JP2007305434A - Lighting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting device capable of realizing downsizing. <P>SOLUTION: A heat radiating land 290 is formed along the upper end 200A (end part) on a child substrate 200, and a conduction land 220 is formed on the opposite side to the upper end 200A of the child substrate 200 through the heat generating land 240. Furthermore, the heat generating part 120 of a light-emitting diode module 100 is led out in right and left direction from the right and left side of the case 110, and the connecting terminal 130 is led out from the lower part of the case part 110 to the lower direction. Then, the heat radiating part 120 is soldered to the heat radiating land 240, and the connecting terminal 130 is soldered to each conductive land 220. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an illuminating device for irradiating an illuminated area with illumination light from a light emitting diode module mounted on a circuit board, and particularly to a light emitting diode module that can be mounted on the end of a circuit board for miniaturization. About.

As an illumination device using a light emitting diode module, for example, a device described in Patent Document 1 is known. This is because a surface-mounted light-emitting diode module is mounted on a metal circuit board such as an aluminum substrate, and illumination light emitted from the light-emitting diode is diffused by a light diffusion member such as a light guide plate. It is the structure which irradiates uniformly.
JP 2001-160312 A

  By the way, the reason why the circuit board is made of metal is to dissipate the heat generated from the light emitting diode module, and the land (conductor pattern) formed on the electrode of the light emitting diode module and the circuit board is supplied with power. It also has a heat dissipation function. Therefore, the heat generated in the light emitting diode module propagates to the circuit board main body through the electrode of the light emitting diode module and the land of the circuit board, and is radiated to the outside from the circuit board.

  The lands formed on this type of circuit board are often formed with an interval of about 1 to 2 mm from the end of the circuit board. This is because when the circuit board is punched and formed, burrs are generated at the end face of the circuit board. If the lands are formed at the end of the circuit board, the generated burrs come into contact with the lands so that both This is because there is a possibility of short circuit.

  For this reason, in the conventional device, it is difficult to dispose the light emitting diode module along the end portion of the circuit board, and as a result, it is difficult to reduce the size of the device.

  This invention is made | formed in view of the said situation, The objective is to provide the illuminating device which can achieve size reduction.

  In order to achieve the above object, in the invention of claim 1, the light emitting diode module is mounted on a circuit board, and the illumination device irradiates the illumination area with the illumination light from the light emitting diode module. Consists of a metal substrate, heat dissipation lands are formed along the edges, and conduction lands are formed on the side opposite to the ends via the heat dissipation lands. The mounting surface that is attached to the circuit board is formed on the side opposite to the exit surface from which the illumination light is emitted, and is provided in an exposed state on the casing and connected to the heat dissipation land. And a connecting terminal that is led out from the casing to the side opposite to the end and connected to the conduction land.

  According to the invention of claim 1, even if a burr is generated at the end of the circuit board by the punching formation of the circuit board, and the heat dissipation land is short-circuited with the circuit board by this burr, the heat dissipation performance is not hindered. Further, there is no risk of short circuit due to burrs with respect to the conductive land. Therefore, the light emitting diode module can be disposed along the end of the circuit board, and the device can be miniaturized.

  According to a second aspect of the present invention, there is provided an illuminating device for mounting a light emitting diode module on a circuit board and irradiating illumination light from the light emitting diode module onto an illuminated area, the circuit board being constituted by a metal substrate, The heat radiation land is formed along the portion, and the conduction land is formed on the side opposite to the end portion through the heat radiation land. The attachment surface attached to the circuit board is formed on the side opposite to the emission surface from which the illumination light is emitted, and is led out to the outside along the extending direction of the end portion of the circuit board from the housing part. A heat dissipating part provided in an exposed state and connected to the heat dissipating land, and a connection terminal led out to the outside along the extending direction of the end from the housing part and connected to the conductive land. There.

  According to the invention of claim 2, in addition to the effect of the invention of claim 1, mounting in the direction orthogonal to the extending direction of the circuit board end by deriving the connection terminals along the extending direction of the end of the circuit board. There is also an effect that the space can be saved.

  The invention according to claim 3 is characterized in that the heat radiating portion is provided on the mounting surface side. In this way, the space for heat dissipation can be saved.

  The invention according to claim 4 is characterized in that the heat radiating portion is led out in the extending direction of the end portion of the circuit board.

  According to the invention of claim 4, since the heat radiating portion is led out from the housing portion, whether or not the soldering is reliably performed when the heat radiating portion is connected to the heat radiating land by soldering or the like. Can be easily determined. Thereby, the fall of the heat dissipation performance by solder failure can be prevented reliably.

  According to a fifth aspect of the present invention, there is provided a light diffusing member that makes the illumination light incident on the incident end face and diffuses and irradiates the illumination light to the illuminated area from the exit face arranged orthogonal to the incident end face, and the circuit board is parallel to the incident end face. It is characterized by being placed in a posture.

  According to the invention of claim 5, since the light emitting diode can be disposed at the end of the circuit board, the dimension in the direction orthogonal to the extending direction of the end of the circuit board can be reduced. For this reason, the dimension in the said orthogonal direction can be made small also as the whole apparatus. Such a configuration is effective, for example, in an edge light type lighting device.

<First Embodiment>
The example which applied the illuminating device based on this invention to the backlight apparatus of the instrument for vehicles is demonstrated with reference to FIG. FIG. 1 is a front view of the backlight device. FIG. 2 is an enlarged perspective view of the circuit board and the light emitting diode module mounted on the circuit board. FIG. 3 is an enlarged perspective view of the circuit board and the light emitting diode module mounted on the circuit board. In addition, let the direction of the arrow line A in a figure be an up-down direction, and let the direction of the arrow line B be the front-back direction.

  The backlight device of the present embodiment is of an edge light type, and includes a light emitting diode module 100 that emits illumination light L, a sub board 200 (circuit board) on which the light emitting diode module 100 is mounted, and a light emitting diode module. The main body substrate 300 for driving 100 and the light diffusing member 400 for diffusing and irradiating the illumination light L to the dial plate 500 (illuminated area) are accommodated in a case (not shown) that maintains a predetermined positional relationship. ing.

  Here, each component is arranged as follows. That is, as shown in FIG. 1, the main body substrate 300 and the light diffusing member 400 are arranged in a parallel state with a gap therebetween, and the child substrate 200 is disposed on the end portions of the main body substrate 300 and the light diffusing member 400. Arranged in an upright position. The daughter board 200 is disposed at a position where the illumination light L from the light emitting diode module 100 can enter the incident end face 420 </ b> A of the light diffusion member 400.

  The main body substrate 300 is formed of a resin substrate such as a glass epoxy substrate, and is mounted with an integrated circuit and circuit elements for driving each component of the vehicle instrument, and is electrically connected to the child substrate 200. A connector 310 is mounted on the surface.

The light diffusion member 400 is disposed on the upper side of the main body substrate 300, and diffuses and reflects the illumination light L inside so that the illumination light L incident from the incident end face 420A is uniformly irradiated to the dial plate 500.

  The light diffusion member 400 includes a reflection sheet 410 that reflects light, a light guide plate 420 that is superimposed on the reflection sheet 410, and a diffusion sheet 430 that is superimposed on the light guide plate 420, and an incident end face 420 </ b> A of the light guide plate 420. The illumination light L incident on the dial is diffusely reflected inside, and the dial 500 is irradiated with the illumination light L of uniform luminance from the exit surface 420B orthogonal to the incident end face 420A via the diffusion sheet 430.

Among them, the reflection sheet 410 reflects light that is transmitted from the back surface of the light guide plate 420 to the outside again toward the light guide plate 420 side, and the diffusion sheet 430 is light emitted to the outside from the surface of the light guide plate 420. Is made uniform.

  The sub board 200 is made of, for example, an aluminum metal board, and is formed in a rectangular shape by performing punching after the conductor pattern is formed. An insulating layer 210 is formed on the entire surface of the child substrate 200, and a predetermined conductor pattern (not shown) is formed on the insulating layer 210. A plurality of conductive lands 220 to which the connection terminals 130 of the light emitting diode module 100 are soldered are formed in this conductor pattern.

  On the other hand, a connector 230 that is conductively connected to the main board 300 is formed on the lower end side of the sub board 200, and is configured to be conductively connected to the main board 300 via a harness. Since the connector 230 is electrically connected to the conductor pattern described above, power is supplied to the light emitting diode module 100 connected to the conduction land 220.

  Further, a heat dissipation land 240 for radiating heat generated from the light emitting diode module 100 is formed on the sub board 200. Similar to the conductor pattern, the heat radiation land 240 is formed in a predetermined shape on the insulating layer 210, and the heat radiation portion 120 of the light emitting diode module 100 is connected by soldering.

  The conduction land 220 and the heat radiation land 240 described above are formed on the sub board 200 with the following positional relationship. That is, a heat radiation land 240 is formed along the upper end 200A (end portion) of the sub board 200, and the conduction land 220 is provided on the side opposite to the upper end 200A side of the sub board 200 through the heat dissipation land 240. Is formed. Specifically, a rectangular heat radiation land 240 is formed along the upper end 200 </ b> A of the sub-board 200, and rectangular conductive lands 220 are arranged in the lateral direction below the heat radiation land 240. Is formed.

  The light emitting diode module 100 includes a casing 110 that forms an appearance, a heat radiating part 120 that radiates heat generated inside, and a connection terminal 130.

  The casing 110 is formed in a box shape by molding. A light transmitting portion 112 for transmitting the illumination light L is provided in a portion corresponding to a region where the light beam of the illumination light L is formed on the front surface 111 (outgoing surface) side of the casing 110. Yes. For example, epoxy, silicon, or the like is used for the light transmitting portion 112, and the epoxy, silicon, or the like may contain a phosphor, a filler, or the like.

  A light emitting element that emits the illumination light L and a die on which the light emitting element is placed are embedded in the housing unit 110. An electrode is provided on the die and is electrically connected to the connection terminal 130 by wire bonding. Further, the die is in contact with the heat radiating part 120 in an insulating state in the casing 110 in order to easily conduct the heat generated from the light emitting element to the heat radiating part 120.

  The heat dissipating part 120 is formed, for example, from a metal material having a relatively high thermal conductivity in the shape of a square bar, and is led out from the left and right side surfaces of the housing part 110 in the left-right direction (the extending direction of the end of the circuit board). In addition, the back surface thereof is exposed to be flush with the back surface 113 (mounting surface) of the housing unit 110. Therefore, when the housing part 110 is mounted on the sub board 200, the entire back surface of the heat radiating part 120 is in close contact with the heat radiating land 240.

  The connection terminal 130 is formed of a metal piece that can be bent, and extends downward from the lower surface of the housing 110 (on the side opposite to the upper end 200A of the sub board 200. Are derived on the opposite side. Each connection terminal 130 is soldered to the conduction land 220 at the tip side, and is bent halfway so that the tip side is in close contact with the conduction land 220.

  The heat dissipating part 120 of the light emitting diode module 100 configured as described above dissipates heat in a state where the upper side surface of the housing part 110 coincides with the upper end 200A of the sub board 200 and the back surface 113 is attached to the sub board 200. The connection lands 130 are soldered to the conduction lands 220 while being soldered to the lands 240 for connection.

  In the illuminating device of this embodiment, when power is supplied from the main body substrate 300, the light emitting diode module 100 mounted on the child substrate 200 irradiates the illumination light L, and enters the light guide plate 420 from the incident end surface 420A of the light guide plate 420. Is incident on. Inside the light guide plate 420, the illumination light L is diffused, and the illumination light L with uniform illuminance is emitted toward the dial 500 from the emission surface 420B. Further, heat generated from the light emitting elements in the light emitting diode module 100 is transmitted to the heat radiating section 120 and further radiated from the sub board 200 to the outside via the heat radiating land 240.

  Here, as described in the background art section, a burr 600 may be generated at the end of the sub board 200 in the board forming process by punching out of the manufacturing processes of the sub board 200. When the burr 600 protrudes toward the heat dissipation land 240, the burr 600 may come into contact with the heat dissipation land 240. However, since the heat-dissipating land 240 is formed separately from the conductive land 220, even if it contacts the sub board 200, there is no short circuit. Further, since the conduction land 220 is formed on the lower side of the heat dissipation land 240 (on the side opposite to the upper end 200A of the child substrate 200 via the heat dissipation land 240), the child substrate is caused by the burr 600 generated during punching. 200 and the conduction land 220 are not short-circuited. For this reason, the light emitting diode module 100 can be disposed on the upper end 200 </ b> A of the daughter board 200. Further, since the light emitting diode module 100 can be arranged on the upper end 200A of the sub board 200, when the sub board 200 is arranged in an upright position as in the present embodiment, the vertical dimension of the sub board 200 is reduced. Accordingly, the vertical dimension of the entire lighting device can be reduced.

  Further, since the heat dissipating part 120 is led out from the housing part 110 in the left-right direction, it is easy to confirm whether or not the soldering is reliably performed when the heat dissipating part 120 is soldered to the heat dissipating land 240. Judgment can be made. Thereby, the fall of the heat dissipation performance by solder failure can be prevented reliably.

<Second Embodiment>
A second embodiment according to the present invention will be described with reference to FIG. The description of the same parts as those in the first embodiment will be omitted, and only the differences will be described. In the present embodiment, the shape of the heat radiating part 120 is formed in a flat plate shape, and is exposed from the back surface 113 side of the housing part 110. Further, the size of the heat radiating part 120 is set to fit in the back surface 113 of the housing part 110, and the area of contact with the heat radiating land 240 is determined by the heat radiating part 120 in the first embodiment. It is almost the same as the area in contact with. The heat radiation part 120 formed in this way is connected to the heat radiation land 240 by reflow soldering.

  As in the present embodiment, by forming the heat dissipating part 120 so as to fit in the back surface 113 of the housing part 110, a space for heat dissipation can be saved. For this reason, since the several light emitting diode module 100 can be arrange | positioned with high density in the sub-substrate 200, it is a suitable structure when it is intended to increase the luminance of the illumination light L.

<Third Embodiment>
A third embodiment according to the present invention will be described with reference to FIG. The description of the same parts as those in the first embodiment will be omitted, and only the differences will be described. In the present embodiment, the heat dissipating part 120 is configured by a foldable metal piece and is led out to the outside in the left-right direction from the left and right side surfaces of the housing part 110. The heat dissipating part 120 is bent in the middle, and the tip end side is in close contact with the heat dissipating land 240, and is soldered to the heat dissipating land 240 in this state.

<Fourth embodiment>
A fourth embodiment according to the present invention will be described with reference to FIG. The description of the same parts as those in the first embodiment will be omitted, and only the differences will be described. The present embodiment is different from the first embodiment in the lead-out position and lead-out direction of the connection terminal 130 led out from the casing 110 of the light emitting diode module 100.

  In the light emitting diode module 100, the heat radiating part 120 is led out from the upper side of the left and right side surfaces of the housing part 110 in the left-right direction, and the connection terminal 130 is provided in the left-right direction from the lower side of the left and right side surfaces of the housing part 110. Each is derived.

  In addition, as a structure of the thermal radiation part 120, what was shown in 2nd Embodiment or 3rd Embodiment other than what is shown in figure may be sufficient, for example.

  On the other hand, although the conduction land 220 formed on the daughter board 200 is formed below the heat radiation land 240, the height position formed is increased, and the conduction lands 240 are mutually connected. The separation interval is enlarged.

  With this configuration, the mounting space of the light emitting diode module 100 in the vertical direction of the sub board 200 can be saved.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.

  In the said embodiment, although the example which comprised the sub-substrate 200 with aluminum was shown, you may comprise with other metal materials, such as copper, for example.

  Further, in the above-described embodiment, an example in which the heat radiation land 240 is formed along the upper end 200A of the sub board 200 has been described. However, for example, it may be formed along the left end, right end, or lower end of the sub board 200. good.

It is a front view which shows a backlight apparatus. It is an expansion perspective view which shows the sub board | substrate and the light emitting diode module mounted in this sub board | substrate. It is an expansion perspective view which shows the sub board | substrate and the light emitting diode module mounted in this sub board | substrate. FIG. 6 is an enlarged perspective view showing a sub board and a light emitting diode module mounted on the sub board in the second embodiment. It is an expansion perspective view which shows the sub board | substrate and the light emitting diode module mounted in this sub board | substrate in 3rd Embodiment. It is an expansion perspective view which shows the sub board | substrate and the light emitting diode module mounted in this sub board | substrate in 3rd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Light emitting diode module 110 ... Housing | casing part 111 ... Front (outgoing surface)
112 ... Light transmission part 113 ... Back (mounting surface)
120 ... Radiating section 130 ... Connection terminal 200 ... Sub board (circuit board)
200A ... Upper end (end)
220 ... Land for conduction 240 ... Land for heat dissipation 300 ... Body substrate 400 ... Light diffusion member 420A ... Entrance end face 420B ... Outgoing face 500 ... Dial (illuminated area)

Claims (5)

A lighting device that mounts a light emitting diode module on a circuit board and irradiates an illumination area with illumination light from the light emitting diode module,
The circuit board is
Consists of a metal substrate, a heat dissipation land is formed along the end portion, and a conduction land is formed on the opposite side of the end portion through the heat dissipation land,
The light emitting diode module is:
The mounting surface that is attached to the circuit board in the casing part that forms the appearance is formed on the opposite side of the emission surface from which the illumination light is emitted,
A heat dissipating part provided in the housing part in an exposed state and connected to the heat dissipating land;
An illuminating device comprising: a connection terminal that is led out from the housing portion to the side opposite to the end portion and connected to the conduction land. A lighting device that mounts a light emitting diode module on a circuit board and irradiates an illumination area with illumination light from the light emitting diode module,
The circuit board is
Consists of a metal substrate, a heat dissipation land is formed along the end portion, and a conduction land is formed on the opposite side of the end portion through the heat dissipation land,
The light emitting diode module is:
The mounting surface that is attached to the circuit board in the casing part that forms the appearance is formed on the opposite side of the emission surface from which the illumination light is emitted,
A heat dissipating part provided in the housing part in an exposed state and connected to the heat dissipating land;
An illuminating device comprising: a connection terminal led out to the outside along the extending direction of the end portion from the housing portion and connected to the conduction land.   The lighting device according to claim 1, wherein the heat radiating portion is provided on the mounting surface side.   The lighting device according to any one of claims 1 to 3, wherein the heat radiating portion is led out in an extending direction of the end portion of the circuit board. A light diffusing member that makes the illumination light incident on an incident end face, and diffuses and irradiates the illumination light on the illuminated area from an exit face arranged orthogonal to the incident end face;
The lighting device according to any one of claims 1 to 4, wherein the circuit board is arranged in a posture parallel to the incident end face.

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