CN213071644U

CN213071644U - Adapter plate and adapter

Info

Publication number: CN213071644U
Application number: CN202021898558.3U
Authority: CN
Inventors: 袁志华; 许俊洪; 伍贤莉; 赵波
Original assignee: Shenzhen Zhongshen Photoelectric Co ltd
Current assignee: Shenzhen Zhongshen Photoelectric Co ltd
Priority date: 2020-09-03
Filing date: 2020-09-03
Publication date: 2021-04-27
Anticipated expiration: 2030-09-03

Abstract

The utility model discloses a keysets and adapter, include: the PCB comprises a first surface and a second surface opposite to the first surface; the first pad group is arranged on the first surface; the first through hole group is arranged on the first surface and is electrically connected with the first bonding pad group; the second pad group is arranged on the second surface; and the second through hole group is arranged on the second surface and is electrically connected with the second bonding pad group. The embodiment of the utility model provides a through first surface and the second surface at the PCB board set up six sub-pad groups of group and sixty group respectively and switch on punch combination, make the connector can set up on arbitrary a set of or multiunit sub-pad group, when testing or signal conversion to the device under test, only need connect the adapter on the different sub-pad group, can accomplish and test or signal conversion to the device under test of arbitrary pin, improved the suitability of keysets and the efficiency of software testing or signal conversion transmission efficiency of the device under test.

Description

Adapter plate and adapter

Technical Field

The utility model belongs to the technical field of the switching technique and specifically relates to a keysets and adapter are related to.

Background

At present, the adapter plate is specially designed according to the PIN foot. However, when the adapter board is used for signal conversion or connection, different adapter boards need to be replaced according to the pin types of the device under test, which not only affects the applicability of the adapter board, but also reduces the testing efficiency of the device under test.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a keysets and adapter can improve the efficiency of software testing's test and signal switching transmission efficiency.

In a first aspect, an embodiment of the present invention provides an interposer, including: the PCB comprises a first surface and a second surface opposite to the first surface; the first pad group is arranged on the first surface; the first through hole group is arranged on the first surface and is electrically connected with the first bonding pad group; the second pad group is arranged on the second surface; the second through hole group is arranged on the second surface and is electrically connected with the second bonding pad group; the first pad group and the second pad group respectively comprise at least six sub-pad groups, and the first conducting hole group and the second conducting hole group respectively comprise at least sixty sub-conducting hole groups; the six sub-welding pad groups respectively comprise a plurality of welding pads, and the six sub-welding pad groups are sequentially connected.

The utility model discloses the keysets has following beneficial effect at least: the first surface and the second surface of the PCB are respectively provided with at least six sub-pad groups and sixty sub-conduction hole groups, so that the connector can be arranged on any one or more sub-pad groups, when the tested device is tested or signal conversion and transmission is carried out, the tested device with the same pins as the connector can be tested or signal conversion and transmission can be carried out only by connecting the connectors on different sub-pad groups, and the applicability of the adapter plate and the testing efficiency or signal conversion and transmission efficiency of the tested device are improved.

According to the utility model discloses an adapter plate of other embodiments, six groups the equidistant setting of sub-pad group.

According to the utility model discloses an adapter plate of other embodiments, the interval is 0.5mm, the width of sub-padgroup is 0.3mm, the length of sub-padgroup is 4 mm.

According to another embodiment of the present invention, each group of the sub-pads group includes at least: sixty of the pads.

According to another embodiment of the interposer of the present invention, each sub via group at least includes three vias; the three via holes are connected in sequence.

According to the utility model discloses an adaptor plate of other embodiments still includes: and the connectors are connected with any one group of sub-bonding pad groups.

According to other embodiments of the present invention, the adapter plate further comprises a plurality of connectors, wherein the connectors comprise any one or more of the following: front cover type, rear cover type, flip type and plug type.

According to another embodiment of the present invention, the adapter plate further comprises a plurality of connectors connected to the pads in any one of the following manners: STM welding and manual welding.

In a second aspect, an embodiment of the present invention provides an adapter including an adapter plate as described in any of the embodiments of the first aspect.

Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of an interposer according to the present invention;

reference numerals:

the first through hole group 110, the first pad group 120, the first sub-pad group 121, the second sub-pad group 122, the third sub-pad group 123, the fourth sub-pad group 124, the fifth sub-pad group 125, and the sixth sub-pad group 126.

Detailed Description

The conception and the resulting technical effects of the present invention will be described clearly and completely with reference to the following embodiments, so that the objects, features and effects of the present invention can be fully understood. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention.

In the description of the embodiments of the present invention, if "a plurality" is referred to, it means one or more, if "a plurality" is referred to, it means two or more, if "greater than", "less than" or "more than" is referred to, it is understood that the number is not included, and if "more than", "less than" or "within" is referred to, it is understood that the number is included. If reference is made to "first" or "second", this should be understood to distinguish between features and not to indicate or imply relative importance or to implicitly indicate the number of indicated features or to implicitly indicate the precedence of the indicated features.

Referring to fig. 1, in some embodiments, an interposer includes: the PCB comprises a first surface and a second surface opposite to the first surface; a first pad group 120 disposed on the first surface; a first via group 110 disposed on the first surface and electrically connected to the first pad group 120; the second pad group is arranged on the second surface; and the second through hole group is arranged on the second surface and is electrically connected with the second bonding pad group. The first pad group 120 and the second pad group respectively include at least six sub-pad groups, and the first via group 110 and the second via group respectively include at least sixty sub-via groups; the six groups of sub-welding pad groups respectively comprise a plurality of welding pads, and the six groups of sub-welding pad groups are connected in sequence. Specifically, the PCB is provided with a first sub pad group 121, a second sub pad group 122, a third sub pad group 123, a fourth sub pad group 124, a fifth sub pad group 125, and a sixth sub pad group 126 in sequence from top to bottom. The via holes are divided into sixty sub-via groups in the vertical direction. In some specific embodiments, the thickness of the PCB ranges from 0.8mm to 1mm, the first sub-pad group 121, the second sub-pad group 122, the third sub-pad group 123, the fourth sub-pad group 124, the fifth sub-pad group 125, and the sixth sub-pad group 126 are sequentially connected, and sixty sub-via groups are correspondingly connected to a plurality of pads in the first sub-pad group 121. The PCB is a hard PCB, and it can be understood that fig. 1 only shows the first surface of the PCB, the second surface of the PCB is consistent with the first surface circuit structure of the PCB, and the first via hole group 110 of the first surface of the PCB and the second via hole group of the second surface of the PCB are correspondingly conducted, so that the circuit of the first surface of the PCB and the circuit via hole of the second surface of the PCB are conducted. It can be understood that the thickness and size of the PCB board can be adaptively adjusted according to actual needs.

In the embodiment of the application, by respectively arranging at least six sub-pad groups and sixty sub-via groups on the first surface and the second surface of the PCB, the connector can be arranged on any one or more sub-pad groups, and when a device to be tested is tested or signal conversion and transmission is performed, the device to be tested with the same pins as the connector can be tested or signal conversion and transmission can be performed only by connecting the connectors on different sub-pad groups, so that the applicability of the adapter board and the testing efficiency or signal conversion and transmission efficiency of the device to be tested are improved.

In some embodiments, the six groups of sub-pad groups are equally spaced. Specifically, the first sub-pad group, the second sub-pad group, the third sub-pad group, the fourth sub-pad group, the fifth sub-pad group and the sixth sub-pad group are sequentially arranged at equal intervals.

In some embodiments, the pitch of the six groups of sub-pad groups is 0.5mm, the width of each group of sub-pad groups is 0.3mm, and the length of each group of sub-pad groups is 4 mm. It can be understood that the pitch of each sub-pad group, the width and the length of each group of pad groups can be adaptively adjusted according to actual needs.

In some embodiments, each set of sub-padgroups comprises at least: sixty pads. Specifically, the first surface of the PCB and the second surface of the PCB together include twelve groups of 60PIN pads, and the PCB can be connected to FOG module drivers, LCM module drivers or TP module drivers of all 1-60 PIN PINs with conventional specifications on the market according to test requirements so as to realize drive test or signal conversion transmission of tested devices with different PINs.

In some embodiments, each sub-via group includes at least three vias, and the three vias are connected in sequence. Specifically, three via holes connected in sequence in the vertical direction are set as a group of sub-via holes, and the diameter of each via hole is 0.3 mm. One via hole in each sub-via hole group is correspondingly connected to a pad in the first sub-pad group 121, and when any one via hole in any one sub-pad group or any one sub-via hole group is damaged, a solder wire or a jumper wire can be used to connect other sub-pad groups or other via holes in the same sub-via hole group based on the jumper wire principle, so as to ensure the normal use of the adapter plate.

In some embodiments, the interposer further comprises: connectors (not shown) electrically connected to any one of the sub-pad sets. Specifically, the connector can be connected to the first surface sub-pad group of the PCB or the second surface sub-pad group of the PCB at will, so that the interposer includes a connector with multiple pin specifications, thereby improving the applicability of the interposer. It will be appreciated that the number of connectors can be adapted according to the testing requirements and the usage of the pads in the sub-pad set.

In some embodiments, the number of connectors includes any one or more of: the front cover type, the rear cover type, the flip type and the plug type. Specifically, the pin pitch of the connector is 0.5mm, and any one or more of the following connectors can be connected to any one of the sub-pad groups: the front cover type, the rear cover type, the flip type and the plug type.

In some embodiments, the connector is connected to any one of the sub-pad sets by either: STM welding and manual welding. Specifically, the first pad set 120 on the first surface of the PCB and the second pad set on the second surface of the PCB may be repeatedly soldered and replaced with the FPC connector. In some specific embodiments, the FPC connector can be welded on any group of sub-bonding pad groups through STM welding one-step forming or manual free welding, and stable conversion signal transmission can be provided for the tested device by only replacing the FPC extension line with corresponding specification under the condition that relevant devices such as a detection jig and the like are not replaced, so that the applicability of the adapter plate is improved.

In a specific embodiment, the first surface of the PCB and the second surface of the PCB are respectively provided with six sub-pad groups, each sub-pad group includes sixty pads, and the pads in the first sub-pad group 121 are correspondingly connected to the vias in the sub-via groups. The adapter plate is also connected with an FOG module, an LCM module, a TP module and other inspection jigs to realize signal conversion transmission and drive the FOG module, the LCM module and the TP module. According to the practical application requirement, the first surface of the PCB and the second surface of the PCB can be welded with 1-12 connectors with PINs ranging from 5 PIN to 60PIN in total, when the tested device is subjected to signal conversion transmission or drive test, the tested device is connected with the connectors corresponding to the PIN specifications only by using the extension line, the signal conversion transmission or the drive test can be realized, and the adaptability of the adapter plate and the test efficiency or the signal conversion transmission efficiency of the tested device are improved.

In a second aspect, embodiments of the present application provide an adaptor including an adaptor plate as described in any of the embodiments of the first aspect.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art. Furthermore, the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.

Claims

1. The keysets, its characterized in that includes:

the PCB comprises a first surface and a second surface opposite to the first surface;

the first pad group is arranged on the first surface;

the first through hole group is arranged on the first surface and is electrically connected with the first bonding pad group;

the second pad group is arranged on the second surface;

the second through hole group is arranged on the second surface and is electrically connected with the second bonding pad group;

the first pad group and the second pad group respectively comprise at least six sub-pad groups, and the first conducting hole group and the second conducting hole group respectively comprise at least sixty sub-conducting hole groups; the six sub-welding pad groups respectively comprise a plurality of welding pads, and the six sub-welding pad groups are sequentially connected.

2. The interposer as recited in claim 1, wherein six of said sets of sub-pads are equally spaced.

3. The interposer as recited in claim 2, wherein the pitch is 0.5mm, the width of the sub-padgroup is 0.3mm, and the length of the sub-padgroup is 4 mm.

4. The interposer as recited in claim 3, wherein each of said sets of sub-pads comprises at least: sixty of the pads.

5. The interposer as recited in claim 4, wherein each of said sub via groups comprises at least three vias;

the three via holes are connected in sequence.

6. The interposer as recited in any one of claims 1 to 5, further comprising:

and the connectors are electrically connected with any one group of sub-bonding pad groups.

7. The patch panel of claim 6, wherein a number of said connectors comprise any one or more of: front cover type, rear cover type, flip type and plug type.

8. The interposer as recited in claim 7, wherein a plurality of said connectors are connected to said set of sub-pads by any one of: STM welding and manual welding.

9. An adapter comprising an adapter plate according to any of claims 1 to 8.