JP2008103393A - Led lamp device - Google Patents

Led lamp device Download PDF

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Publication number
JP2008103393A
JP2008103393A JP2006282577A JP2006282577A JP2008103393A JP 2008103393 A JP2008103393 A JP 2008103393A JP 2006282577 A JP2006282577 A JP 2006282577A JP 2006282577 A JP2006282577 A JP 2006282577A JP 2008103393 A JP2008103393 A JP 2008103393A
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Prior art keywords
lead terminal
led lamp
lead
led
pad
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Japanese (ja)
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Shigeo Hatakeyama
茂夫 畠山
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Funai Electric Co Ltd
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Funai Electric Co Ltd
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Priority to JP2006282577A priority Critical patent/JP2008103393A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

<P>PROBLEM TO BE SOLVED: To prevent heat due to soldering from easily transmitting to an LED element in an LED lamp device. <P>SOLUTION: The LED lamp 1 is provided with the LED element and an electrically connected lead terminal 20, and the lead terminal 20 has legs 22 and contact portions 21. A metal having a heat conductive rate lower than that of general tin is plated on the surface of the lead terminal 20. The contact portions 21 are each longer than a length necessary and sufficient for fitting each of the legs 22 to an attaching hole 31 of a substrate 3. Pads 32 are formed on a surface 30a of the substrate 3, and wiring patterns 34 are formed on a rear surface 30b. The LED lamp device 4 is manufactured in such a way that the legs 22 of the LED lamp 1 are fitted into the attaching holes 31 from the surface 30a of the substrate 3 in the rear surface 30b direction, and the legs 22 are connected to the wiring patterns 34 from the rear surface 30b of the substrate 3 using lead-free solder. After the LED lamp 1 is attached on the substrate 3, the surfaces of the substrate side of the contact portions 21 contact the surface of the LED lamp 1 side of the pads 32. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、ＬＥＤランプ装置に関し、特に放熱技術に関する。   The present invention relates to an LED lamp device, and more particularly to a heat dissipation technique.

従来から、電子機器の表示灯部等にＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）ランプが使用されている。図４は、従来のＬＥＤランプ１００の例を示す透視図である。ＬＥＤランプ１００は、ＬＥＤ素子１０１を透明樹脂等でモールドした本体部１１０と、このＬＥＤ素子１０１にワイヤーボンディングされたリード線１０２等を用いてＬＥＤ素子１０１に電気的に接続された一対のリード端子１２０等で構成されている。このようなＬＥＤランプ１００は、一般的に、基板に設けられたリード端子１２０を取り付けるための取付孔にリード端子１２０を挿入した後、基板の裏側でリード端子１２０をはんだ付けすることにより、基板に実装される。   Conventionally, LED (Light Emitting Diode) lamps have been used for indicator lamps of electronic devices. FIG. 4 is a perspective view showing an example of a conventional LED lamp 100. The LED lamp 100 includes a pair of lead terminals electrically connected to the LED element 101 using a main body 110 obtained by molding the LED element 101 with a transparent resin and the like, and a lead wire 102 wire-bonded to the LED element 101. 120 or the like. In general, the LED lamp 100 is formed by inserting the lead terminal 120 into a mounting hole for mounting the lead terminal 120 provided on the substrate and then soldering the lead terminal 120 on the back side of the substrate. To be implemented.

ところで、近年、環境問題に対処するため、電子部品を基板に実装する際に用いられるはんだの鉛フリー化が進んでいる。鉛フリーはんだは、従来の鉛入りはんだに比べて融点が高い。そのため、はんだ付けの条件によっては、ＬＥＤランプ１００を基板に実装する際に、はんだ付けによる熱がリード端子１２０からＬＥＤ素子１０１に伝わり、リード線１０２とＬＥＤ素子１０１との接続が外れてしまうことがある。その結果、ＬＥＤランプ１００の輝度ムラや不点灯が発生する。   By the way, in recent years, in order to cope with environmental problems, lead-free solder used for mounting electronic components on a substrate has been advanced. Lead-free solder has a higher melting point than conventional lead-containing solder. Therefore, depending on the soldering conditions, when the LED lamp 100 is mounted on the substrate, heat from the soldering is transmitted from the lead terminal 120 to the LED element 101, and the connection between the lead wire 102 and the LED element 101 is disconnected. There is. As a result, uneven brightness and non-lighting of the LED lamp 100 occur.

これに対して、特許文献１及び特許文献２に開示されているＬＥＤランプと基板を含むＬＥＤランプ装置では、はんだ付けによる熱をＬＥＤ素子に伝わりにくくすることができないため、上記問題を解決できない。
特開昭６１−４２８６号公報 実開平５−４１１５７号公報 On the other hand, in the LED lamp device including the LED lamp and the substrate disclosed in Patent Document 1 and Patent Document 2, it is difficult to transfer heat due to soldering to the LED element, and thus the above problem cannot be solved.
JP 61-4286 A Japanese Utility Model Publication No. 5-41157

本発明は、上記従来の問題を解決するためになされたものであり、はんだ付けによる熱がＬＥＤ素子に伝わりにくいＬＥＤランプ装置を提供することを目的とする。   The present invention has been made to solve the above-described conventional problems, and an object thereof is to provide an LED lamp device in which heat due to soldering is not easily transmitted to the LED element.

上記目的を達成するために請求項１の発明は、ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｎｇ Ｄｉｏｄｅ）素子と、このＬＥＤ素子に電気的に接続された一対のリード端子とを有するＬＥＤランプと、表面に銅箔のパッドが形成され、裏面に配線パターンが形成され、前記リード端子を取り付けるための一対の取付孔が設けられた基板とを備え、前記リード端子を前記取付孔に前記基板の表面から裏面方向へ嵌入した後、鉛フリーはんだを用いて該リード端子と前記配線パターンとを接合するＬＥＤランプ装置において、前記リード端子は、前記取付孔に嵌入される脚部と、該脚部に対して略直角に曲げられ、該脚部を前記取付孔に嵌入したとき、前記パッドと接触する接触部とを有し、前記リード端子の表面には、すずよりも熱伝導率の低い金属がメッキされ、それによって、鉛フリーはんだを用いて前記リード端子と前記配線パターンとをはんだ付けにより接合するときに発生する熱が該リード端子に伝わりにくくなり、前記接触部を前記パッド上に引き回すことで、該接触部を可及的に長くし、それによって、前記リード端子に伝わった熱が、該パッドにより吸収され、該接触部から放熱されるため、前記ＬＥＤ素子に伝わりにくくなり、該リード端子と該ＬＥＤ素子との接続が熱膨張によって外れるのを防ぐことができるものである。   In order to achieve the above object, an invention according to claim 1 is an LED lamp having an LED (Light Emitting Diode) element and a pair of lead terminals electrically connected to the LED element, and a copper foil pad on the surface. A wiring pattern is formed on the back surface, and a substrate is provided with a pair of mounting holes for mounting the lead terminals, and the lead terminals are inserted into the mounting holes from the front surface to the back surface direction. Thereafter, in the LED lamp device that joins the lead terminal and the wiring pattern using lead-free solder, the lead terminal is bent at a substantially right angle with respect to the leg portion inserted into the mounting hole. A contact portion that comes into contact with the pad when the leg portion is inserted into the mounting hole, and a metal having a lower thermal conductivity than tin is formed on the surface of the lead terminal. It is plated, so that heat generated when the lead terminal and the wiring pattern are joined by soldering using lead-free solder is less likely to be transmitted to the lead terminal, and the contact portion is drawn around the pad. Thus, the contact portion is made as long as possible, so that the heat transmitted to the lead terminal is absorbed by the pad and radiated from the contact portion, so that it is difficult to transmit to the LED element. It is possible to prevent the connection between the terminal and the LED element from being disconnected due to thermal expansion.

請求項２の発明は、 ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｎｇ Ｄｉｏｄｅ）素子と、このＬＥＤ素子に電気的に接続されたリード端子とを有するＬＥＤランプと、表面にパッドが形成され、裏面に配線パターンが形成され、前記リード端子を取り付けるための取付孔が設けられた基板とを備え、鉛フリーはんだを用いて該リード端子と前記配線パターンとを接合するＬＥＤランプ装置において、前記リード端子は、前記取付孔に嵌入される脚部と、該脚部を前記取付孔に嵌入したとき、前記パッドと接触する接触部とを有し、前記接触部を前記パッド上に引き回すことで、該接触部を可及的に長くするものである。   The invention of claim 2 is an LED lamp having an LED (Light Emitting Diode) element and a lead terminal electrically connected to the LED element, a pad is formed on the front surface, and a wiring pattern is formed on the back surface. In an LED lamp device comprising: a substrate provided with a mounting hole for mounting the lead terminal; and joining the lead terminal and the wiring pattern using lead-free solder, the lead terminal is fitted into the mounting hole And a contact portion that comes into contact with the pad when the leg portion is inserted into the mounting hole, and the contact portion is drawn as much as possible on the pad. It is what makes it long.

請求項３の発明は、請求項２に記載のＬＥＤランプ装置において、前記リード端子の表面には、すずよりも熱伝導率の低い金属がメッキされているものである。   According to a third aspect of the present invention, in the LED lamp device according to the second aspect, the surface of the lead terminal is plated with a metal having a thermal conductivity lower than that of tin.

請求項１の発明によれば、リード端子の表面に、一般的なすずよりも熱伝導率の低い金属をメッキしたことにより、従来のものよりも、はんだ付けによる熱がリード端子に伝わりにくくなる。また、リード端子の接触部がパッドと接触することにより、はんだ付けによる熱をパッドが吸収するので、さらに、熱がＬＥＤ素子に伝わりにくくなる。そのため、リード端子とＬＥＤ素子の接続が熱膨張によって外れることを防ぐことができる。   According to the first aspect of the present invention, the surface of the lead terminal is plated with a metal having a lower thermal conductivity than that of general tin, so that heat due to soldering is less likely to be transmitted to the lead terminal than in the conventional case. . In addition, since the contact portion of the lead terminal comes into contact with the pad, the pad absorbs heat due to soldering, so that the heat is hardly transmitted to the LED element. Therefore, it is possible to prevent the connection between the lead terminal and the LED element from being disconnected due to thermal expansion.

また、接触部を長くすることにより、リード端子に伝わった熱が接触部から放熱されるので、熱がＬＥＤ素子に伝わりにくくなる。そのため、リード端子とＬＥＤ素子との接続が熱膨張によって外れることを防ぐことができる。   Moreover, since the heat transmitted to the lead terminal is radiated from the contact portion by lengthening the contact portion, the heat is hardly transmitted to the LED element. Therefore, it is possible to prevent the connection between the lead terminal and the LED element from being disconnected due to thermal expansion.

請求項２の発明によれば、接触部がパッドと接触することにより、はんだ付けによる熱をパッドが吸収するので、この熱がＬＥＤ素子に伝わりにくくなる。そのため、リード端子とＬＥＤ素子の接続が熱膨張によって外れることを防ぐことができる。また、接触部を長くすることにより、リード端子に伝わった熱が接触部から放熱されるので、熱がＬＥＤ素子に伝わりにくくなる。そのため、リード端子とＬＥＤ素子との接続が熱膨張によって外れることを防ぐことができる。   According to the second aspect of the present invention, when the contact portion comes into contact with the pad, the pad absorbs heat due to soldering, so that this heat is hardly transmitted to the LED element. Therefore, it is possible to prevent the connection between the lead terminal and the LED element from being disconnected due to thermal expansion. Moreover, since the heat transmitted to the lead terminal is radiated from the contact portion by lengthening the contact portion, the heat is hardly transmitted to the LED element. Therefore, it is possible to prevent the connection between the lead terminal and the LED element from being disconnected due to thermal expansion.

請求項３の発明によれば、リード端子の表面に、一般的なすずよりも熱伝導率の低い金属をメッキしたことにより、従来のものよりも、はんだ付けによる熱がリード端子に伝わりにくくなるので、さらに、熱がＬＥＤ素子に伝わりにくくなる。そのため、リード端子とＬＥＤ素子との接続が熱膨張によって外れることを防ぐことができる。   According to the third aspect of the present invention, the surface of the lead terminal is plated with a metal having a thermal conductivity lower than that of general tin, so that heat due to soldering is less likely to be transmitted to the lead terminal than in the conventional case. As a result, heat is not easily transmitted to the LED element. Therefore, it is possible to prevent the connection between the lead terminal and the LED element from being disconnected due to thermal expansion.

以下、本発明の一実施形態に係るＬＥＤランプ装置について、図１乃至図３を参照して説明する。ＬＥＤランプ装置４は、ＬＥＤランプ１を基板３に実装したものである。図１は、ＬＥＤランプ１の透視図を示し、図２は、ＬＥＤランプ１を実装する基板３の上面を示し、図３は、ＬＥＤランプ装置４の側断面を示す。   Hereinafter, an LED lamp device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3. The LED lamp device 4 is obtained by mounting the LED lamp 1 on a substrate 3. 1 shows a perspective view of the LED lamp 1, FIG. 2 shows an upper surface of a substrate 3 on which the LED lamp 1 is mounted, and FIG. 3 shows a side cross section of the LED lamp device 4.

ＬＥＤランプ１は、図１に示すように、ＬＥＤ素子１１を透明樹脂等でモールドした本体部１０と、このＬＥＤ素子１１と電気的に接続されたリード線１２等を用いてＬＥＤ素子１１に電気的に接続された一対のリード端子２０とを備える。   As shown in FIG. 1, the LED lamp 1 is electrically connected to the LED element 11 using a main body 10 in which the LED element 11 is molded with a transparent resin or the like, and a lead wire 12 electrically connected to the LED element 11. And a pair of lead terminals 20 connected to each other.

リード端子２０は、略階段形状に形成され、取付孔３１（図２参照）に嵌入される脚部２２と、脚部２２に対して略直角に曲げられた接触部２１とを有する。リード端子２０の表面には、一般的なすずよりも熱伝導率の低い金属、例えば、ビスマスがメッキされている。なお、ここでは、一般的なすずよりも熱伝導率の低い金属としてビスマスを示したが、これに限られない。   The lead terminal 20 is formed in a substantially staircase shape, and includes a leg portion 22 that is fitted into the attachment hole 31 (see FIG. 2), and a contact portion 21 that is bent at a substantially right angle with respect to the leg portion 22. The surface of the lead terminal 20 is plated with a metal having a thermal conductivity lower than that of general tin, for example, bismuth. In addition, although bismuth was shown here as a metal whose heat conductivity is lower than general tin, it is not restricted to this.

接触部２１は、脚部２２を基板３の取付孔３１に嵌入したとき、パッド３２（図２参照）と接触する。また、接触部２１は、脚部２２を基板３の取付孔３１に嵌入するのに必要十分な長さよりも長い。脚部２２の一方と他方との距離は、例えば、５ｍｍであり、ＤＩＰ（ｄｕａｌ ｉｎｌｉｎｅ ｐａｃｋａｇｅ）によるＬＥＤランプのリード端子間の一般的な距離（２．５４ｍｍ）と比べて長い。   The contact portion 21 comes into contact with the pad 32 (see FIG. 2) when the leg portion 22 is inserted into the mounting hole 31 of the substrate 3. Further, the contact portion 21 is longer than a length necessary and sufficient to fit the leg portion 22 into the mounting hole 31 of the substrate 3. The distance between one of the leg portions 22 and the other is, for example, 5 mm, which is longer than the general distance (2.54 mm) between the lead terminals of the LED lamp by DIP (dual inline package).

基板３は、図２に示すように、ＬＥＤランプ１の脚部２２を取りつけるための貫通した一対の取付孔３１が設けられている。基板３の表面３０ａ上には、略楕円形状であり、はんだ付け用の銅薄で構成されるパッド３２が取付孔３１の周囲に形成されている。取付孔３１の一方と他方との距離は、取付部２２の端子間の距離と同様である。また、基板３の裏面３０ｂ（図３参照）には、配線パターン３４（図３参照）が形成されている。   As shown in FIG. 2, the substrate 3 is provided with a pair of through-holes 31 through which the legs 22 of the LED lamp 1 are attached. On the surface 30 a of the substrate 3, a pad 32 having a substantially elliptical shape and made of copper thin for soldering is formed around the mounting hole 31. The distance between one and the other of the attachment holes 31 is the same as the distance between the terminals of the attachment portion 22. A wiring pattern 34 (see FIG. 3) is formed on the back surface 30b (see FIG. 3) of the substrate 3.

基板３は、両面銅箔プリント基板（図示せず）にレジストを塗布し、露光させてレジストにパターンを形成し、銅箔をエッチング後にレジストを除去して製造されている。そのため、パッド３２及び配線パターン３４は、銅箔で構成されている。   The substrate 3 is manufactured by applying a resist to a double-sided copper foil printed board (not shown), exposing the resist to a pattern, and removing the resist after etching the copper foil. Therefore, the pad 32 and the wiring pattern 34 are made of copper foil.

ＬＥＤランプ装置４は、図３に示すように、ＬＥＤランプ１と、基板３とを備え、ＬＥＤランプ１を基板３に実装したものである。ＬＥＤランプ装置４は、ＬＥＤランプ１の脚部２２を、取付孔３１に基板３の表面３０ａから裏面３０ｂ方向へ嵌入した後、鉛フリーはんだを用いて基板３の裏面３０ｂから脚部２２と配線パターン３４とをはんだ付けにより接合している。ＬＥＤランプ１を基板３に実装する際、接触部２１の基板側の面が、パッド３２のＬＥＤランプ１側の面と接触し、接触部２１は、パッド３２上に引き回されている。   As shown in FIG. 3, the LED lamp device 4 includes an LED lamp 1 and a substrate 3, and the LED lamp 1 is mounted on the substrate 3. The LED lamp device 4 inserts the leg portion 22 of the LED lamp 1 into the mounting hole 31 in the direction from the front surface 30a of the substrate 3 to the rear surface 30b, and then uses the lead-free solder to wire the leg portion 22 from the rear surface 30b of the substrate 3. The pattern 34 is joined by soldering. When the LED lamp 1 is mounted on the substrate 3, the surface of the contact portion 21 on the substrate side is in contact with the surface of the pad 32 on the LED lamp 1 side, and the contact portion 21 is drawn around the pad 32.

上述したように、本実施形態に係るＬＥＤランプ装置４によれば、リード端子２０の表面に、一般的なすずよりも熱伝導率の低い金属をメッキしたので、従来のリード端子よりもはんだ付けによる熱がリード端子２０に伝わりにくくなる。また、リード端子２０の接触部２１がパッド３２と接触することにより、はんだ付けによる熱をパッド３２が吸収するので、さらに、熱がＬＥＤ素子１１に伝わりにくくなる。そのため、リード端子２０とＬＥＤ素子１１の接続が熱膨張によって外れることを防ぐことができる。   As described above, according to the LED lamp device 4 according to the present embodiment, the surface of the lead terminal 20 is plated with a metal having a lower thermal conductivity than that of general tin, so that it is soldered more than the conventional lead terminal. It becomes difficult for heat due to the heat to be transmitted to the lead terminal 20. Further, since the contact portion 21 of the lead terminal 20 comes into contact with the pad 32, the pad 32 absorbs heat due to soldering, so that the heat is not easily transmitted to the LED element 11. Therefore, it is possible to prevent the connection between the lead terminal 20 and the LED element 11 from being disconnected due to thermal expansion.

また、接触部２１を長くすることにより、リード端子２０に伝わった熱が接触部３２から放熱されるので、熱がＬＥＤ素子１１に伝わりにくくなる。そのため、リード端子２０とＬＥＤ素子１１との接続が熱膨張によって外れることを防ぐことができる。   Moreover, since the heat transmitted to the lead terminal 20 is radiated from the contact portion 32 by elongating the contact portion 21, the heat is hardly transmitted to the LED element 11. Therefore, it is possible to prevent the connection between the lead terminal 20 and the LED element 11 from being disconnected due to thermal expansion.

なお、本発明は上記実施形態の構成に限定されるものではなく、発明の趣旨を変更しない範囲で適宜に種々の変形が可能である。例えば、ＬＥＤランプ１のリード端子２０が２本である場合の例を示したが、これに限られず、少なくとも１本以上あればよい。   In addition, this invention is not limited to the structure of the said embodiment, A various deformation | transformation is possible suitably in the range which does not change the meaning of invention. For example, although the example in the case where the number of the lead terminals 20 of the LED lamp 1 is two has been shown, the present invention is not limited to this, and there may be at least one or more.

本発明の一実施形態に係るＬＥＤランプ装置のＬＥＤランプの概略構成を示す透視図。The perspective view which shows schematic structure of the LED lamp of the LED lamp apparatus which concerns on one Embodiment of this invention. 上記ＬＥＤランプ装置の基板の上面図。The top view of the board | substrate of the said LED lamp apparatus. 上記ＬＥＤランプ装置の側断面図。The sectional side view of the said LED lamp apparatus. 従来のＬＥＤランプの透視図。The perspective view of the conventional LED lamp.

符号の説明Explanation of symbols

１ ＬＥＤランプ
３ 基板
４ ＬＥＤランプ装置
１１ ＬＥＤ素子
２０ リード端子
２１ 接触部
２２ 脚部
３０ａ 表面
３０ｂ 裏面
３１ 取付孔
３２ パッド DESCRIPTION OF SYMBOLS 1 LED lamp 3 Board | substrate 4 LED lamp apparatus 11 LED element 20 Lead terminal 21 Contact part 22 Leg part 30a Front surface 30b Back surface 31 Mounting hole 32 Pad

Claims (3)

ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｎｇ Ｄｉｏｄｅ）素子と、このＬＥＤ素子に電気的に接続された一対のリード端子とを有するＬＥＤランプと、
表面に銅箔のパッドが形成され、裏面に配線パターンが形成され、前記リード端子を取り付けるための一対の取付孔が設けられた基板とを備え、
前記リード端子を前記取付孔に前記基板の表面から裏面方向へ嵌入した後、鉛フリーはんだを用いて該リード端子と前記配線パターンとを接合するＬＥＤランプ装置において、
前記リード端子は、前記取付孔に嵌入される脚部と、該脚部に対して略直角に曲げられ、該脚部を前記取付孔に嵌入したとき、前記パッドと接触する接触部とを有し、
前記リード端子の表面には、すずよりも熱伝導率の低い金属がメッキされ、それによって、鉛フリーはんだを用いて前記リード端子と前記配線パターンとをはんだ付けにより接合するときに発生する熱が該リード端子に伝わりにくくなり、
前記接触部を前記パッド上に引き回すことで、該接触部を可及的に長くし、それによって、前記リード端子に伝わった熱が、該パッドにより吸収され、該接触部から放熱されるため、前記ＬＥＤ素子に伝わりにくくなり、該リード端子と該ＬＥＤ素子との接続が熱膨張によって外れるのを防ぐことができることを特徴とするＬＥＤランプ装置。 An LED lamp having an LED (Light Emitting Diode) element and a pair of lead terminals electrically connected to the LED element;
A copper foil pad is formed on the front surface, a wiring pattern is formed on the back surface, and a substrate provided with a pair of mounting holes for mounting the lead terminals,
In the LED lamp device for joining the lead terminal and the wiring pattern by using lead-free solder after the lead terminal is inserted into the mounting hole from the front surface to the back surface direction,
The lead terminal has a leg portion that is fitted into the mounting hole, and a contact portion that is bent at a substantially right angle with respect to the leg portion and contacts the pad when the leg portion is fitted into the mounting hole. And
The surface of the lead terminal is plated with a metal having a thermal conductivity lower than that of tin, and thereby heat generated when the lead terminal and the wiring pattern are joined by soldering using lead-free solder. It becomes difficult to be transmitted to the lead terminal,
By routing the contact portion on the pad, the contact portion is made as long as possible, whereby heat transferred to the lead terminal is absorbed by the pad and radiated from the contact portion. An LED lamp device, wherein the LED element is difficult to be transmitted to the LED element, and the connection between the lead terminal and the LED element can be prevented from coming off due to thermal expansion. ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｎｇ Ｄｉｏｄｅ）素子と、このＬＥＤ素子に電気的に接続されたリード端子とを有するＬＥＤランプと、
表面にパッドが形成され、裏面に配線パターンが形成され、前記リード端子を取り付けるための取付孔が設けられた基板とを備え、鉛フリーはんだを用いて該リード端子と前記配線パターンとを接合するＬＥＤランプ装置において、
前記リード端子は、前記取付孔に嵌入される脚部と、該脚部を前記取付孔に嵌入したとき、前記パッドと接触する接触部とを有し、
前記接触部を前記パッド上に引き回すことで、該接触部を可及的に長くすることを特徴とするＬＥＤランプ装置。 An LED lamp having an LED (Light Emitting Diode) element and a lead terminal electrically connected to the LED element;
A board having a pad formed on the front surface, a wiring pattern formed on the back surface, and a substrate provided with a mounting hole for mounting the lead terminal, and the lead terminal and the wiring pattern are joined using lead-free solder In LED lamp device,
The lead terminal has a leg portion fitted into the attachment hole, and a contact portion that comes into contact with the pad when the leg portion is fitted into the attachment hole.
An LED lamp device characterized in that the contact portion is made as long as possible by drawing the contact portion on the pad. 前記リード端子の表面には、すずよりも熱伝導率の低い金属がメッキされていることを特徴とする請求項２に記載のＬＥＤランプ装置。   The LED lamp device according to claim 2, wherein the surface of the lead terminal is plated with a metal having a thermal conductivity lower than that of tin.
JP2006282577A 2006-10-17 2006-10-17 Led lamp device Withdrawn JP2008103393A (en)

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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101834262A (en) * 2010-04-20 2010-09-15 中山市晶艺光电科技有限公司 Novel light emitting diode
JP2011066419A (en) * 2009-09-15 2011-03-31 Maintek Computer (Suzhou) Co Ltd Light-emitting diode

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066419A (en) * 2009-09-15 2011-03-31 Maintek Computer (Suzhou) Co Ltd Light-emitting diode
US8294169B2 (en) 2009-09-15 2012-10-23 Maintek Computer (Suzhou) Co., Ltd. Light-emitting diode
CN101834262A (en) * 2010-04-20 2010-09-15 中山市晶艺光电科技有限公司 Novel light emitting diode

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