sheet metal is provided with several the first through holes on the described sheet metal, described sheet metal is arranged at the back side of described printed circuit board (PCB), and the first through hole of described sheet metal overlaps with the leg hole of described printed circuit board (PCB);
Wherein, the leg that described Through-hole reflow connects device passes leg hole on the described printed circuit board (PCB) and the first through hole on the described sheet metal, and described Through-hole reflow connects device, described printed circuit board (PCB) and described sheet metal and passes through solder bond.
In the technical scheme of the utility model embodiment, provide a kind of Through-hole reflow to connect the Welding Structure of device, connect device, printed circuit board (PCB) and sheet metal comprising Through-hole reflow, described Through-hole reflow connects the front that device is fixed on described printed circuit board (PCB), and described sheet metal is fixed in the back side of described printed circuit board (PCB).The described sheet metal that is fixed in the back side of described printed circuit board (PCB) connects the relation that the device relation just is equivalent to nut and nut with the Through-hole reflow that is arranged at the another side of described printed circuit board (PCB), sheet metal is locked in the pin that described Through-hole reflow connects device on the described printed circuit board (PCB) firmly, has reduced Through-hole reflow and connect the possibility that device breaks away from from printed circuit board (PCB) in the process of test or use; Simultaneously, the existence of sheet metal can also strengthen the mechanical strength of described printed circuit board (PCB), has greatly reduced the possibility of printed circuit board (PCB) fracture in test or use procedure; In addition, the thickness of described sheet metal is little, and the three dimensions of occupied terminal is little, do not affect manufacturer, user etc. to the pursuit of ultra-thin terminal, and this infrastructure cost is low, and is easy to operate, effective, is easy to promote.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, the accompanying drawing of required use was done to introduce simply during the below will describe embodiment, apparently, accompanying drawing in the following describes only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the disassembly diagram one of Through-hole reflow connecting structure among the utility model embodiment;
Fig. 2 is the disassembly diagram two of Through-hole reflow connecting structure among the utility model embodiment;
Fig. 3 is the structure schematic diagram of PCB among the utility model embodiment.
Description of reference numerals:
1-Through-hole reflow connects device; 11-leg; 12-signal pins;
2-printed circuit board (PCB); 21-leg hole; 22-signal pins pad;
The 23-the first pad; The 24-the second pad; 3-sheet metal;
The 31-the first through hole; The 32-the second through hole; 33-half hole.
Embodiment
Embodiment one
The Welding Structure that the utility model embodiment provides a kind of Through-hole reflow to connect device, as shown in Figure 1, this structure comprises PCB2 and is arranged at the THR device 1 in the front of described PCB2, also comprises:
Wherein, the leg 11 of described THR device 1 passes leg hole 21 on the described PCB2 and the first through hole 31 on the described sheet metal 3, and described THR device 1, described PCB2 and described sheet metal 3 pass through solder bond.
As shown in Figure 1, the effect of leg 11 is mainly strengthens fixing between THR device 1 and the PCB2, in general, can be provided with the even number leg 11 more than four on the THR device, suppose that the THR device 1 among the utility model embodiment has four legs 11, for so that THR device 1 can firmly be fixed on the PCB2, be provided with four on the PCB2 and be used for leg hole 21 accommodating and that weld described leg 11.
In the utility model embodiment, for so that described sheet metal 3 can cooperate the use of described PCB2, be provided with too four on the described sheet metal 3 and be used for accommodating and weld the first through hole 31 of described leg 11, and the first through hole 31 of described sheet metal 3 overlaps with leg hole 21 on the described PCB2.
When assembling, at first adopt surface mounting technology (Surface Mounted Technology, be called for short SMT), four leg holes 21 in the front of described PCB2, and for printing the tin cream that connects for Through-hole reflow on the signal pins pad 22 of the signal pins 12 of welding described THR device 1, afterwards sheet metal 3 is placed on the back side of described PCB2, wherein, each first through hole 31 needs to overlap with a leg hole 21, the 3rd step, another side at PCB2, namely positive, in the leg hole 21 and the first through hole 31 that each leg 11 insertion position of THR device 1 are corresponding, and use the Through-hole reflow connection technology, with described THR device 1, PCB2 and sheet metal 3 are integrated.The sheet metal 3 at the described back side of being fixed in described PCB2 and the THR device of the another side that is arranged at described PCB2 1 relation just are equivalent to the relation of nut and nut, sheet metal 3 is locked in the pin of described THR device 1 on the described PCB2 firmly, has reduced the possibility that THR device 1 breaks away from from PCB2 in the process of test or use; Simultaneously, the existence of sheet metal 3 can also strengthen the mechanical strength of described PCB2, has greatly reduced the possibility of PCB2 fracture in test or use procedure.
Need to prove, the cross sectional dimensions in the leg hole 21 on the described PCB2 and the cross sectional dimensions of the first through hole 31 on the described sheet metal 3 can be a bit larger tham the cross sectional dimensions of the leg 11 of described THR device 1, be conducive to when Through-hole reflow connects, described THR device 1 increases leg hole 21 on the described PCB2 and the soldering tin amount between the leg 11, so that can comparatively be securely fixed on the described PCB2.
In the technical scheme of present embodiment, provide a kind of Through-hole reflow to connect the Welding Structure of device, connect device, printed circuit board (PCB) and sheet metal comprising Through-hole reflow, described Through-hole reflow connects the front that device is fixed on described printed circuit board (PCB), and described sheet metal is fixed in the back side of described printed circuit board (PCB).The described sheet metal that is fixed in the back side of described printed circuit board (PCB) connects the relation that the device relation just is equivalent to nut and nut with the Through-hole reflow that is arranged at the another side of described printed circuit board (PCB), sheet metal is locked in the pin that described Through-hole reflow connects device on the described printed circuit board (PCB) firmly, has reduced Through-hole reflow and connect the possibility that device breaks away from from printed circuit board (PCB) in the process of test or use; Simultaneously, the existence of sheet metal can also strengthen the mechanical strength of described printed circuit board (PCB), has greatly reduced the possibility of printed circuit board (PCB) fracture in test or use procedure; In addition, the thickness of described sheet metal is little, and the three dimensions of occupied terminal is little, do not affect manufacturer, user etc. to the pursuit of ultra-thin terminal, and this infrastructure cost is low, and is easy to operate, effective, is easy to promote.
Embodiment two
The Welding Structure that the utility model embodiment provides a kind of Through-hole reflow to connect device, as shown in Figure 1, this structure comprises PCB2 and is arranged at the THR device 1 in the front of described PCB2, also comprises:
Wherein, the leg 11 of described THR device 1 passes leg hole 21 on the described PCB2 and the first through hole 31 on the described sheet metal 3, and described THR device 1, described PCB2 and described sheet metal 3 pass through solder bond.
As shown in Figure 1, the effect of leg 11 is mainly strengthens fixing between THR device 1 and the PCB2, in general, can be provided with the even number leg 11 more than four on the THR device, suppose that the THR device 1 among the utility model embodiment has four legs 11, for so that THR device 1 can firmly be fixed on the PCB2, be provided with four on the PCB2 and be used for leg hole 21 accommodating and that weld described leg 11.
In the utility model embodiment, for so that described sheet metal 3 can cooperate the use of described PCB2, be provided with too four on the described sheet metal 3 and be used for accommodating and weld the first through hole 31 of described leg 11, and the first through hole 31 of described sheet metal 3 overlaps with leg hole 21 on the described PCB2.
When assembling, at first adopt surface mounting technology (Surface Mounted Technology, be called for short SMT), four leg holes 21 in the front of described PCB2, and for printing the tin cream that connects for Through-hole reflow on the signal pins pad 22 of the signal pins 12 of welding described THR device 1, afterwards sheet metal 3 is placed on the back side of described PCB2, wherein, each first through hole 31 needs to overlap with a leg hole 21, the 3rd step, another side at PCB2, namely positive, in the leg hole 21 and the first through hole 31 that each leg 11 insertion position of THR device 1 are corresponding, and use the Through-hole reflow connection technology, with described THR device 1, PCB2 and sheet metal 3 are integrated.The sheet metal 3 at the described back side of being fixed in described PCB2 and the THR device of the another side that is arranged at described PCB2 1 relation just are equivalent to the relation of nut and nut, sheet metal 3 is locked in the pin of described THR device 1 on the described PCB2 firmly, has reduced the possibility that THR device 1 breaks away from from PCB2 in the process of test or use; Simultaneously, the existence of sheet metal 3 can also strengthen the mechanical strength of described PCB2, has greatly reduced the possibility of PCB2 fracture in test or use procedure.
Need to prove, the cross sectional dimensions in the leg hole 21 on the described PCB2 and the cross sectional dimensions of the first through hole 31 on the described sheet metal 3 can be a bit larger tham the cross sectional dimensions of the leg 11 of described THR device 1, be conducive to when Through-hole reflow connects, described THR device 1 increases leg hole 21 on the described PCB2 and the soldering tin amount between the leg 11, so that can comparatively be securely fixed on the described PCB2.
For so that sheet metal 3 is more firm with the combination of PCB2, in general, need to be electroplate with the metal of being convenient to weld at the hole wall of the first through hole 31 of described sheet metal 3, the metal of usually electroplating is one or more the combination in nickel, silver, gold, the tin.Usually, can electroplate pure nickel at hole wall, also can be first after hole wall be electroplated one deck nickel, other metals of being convenient to weld such as silver, gold, tin in the re-plating.
In addition, as shown in Figure 2, for so that the combination between described sheet metal 3 and the described PCB is more firm, promote to some extent with the weld strength of guaranteeing described THR device, further, be provided with the second through hole 32 on the described sheet metal 3, corresponding, as shown in Figure 3, be provided with on the described PCB2 for the first pad 23 of described the second through hole 32 welding, particularly, described the first pad 23 is arranged at the back side of described PCB2.
Need to prove that described the second through hole 32 can be arranged on any empty place on the described sheet metal 3, for example, described the second through hole 32 can be arranged between described the first through hole 31.The utility model embodiment does not carry out any restriction to the particular location of described the second through hole 32.
Then when assembling, need utilize the SMT technology with the signal pins pad 22 of PCB2, the upper tin cream of 21 places, leg hole printing of front and back, afterwards sheet metal 3 is placed on the back side of described PCB2, wherein, each first through hole 31 needs to overlap with a leg hole 21, and each second through hole 32 needs to overlap with first pad 23, and utilizes reflow solder technique, the second through hole 32 of described sheet metal 3 and the first pad 23 of described PCB2 are integrated, continue again welding THR device 1.
Similarly, for the ease of welding, the hole wall of described the second through hole 32 also electrodepositable has one or more combination in nickel, silver, gold, the tin.
In addition, selectable, as shown in Figure 2, the edge of described sheet metal 3 is provided with half hole 33, similarly, and as shown in Figure 3, be provided with on the described PCB2 for the second pad 24 of described half hole 33 welding, particularly, described the second pad 24 is arranged at the back side of described PCB2.
In the utility model embodiment, described half hole 33 is two, is arranged side by side on the same edge of described sheet metal 3.In fact, described half hole 33 can distribute and be positioned on the arbitrary edge or all edges of described sheet metal 3, and the utility model embodiment does not specifically limit this.
Same, the hole wall in described half hole 33 also electrodepositable has one or more combination in nickel, silver, gold, the tin.
Described the second through hole 32 cooperates with described the second pad 24 with described the first pad 23, described half hole 33, so that described sheet metal 3 can more be firmly fixed on the described PCB2, reduced the possibility that described sheet metal 3 comes off from described PCB2, further reduced the possibility that THR device 1 breaks away from from PCB2 in the process of test or use, and further strengthen the mechanical strength of described PCB2, greatly reduced the possibility of PCB2 fracture in test or use procedure.
Usually, the material of described sheet metal 3 can be stainless steel or iron, and when the material of described sheet metal 3 is stainless steel, because stainless rigidity is larger, the thickness of sheet metal 3 can be thinner; When the material of described sheet metal 3 is iron, because the rigidity of iron is less than stainless rigidity, in order to guarantee the mechanical strength of sheet metal 3, so the thickness of the sheet metal 3 of making take iron as material should be greater than the thickness of the sheet metal 3 of making take stainless steel as material.
In the technical scheme of present embodiment, provide a kind of Through-hole reflow to connect the Welding Structure of device, connect device, printed circuit board (PCB) and sheet metal comprising Through-hole reflow, described Through-hole reflow connects the front that device is fixed on described printed circuit board (PCB), and described sheet metal is fixed in the back side of described printed circuit board (PCB).The described sheet metal that is fixed in the back side of described printed circuit board (PCB) connects the relation that the device relation just is equivalent to nut and nut with the Through-hole reflow that is arranged at the another side of described printed circuit board (PCB), sheet metal is locked in the pin that described Through-hole reflow connects device on the described printed circuit board (PCB) firmly, has reduced Through-hole reflow and connect the possibility that device breaks away from from printed circuit board (PCB) in the process of test or use; Simultaneously, the existence of sheet metal can also strengthen the mechanical strength of described printed circuit board (PCB), has greatly reduced the possibility of printed circuit board (PCB) fracture in test or use procedure; In addition, the thickness of described sheet metal is little, and the three dimensions of occupied terminal is little, do not affect manufacturer, user etc. to the pursuit of ultra-thin terminal, and this infrastructure cost is low, and is easy to operate, effective, is easy to promote.
The above; it only is embodiment of the present utility model; but protection range of the present utility model is not limited to this; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; can expect easily changing or replacing, all should be encompassed within the protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range of described claim.
Claims (8)
1. a Through-hole reflow connects the Welding Structure of device, and the Through-hole reflow that comprises printed circuit board (PCB) and be arranged at the front of described printed circuit board (PCB) connects device, it is characterized in that, also comprises:
Sheet metal is provided with several the first through holes on the described sheet metal, described sheet metal is arranged at the back side of described printed circuit board (PCB), and the first through hole of described sheet metal overlaps with the leg hole of described printed circuit board (PCB);
Wherein, the leg that described Through-hole reflow connects device passes leg hole on the described printed circuit board (PCB) and the first through hole on the described sheet metal, and described Through-hole reflow connects device, described printed circuit board (PCB) and described sheet metal and passes through solder bond.
2. Through-hole reflow according to claim 1 connects the Welding Structure of device, it is characterized in that,
The cross sectional dimensions of described the first through hole is greater than the cross sectional dimensions of described leg.
3. Through-hole reflow according to claim 1 and 2 connects the Welding Structure of device, it is characterized in that,
The hole wall of described the first through hole is electroplate with one or more the combination in nickel, silver, gold, the tin.
4. Through-hole reflow according to claim 1 and 2 connects the Welding Structure of device, it is characterized in that,
Be provided with the second through hole on the described sheet metal, be provided with on the described printed circuit board (PCB) for the first pad of described the second through hole welding.
5. Through-hole reflow according to claim 4 connects the Welding Structure of device, it is characterized in that,
The hole wall of described the second through hole is electroplate with a kind of in nickel, silver, gold, the tin.
6. Through-hole reflow according to claim 1 connects the Welding Structure of device, it is characterized in that,
The edge of described sheet metal is provided with half hole, is provided with on the described printed circuit board (PCB) for the second pad that connects with described half eyelet welding.
7. Through-hole reflow according to claim 6 connects the Welding Structure of device, it is characterized in that,
The hole wall in described half hole is electroplate with a kind of in nickel, silver, gold, the tin.
8. Through-hole reflow according to claim 1 connects the Welding Structure of device, it is characterized in that,
The material of described sheet metal is stainless steel or iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220326887 CN202907341U (en) | 2012-07-06 | 2012-07-06 | Welding structure of through-hole reflow welding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220326887 CN202907341U (en) | 2012-07-06 | 2012-07-06 | Welding structure of through-hole reflow welding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202907341U true CN202907341U (en) | 2013-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220326887 Expired - Lifetime CN202907341U (en) | 2012-07-06 | 2012-07-06 | Welding structure of through-hole reflow welding device |
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| CN (1) | CN202907341U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125721A (en) * | 2014-08-04 | 2014-10-29 | 太仓市同维电子有限公司 | Method and device for firmly welding SMD (surface mounted devices) nuts on printed circuit boards |
| CN105025129A (en) * | 2015-07-27 | 2015-11-04 | 广东欧珀移动通信有限公司 | Encapsulation method of card seat and mobile terminal |
| CN108834331A (en) * | 2018-07-09 | 2018-11-16 | 中国船舶重工集团公司第七0九研究所 | A kind of method of Pin-through-hole reflow soldering |
-
2012
- 2012-07-06 CN CN 201220326887 patent/CN202907341U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125721A (en) * | 2014-08-04 | 2014-10-29 | 太仓市同维电子有限公司 | Method and device for firmly welding SMD (surface mounted devices) nuts on printed circuit boards |
| CN104125721B (en) * | 2014-08-04 | 2017-02-01 | 太仓市同维电子有限公司 | Method and device for firmly welding SMD (surface mounted devices) nuts on printed circuit boards |
| CN105025129A (en) * | 2015-07-27 | 2015-11-04 | 广东欧珀移动通信有限公司 | Encapsulation method of card seat and mobile terminal |
| CN108834331A (en) * | 2018-07-09 | 2018-11-16 | 中国船舶重工集团公司第七0九研究所 | A kind of method of Pin-through-hole reflow soldering |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171102 Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Patentee after: Huawei terminal (Dongguan) Co.,Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: HUAWEI DEVICE Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: Huawei terminal (Dongguan) Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210427 Address after: Unit 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong 518040 Patentee after: Honor Device Co.,Ltd. Address before: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Patentee before: HUAWEI DEVICE Co.,Ltd. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130424 |