CN114928938A - Packaging structure and packaging method of PCB fuse - Google Patents
Packaging structure and packaging method of PCB fuse Download PDFInfo
- Publication number
- CN114928938A CN114928938A CN202210519507.2A CN202210519507A CN114928938A CN 114928938 A CN114928938 A CN 114928938A CN 202210519507 A CN202210519507 A CN 202210519507A CN 114928938 A CN114928938 A CN 114928938A
- Authority
- CN
- China
- Prior art keywords
- fuse
- printed
- special
- pcb
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 114
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 45
- 238000005476 soldering Methods 0.000 claims abstract description 39
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 239000010959 steel Substances 0.000 claims abstract description 26
- 230000002708 enhancing effect Effects 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000003990 capacitor Substances 0.000 description 4
- 230000001680 brushing effect Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 2
- 241001424392 Lucia limbaria Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Abstract
The invention discloses a packaging structure and a packaging method of a PCB fuse. Comprises a solder resistance ring, a solder joint and a printed fuse; the welding spot is a special-shaped welding spot and is formed by connecting a larger semicircular welding spot and a smaller semicircular welding spot, the larger semicircular welding spot is used as a detinning welding spot for uniformly guiding soldering tin to stay, and the smaller semicircular welding spot is used as a fuse welding spot for enhancing the soldering tin quality on the surface of the fuse; the printed fuse structure further comprises soldering tin arranged on the printed fuse, and the soldering tin is formed by a rectangular steel mesh windowing layer and is arranged in the middle of the printed fuse; the circle center of the larger semicircular welding point and the circle center of the smaller semicircular welding point are superposed to be used as the circle center of the special-shaped welding point, and the diameter side of the larger semicircular welding point and the diameter side of the smaller semicircular welding point are superposed to be positioned on the same straight line. The structure of the invention can effectively achieve the aims of strong welding spot stress of the printed fuse, flat tin-plated surface and difficult formation of tin balls.
Description
Technical Field
The invention relates to an encapsulation structure in the technical field of SMT (surface mount technology), in particular to an encapsulation structure and an encapsulation method of a PCB fuse.
Background
The hardware circuit design adds a filter capacitor on the power supply line to suppress the ripple noise of the power supply line. Because the capacitor has a voltage across it, once a short circuit occurs, it may short the power supply to ground, causing damage to the circuit board. To prevent this, a small copper fuse wire is usually designed on the circuit board between the capacitor and the ground.
When designing a PCB, if a designed slender copper wire is just directly arranged between a capacitor and the ground, tin is plated on the surface of a fuse, and after the tin is cooled, a tin ball is formed on a printed wire. The solder balls are easy to fall off to cause board-level short circuit, thereby increasing the reject ratio of products.
Disclosure of Invention
In order to solve the problems in the background art, the invention discloses a packaging structure and a packaging method of a PCB fuse, which avoid forming solder balls on printed wires and avoid causing board-level short circuit, thereby increasing the yield of products.
The technical scheme of the invention is realized as follows:
a packaging structure of a PCB fuse:
the PCB comprises two welding spots which are arranged at intervals and arranged on the PCB, and soldering tin is arranged on the welding spots;
the PCB comprises a printed fuse and a printed circuit board, wherein the printed fuse is arranged on the PCB and connected between two special-shaped welding spots;
the PCB comprises a solder mask ring, a printed fuse and two special-shaped welding points, wherein the solder mask ring is arranged on a PCB and wraps the periphery of the printed fuse and the two special-shaped welding points;
the method is characterized in that:
the welding points are special-shaped welding points, and each special-shaped welding point is formed by connecting a larger semicircular welding point and a smaller semicircular welding point;
wherein, the larger semicircular welding spot is used as a detinning welding spot for uniformly guiding the solder to stay;
wherein the smaller semicircular welding points are used as the welding points of the fuse for enhancing the soldering tin quality on the surface of the fuse.
The printed fuse structure further comprises soldering tin arranged on the printed fuse, and the soldering tin is formed through a rectangular steel mesh windowing layer and is arranged in the middle of the printed fuse.
During the preparation, set up the steel mesh above the printing fuse, the steel mesh department directly over the printing fuse middle part sets up the rectangle and leads to the groove to form rectangle steel mesh layer of windowing, arrange in the rectangle leads to the groove to add soldering tin and make soldering tin cover on the printing fuse middle part.
The circle center of the larger semicircular welding point and the circle center of the smaller semicircular welding point are coincided to serve as the circle center of the special-shaped welding point, and the diameter edge of the larger semicircular welding point and the diameter edge of the smaller semicircular welding point are coincided to be positioned on the same straight line.
And two ends of the printed fuse are respectively connected to the centers of the special-shaped welding spots.
The two special-shaped welding points are symmetrically arranged at the midpoint of the printed fuse, the fuse welding points of the two smaller semicircular welding points are symmetrically arranged at the inner side positions of the special-shaped welding points, and two ends of the printed fuse extend through the fuse welding points of the smaller semicircular welding points and then are connected to the centers of the special-shaped welding points.
The printed fuse is a copper wire.
The packaging manufacturing method of the packaging structure of the PCB fuse comprises the following steps:
firstly, manufacturing two special-shaped welding points on a PCB, connecting a printed fuse between the two special-shaped welding points through soldering tin, and arranging upper welding resistant rings around the special-shaped welding points and the printed fuse; then set up the steel mesh above the printing fuse, the steel mesh department directly over the printing fuse middle part sets up the rectangle and leads to the groove to form rectangle steel mesh windowing layer, arrange in the rectangle leads to the inslot and add soldering tin and make soldering tin cover on the printing fuse middle part.
The rectangular steel mesh windowing layer covers the middle part of the printed fuse, so that the center of the rectangular groove of the rectangular steel mesh windowing layer is superposed with the center of the printed fuse.
The invention has the beneficial effects that:
the invention effectively reduces the amount of the whole soldering tin paste, reduces the soldering cost, prevents excessive tin paste brushing and avoids the phenomenon and the problem of easy formation of tin balls.
The structure of the invention can effectively achieve the purposes of strong stress of the printed fuse welding spot, flat tin-plated surface and difficult formation of tin balls.
Drawings
FIG. 1 is a diagram of a PCB fuse package structure according to the present invention.
Detailed Description
The invention is further described with reference to the following figures and examples.
As shown in fig. 1, the package structure includes solder resist ring 1, fuse pad 2, printed fuse 4 and detinned pad 5.
The PCB comprises two welding spots which are arranged at intervals and arranged on the PCB, and soldering tin is arranged on the welding spots;
the PCB comprises a printed fuse 4 which is arranged on a PCB and connected between two special-shaped welding spots;
the printed fuse structure further comprises soldering tin arranged on the printed fuse 4, and the soldering tin is formed and arranged on the middle of the printed fuse 4 through the rectangular steel mesh windowing layer 3.
During the preparation, 4 tops of printing fuse set up the steel mesh, and the steel mesh department directly over 4 middle parts of printing fuse sets up the rectangle and leads to the groove to form rectangle steel mesh windowing layer 3, arrange in the rectangle leads to the groove to add soldering tin and make soldering tin cover on 4 middle parts of printing fuse.
The PCB comprises a solder mask ring 1, a printed fuse 4 and two special-shaped welding points, wherein the solder mask ring is arranged on the PCB and wraps the periphery of the printed fuse and the two special-shaped welding points;
the welding spots are special-shaped welding spots, and each special-shaped welding spot is formed by connecting a larger semicircular welding spot and a smaller semicircular welding spot;
wherein, the larger semicircular welding spot is used as a detinning welding spot 5 for uniformly guiding the solder to stay and leading the solder to be uniform;
wherein the smaller semicircular welding spots are used as the fuse welding spots 2 for enhancing the soldering quality of the fuse surface.
The circle center of the larger semicircular welding point and the circle center of the smaller semicircular welding point are coincided to serve as the circle center of the special-shaped welding point, and the diameter edge of the larger semicircular welding point and the diameter edge of the smaller semicircular welding point are coincided to be positioned on the same straight line. Two ends of the printed fuse 4 are respectively connected to the centers of the special-shaped welding spots.
The two special-shaped welding points are symmetrically arranged at the middle point of the printed fuse 4 in the packaging structure, the fuse welding points 2 of the two smaller semicircular welding points are symmetrically arranged at the inner side positions of the special-shaped welding points, the two larger semicircular welding points are symmetrically arranged close to the outer side, and two ends of the printed fuse 4 firstly extend through the fuse welding points 2 of the smaller semicircular welding points and then are connected to the centers of the special-shaped welding points, namely the circle centers of the special-shaped welding points.
Because the printed fuse 4 has a slender structure, in the process of melting the soldering tin, a large amount of tin can be remained on the surface of the fuse to form the soldering tin ball, and the product quality is influenced.
The detinned solder joint 5 is designed into a large semicircular shape and arranged on the outer side, the surface area of the detinned solder joint 5 is far larger than that of the printed fuse 4, the fuse solder joint 2 is designed into a small semicircular shape and arranged on the inner side to be connected with the printed fuse 4, so that the redundant melted soldering tin on the printed fuse 4 is absorbed away by the detinned solder joint 5, and the formation of the soldering tin on the printed fuse 4 is avoided.
The invention designs the small semicircular fuse welding spot 2, which not only can increase the connection area of the two ends of the printed fuse 4 on the PCB, but also can enhance the adhesive force of the copper wire to prevent the copper wire from cracking due to stress; the small semicircular welding points can effectively prevent the printed fuse 4 from conducting heat too fast due to overlarge connecting area of two ends in the process of melting soldering tin, so that the surface of the printed fuse 4 is plated with tin and is not flat.
The special-shaped welding points and the printed fuses 4 are wrapped by the solder resisting rings 1, and the copper wires of the printed fuses 4 are exposed by the special-shaped welding points and the printed fuses 4 through windowing the special-shaped welding points and the printed fuses 4 due to the existence of the solder resisting rings 1.
In the specific implementation, firstly, two special-shaped welding points are manufactured on a PCB, a printed fuse 4 is connected between the two special-shaped welding points through soldering tin, and an upper solder stop ring 1 is arranged around the special-shaped welding points and the printed fuse 4; then set up the steel mesh above printing fuse 4, the steel mesh department directly over printing fuse 4 middle part sets up the rectangle and leads to the groove to form rectangle steel mesh windowing layer 3, arrange in the rectangle leads to the groove and add soldering tin and make soldering tin cover on printing fuse 4 middle part.
The area of actually brushing the solder paste for the PCB fuse wire is the area of the rectangular groove of the rectangular steel mesh windowing layer 3, the design effectively reduces the whole amount of the solder paste, and the phenomenon of brushing the solder balls formed by excessive solder paste is prevented while the welding cost is reduced.
The rectangular steel mesh windowing layer 3 covers the middle part of the printed fuse 4, so that the center of the rectangular groove of the rectangular steel mesh windowing layer 3 coincides with the center of the printed fuse 4.
After the middle of the printed fuse 4 is provided with the soldering tin, the soldering tin in the melting state can flow along with the printed fuse 4 and then be connected with the soldering tin on the two welding spots, and then the current-carrying capacity of the printed fuse 4 is increased.
Claims (8)
1. A package structure of a PCB fuse is disclosed,
the PCB comprises two welding spots which are arranged at intervals and arranged on the PCB, and soldering tin is arranged on the welding spots;
the PCB comprises a printed fuse (4) which is arranged on a PCB and connected between two special-shaped welding points;
the PCB comprises a solder mask ring (1) which is arranged on a PCB and wraps a printed fuse (4) and two special-shaped welding points;
the method is characterized in that:
the welding points are special-shaped welding points, and each special-shaped welding point is formed by connecting a larger semicircular welding point and a smaller semicircular welding point;
wherein, the larger semicircular welding spot is used as a detinning welding spot (5) for uniformly guiding the solder to stay;
wherein the small semicircular welding spots are used as fuse welding spots (2) for enhancing the soldering quality of the fuse surface.
2. The PCB fuse package structure of claim 1, wherein:
the printed fuse structure further comprises soldering tin arranged on the printed fuse (4), and the soldering tin is formed through the rectangular steel mesh windowing layer (3) and is arranged in the middle of the printed fuse (4).
3. The PCB fuse package structure of claim 1, wherein:
the circle center of the larger semicircular welding point and the circle center of the smaller semicircular welding point are coincided to serve as the circle center of the special-shaped welding point, and the diameter edge of the larger semicircular welding point and the diameter edge of the smaller semicircular welding point are coincided to be positioned on the same straight line.
4. The PCB fuse packaging structure of claim 3, wherein:
and two ends of the printed fuse (4) are respectively connected to the centers of the special-shaped welding spots.
5. The PCB fuse package structure of claim 1, wherein:
the two special-shaped welding points are symmetrically arranged at the midpoint of the printed fuse (4), the fuse welding points (2) of the two smaller semicircular welding points are symmetrically arranged at the inner sides of the special-shaped welding points, and two ends of the printed fuse (4) extend through the fuse welding points (2) of the smaller semicircular welding points and then are connected to the centers of the special-shaped welding points.
6. The PCB fuse package structure of claim 1, wherein:
the printed fuse (4) is made of copper wires.
7. The package manufacturing method applied to the package structure of any one of claims 1 to 6, characterized in that:
firstly, two special-shaped welding points are manufactured on a PCB, a printed fuse (4) is connected between the two special-shaped welding points through soldering tin, and an upper solder resisting ring (1) is arranged around the special-shaped welding points and the printed fuse (4); then set up the steel mesh above printing fuse (4), the steel mesh department directly over printing fuse (4) middle part sets up the rectangle and leads to the groove to form rectangle steel mesh windowing layer (3), arrange in the rectangle leads to the groove to add soldering tin and make soldering tin cover on printing fuse (4) middle part.
8. The method of claim 7, wherein:
the rectangular steel mesh windowing layer (3) covers the middle part of the printed fuse (4), so that the center of the rectangular groove of the rectangular steel mesh windowing layer (3) is superposed with the center of the printed fuse (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210519507.2A CN114928938A (en) | 2022-05-12 | 2022-05-12 | Packaging structure and packaging method of PCB fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210519507.2A CN114928938A (en) | 2022-05-12 | 2022-05-12 | Packaging structure and packaging method of PCB fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114928938A true CN114928938A (en) | 2022-08-19 |
Family
ID=82808470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210519507.2A Pending CN114928938A (en) | 2022-05-12 | 2022-05-12 | Packaging structure and packaging method of PCB fuse |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114928938A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101217082A (en) * | 2008-01-04 | 2008-07-09 | 深圳和而泰智能控制股份有限公司 | A structure for controlling circuit copper foil combusting |
| KR20110137060A (en) * | 2010-06-16 | 2011-12-22 | 주식회사 하이닉스반도체 | Semiconductor package |
| CN203950768U (en) * | 2014-06-03 | 2014-11-19 | 福建万众百源实业有限公司 | The encapsulating structure of a kind of pcb board and fuse |
| CN208623993U (en) * | 2018-07-05 | 2019-03-19 | 芜湖宏景电子股份有限公司 | A kind of printing stencil structure |
| CN212436044U (en) * | 2020-07-29 | 2021-01-29 | 重庆紫光华山智安科技有限公司 | Circuit board pad packaging structure |
| KR20210085173A (en) * | 2019-12-30 | 2021-07-08 | 주식회사 유라코퍼레이션 | Printed Circuit Board |
| CN217741990U (en) * | 2022-05-12 | 2022-11-04 | 浙江亚太机电股份有限公司 | Packaging structure of PCB fuse |
-
2022
- 2022-05-12 CN CN202210519507.2A patent/CN114928938A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101217082A (en) * | 2008-01-04 | 2008-07-09 | 深圳和而泰智能控制股份有限公司 | A structure for controlling circuit copper foil combusting |
| KR20110137060A (en) * | 2010-06-16 | 2011-12-22 | 주식회사 하이닉스반도체 | Semiconductor package |
| CN203950768U (en) * | 2014-06-03 | 2014-11-19 | 福建万众百源实业有限公司 | The encapsulating structure of a kind of pcb board and fuse |
| CN208623993U (en) * | 2018-07-05 | 2019-03-19 | 芜湖宏景电子股份有限公司 | A kind of printing stencil structure |
| KR20210085173A (en) * | 2019-12-30 | 2021-07-08 | 주식회사 유라코퍼레이션 | Printed Circuit Board |
| CN212436044U (en) * | 2020-07-29 | 2021-01-29 | 重庆紫光华山智安科技有限公司 | Circuit board pad packaging structure |
| CN217741990U (en) * | 2022-05-12 | 2022-11-04 | 浙江亚太机电股份有限公司 | Packaging structure of PCB fuse |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100521125C (en) | aMethod of manufacturing semiconductor device | |
| US6143991A (en) | Bump electrode with adjacent pad and insulation for solder flow stopping | |
| US7544899B2 (en) | Printed circuit board | |
| CN217741990U (en) | Packaging structure of PCB fuse | |
| CN102315135B (en) | Chip package and manufacturing process thereof | |
| CN211630498U (en) | PCB and common bonding pad thereof | |
| CN108899283B (en) | Ball grid array packaging structure and packaging method thereof | |
| US5334873A (en) | Semiconductor packages with centrally located electrode pads | |
| CN114928938A (en) | Packaging structure and packaging method of PCB fuse | |
| KR20100025750A (en) | Semiconductor package | |
| CN217985529U (en) | Novel jumper wire structure of circuit board | |
| CN111785822A (en) | LED flip chip packaging device and packaging process thereof | |
| CN219144254U (en) | Heavy-current battery protection plate and heavy-current battery | |
| CN214068695U (en) | 2.5D packaging structure and electronic equipment | |
| CN204834345U (en) | Inductance transformer surface mounting pin welded structure | |
| CN112074102B (en) | PCB structure and circuit slotting and flow increasing process for PCB | |
| CN218769602U (en) | LED device and LED module | |
| CN104124180A (en) | Manufacturing method of chip packaging structure | |
| CN219459387U (en) | PCB heat dissipation pad structure for QFN packaging element and electronic equipment | |
| CN211267256U (en) | Packaging structure for improving reliability welding of high-power device | |
| CN220509869U (en) | Patch type ceramic capacitor | |
| CN212412077U (en) | LED flip chip packaging device | |
| CN219834519U (en) | Chip component and electronic equipment | |
| CN114096078B (en) | Preparation method of printed board protective cover of device not resistant to high temperature, protective cover and application | |
| TWI769102B (en) | A magnetic device and the method to make the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |