CN210956671U

CN210956671U - Display panel

Info

Publication number: CN210956671U
Application number: CN201921802346.8U
Authority: CN
Inventors: 胡军辉
Original assignee: Shenzhen Baroy New Material Technology Co ltd
Current assignee: Shenzhen Baroy New Material Technology Co ltd
Priority date: 2019-10-24
Filing date: 2019-10-24
Publication date: 2020-07-07
Anticipated expiration: 2029-10-24

Abstract

The utility model provides a display panel, including base plate, control chip and luminous chip, the base plate has front and the back and many first through-holes, and the intussuseption of first through-hole is filled with conducting material, and the front of base plate is equipped with the front conducting layer, and the back of base plate is equipped with multilayer back conducting layer, and every layer of back conducting layer all includes back conducting wire and printing ink insulating layer, and front conducting layer and back conducting layer are located respectively to luminous chip and control chip. The utility model provides a display panel, the number of conductive layers at the base plate back is more, makes the base plate more be close to the setting of giving out light the chip, and the heat dispersion of base plate itself is better, can improve the radiating efficiency of giving out light the chip, and the base plate is close to more in addition and gives out light the chip, and its deformation is less to the influence of giving out light the chip, can not influence the subsides dress precision of giving out light the chip, for traditional handicraft, need not to use drilling and copper facing technology, and production flow is environmental protection more.

Description

Display panel

Technical Field

The utility model belongs to the technical field of display device, more specifically say, relate to a display panel.

Background

When the circuit board is manufactured by adopting the traditional copper plating process for the mini LED display, the circuit board manufactured by adopting the traditional process has the following defects: the process is not environment-friendly, the circuit precision of the display processed by the traditional process is low, the high-density chip layout cannot be realized, and otherwise, the circuit defects such as open circuit, short circuit and the like can occur. However, since the mini LED display has a small area, enough chips must be arranged in a limited space, so that the heat dissipation performance of the mini LED display is poor, and the mounting accuracy is affected by slight deformation of the substrate.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a display panel to can not satisfy the technical problem of precision and heat dispersion among the solution prior art.

In order to achieve the above object, the utility model adopts the following technical scheme: the display panel comprises a substrate, a control chip and a light-emitting chip, wherein the substrate is provided with a front surface, a back surface and a plurality of first through holes which penetrate through the front surface and the back surface, the first through holes are filled with conductive materials, the front surface of the substrate is provided with a front conductive layer, the surface of the front conductive layer is provided with a front bonding pad, the back surface of the substrate is provided with a plurality of layers of back conductive layers, each layer of back conductive layer comprises a back conductive circuit and an ink insulating layer, the thickness of the insulating ink layer is greater than that of the back conductive circuit, the insulating ink layer covers the surface of the back conductive circuit, the insulating ink layer is provided with a through hole which enables the back conductive circuit to be exposed, conductive paste is filled in the through hole between two adjacent back conductive circuits, and the surface of the back conductive layer on, and the light emitting chip is welded on the front surface bonding pad, and the control chip is welded on the back surface bonding pad.

Further, the substrate is a glass substrate or a ceramic substrate.

Furthermore, the back surface of the substrate is provided with a plurality of layers of back surface conducting layers, and the area occupied by each back surface conducting circuit is gradually increased from one side close to the substrate to one side far away from the substrate.

Furthermore, the front conductive layer comprises an ink protection area which covers the front surface of the substrate and has a front line shape and a front conductive line which is filled in the front line shape, the ink protection area is provided with a second through hole which is opposite to the first through hole, and a conductive material is filled in the second through hole.

Further, the front surface bonding pad and the back surface bonding pad are formed by a soldering pad or a conductive adhesive bonding pad.

Furthermore, the surface of the light-emitting chip is covered with a fluorescent glue layer, and the outline of the fluorescent glue layer is in a crown shape.

Further, the outer periphery of the light emitting chip is provided with a dam structure for shading light.

Further, the height of the dam structure is greater than 300 μm and less than 500 μm.

The utility model provides a display panel's beneficial effect lies in: compared with the prior art, the utility model discloses display panel includes the base plate, control chip and luminous chip, base plate itself has first through-hole, and the intussuseption of first through-hole is filled with conducting material, the base plate be equipped with positive conducting layer, the back of base plate is equipped with multilayer back conducting layer, every layer of back conducting layer all includes back conducting wire and printing ink insulating layer, the thickness of printing ink insulating layer is greater than the thickness of back conducting wire, and printing ink insulating layer covers in the surface of back conducting wire, only just to back conducting wire department seted up the conducting hole, the conducting hole intussuseption between the adjacent back conducting wire is filled with conductive slurry, with the adjacent back conducting wire. In this kind of display panel, the number of conductive layers at the base plate back is more, makes the base plate more be close to the luminous chip setting, and the heat dispersion of base plate itself is better, can improve the radiating efficiency of luminous chip, and the base plate is close to luminous chip more in addition, and its deformation is less to luminous chip's influence, can not influence luminous chip's subsides dress precision, for traditional handicraft, need not to use drilling and copper facing technology, and production flow is environmental protection more.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a cross-sectional view of a display panel according to an embodiment of the present invention;

fig. 2 is a cross-sectional view of a front surface of a substrate according to an embodiment of the present invention;

fig. 3 is a cross-sectional view of the back surface of the substrate according to an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

1-a substrate; 10-a first via; 2-front side conductive layer; 21-ink protection area; 210-a second via; 22-front side conductive traces; 3-back side conductive layer; 31-ink insulation layer; 310-via holes; 32-back side conductive traces; 41-front side pads; 42-back side pads; 5-a light emitting chip; 6-a control chip; 7-fluorescent glue layer; 8-box dam structure.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 to fig. 3, a display panel according to an embodiment of the present invention will be described. In one embodiment, the display panel includes a substrate 1, a control chip 6, and a light emitting chip 5. The substrate 1 is provided with a front surface and a back surface which are oppositely arranged, wherein the back surface is a luminous surface, the substrate 1 is further provided with a first through hole 10 which penetrates through the front surface and the back surface, a conductive material is filled in the first through hole 10, and the conductive material is also filled in a printing mode. The front side of the substrate 1 is printed with a front side conductive layer 2, the back side of the substrate 1 is printed with a back side conductive layer 3, the front side conductive layer 2 is connected with the conductive material in the first through hole 10, and the back side conductive layer 3 is also connected with the conductive material in the first through hole 10, so that the front side conductive layer 2 and the back side conductive layer 3 are conductively connected. The surface of the front conductive layer 2 is provided with a front pad 41, the light emitting chip 5 is welded on the front pad 41, the surface of the back conductive layer 3 is provided with a back pad 42, and the control chip 6 is welded on the back pad 42, so that the light emitting chip 5 and the control chip 6 are respectively arranged on two sides of the substrate 1, the occupied space on the front surface of the substrate 1 is reduced as much as possible, and the light emitting chips 5 are arranged more densely as possible. The back conductive layer 3 includes a back conductive trace 32 and an ink insulating layer 31 covering the back conductive trace 32, the ink insulating layer 31 has a via 310 exposing the back conductive trace 32, and the thickness of the ink insulating layer 31 is greater than that of the back conductive layer 3. The via 310 between the adjacent back conductive traces 32 is filled with conductive paste to make the two back conductive traces 32 conductive. The outermost via 310 is provided with a back pad 42, and the control chip 6 is soldered to the back pad 42. When the conductive paste is printed in the conductive via 310, the back conductive traces 32 are connected to the conductive material in the first via 10, and thus the front conductive traces 22 and the back conductive traces 32 are electrically connected to each other. When the back conductive layer 3 is manufactured, the back conductive line 32 is printed on the back of the substrate 1, the ink insulating layer 31 is printed on the back of the substrate 1 and the surface of the back conductive line 32, the surface of the ink insulating layer 31 is higher than the surface of the back conductive line 32, the via hole 310 can be directly arranged in the higher area, the printing precision and the slurry dosage of the via hole 310 do not need to be controlled, even if part of slurry is printed on the surface of the ink insulating layer 31, the slurry can be integrated with the next back conductive line 32, the via hole 310 can be filled and the next back conductive line 32 can be printed at the same time, the printing precision of the edge does not need to be controlled, and the higher yield can be ensured. Moreover, a conducting layer with a conducting hole 310 does not need to be arranged between every two back conducting layers 3, namely, the two steps of printing the ink insulating layer 31 and printing the conducting layer are combined into one step, so that the process flow can be saved, and the processing cost can be saved.

The utility model provides a display panel, compared with the prior art, the utility model discloses display panel includes base plate 1, control chip 6 and luminous chip 5, base plate 1 itself has first through-hole 10, and the intussuseption of first through-hole 10 is filled with conducting material, base plate 1's front is equipped with positive conducting layer 2, base plate 1's the back is equipped with multilayer back conducting layer 3, every layer of back conducting layer 3 all includes back conducting wire 32 and printing ink insulating layer 31, the thickness of printing ink insulating layer 31 is greater than back conducting wire 32's thickness, and printing ink insulating layer 31 covers in back conducting wire 32's surface, only just locating to back conducting wire 32 and having seted up conducting hole 310, the intussuseption of conducting hole 310 between the adjacent back conducting wire 32 is filled with conductive paste, with the adjacent back conducting. In this kind of display panel, the number of conductive layers at the back of base plate 1 is more, makes base plate 1 more be close to emitting chip 5 and sets up, and the heat dispersion of base plate 1 itself is better, can improve emitting chip 5's radiating efficiency, and base plate 1 is close to emitting chip 5 more moreover, and its deformation is less to emitting chip 5's influence, can not influence emitting chip 5's subsides dress precision, for traditional handicraft, need not to use drilling and copper facing technology, the production flow is environmental protection more.

In one embodiment, the substrate 1 is a glass substrate or a ceramic substrate. The traditional substrate 1 is made of a resin-based composite material, the thermal expansion coefficient is large, the position precision of a bonding pad and a wire is seriously affected by disordered expansion and contraction in the processing process, and the stability of the follow-up micron-sized surface mounting process cannot be ensured. When the substrate 1 is selected as the substrate 1 with a small thermal expansion coefficient, such as a glass substrate, a ceramic substrate and the like, the substrate 1 can be prevented from expanding with heat and contracting with cold in the processing process, the bonding pads and the wiring are ensured not to displace, and the processing precision of the display panel is improved. The glass substrate and the ceramic substrate also have high flatness, and the front conductive layer 2 and the back conductive layer 3 on the surfaces thereof also have high flatness.

Referring to fig. 1 and 2, in one embodiment, the front conductive layer 2 includes an ink protection area 21 covering the front surface of the substrate 1 and having a front trace shape, and a front conductive trace 22 filled in the front trace shape, the ink protection area 21 has a second via 210 opposite to the first via 10, and the second via 210 is filled with a conductive material. Thus, the conductive material in the first via hole 10, the conductive material in the second via hole 210, and the front conductive trace 22 are connected in sequence, and the three are electrically connected. More specifically, when the front conductive layer 2 is processed, ink may be directly printed and covered on the front surface of the substrate 1, and then the ink corresponding to the first through hole 10 is removed by laser engraving or chemical etching, so that the ink protective layer has a second through hole 210; or, a screen printing plate with a corresponding shape is adopted to shield the area opposite to the first through hole 10, so that the ink protection layer formed after screen printing also has a second through hole 210; alternatively, before ink-jet printing, the position information of the second through hole 210 is uploaded to an ink-jet printer, and the ink-jet printer directly ink-jet prints the ink protection layer with the second through hole 210. The ink protective layer is formed by printing optical ink and then curing, and the curing mode and curing time are not limited herein. The optical ink is usually black, the glass transition temperature Tg of the cured optical ink is higher than 180 degrees, and the optical ink has the performances of organic solvent resistance and acid and alkali resistance. The laser-removed part of the ink protection layer corresponds to the shape of the front conductive line 22, and the laser-removed part of the ink protection layer may be removed by a laser engraving machine to form the ink protection region 21, and the substrate 1 may be cleaned after the laser-removed part of the ink protection layer.

Optionally, two or more front conductive layers 2 are printed on the front surface of the substrate 1 as required, and each front conductive layer 2 is connected and conducted.

Referring to fig. 1 and fig. 3, in one embodiment, a plurality of back conductive layers 3 are disposed on the back surface of the substrate 1, and the area occupied by each back conductive line 32 gradually increases from a side close to the substrate 1 to a side far from the substrate 1. Since the distribution of the light emitting chips 5 is dense, accordingly, the smaller the size of the back surface conductive line 32 closer to the back surface of the substrate 1, the more difficult it is to ensure the yield. The size from the first layer of back conductive traces 32 to the outermost layer of back conductive traces 32 can be larger and larger, that is, the occupied area is larger and larger, so that the yield of the back conductive traces 32 farther from the substrate 1 is higher, which is beneficial to improving the overall manufacturing yield of the display panel.

Referring to fig. 1 to 3, in one embodiment, the front pads 41 and the back pads 42 may be solder pads or conductive adhesive pads. When the front conductive traces 22 and the rear conductive traces 32 are made of aluminum paste, the light emitting chip 5 and the control chip 6 are difficult to be soldered with solder paste and can be soldered to pads using conductive paste.

After the light emitting chip 5 is soldered to the front conductive traces 22, the surface of the light emitting chip 5 is covered with the fluorescent adhesive layer 7 by a steel screen printing or dispensing method, and the fluorescent adhesive layer 7 is heated and cured, wherein the fluorescent adhesive layer 7 is used for wrapping and protecting the light emitting chip 5, and a part of the fluorescent adhesive layer 7 also has an effect of changing the color of the emergent light of the light emitting chip 5. More specifically, the fluorescent glue layer 7 covers the surface of the light emitting chip 5, and the outer contour of the fluorescent glue layer 7 is a crown-shaped structure with a certain radian, that is, the outer contour of the fluorescent glue layer 7 is arc-shaped, so that the emitted light is more uniform.

Further, the surface of the light emitting chip 5 is provided with a dam structure 8. The dam structure 8 is used for shielding light rays emitted by the light emitting chips 5, so that the two adjacent light emitting chips 5 are not interfered with each other, and light leakage of each light emitting chip 5 is prevented. The height of the dam structure 8 is more than 300 μm and less than 500 μm to ensure that it has a light leakage prevention function. Specifically, the dam structure 8 may be formed by means of paste extrusion using reflective ink or black ink.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. Display panel, its characterized in that: the LED packaging structure comprises a substrate, a control chip and a light-emitting chip, wherein the substrate is provided with a front surface and a back surface which are oppositely arranged, and a plurality of first through holes which penetrate through the front surface and the back surface, conductive materials are filled in the first through holes, a front conductive layer is arranged on the front surface of the substrate, a front pad is arranged on the surface of the front conductive layer, a plurality of layers of back conductive layers are arranged on the back surface of the substrate, each layer of back conductive layer comprises a back conductive circuit and an ink insulating layer, the thickness of the ink insulating layer is larger than that of the back conductive circuit, the ink insulating layer covers the surface of the back conductive circuit, a through hole which enables the back conductive circuit to be exposed is formed in the ink insulating layer, conductive slurry is filled in the through hole between every two adjacent back, and the light emitting chip is welded on the front surface bonding pad, and the control chip is welded on the back surface bonding pad.

2. The display panel of claim 1, wherein: the substrate is a glass substrate or a ceramic substrate.

3. The display panel of claim 1, wherein: the back of the substrate is provided with a plurality of layers of back conducting layers, and the area occupied by each back conducting circuit is gradually increased from one side close to the substrate to one side far away from the substrate.

4. The display panel of claim 1, wherein: the front conductive layer comprises an ink protection area which covers the front surface of the substrate and is provided with a front line shape and a front conductive line which is filled in the front line shape, the ink protection area is provided with a second through hole which is opposite to the first through hole, and a conductive material is filled in the second through hole.

5. The display panel according to any one of claims 1 to 4, wherein: the front bonding pad and the back bonding pad are soldering pads or conductive adhesive bonding pads.

6. The display panel according to any one of claims 1 to 4, wherein: the surface of the light-emitting chip is covered with a fluorescent glue layer, and the outline of the fluorescent glue layer is in a crown shape.

7. The display panel according to any one of claims 1 to 4, wherein: and a dam structure for shading is arranged on the outer periphery of the light-emitting chip.

8. The display panel of claim 7, wherein: the height of the dam structure is greater than 300 μm and less than 500 μm.