CN114096078B - Preparation method of printed board protective cover of device not resistant to high temperature, protective cover and application - Google Patents
Preparation method of printed board protective cover of device not resistant to high temperature, protective cover and application Download PDFInfo
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- CN114096078B CN114096078B CN202111412593.9A CN202111412593A CN114096078B CN 114096078 B CN114096078 B CN 114096078B CN 202111412593 A CN202111412593 A CN 202111412593A CN 114096078 B CN114096078 B CN 114096078B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a preparation method of a printed board protective cover of a device which does not resist high temperature, a protective cover and application, wherein the method comprises the following steps: selecting an additive protection material of the protection cover, and constructing a convection heat transfer model according to the characteristics of the additive protection material and a reflow soldering heat transfer principle; according to the convection heat transfer model, constructing a protective cover size model of a device which is not resistant to high temperature on the printed board through thermal simulation; according to the protective cover size model of the device which is not resistant to high temperature, the protective cover size of the device which is not resistant to high temperature on the printed board is obtained; according to the size of the protective cover of the non-high temperature resistant device, a bonding pad is arranged on the printed board, and the protective cover is welded on the periphery of the non-high temperature resistant device of the printed board through the bonding pad. According to the principle of heat transfer and the characteristics of a reflow soldering process, the invention adopts an additive protection technology to reduce the design thought of the temperature of the non-high temperature resistant device in the reflow soldering process, effectively solves the defect that the non-high temperature resistant device is not suitable for the reflow soldering process, and improves the consistency, the production efficiency and the product quality of the printed board assembly product.
Description
Technical Field
The invention relates to the technical field of reflow soldering processes, in particular to a preparation method of a protective cover of a printed board of a device which is not resistant to high temperature, the protective cover and application.
Background
The reflow soldering process is a core process for assembling the printed board, and due to the design of part of domestic chip manufacturers and the technical level of the process, part of domestic devices are not high-temperature resistant, and the compatibility of the lead reflow soldering process is poor; particularly, part of domestic military chips adopt a lead-containing process, the chip welding can only adopt manual welding, the production efficiency of products is reduced, and the welding quality and reliability of the chips are difficult to ensure.
Along with the large-scale application of domestic chip devices, more and more QFP and QFN packaging domestic devices which are not resistant to high temperature are arranged on a printed board assembly, and the traditional devices which are not resistant to high temperature are mostly arranged on the printed board assembly in a manual welding mode so as to ensure that the devices are not subjected to excessive temperature impact and ensure that the devices work normally. However, hand soldering such devices has the following problems: 1. the manual welding cannot weld the bottom hot pad of the device, the grounding of the bottom pad of the device cannot be ensured, particularly the A/D, D/A device, and the poor bottom grounding cannot ensure the complete realization of the electrical performance parameters of the device; 2. poor bottom bonding pad grounding is not beneficial to heat dissipation of the device, so that heat dissipation cost of the device is increased; 3. the manual welding is low in efficiency, the consistency and quality of products cannot be guaranteed, and the reliability of welding spots of the device is affected; 4. the production process of the product is increased, the device is manually cleaned after being manually welded, and the production cost is increased.
Disclosure of Invention
The invention aims to provide a preparation method of a printed board protective cover of a non-high temperature resistant device, a protective cover and application thereof, and effectively solves the technical defect that the printed board of the non-high temperature resistant device is not suitable for a reflow soldering process.
The invention is realized by the following technical scheme:
in a first aspect, the present invention provides a method for manufacturing a protective cover for a printed board for a device that does not withstand high temperatures, the method comprising:
selecting an additive protection material of the protection cover, and constructing a convection heat transfer model according to the characteristics of the additive protection material and a reflow soldering heat transfer principle;
according to the convection heat transfer model, constructing a protective cover size model of a device which is not resistant to high temperature on a printed board through thermal simulation; according to the protective cover size model of the device which is not resistant to high temperature, the protective cover size of the device which is not resistant to high temperature on the printed board is obtained;
according to the size of the protective cover of the non-high temperature resistant device, arranging lattice bonding pads on the printed board, and welding the protective cover on the periphery of the non-high temperature resistant device of the printed board through the bonding pads.
The working principle is as follows: the invention designs and prepares the printed board protection cover aiming at the non-high temperature resistant device according to the heat transfer theory and the reflow soldering process characteristic from the perspective of printed board design and adopts the additive protection technology, thereby realizing the applicability of the non-high temperature resistant device in the reflow soldering process. The invention adopts the technical scheme that the design thought of reducing the temperature of a device which is not resistant to high temperature in the reflow soldering process is adopted by adopting an additive protection technology according to the principle of heat transfer and the characteristics of the reflow soldering process. Firstly, selecting an additive protection material of a protection cover, and constructing a convection heat transfer model according to the characteristics of the additive protection material and a reflow soldering heat transfer principle; secondly, according to the convection heat transfer model, constructing a protective cover size model of a device which is not resistant to high temperature on the printed board through thermal simulation; according to the protective cover size model of the device which is not resistant to high temperature, the protective cover size of the device which is not resistant to high temperature on the printed board is obtained; and finally, arranging a bonding pad on the printed board according to the size of the protective cover of the non-high temperature resistant device, and welding the protective cover on the periphery of the non-high temperature resistant device of the printed board through the bonding pad.
The invention can pretreat the printed board assembly with the non-high temperature resistant device in the design stage of the printed board, so that the non-high temperature resistant device can be assembled with the high temperature resistant device through a reflow soldering process without adopting a manual soldering method; effectively solves the technical defect that the device which is not resistant to high temperature is not suitable for reflow soldering technology. The practical demonstration proves that the method is stable and reliable, and the consistency, production efficiency and product quality of the printed board assembly product can be greatly improved.
Further, the additive protection material of the protection cover is a metal material with high heat conductivity.
Further, the convective heat transfer model is:
wherein h is m Is the average convective heat transfer coefficient; d is the diameter of the circular nozzle; lambda (lambda)Is the heat conductivity coefficient of air; h is the height of the nozzle to the impacted surface; re (Re) D Is a Reynolds number; nu (Nu) D Is the knoop-el coefficient.
Furthermore, the protective cover of the device which is not resistant to high temperature on the printed board is in the shape of a rectangular cavity with an opening at the lower end.
Further, the protective cover size of the device which is not resistant to high temperature on the printed board: (non-high temperature resistant device length+8 mm) > protective cover length > (non-high temperature resistant device length+3 mm); (non-high temperature resistant device width+8mm) > protective cover width > (non-high temperature resistant device width+3mm); (non-high temperature resistant device height +8mm) > protective cover height > (non-high temperature resistant device height +3mm); the thickness of the protective cover is 1.5 mm-2.5 mm.
Further, the bottom of the protective cover is plated with convex points, and the size of each convex point is 60% -80% of the area of the bonding pad.
Further, copper is plated on the convex points, and nickel is plated after copper plating to serve as a barrier layer; and finally tinning. The metal convex points are prepared at the bottom of the protective cover so as to facilitate welding alignment; the protective cover is ensured to have better solderability, and the protective cover of the device which is not resistant to high temperature is ensured not to deviate in the reflow soldering process.
Furthermore, the bonding pad adopts a dot matrix bonding pad structure, and the self-alignment principle of the welding spot is utilized to ensure that the cavity of the protective cover is not deviated in the reflow soldering process.
In a second aspect, the invention further provides a printed board protection cover of the non-high temperature resistant device, wherein the protection cover is manufactured by using the preparation method of the printed board protection cover of the non-high temperature resistant device; the protective cover is a rectangular cavity with an opening at the lower end and is used for welding the periphery of a device which is not resistant to high temperature on the printed board.
In a third aspect, the present invention also provides the use of a protective cover for a printed board for a non-refractory device, using a protective cover for a printed board for a non-refractory device according to claim 9, the non-refractory device being assembled with the refractory device by reflow soldering by soldering the protective cover to the periphery of the non-refractory device on the printed board.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. according to the invention, from the perspective of printed board design, according to the principle of heat transfer and the characteristics of reflow soldering process, the material-increasing protection technology is adopted, and the printed board protection cover for the non-high-temperature-resistant device is designed and prepared, so that the applicability of the non-high-temperature-resistant device in the reflow soldering process is realized. The invention adopts the technical scheme that the design thought of reducing the temperature of a device which is not resistant to high temperature in the reflow soldering process is adopted by adopting an additive protection technology according to the principle of heat transfer and the characteristics of the reflow soldering process.
2. The invention can pretreat the printed board assembly with the non-high temperature resistant device in the design stage of the printed board, so that the non-high temperature resistant device can be assembled with the high temperature resistant device through a reflow soldering process without adopting a manual soldering method; effectively solves the technical defect that the device which is not resistant to high temperature is not suitable for reflow soldering technology. The practical demonstration proves that the method is stable and reliable, and the consistency, production efficiency and product quality of the printed board assembly product can be greatly improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention. In the drawings:
FIG. 1 is a schematic diagram of the layout position of a device which does not resist high temperature in the invention.
Fig. 2 is a schematic view of a protective cover (including a pad array) according to the present invention.
FIG. 3 is a schematic view of a boot with bump structures at the bottom of the boot after sizing in accordance with the present invention.
Fig. 4 is a schematic diagram of a typical heat transfer principle of a hot air reflow oven employed in the reflow process of the present invention.
Fig. 5 is a schematic diagram of a part of a printed board suitable for a reflow soldering process for a device which does not resist high temperature.
Reference numerals and corresponding part names:
1-printed board, 2-non-high temperature resistant device, 3-bonding pad, 4-salient point and 5-protection cover.
Detailed Description
Hereinafter, the terms "comprises" or "comprising" as may be used in various embodiments of the present invention indicate the presence of inventive functions, operations or elements, and are not limiting of the addition of one or more functions, operations or elements. Furthermore, as used in various embodiments of the invention, the terms "comprises," "comprising," and their cognate terms are intended to refer to a particular feature, number, step, operation, element, component, or combination of the foregoing, and should not be interpreted as first excluding the existence of or increasing likelihood of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing.
In various embodiments of the invention, the expression "or" at least one of a or/and B "includes any or all combinations of the words listed simultaneously. For example, the expression "a or B" or "at least one of a or/and B" may include a, may include B or may include both a and B.
Expressions (such as "first", "second", etc.) used in the various embodiments of the invention may modify various constituent elements in the various embodiments, but the respective constituent elements may not be limited. For example, the above description does not limit the order and/or importance of the elements. The above description is only intended to distinguish one element from another element. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of various embodiments of the present invention.
It should be noted that: if it is described to "connect" one component element to another component element, a first component element may be directly connected to a second component element, and a third component element may be "connected" between the first and second component elements. Conversely, when one constituent element is "directly connected" to another constituent element, it is understood that there is no third constituent element between the first constituent element and the second constituent element.
The terminology used in the various embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the various embodiments of the invention. As used herein, the singular is intended to include the plural as well, unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the invention belong. The terms (such as those defined in commonly used dictionaries) will be interpreted as having a meaning that is the same as the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in connection with the various embodiments of the invention.
For the purpose of making apparent the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the following examples and the accompanying drawings, wherein the exemplary embodiments of the present invention and the descriptions thereof are for illustrating the present invention only and are not to be construed as limiting the present invention.
Example 1
As shown in fig. 1 to 5, the method for manufacturing the protective cover of the printed board of the high temperature resistant device comprises the following steps:
selecting an additive protection material of the protection cover 5, and constructing a convection heat transfer model according to the characteristics of the additive protection material and a reflow soldering heat transfer principle;
according to the convection heat transfer model, constructing a protective cover size model of a device which is not resistant to high temperature on a printed board through thermal simulation; according to the protective cover size model of the device which is not resistant to high temperature, the protective cover size of the device which is not resistant to high temperature on the printed board is obtained;
according to the size of the protective cover of the non-high temperature resistant device, the bonding pads 3 are arranged on the printed board, and the protective cover 5 is welded on the periphery of the non-high temperature resistant device 2 of the printed board through the bonding pads 3.
For further explanation of the present embodiment, the additive protection material of the protection cover 5 is a metal material with high thermal conductivity.
For further explanation of this embodiment, the convective heat transfer model is:
wherein h is m Is the average convective heat transfer coefficient; d is the diameter of the circular nozzle; lambda is the air heat conductivity coefficient; h is the height of the nozzle to the impacted surface; re (Re) D Is a Reynolds number; nu (Nu) D Is the knoop-el coefficient.
For further explanation of this embodiment, the protective cover 5 of the refractory device on the printed board is a rectangular cavity with an opening at the lower end. Protective cover size of high temperature resistant device on printed board: (non-high temperature resistant device length+8 mm) > protective cover length > (non-high temperature resistant device length+3 mm); (non-high temperature resistant device width+8mm) > protective cover width > (non-high temperature resistant device width+3mm); (non-high temperature resistant device height +8mm) > protective cover height > (non-high temperature resistant device height +3mm); the thickness of the protective cover is 1.5 mm-2.5 mm.
In specific implementation, taking SFM95 series rf chips of some department of midrange electronics used in factories as an example, the highest withstand temperature of the device is not more than 215 ℃, and a hybrid reflow soldering (maximum temperature is more than 217 ℃) process cannot be used. The chip size is 21.7X121.7X14 mm, and the simulation shows that the size of the shield is length (25-27 mm), width (25-27 mm), height (7-9 mm) and thickness (1.5-2.5 mm), so that the high temperature resistance of the device can be protected to be not more than 215 ℃ and the temperature of the device reaches over 183 ℃. Proved by experiments, the protective cover with the length (26 mm), the width (26 mm), the height (7 mm) and the thickness (2 mm) has the advantages that the device is not damaged, and a better reflow soldering effect is obtained.
For further explanation of this embodiment, the bottom of the protective cover 5 is coated with the bump 4, and the size of the bump 4 is 60% -80% of the area of the bonding pad 3.
Copper is plated on the convex points 4, and then nickel is plated after copper plating to serve as a barrier layer; and finally tinning. The metal convex points are prepared at the bottom of the protective cover so as to facilitate welding alignment; the protective cover is ensured to have better solderability, and the protective cover of the device which is not resistant to high temperature is ensured not to deviate in the reflow soldering process.
In order to further describe the embodiment, the pad 3 adopts a dot matrix pad structure, and the self-alignment principle of the welding spot is utilized to ensure that the cavity of the protective cover is not deviated in the reflow soldering process; and pay attention to the lattice spacing to facilitate printed board design.
In order to further explain the embodiment, according to the design requirement of the printed board, determining the position of the device which is not suitable for the reflow soldering process and is not resistant to high temperature; and reasonably distributing the high-temperature-resistant devices according to the requirements of the design structural elements of the printed board, and keeping enough distance from other devices as far as possible.
The working principle is as follows: the invention designs and prepares the printed board protection cover aiming at the non-high temperature resistant device according to the heat transfer theory and the reflow soldering process characteristic from the perspective of printed board design and adopts the additive protection technology, thereby realizing the applicability of the non-high temperature resistant device in the reflow soldering process. The invention adopts the technical scheme that the design thought of reducing the temperature of a device which is not resistant to high temperature in the reflow soldering process is adopted by adopting an additive protection technology according to the principle of heat transfer and the characteristics of the reflow soldering process. Firstly, selecting an additive protection material of a protection cover, and constructing a convection heat transfer model according to the characteristics of the additive protection material and a reflow soldering heat transfer principle; secondly, according to the convection heat transfer model, constructing a protective cover size model of a device which is not resistant to high temperature on the printed board through thermal simulation; according to the protective cover size model of the device which is not resistant to high temperature, the protective cover size of the device which is not resistant to high temperature on the printed board is obtained; and finally, arranging a bonding pad on the printed board according to the size of the protective cover of the non-high temperature resistant device, and welding the protective cover on the periphery of the non-high temperature resistant device of the printed board through the bonding pad.
The invention can pretreat the printed board assembly with the non-high temperature resistant device in the design stage of the printed board, so that the non-high temperature resistant device can be assembled with the high temperature resistant device through a reflow soldering process without adopting a manual soldering method; effectively solves the technical defect that the device which is not resistant to high temperature is not suitable for reflow soldering technology. The practical demonstration proves that the method is stable and reliable, and the consistency, production efficiency and product quality of the printed board assembly product can be greatly improved.
Example 2
As shown in fig. 1 to 5, the difference between the present embodiment and embodiment 1 is that the present embodiment provides a protective cover for a printed board of a device that does not withstand high temperatures, which is manufactured by using the manufacturing method for the protective cover for a printed board of a device that does not withstand high temperatures described in embodiment 1; the protective cover 5 is a rectangular cavity with an opening at the lower end, and the protective cover 5 is used for welding the periphery of the device 2 which is not resistant to high temperature on the printed board.
Meanwhile, the invention also provides application of the printed board protection cover of the non-high temperature resistant device, the printed board protection cover of the non-high temperature resistant device is used, the printed board is assembled with the non-high temperature resistant device through a reflow soldering process by welding the protection cover on the periphery of the non-high temperature resistant device on the printed board.
Because the assembly of the printed board basically adopts a reflow soldering process, the device which is not resistant to high temperature cannot be suitable for the reflow soldering process because the temperature resistance value is low, and the working procedures and the cost of the assembly process of the printed board are increased. Through the application of the printed board protective cover of the non-high temperature resistant device, the reflow soldering process of the non-high temperature resistant device can be realized, the process of printed board assembly is reduced, the production efficiency of printed board assembly is improved, and the production cost of products is greatly reduced.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the invention, and is not meant to limit the scope of the invention, but to limit the invention to the particular embodiments, and any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (7)
1. The preparation method of the printed board protective cover of the device which is not resistant to high temperature is characterized by comprising the following steps:
selecting an additive protection material of the protection cover, and constructing a convection heat transfer model according to the characteristics of the additive protection material and a reflow soldering heat transfer principle;
according to the convection heat transfer model, constructing a protective cover size model of a device which is not resistant to high temperature on a printed board through thermal simulation; according to the protective cover size model of the device which is not resistant to high temperature, the protective cover size of the device which is not resistant to high temperature on the printed board is obtained;
according to the size of the protective cover of the non-high temperature resistant device, arranging a bonding pad on the printed board, and welding the protective cover on the periphery of the non-high temperature resistant device of the printed board through the bonding pad;
the convection heat transfer model is as follows:
wherein h is m Is the average convective heat transfer coefficient; d is the diameter of the circular nozzle; lambda is the air heat conductivity coefficient; h is the height of the nozzle to the impacted surface; re (Re) D Is a Reynolds number; nu (Nu) D Is a knoop-sirer coefficient;
the bottom of the protective cover is plated with convex points, and the size of each convex point is 60% -80% of the area of the bonding pad;
the bonding pad adopts a dot matrix bonding pad structure.
2. The method for manufacturing the printed board protection cover of the high-temperature-resistant device, which is characterized in that the additive protection material of the protection cover is a metal material.
3. The method for manufacturing the protective cover of the printed board, which is not resistant to the high temperature device, according to claim 1, wherein the protective cover of the not resistant to the high temperature device on the printed board is in the shape of a rectangular cavity with an opening at the lower end.
4. The method for manufacturing the protective cover of the printed board for the device which does not resist high temperature according to claim 3, wherein the protective cover of the device which does not resist high temperature on the printed board has the following dimensions: the length of the protective cover is greater than the length of the non-high temperature resistant device by +3mm and less than the length of the non-high temperature resistant device by +8mm; the width of the protective cover is larger than the width of the device which is not resistant to high temperature by +3mm and smaller than the width of the device which is not resistant to high temperature by +8mm; the height of the protective cover is greater than +3mm and less than +8mm of the device which is not high temperature resistant; the thickness of the protective cover is 1.5 mm-2.5 mm.
5. The method for manufacturing a protective cover for a printed board for a device which does not withstand high temperatures according to claim 1, wherein copper is plated on the bumps, and nickel is plated after copper is plated; and finally tinning.
6. A printed board protection cover for a device which does not resist high temperature, characterized in that the protection cover is manufactured by the method for manufacturing the printed board protection cover for the device which does not resist high temperature according to any one of claims 1 to 5; the protective cover is a rectangular cavity with an opening at the lower end and is used for welding the periphery of a device which is not resistant to high temperature on the printed board.
7. Use of a protective cover for a printed board for a non-refractory device according to claim 6, characterized in that the protective cover for a printed board for a non-refractory device is used, which is assembled together with the refractory device by means of a reflow soldering process by soldering the protective cover to the periphery of the non-refractory device on the printed board.
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| CN202111412593.9A CN114096078B (en) | 2021-11-25 | 2021-11-25 | Preparation method of printed board protective cover of device not resistant to high temperature, protective cover and application |
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| CN202111412593.9A CN114096078B (en) | 2021-11-25 | 2021-11-25 | Preparation method of printed board protective cover of device not resistant to high temperature, protective cover and application |
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