CN216817389U - Bottom plate and device for development and debugging of wireless module - Google Patents
Bottom plate and device for development and debugging of wireless module Download PDFInfo
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- CN216817389U CN216817389U CN202122562704.6U CN202122562704U CN216817389U CN 216817389 U CN216817389 U CN 216817389U CN 202122562704 U CN202122562704 U CN 202122562704U CN 216817389 U CN216817389 U CN 216817389U
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Abstract
The application discloses bottom plate and device towards wireless module development and debugging, wherein the bottom plate includes: the first core board interface comprises a plurality of welding parts, and the plurality of welding parts are used for welding with the first core board; the second core board interface is arranged on the substrate and comprises a plurality of plug connectors, the plurality of plug connectors are correspondingly and electrically connected with the welding part of the first core board interface, and the plurality of plug connectors are used for being plugged with the second core board; the peripheral module is arranged on the substrate, is adjacent to the first core board interface and/or the second core board interface and is electrically connected with the first core board interface and the second core board interface. The technical problem that the connection mode of the bottom plate and the core plate is single is solved, and therefore debugging efficiency is improved.
Description
Technical Field
The application relates to the technical field of development and debugging, in particular to a bottom plate and a device for development and debugging of a wireless module.
Background
At present, in the development and debugging technology field, a development board generally adopts a combination mode of a core board and a bottom board. The existing bottom plate is generally a bottom plate with a single connection mode, and in the process of matching debugging of the bottom plate and the core plate, the core plate with a specific connection structure can only be purchased or the core plate is connected by manual welding flying lines due to the single connection mode of the bottom plate and the core plate, so that the process is complex, and the debugging efficiency is reduced.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a towards bottom plate and device of wireless module development and debugging, solves the single technical problem of connected mode of bottom plate and nuclear core plate, improves the suitability of bottom plate and nuclear core plate to improve debugging efficiency.
The first aspect of the embodiments of the present application provides a bottom plate for development and debugging of a wireless module, including:
a substrate;
the first core board interface is arranged on the substrate and comprises a plurality of welding parts, and the plurality of welding parts are used for welding with the first core board;
the second core board interface is arranged on the substrate and comprises a plurality of plug connectors, the plurality of plug connectors are correspondingly and electrically connected with the welding parts of the first core board interface, and the plurality of plug connectors are used for being plugged with the second core board;
the peripheral module is arranged on the substrate, and the peripheral module is adjacent to the first core board interface and/or the second core board interface and is electrically connected with the first core board interface and the second core board interface.
Optionally, the base plate further comprises:
a plurality of card needle connecting portion, each card needle connecting portion with the welding part of first nuclear core plate interface corresponds the connection, a plurality of card needle connecting portions are used for with third nuclear core plate joint.
In some embodiments, the card pin connecting portion and the welding portion are integrally disposed, or the card pin connecting portion and the welding portion are connected by a wire.
In some embodiments, the plurality of welding portions include at least a plurality of first welding portions arranged in an array and a plurality of second welding portions arranged in an array, and an arrangement direction of the plurality of first welding portions is parallel to an arrangement direction of the plurality of second welding portions;
the plurality of plug connectors are at least arranged on a plurality of first plug connectors and a plurality of second plug connectors, the plurality of first plug connectors are arranged on the plurality of second plug connectors, and the arrangement directions of the plurality of first plug connectors are parallel to the arrangement directions of the plurality of second plug connectors and the arrangement directions of the plurality of first welding parts are parallel to each other.
In some embodiments, the peripheral module includes one or more of:
the device comprises a key module, an indicator light module, a buzzer module, a display module and a pin header module.
Optionally, the base plate further comprises:
the power module, power module with button module, pilot lamp module, buzzer module, display module, row needle module, first nuclear core plate interface, second nuclear core plate interface electricity are connected, and do button module, pilot lamp module, buzzer module, display module, row needle module, first nuclear core plate interface, second nuclear core plate interface provide the power.
In some embodiments, the power module comprises:
a USB interface;
the switch is electrically connected with the USB interface;
the voltage transformation circuit is electrically connected with the switch;
and the USB-to-serial port circuit is electrically connected with the voltage transformation circuit.
A second aspect of the embodiments of the present application provides a device for developing and debugging a wireless module, including:
the aforementioned bottom plate;
a first core board, the first core board being interface welded to the first core board of the base plate; and
the second is nuclear core plate, the second nuclear core plate be used for with the bottom plate the second nuclear core plate interface is pegged graft.
Optionally, the second core board of the device comprises:
an interposer comprising opposing first and second sides;
the plug-in component is arranged on the first side surface and is used for being plugged with the second core board interface;
a core board circuit soldered to the second side surface.
The embodiment of the application provides a towards bottom plate and device of wireless module development debugging, the bottom plate includes: a substrate; the first core board interface is arranged on the substrate and comprises a plurality of welding parts, and the plurality of welding parts are used for welding with the first core board; the second core board interface is arranged on the substrate and comprises a plurality of plug connectors, the plurality of plug connectors are correspondingly and electrically connected with the welding parts of the first core board interface, and the plurality of plug connectors are used for being plugged with the second core board; the peripheral module sets up on the base plate, the peripheral module with first nuclear core plate interface and/or the adjacent setting of second nuclear core plate interface, and with first nuclear core plate interface with the second is connected in the nuclear core plate interface electricity, solves the single technical problem of connected mode of bottom plate and nuclear core plate, improves the suitability of bottom plate and nuclear core plate to improve debugging efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a base plate according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of an apparatus provided in the second embodiment of the present application.
Description of reference numerals: 10. a base plate; 20. a first core board; 30. a second core board; 101. a first core board interface; 102. a second core board interface; 103. a peripheral module; 104. a needle-clamping connection part; 105. a power supply module; 1011. welding the part; 1021. a plug-in unit; 1031. a key module; 1032. an indicator light module; 1033. a buzzer module; 1034. a display module; 1035. and a pin header module.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be noted that, if not conflicted, the individual features of the embodiments of the present application can be combined with one another within the scope of protection of the present application. In addition, although the division of the functional blocks is made in the configuration diagram, in some cases, it may be divided in blocks different from those in the configuration diagram.
It is to be understood that the terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
The following describes the embodiments in further detail with reference to the accompanying drawings.
Example one
The embodiment of the present application provides a backplane 10 for development and debugging of a wireless module, and a schematic structural diagram of the backplane 10 is shown in fig. 1. As shown in fig. 1, the base plate 10 includes:
a substrate;
the first core board interface 101 is disposed on the substrate, and the first core board interface 101 includes a plurality of welding portions 1011, where the plurality of welding portions 1011 are used for welding with the first core board 20;
the second core board interface 102 is arranged on the substrate, the second core board interface 102 comprises a plurality of connectors 1021, the plurality of connectors 1021 are correspondingly and electrically connected with the welding part 1011 of the first core board interface 101, and the plurality of connectors 1021 are used for being spliced with the second core board 30;
the peripheral module 103 is disposed on the substrate, and the peripheral module 103 is disposed adjacent to the first core board interface 101 and/or the second core board interface 102, and is electrically connected to the first core board interface 101 and the second core board interface 102.
It will be appreciated that the connection of the board 10 to the core board includes: welding, inserting and clamping. The types of the pins of the core board are different, and the corresponding connection modes between the core board and the bottom board 10 are also different. From a practical application scenario, it is necessary to design the backplane 10 of the multi-type core board interface.
In some embodiments, the core board connected to the backplane 10 may be a wireless module, and the wireless module may be welded, plugged or clamped to the backplane 10.
In some embodiments, bond 1011 includes a pad and the pad structure includes a regular pad, a hot air pad, an isolation pad, and an electrical resistance pad. Wherein the shape of the pad is not limited. It is understood that the first core board 20 may be a soldering core board, and the leads of the soldering core board are soldered to the plurality of soldering portions 1011 of the first core board interface 101. It is understood that the first core board 20 may be a wireless module with soldering, and the pins of the wireless module are soldered to the plurality of soldering portions 1011 of the first core board interface 101.
In some embodiments, a welding hole is formed on a pad of the welding portion 1011, and the welding hole is used for inserting a card pin so that the card pin can be fixed on the welding portion 1011.
In some embodiments, the connector 1021 includes a connector base having a plurality of connector holes formed therein that correspond to the pins of the core board. It is understood that the second core board 30 may be a plug-in core board, and the pins of the plug-in core board are correspondingly plugged with the plurality of plugs 1021 of the second core board interface 102. It is understood that the second core board 30 may be a plug-in wireless module, and the pins of the plug-in wireless module are correspondingly plugged into the plurality of plug-in units 1021 of the second core board interface 102.
In some embodiments, a first core board interface 101, a second core board interface 102, and a peripheral module 103 are disposed on the substrate of the backplane 10. The peripheral module 103 is arranged in an adjacent area of the first core board interface 101 and/or the second core board interface 102.
Optionally, the plurality of welding portions 1011 at least include a plurality of first welding portions arranged in an array and a plurality of second welding portions arranged in an array, and the array direction of the plurality of first welding portions is parallel to the array direction of the plurality of second welding portions; the plurality of connectors 1021 at least comprise a plurality of first connectors arranged and a plurality of second connectors arranged, and the arrangement direction of the plurality of first connectors is parallel to the arrangement direction of the plurality of second connectors and parallel to the arrangement direction of the plurality of first welding parts.
In some embodiments, the plurality of welding portions 1011 include at least a plurality of first welding portions arranged in an array and a plurality of third welding portions arranged in an array, and the array direction of the plurality of first welding portions is perpendicular to the array direction of the plurality of third welding portions; the plurality of connectors 1021 at least comprise a plurality of first connectors arranged and a plurality of third connectors arranged, the arrangement direction of the plurality of first connectors is perpendicular to the arrangement direction of the plurality of third connectors, the arrangement direction of the plurality of first connectors is parallel to the arrangement direction of the plurality of first welding parts, and the arrangement direction of the plurality of third connectors is parallel to the arrangement direction of the plurality of third welding parts.
It is understood that the arrangement of the plurality of soldering portions 1011 may correspond to the pin position distribution of the first core board 20, and the arrangement of the plurality of connectors 1021 may correspond to the pin position distribution of the second core board 30.
Optionally, the peripheral module 103 includes one or more of:
a key module 1031, an indicator light module 1032, a buzzer module 1033, a display module 1034 and a pin arranging module 1035.
In some embodiments, the pin header module 1035 is electrically connected to the first core board interface 101 and/or the second core board interface 102, the pin header module 1035 is electrically connected to the key module 1031, and the key module 1031 is electrically connected to the indicator light module 1032. During the commissioning process, the corresponding key in the key module 1031 may be selected by changing the state of the pin header module 1035, and the light or dark of the indicator light in the corresponding indicator light module 1032 may be controlled by changing the state of the key. It is understood that the key module 1031, the indication lamp module 1032, the buzzer module 1033, the display module 1034 and the pin arranging module 1035 are electrically connected correspondingly, and the key module 1031, the indication lamp module 1032, the buzzer module 1033, the display module 1034 and the pin arranging module 1035 are electrically connected correspondingly with the first core board interface 101 and/or the second core board interface 102.
In some embodiments, the specific modules of the peripheral module 103 may be set according to the actual application scenario of the backplane 10. It will be appreciated that the actual application scenario of the backplane 10 is relevant to the core board.
Optionally, the core board may be a wireless module, and specific modules of the peripheral modules 103 on the bottom board 10 may be set according to specific module requirements in a development and debugging process of the wireless module. It can be understood that, when a large number of keys are needed in the development and debugging process of the wireless module, a corresponding number of key modules 1031 may be set as required; when related loads are needed in the development and debugging process of the wireless module, the corresponding number of load modules such as the indicator light module 1032, the buzzer module 1033, the display module 1034 and the like can be set according to actual requirements; when the related modules need to be selected during the development and debugging of the wireless module, the corresponding number of pin-arranging modules 1035 can be set according to actual requirements.
Optionally, as shown in fig. 1, the base plate 10 further includes:
each of the plurality of clip connecting portions 104 is connected to the corresponding welding portion 1011 of the first core board interface 101, and the plurality of clip connecting portions 104 are configured to be clipped to the third core board.
In some embodiments, the card pin connection part 104 is formed with a pad and a card pin hole, and the card pin may be inserted into the card pin hole and soldered in the card pin connection part 104 through the pad. It can be understood that one end of the clip is fixed in the clip hole by welding, and the other end of the clip can be correspondingly inserted through the pin of the third core board and be clipped in the welding hole of the corresponding welding portion 1011, so as to fix the third core board on the base board 10. It is understood that the third core board may be a wireless module of a clip type, and the wireless module of a clip type may be fixed on the base board 10 by a clip pin.
Optionally, the card pin connecting portion 104 and the welding portion 1011 are integrally disposed, or the card pin connecting portion 104 and the welding portion 1011 are connected by a wire.
In some embodiments, when the wiring of the bottom plate 10 is designed, the card pin connecting portion 104 and the soldering portion 1011 may be directly integrated, that is, the pad of the soldering portion 1011 and the pad of the card pin connecting portion 104 are integrated, and it can be understood that the soldering portion 1011 and the card pin connecting portion 104 after the integrated configuration do not need to establish an electrical connection relationship through the wiring. The card pin connecting portion 104 and the soldering portion 1011 may also be separately disposed, that is, a pad of the soldering portion 1011 and a pad of the card pin connecting portion 104 are separately disposed, and an electrical connection relationship between the soldering portion 1011 and the card pin connecting portion 104 is established by disposing a trace.
Optionally, as shown in fig. 1, the base plate 10 further includes:
the power module 105 is electrically connected to the key module 1031, the indicator light module 1032, the buzzer module 1033, the display module 1034, the pin arranging module 1035, the first core board interface 101, and the second core board interface 102, and provides power for the key module 1031, the indicator light module 1032, the buzzer module 1033, the display module 1034, the pin arranging module 1035, the first core board interface 101, and the second core board interface 102.
In some embodiments, the power module 105 includes:
a USB (Universal Serial Bus) interface;
the switch is electrically connected with the USB interface;
the voltage transformation circuit is electrically connected with the switch;
and the USB-to-serial port circuit is electrically connected with the voltage transformation circuit.
In some embodiments, during the debugging process of the core board and the backplane 10, the USB interface is used to connect an external device through USB, where the external device may be a computer. It can be understood that, after the USB interface is connected to the power supply device, the power supply state of the bottom plate 10 can be controlled through the switch, and the power supply voltage can be stabilized in the voltage range in which the bottom plate 10 and the core plate can normally work through the voltage transformation circuit, and the data transmission between the external device and the core plate and the bottom plate 10 can be performed through the USB to serial port circuit, so that the core plate and the bottom plate 10 can be debugged.
Optionally, the substrate comprises a single layer board, a double layer board, or a multilayer board.
In some embodiments, the substrate includes two opposite sides, and when a PCB (Printed Circuit Board) drawing is performed, the wiring is performed according to an electrical connection relationship among the first core Board interface 101, the second core Board interface 102, the key module 1031, the indicator light module 1032, the buzzer module 1033, the display module 1034, and the pin arranging module 1035. The single layer board means that PCB wiring can only be drawn on the same side, the double layer board means that PCB wiring can be drawn on both sides, and the multi-layer board generally includes double-number boards such as four-layer boards, six-layer boards, eight-layer boards, and the like. Multilayer boards mean that PCB wiring can be drawn in multiple layers, where the PCB wiring of a multilayer board is typically dominated by the top and bottom layers and by the middle wiring layer. In practical application, a single-layer board, a double-layer board or a multi-layer board can be selected as a substrate according to actual conditions, and the PCB wiring is drawn on the substrate.
Example two
Referring to fig. 2 in conjunction with the first embodiment, fig. 2 is a schematic structural diagram of a device for developing and debugging a wireless module according to a second embodiment of the present application.
As shown in fig. 2, an apparatus for developing and debugging a wireless module includes:
the aforementioned base plate 10;
the first core board 20, the first core board 20 is welded with the first core board interface 101 of the base board 10; and
a second core board 30, wherein the second core board 30 is used for plugging with the second core board interface 102 of the backplane 10.
In some embodiments, the first core board 20 and the second core board 30 in the above embodiments may be the same type of core board, the same type of core board may be selectively welded to the first core board interface 101 of the backplane 10 through an associated welding operation, and the same type of core board may also be plugged to the second core board interface 102 of the backplane 10 through an associated plugging operation. It is understood that the first core board 20 and the second core board 30 in the above embodiments may be the same type of wireless module, and the wireless module may be selectively soldered to the plurality of soldering portions 1011 of the first core board interface 101 of the base board 10 by the related soldering operation, or may be selectively plugged to the plurality of plugging portions 1021 of the second core board interface 102 of the base board 10 by the related plugging operation.
It is to be understood that in another embodiment, the third core board in the above embodiments may be of the same type as the first core board 20 and the second core board 30. It is understood that, in another embodiment, the third core board in the above embodiments may be the same type of wireless module as the first core board 20 and the second core board 30, and the wireless module may also be optionally fixed on the bottom board 10 through a related clamping operation, so as to establish an electrical connection relationship between the wireless module and the bottom board 10.
Optionally, the second core board 30 of the apparatus comprises:
the adapter plate comprises a first side surface and a second side surface which are opposite;
the plug-in component is arranged on the first side face and is used for being plugged with the second core board interface 102;
and the core board circuit is welded on the second side surface.
In some embodiments, a correspondingly sized interposer may be selected based on the size of the core board circuitry and the size of the second core board interface 102 of the backplane 10, and the core board circuitry is soldered to the second side of the interposer and plugged into the second core board interface 102 of the backplane 10 via a plug assembly provided on the first side of the interposer, thereby establishing an electrical connection between the second core board 30 and the backplane 10.
In some embodiments, the second core board 30 may be a wireless module, optionally, the wireless module includes a wireless module circuit, and when the size of the wireless module circuit is not suitable for the size of the second core board interface 102 of the base board 10, a patch board with a corresponding size may be selected, the wireless module circuit is soldered on the second side of the patch board, the patch board is configured to run and is plugged with the second core board interface 102 of the base board 10 through a plug assembly disposed on the first side of the patch board, so as to establish an electrical connection relationship between the wireless module and the base board 10.
It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a towards bottom plate of wireless module development debugging which characterized in that includes:
a substrate;
the first core board interface is arranged on the substrate and comprises a plurality of welding parts, and the plurality of welding parts are used for welding with the first core board;
the second core board interface is arranged on the substrate and comprises a plurality of plug connectors, the plurality of plug connectors are correspondingly and electrically connected with the welding parts of the first core board interface, and the plurality of plug connectors are used for being plugged with the second core board;
peripheral hardware module sets up on the base plate, peripheral hardware module with first nuclear core plate interface and/or the adjacent setting of second nuclear core plate interface, and with first nuclear core plate interface with second nuclear core plate interface electricity is connected.
2. The backplane of claim 1, further comprising:
a plurality of card needle connecting portion, each card needle connecting portion with the welding part of first nuclear core plate interface corresponds the connection, a plurality of card needle connecting portions are used for with third nuclear core plate joint.
3. The bottom plate according to claim 2, wherein the card pin connecting portion is integrally provided with the soldering portion, or the card pin connecting portion is connected with the soldering portion by a wire.
4. The bottom plate according to claim 1, wherein the plurality of welding portions include at least a plurality of first welding portions arranged in a row and a plurality of second welding portions arranged in a row, and an arrangement direction of the plurality of first welding portions is parallel to an arrangement direction of the plurality of second welding portions;
the plurality of plug connectors are at least arranged on a plurality of first plug connectors and a plurality of second plug connectors, the plurality of first plug connectors are arranged on the plurality of second plug connectors, and the arrangement directions of the plurality of first plug connectors are parallel to the arrangement directions of the plurality of second plug connectors and the arrangement directions of the plurality of first welding parts are parallel to each other.
5. The backplane of claim 1, wherein the peripheral modules comprise one or more of:
the device comprises a key module, an indicator light module, a buzzer module, a display module and a pin header module.
6. The backplane of claim 5, further comprising:
power module, power module with button module, pilot lamp module piece, bee calling organ module, display module, row's needle module, first nuclear core plate interface, second nuclear core plate interface electricity are connected, and do button module, pilot lamp module piece, bee calling organ module, display module, row's needle module, first nuclear core plate interface, second nuclear core plate interface provide the power.
7. The backplane of claim 6, wherein the power module comprises:
a USB interface;
the switch is electrically connected with the USB interface;
the voltage transformation circuit is electrically connected with the switch;
and the USB-to-serial port circuit is electrically connected with the voltage transformation circuit.
8. A backplane according to claim 1, wherein the substrate comprises a single layer board, a double layer board or a multi layer board.
9. The utility model provides a device towards wireless module development debugging which characterized in that includes:
the base plate of any one of claims 1 to 8;
the first core board is welded with the first core board interface of the base board; and
the second core board is used for being connected with the second core board interface of the base plate in an inserting mode.
10. The apparatus of claim 9, wherein the second core board comprises:
an interposer comprising opposing first and second sides;
the plug-in component is arranged on the first side surface and is used for being plugged with the second core board interface;
a core board circuit soldered to the second side surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122562704.6U CN216817389U (en) | 2021-10-22 | 2021-10-22 | Bottom plate and device for development and debugging of wireless module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122562704.6U CN216817389U (en) | 2021-10-22 | 2021-10-22 | Bottom plate and device for development and debugging of wireless module |
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| Publication Number | Publication Date |
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| CN216817389U true CN216817389U (en) | 2022-06-24 |
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| CN202122562704.6U Active CN216817389U (en) | 2021-10-22 | 2021-10-22 | Bottom plate and device for development and debugging of wireless module |
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