CN220545196U

CN220545196U - BGA packaging structure capable of improving welding yield

Info

Publication number: CN220545196U
Application number: CN202321839838.0U
Authority: CN
Inventors: 王成; 李麟
Original assignee: Changsha Quanbo Electronic Technology Co ltd
Current assignee: Changsha Quanbo Electronic Technology Co ltd
Priority date: 2023-07-13
Filing date: 2023-07-13
Publication date: 2024-02-27
Anticipated expiration: 2033-07-13

Abstract

The utility model discloses a BGA packaging structure for improving welding yield in the technical field of circuit board design, which comprises a plurality of BGA non-empty bonding pads and BGA empty bonding pads which are arranged on a circuit board, wherein each BGA non-empty bonding pad is led out of a non-empty network wiring. The problem of current BGA's pad heat dissipation inhomogeneous, lead to the BGA device to weld poorly easily, and then can influence the yield, increase manufacturing cost is solved, it makes the heat dissipation of the empty pad of BGA and the non-empty pad of BGA as far as possible even, reduces the BGA device and welds poorly, and then improves the welding yield, reduction in production cost.

Description

BGA packaging structure capable of improving welding yield

Technical Field

The utility model relates to the technical field of circuit board design, in particular to a BGA packaging structure for improving welding yield.

Background

Printed circuit boards (PrintedCircuitBoard, PCB boards), also known as printed circuit boards, are an important component of the physical support and signal transmission of electronic products. With the continuous development of electronic technology, iterative updating of products is rapid, and automatic and intelligent products are increasingly popular. The requirements of people on the functions of electronic products are higher and higher, and an advanced high-density packaging technology, namely BGA packaging technology, is developed at a high speed. BGA (BallGridArray) -ball-point-grid-array packaging techniques, high-density surface-mount packaging techniques. At the bottom of the package, the pins are all spherical and arranged in a grid-like pattern, hence the name BGA.

In general, BGA package devices are soldered to a circuit board by means of solder, and during soldering, thermal energy is applied to diffuse the solder to the device and raise the solder temperature to a suitable soldering temperature to form a metal alloy with the solder. However, in the BGA package device, a land with an empty network is designed (the land with an empty network refers to a land on which no network signal is given and no signal connection is generated), no empty network wiring is provided on the land with an empty network wiring, and when the land with a network is soldered, the land with a network and the land with an empty network are prone to uneven heat dissipation, and uneven heat dissipation affects the cooling effect of solder. The heat dissipation is too fast, the soldering tin is cooled too fast, and the phenomena of welding leakage, false welding and the like are easy to occur; when the heat dissipation is too slow, the solder cools too slowly, and the situation such as stacking of solder is likely to occur. Therefore, the solder cools too fast or too slow to affect the connection of the tray of the whole BGA chip, that is, the heat dissipation of the bonding pad of the BGA is uneven, which easily causes poor soldering of the BGA device, further affects the yield and increases the production cost.

The above drawbacks need to be addressed.

Disclosure of Invention

In order to solve the problems that the existing BGA bonding pads are uneven in heat dissipation, and poor in welding of BGA devices is easy to cause, so that the yield is affected, and the production cost is increased, the utility model provides a BGA packaging structure for improving the welding yield.

The technical scheme of the utility model is as follows:

the utility model provides an improve BGA packaging structure of welding yields, includes a plurality of BGA non-empty bonding pads, the empty bonding pad of BGA that set up on the circuit board, every the non-empty network of drawing forth of the non-empty bonding pad of BGA walks the line, every all draw forth a plurality of empty network on the empty bonding pad of BGA and walk the line, lie in same two adjacent on the empty bonding pad of BGA be certain contained angle between the empty network walks the line, and every the tip that the empty network walked the line all surpasss at least corresponding the periphery 0.1mm of the empty bonding pad of BGA.

According to the utility model of the scheme, each empty network wire is led out from the center of the BGA empty bonding pad.

According to the utility model of the scheme, the end of each empty network wire exceeds the periphery of the BGA empty bonding pad by 0.15mm.

According to the utility model of the scheme, the included angle between two adjacent empty network wires on the same BGA empty bonding pad is 90 degrees or 180 degrees.

According to the utility model of the scheme, the distance between the adjacent non-empty network wires and the empty network wires is at least 0.1mm.

According to the utility model of the scheme, the diameter of the BGA empty bonding pad is 0.4-0.6 mm.

According to the scheme, the outer side of the BGA empty bonding pad is provided with a solder mask opening window.

Further, the diameter of the solder mask window is 0.5 mm-0.7 mm.

According to the utility model of the scheme, the line width of each empty network wire is 0.05 mm-0.15 mm.

According to the utility model of the scheme, the line width of each empty network wire is 0.1mm.

According to the utility model of the scheme, the length of each empty network wire is 0.3-0.45 mm.

The utility model according to the scheme has the beneficial effects that:

in the BGA packaging structure for improving the welding yield, a plurality of empty network wires are led out from each BGA empty bonding pad, a certain included angle is formed between every two adjacent empty network wires on the same BGA empty bonding pad, so that heat dissipation of the BGA empty bonding pad and the BGA non-empty bonding pad is as uniform as possible, poor welding of a BGA device is reduced, welding yield is improved, and production cost is reduced. In addition, the end of the empty network wire at least exceeds the periphery of the BGA empty pad by 0.1mm, so that the empty network wire is better attached to the BGA empty pad, and the heat dissipation uniformity of the BGA empty pad and the BGA non-empty pad is improved.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of another embodiment of the present utility model;

FIG. 3 is a schematic diagram of a structure of a BGA bare land with 4 bare network traces;

FIG. 4 is a schematic diagram of a structure of 3 dummy network traces on a BGA dummy pad;

FIG. 5 is a schematic diagram of a structure with 2 dummy network traces routed over the BGA dummy pads;

FIG. 6 is another schematic diagram of a structure with 2 dummy network traces routed over BGA dummy pads;

fig. 7 is a schematic diagram of a structure of 1 empty network trace led out of a BGA empty pad.

In the figure, 1, a circuit board; 11. BGA non-empty pads; 12. a non-empty network trace; 13. BGA empty bonding pads; 14. an empty network wiring; 15. and (5) solder mask windowing.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

As shown in fig. 1, the utility model provides a BGA package structure for improving solder yield, which comprises a plurality of BGA non-empty pads 11 and BGA empty pads 13 arranged on a circuit board 1, wherein each BGA non-empty pad 11 is led out of a non-empty network wire 12, each BGA empty pad 13 is led out of a plurality of empty network wires 14, a certain included angle is formed between two adjacent empty network wires 14 positioned on the same BGA empty pad 13, and the end part of each empty network wire 14 at least exceeds the periphery of the corresponding BGA empty pad 13 by 0.1mm.

In the present embodiment, BGA dummy pads 13 and BGA non-dummy pads 11 are provided on the circuit board 1, the BGA dummy pads 13 refer to pads to which no network signal is given and no signal connection is made, and the BGA non-dummy pads 11 refer to pads to which a network signal is given and signal connection is made. A plurality of empty network wires 14 are led out from each BGA empty bonding pad 13, and a certain included angle is formed between two adjacent empty network wires 14 positioned on the same BGA empty bonding pad 13, so that heat dissipation of the BGA empty bonding pad 13 and the BGA non-empty bonding pad 11 is as uniform as possible, poor welding of a BGA device is reduced, welding yield is improved, and production cost is reduced. In addition, the end of the empty network wire 14 at least exceeds the periphery of the BGA empty pad 13 by 0.1mm, so that the empty network wire 14 is better attached to the BGA empty pad 13, and the heat dissipation uniformity of the BGA empty pad 13 and the BGA non-empty pad 11 is improved.

As shown in fig. 1 and 2, in the present embodiment, each of the dummy network traces 14 is led out from the center of the BGA dummy pad 13, and the end portion of each of the dummy network traces 14 exceeds the outer periphery of the BGA dummy pad 13 by 0.15mm, not only can the dummy network traces 14 be better attached to the BGA dummy pad 13, but also the network traces affecting the BGA non-dummy pad 11 can be prevented. In addition, the length of each of the air network wires 14 is 0.3mm to 0.45mm, and the length of each of the air network wires 14 can be designed to be 0.3mm, and of course, in actual design, the length of each of the air network wires 14 can be designed according to actual conditions.

In an alternative embodiment, each dummy network trace 14 is led out from the center of the BGA dummy pad 13, and the end of each dummy network trace 14 exceeds the outer periphery of the BGA dummy pad 13 by 0.15mm, not only enabling the dummy network trace 14 to be better attached to the BGA dummy pad 13, but also preventing the network trace affecting the BGA non-dummy pad 11. In addition, the length of each empty network wire 14 is 0.3 mm-0.45 mm, and the length of each empty network wire 14 can be designed to be 0.4mm, and of course, in actual design, the length of each empty network wire 14 can be designed according to actual situations.

In another alternative embodiment, each dummy network trace 14 is led out from the center of the BGA dummy pad 13, and the end of each dummy network trace 14 exceeds the outer periphery of the BGA dummy pad 13 by 0.15mm, which not only enables the dummy network trace 14 to be better attached to the BGA dummy pad 13, but also prevents the network trace affecting the BGA non-dummy pad 11. In addition, the length of each empty network wire 14 is 0.3 mm-0.45 mm, and the length of each empty network wire 14 can be designed to be 0.45mm, and of course, in actual design, the length of each empty network wire 14 can be designed according to actual situations.

As shown in fig. 2, in the present embodiment, the spacing a between the empty network trace 14 and the adjacent BGA non-empty pad 11 or non-empty network trace 12 is at least 0.1mm, so as to prevent the non-empty network trace 12 affecting the BGA non-empty pad 11 from being short-circuited during processing of the circuit board 1.

As shown in fig. 3 to 7, in this embodiment, when there is a routing space for each BGA empty pad 13 to lead out an empty network routing 14 on the outside of the BGA empty pad 13, then 4 empty network routing 14 are led out on the BGA empty pad 13, and the included angle between two adjacent empty network routing 14 on the same BGA empty pad 13 is 90 °. When three directions of the front, back, left and right directions of the BGA empty pads 13 have wiring spaces for each BGA empty pad 13 to lead out an empty network wiring 14, 3 empty network wirings 14 are led out on the BGA empty pad 13, and an included angle between two adjacent empty network wirings 14 on the same BGA empty pad 13 is 90 degrees or 180 degrees. When two directions of the front, back, left and right directions of the BGA empty pads 13 have wiring spaces for each BGA empty pad 13 to lead out an empty network wiring 14, 2 empty network wirings 14 are led out on the BGA empty pad 13, and an included angle between two adjacent empty network wirings 14 on the same BGA empty pad 13 is 90 degrees or 180 degrees. When only one direction of the front, back, left and right of the BGA empty pads 13 has a routing space for each BGA empty pad 13 to lead out an empty network routing 14, 1 empty network routing 14 is led out on the BGA empty pad 13. Of course, in actual design, the number of the dummy network traces 14 may be designed according to the actual trace space outside the BGA dummy pads 13.

In this embodiment, the line width of each empty network trace 14 is 0.05mm to 0.15mm, and the line width of each empty network trace 14 can be designed to be 0.1mm. Of course, in actual design, the line width of each empty network trace 14 may be designed according to the actual situation.

In an alternative embodiment, the line width of each empty network trace 14 is 0.05mm to 0.15mm, and the line width of each empty network trace 14 may be designed to be 0.08mm. Of course, in actual design, the line width of each empty network trace 14 may be designed according to the actual situation.

In another alternative embodiment, the line width of each empty network trace 14 is 0.05mm to 0.15mm, and the line width of each empty network trace 14 may be designed to be 0.12mm. Of course, in actual design, the line width of each empty network trace 14 may be designed according to the actual situation.

In this embodiment, the diameter of the BGA dummy pad 13 is 0.4mm to 0.6mm, and the diameter of the BGA dummy pad 13 can be designed to be 0.4mm. Of course, in actual design, the diameter of the BGA empty pad 13 may be designed according to actual circumstances.

In an alternative embodiment, the diameter of the BGA dummy pad 13 is 0.4mm to 0.6mm, and the diameter of the BGA dummy pad 13 may be designed to be 0.5mm. Of course, in actual design, the diameter of the BGA empty pad 13 may be designed according to actual circumstances.

In another alternative embodiment, the diameter of the BGA dummy pad 13 is 0.4mm to 0.6mm, and the diameter of the BGA dummy pad 13 may be designed to be 0.6mm. Of course, in actual design, the diameter of the BGA empty pad 13 may be designed according to actual circumstances.

In this embodiment, the outside of BGA dummy pad 13 is provided with solder mask window 15. The solder mask window 15 is referred to as a solder mask on a solder pad of the circuit board 1, and in order to facilitate soldering of components, an opening needs to be created in the solder mask layer to allow soldering or connection of the solder pad of the circuit board 1. The diameter of the solder mask opening 15 is 0.5mm to 0.7mm, and the diameter of the solder mask opening 15 can be designed to be 0.5mm. Of course, in actual design, the diameter of the solder mask opening 15 may be designed according to the actual situation.

In an alternative embodiment, the outside of BGA dummy pad 13 is provided with solder mask window 15. The solder mask window 15 is referred to as a solder mask on a solder pad of the circuit board 1, and in order to facilitate soldering of components, an opening needs to be created in the solder mask layer to allow soldering or connection of the solder pad of the circuit board 1. The diameter of the solder mask opening 15 is 0.5mm to 0.7mm, and the diameter of the solder mask opening 15 can be designed to be 0.6mm. Of course, in actual design, the diameter of the solder mask opening 15 may be designed according to the actual situation.

In another alternative embodiment, the outside of BGA dummy pad 13 is provided with solder mask window 15. The solder mask window 15 is referred to as a solder mask on a solder pad of the circuit board 1, and in order to facilitate soldering of components, an opening needs to be created in the solder mask layer to allow soldering or connection of the solder pad of the circuit board 1. The diameter of the solder mask opening 15 is 0.5mm to 0.7mm, and the diameter of the solder mask opening 15 can be designed to be 0.7mm. Of course, in actual design, the diameter of the solder mask opening 15 may be designed according to the actual situation.

It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.

While the utility model has been described above with reference to the accompanying drawings, it will be apparent that the implementation of the utility model is not limited by the above manner, and it is within the scope of the utility model to apply the inventive concept and technical solution to other situations as long as various improvements made by the inventive concept and technical solution are adopted, or without any improvement.

Claims

1. The utility model provides an improve BGA packaging structure of welding yields, includes a plurality of BGA non-empty bonding pads, the empty bonding pad of BGA that set up on the circuit board, every the non-empty network wiring of drawing forth of the empty bonding pad of BGA, its characterized in that, every all draw forth a plurality of empty network wiring on the empty bonding pad of BGA, lie in same two adjacent on the empty bonding pad of BGA be certain contained angle between the empty network wiring, and every the tip that the empty network was walked all surpasses at least corresponding the periphery 0.1mm of the empty bonding pad of BGA.

2. The BGA package of claim 1, wherein each of the dummy network traces is routed from a center of the BGA dummy pad.

3. The BGA package of claim 1, wherein an end portion of each of the dummy network traces extends 0.15mm beyond a periphery of the BGA dummy pads.

4. The BGA package of claim 1, wherein an included angle between two adjacent dummy network traces on the same BGA dummy pad is 90 ° or 180 °.

5. The BGA package of claim 1, wherein the spacing between adjacent non-empty network traces and empty network traces is at least 0.1mm.

6. The BGA package of claim 1, wherein the BGA empty pads have a diameter of 0.4mm to 0.6mm.

7. The BGA package of claim 1, wherein a solder mask window is provided on an outer side of the BGA dummy pad.

8. The BGA package of claim 7, wherein the solder mask window has a diameter of 0.5mm to 0.7mm.

9. The BGA package of claim 1, wherein each of the dummy network traces has a line width of 0.05mm to 0.15mm.

10. The BGA package of claim 1, wherein each of the traces has a length of 0.3mm to 0.45mm.